CN110491844B - Heat radiator for system integrated circuit board - Google Patents
Heat radiator for system integrated circuit board Download PDFInfo
- Publication number
- CN110491844B CN110491844B CN201910792332.0A CN201910792332A CN110491844B CN 110491844 B CN110491844 B CN 110491844B CN 201910792332 A CN201910792332 A CN 201910792332A CN 110491844 B CN110491844 B CN 110491844B
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- Prior art keywords
- heat dissipation
- dust
- circuit board
- rotating
- installation box
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- 239000000428 dust Substances 0.000 claims abstract description 110
- 230000017525 heat dissipation Effects 0.000 claims abstract description 80
- 238000009434 installation Methods 0.000 claims abstract description 44
- 238000000605 extraction Methods 0.000 claims abstract description 6
- 238000005057 refrigeration Methods 0.000 claims description 39
- 238000001816 cooling Methods 0.000 claims description 24
- 238000007599 discharging Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 238000009825 accumulation Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003809 water extraction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
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- B08B1/30—
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention discloses a heat dissipation device of a system integrated circuit board, which belongs to the technical field of integrated circuits and comprises an installation box, a box cover, a rotating assembly, a dust removal assembly and a heat dissipation assembly, wherein the box cover is arranged on the installation box, an installation plate is arranged in the installation box, the installation box is divided into a first accommodating cavity and a second accommodating cavity by the installation plate, the rotating assembly is arranged on the box cover, the dust removal assembly is arranged on the installation box, the heat dissipation assembly comprises a heat dissipation member and a heat extraction member, and the heat dissipation member is arranged in the second accommodating cavity. According to the invention, the two rotating motors work to drive the two rotating screw rods to rotate so as to drive the movable plate to move in the movable groove, the movable plate moves to drive the dust removing rods to move, the dust removing rods move to drive the dust removing pastes to move, the dust removing pastes move to remove dust on the circuit board, and after dust is removed, the circuit board cannot have poor heat dissipation effect due to dust accumulation, so that the normal work of the circuit board is not influenced.
Description
Technical Field
The invention relates to the technical field of integrated circuits, in particular to a heat dissipation device of a system integrated circuit board.
Background
The system integrated circuit board is a miniature electronic device or component, and adopts a certain process to interconnect the elements of transistor, resistor, capacitor and inductor, etc. required in a circuit and the wiring together, and makes them on a small piece or several small pieces of semiconductor wafer or medium substrate, then packages them in a tube shell to form the miniature structure with required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability.
Patent for CN108922874A relates to a heat abstractor of system integrated circuit board, including circuit board body, cooling tube, temperature sensor, delivery pump, controller, cooler and miniature heat dissipation fan, the circuit board body is installed on the mount pad, the circuit board body passes through splint to be fixed on the mount pad, temperature sensor is installed to the lower part of circuit board body, the externally mounted of circuit board body has the cooling tube, the left end and the drain pipe of cooling tube communicate each other, the lower extreme of drain pipe is installed on the liquid reserve tank, the transfer line is installed on the right side of liquid reserve tank, install the delivery pump on the transfer line. The invention provides a heat dissipation device of a system integrated circuit board, which solves the problems of poor heat dissipation effect, low heat dissipation speed of a heat dissipation fan and inconvenience for cooling the system integrated circuit board by arranging a circuit board body, a cooling pipe, a temperature sensor, a delivery pump, a controller, a cooler and a micro heat dissipation fan. However, the above-mentioned devices also have the following problems in use: when dispelling the heat to the circuit board, because long-time work, can fall a large amount of dusts on the circuit board, the device can not clear up the dust on the circuit board, and the accumulation of dust leads to the radiating effect of circuit board not good.
Disclosure of Invention
The invention aims to provide a heat dissipation device of a system integrated circuit board, which aims to solve the technical problems that in the prior art, dust on the circuit board cannot be cleaned, and the heat dissipation effect of the circuit board is poor due to the accumulation of the dust.
In order to solve the technical problems, the invention provides the following technical scheme: a heat dissipation device of a system integrated circuit board comprises an installation box, a box cover, a rotating assembly, a dust removal assembly and a heat dissipation assembly, wherein the box cover is arranged on the installation box, the installation box is hinged with the box cover, a mounting plate is arranged in the installation box and divides the installation box into a first accommodating cavity and a second accommodating cavity, four supporting seats which are arranged in a rectangular shape are arranged on the side wall of the second accommodating cavity, the bottom of the mounting plate is arranged on the four supporting seats, the rotating assembly is arranged on the box cover and is rotationally connected with the box cover, the dust removal assembly is arranged on the installation box and is positioned in the first accommodating cavity, the dust removal assembly is rotationally connected with the installation box and comprises a heat dissipation member and a heat dissipation member, the heat dissipation member is arranged in the second accommodating cavity, the output end of the heat dissipation member faces to the bottom of the mounting plate, and one end of the heat dissipation member is arranged in the second accommodating, the other end of the heat discharging piece is arranged on the mounting plate.
Further, the runner assembly includes installing frame, swing motor, rotation sleeve, first dwang, second dwang, universal ball and swing fan, the swing motor sets up at the top of case lid and the vertical downward setting of output shaft of swing motor, the rotation sleeve sets up on the output shaft of swing motor, the installing frame sets up on the inside lateral wall of case lid, the universal ball sets up in the bottom of installing frame and rotates with the installing frame to be connected, the one end and the universal ball of first dwang are connected, the swing fan sets up the other end at first dwang, the second dwang is the setting of L type, the one end and the rotation sleeve fixed connection of second dwang, the other end setting of second dwang is on first dwang.
Furthermore, the dust removing assembly comprises a movable plate, two rotating screw rods, two rotating motors and a plurality of dust removing rods, the two rotating screw rods are symmetrically arranged on the installation box, the two rotating screw rods are rotationally connected with the installation box, the two rotating motors are symmetrically arranged on the side wall of the installation box, output shafts of the two rotating motors are respectively and fixedly connected with the two rotating screw rods, the moving plate is arranged on the two rotating screw rods and is in threaded connection with the two rotating screw rods, the movable plate is provided with threaded holes in threaded connection with the two rotary screw rods, the inner wall of the first accommodating cavity is provided with a moving groove matched with the movable plate in a sliding mode, the dust removing rods are arranged at the bottom of the movable plate at equal intervals and are made of rubber, and the lower ends of the dust removing rods are provided with dust removing pastes.
Furthermore, a plurality of dust suction pipes which are arranged at equal intervals are arranged at the bottom of the moving plate, and a dust suction nozzle communicated with the dust suction pipes is arranged at the bottom of each dust suction pipe.
Further, be equipped with a plurality of louvres on the mounting panel, be equipped with the mounting groove that supplies the installation of heat extraction spare on the mounting panel, still be equipped with a plurality of fin of setting in the mounting groove on the mounting panel, be equipped with four mounting holes that are the rectangle and distribute on the mounting panel.
Furthermore, the heat dissipation member comprises two heat dissipation fans, the two heat dissipation fans are symmetrically arranged at the bottom of the second accommodating cavity, and the output ends of the two heat dissipation fans face the bottom of the mounting plate.
Further, heat extraction spare includes annular cooling tube, refrigeration case, delivery pump and a plurality of refrigeration piece, annular cooling tube sets up in the mounting groove of mounting panel, annular cooling tube level sets up in the mounting groove, the refrigeration case sets up the bottom that holds the chamber at the second, and is a plurality of refrigeration piece equidistant setting is in the refrigeration case, the delivery pump sets up the side at the refrigeration case, be connected through the hose between refrigeration case and the delivery pump, annular cooling tube's one end and delivery pump communicate mutually, annular cooling tube's the other end and refrigeration case are linked together.
Furthermore, a plurality of heat discharging holes are formed in the side wall of the installation box, and a wire outlet hole is formed in the side wall of one side of the installation box.
Compared with the prior art, the invention has the beneficial effects that:
firstly, the two rotating motors work to drive the two rotating screw rods to rotate, the two rotating screw rods rotate to drive the movable plate to move in the moving groove, the movable plate moves to drive the dust removing rods to move, the dust removing rods move to drive the dust removing pastes to move, the dust removing pastes move to remove dust on the circuit board, dust cannot be accumulated on the circuit board after dust removal, when the circuit board is used, the circuit board cannot have poor heat dissipation effect due to dust accumulation, the normal work of the circuit board is influenced, when the movable plate moves, the movable plate drives the dust collecting pipes to move, the dust collecting pipes move to drive the dust collecting nozzles to move to collect dust on the circuit board, and therefore, dust residues on the circuit board are prevented from being cleaned comprehensively.
Secondly, when the circuit board is cooled, the swing motor rotates to drive the rotating sleeve to rotate, the rotating sleeve rotates to drive the box cover to rotate, the rotating sleeve rotates to drive the second rotating rod to rotate, the second rotating rod rotates to drive the first rotating rod to rotate on the mounting frame through the universal ball, the first rotating rod rotates to drive the swing fan to rotate to cool the circuit board on the mounting plate, and the swing motor works to drive the swing fan to rotate, so that air discharged by the swing fan can be uniformly conveyed to the circuit board, and uniform cooling operation of the circuit board is realized.
When the heat dissipation is carried out, the conveying pump works to extract water in the refrigeration box through the hose, the plurality of refrigeration sheets in the refrigeration box work to refrigerate the water in the refrigeration box, the water is conveyed into the annular heat dissipation pipe after the water is extracted, the water of the annular heat dissipation pipe carries out heat dissipation operation on the circuit board, the annular heat dissipation pipe conveys the water into the refrigeration box after the heat dissipation is carried out, and the refrigeration sheets carry out refrigeration operation on the water.
Drawings
FIG. 1 is a first perspective view of the present invention;
FIG. 2 is a schematic perspective view of the present invention;
FIG. 3 is a top view of the present invention;
FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3;
FIG. 5 is a perspective view of the rotating assembly of the present invention;
FIG. 6 is a schematic perspective view of the dust extraction assembly of the present invention;
FIG. 7 is an enlarged view at B in FIG. 6;
FIG. 8 is a perspective view of the mounting plate of the present invention;
fig. 9 is a schematic perspective view of a heat dissipation assembly of the present invention.
The reference numbers in the figures are:
the mounting box 1, the mounting plate 11, the heat dissipation hole 111, the mounting groove 112, the heat dissipation fin 113, the mounting hole 114, the first accommodating cavity 12, the second accommodating cavity 13, the heat dissipation hole 14, the wire outlet 15, the moving groove 16, the box cover 2, the rotating assembly 3, the mounting frame 31, the swing motor 32, the rotating sleeve 33, the first rotating rod 34, the second rotating rod 35, the universal ball 36, the swing fan 37, the dust removal assembly 4, the moving plate 41, the rotating screw rod 42, the rotating motor 43, the dust removal rod 44, the dust suction pipe 45, the dust suction nozzle 46, the heat dissipation assembly 5, the heat dissipation member 51, the heat dissipation fan 511, the heat dissipation member 52, the annular heat dissipation pipe 521, the refrigeration box 522, the delivery pump 523, the refrigeration piece 524, and.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description of the present invention, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.
Referring to fig. 1 to 9, the present invention provides a heat dissipation apparatus for a system integrated circuit board, including a mounting box 1, a box cover 2, a rotation component 3, a dust removal component 4 and a heat dissipation component 5, wherein the box cover 2 is disposed on the mounting box 1, the mounting box 1 is hinged to the box cover 2, a mounting plate 11 is disposed in the mounting box 1, the mounting plate 11 divides the mounting box 1 into a first accommodating cavity 12 and a second accommodating cavity 13, four rectangular supporting seats 6 are disposed on a side wall of the second accommodating cavity 13, a bottom of the mounting plate 11 is disposed on the four supporting seats 6, the rotation component 3 is disposed on the box cover 2, the rotation component 3 is rotatably connected to the box cover 2, the dust removal component 4 is disposed on the mounting box 1 and located in the first accommodating cavity 12, the dust removal component 4 is rotatably connected to the mounting box 1, the heat dissipation component 5 includes a heat dissipation member 51 and a heat dissipation member 52, the heat dissipation member 51 is arranged in the second accommodating cavity 13, the output end of the heat dissipation member 51 faces the bottom of the mounting plate 11, one end of the heat dissipation member 52 is arranged in the second accommodating cavity 13, and the other end of the heat dissipation member 52 is arranged on the mounting plate 11; four supporting seats 6 are used for installing mounting panel 11, the circuit board is fixed mounting on mounting panel 11 when using, when dispelling the heat to the circuit board, dust removal component 4 work carries out dust absorption and dust removal processing to the dust on the circuit board, after carrying out the dust absorption and removing dust, just there is not the accumulation of dust on the circuit board, when the circuit board uses, just can not cause radiating effect not good because of accumulating the dust on the circuit board, after clearing up the dust, radiating piece 51 and heat extraction 52 simultaneous working carry out the heat dissipation operation to the circuit board on mounting panel 11, rotate motor 43 work and carry out further heat dissipation operation to the circuit board in the radiating while, case lid 2 can be opened when using, circuit board on mounting panel 11 is examined and is maintained.
The rotating assembly 3 comprises an installation frame 31, a swing motor 32, a rotating sleeve 33, a first rotating rod 34, a second rotating rod 35, a universal ball 36 and a swing fan 37, wherein the swing motor 32 is arranged at the top of the box cover 2 and vertically and downwards arranged on an output shaft of the swing motor 32, the rotating sleeve 33 is arranged on the output shaft of the swing motor 32, the installation frame 31 is arranged on the inner side wall of the box cover 2, the universal ball 36 is arranged at the bottom of the installation frame 31 and is rotationally connected with the installation frame 31, one end of the first rotating rod 34 is connected with the universal ball 36, the swing fan 37 is arranged at the other end of the first rotating rod 34, the second rotating rod 35 is in an L-shaped arrangement, one end of the second rotating rod 35 is fixedly connected with the rotating sleeve 33, and the other end of the second rotating rod 35 is arranged on the first rotating rod 34; when dispelling the heat to the circuit board, swing motor 32 rotates and drives rotation sleeve 33 and rotate, rotation sleeve 33 rotates and drives and rotate on case lid 2, rotation sleeve 33 rotates and drives second dwang 35 and rotates, second dwang 35 rotates and drives first dwang 34 and rotate on installing frame 31 through universal ball 36, first dwang 34 rotates and drives swing fan 37 and rotate the operation of dispelling the heat to the circuit board on the mounting panel 11, swing motor 32 work drives swing fan 37 and rotates and can realize the even transport to the circuit board with swing fan 37 exhaust wind, realize the even heat dissipation operation of circuit board.
The dust removing assembly 4 comprises a moving plate 41, two rotating screw rods 42, two rotating motors 43 and a plurality of dust removing rods 44, wherein the two rotating screw rods 42 are symmetrically arranged on the installation box 1, the two rotating screw rods 42 are rotationally connected with the installation box 1, the two rotating motors 43 are symmetrically arranged on the side wall of the installation box 1, output shafts of the two rotating motors 43 are respectively and fixedly connected with the two rotating screw rods 42, the moving plate 41 is arranged on the two rotating screw rods 42, the moving plate 41 is in threaded connection with the two rotating screw rods 42, threaded holes in threaded connection with the two rotating screw rods 42 are formed in the moving plate 41, a moving groove 16 matched with the moving plate 41 in a sliding manner is formed in the inner wall of the first accommodating cavity 12, the plurality of dust removing rods 44 are arranged at the bottom of the moving plate 41 at equal intervals, and the plurality of dust removing rods 44 are all made of rubber, the lower end of each dust removal rod 44 is provided with a dust removal sticker; dust removal pole 44 that the rubber material was made can not cause the damage to the circuit board when removing, carry out long-time work back at the circuit board, there is a large amount of dusts on the circuit board, the accumulation of dust can influence the heat dissipation operation of circuit board, two rotate motor 43 work and drive two rotation lead screws 42 and rotate, two rotate lead screw 42 and rotate and drive movable plate 41 and remove in the shifting chute 16, movable plate 41 removes and drives a plurality of dust removal poles 44 and removes, a plurality of dust removal poles 44 remove and drive a plurality of dust removal pastes and remove, a plurality of dust removal pastes the dust removal operation of removing dust on the circuit board, after removing dust, just can not have the accumulation of dust on the circuit board, when the circuit board carries out the use, just can not cause radiating effect not good owing to the accumulation dust on the circuit board.
A plurality of dust suction pipes 45 arranged at equal intervals are arranged at the bottom of the moving plate 41, and a dust suction nozzle 46 communicated with the dust suction pipes 45 is arranged at the bottom of each dust suction pipe 45; when the moving plate 41 moves, the moving plate 41 drives the dust suction pipes 45 to move, and the dust suction pipes 45 move to drive the dust suction nozzles 46 to move to suck dust on the circuit board, so that dust residues on the circuit board are prevented from being cleaned comprehensively.
The mounting plate 11 is provided with a plurality of heat dissipation holes 111, the mounting plate 11 is provided with a mounting groove 112 for mounting the heat dissipation member 52, the mounting plate 11 is further provided with a plurality of heat dissipation fins 113 arranged in the mounting groove 112, and the mounting plate 11 is provided with four mounting holes 114 distributed in a rectangular shape; the heat dissipation holes 111 on the mounting plate 11 perform heat dissipation operations on the bottom of the circuit board, the heat dissipation fins 113 perform heat dissipation operations on the circuit board, and the four mounting holes 114 can fix the circuit board on the mounting plate 11.
The heat sink 51 comprises two heat dissipation fans 511, the two heat dissipation fans 511 are symmetrically arranged at the bottom of the second accommodating cavity 13, and the output ends of the two heat dissipation fans 511 face the bottom of the mounting plate 11; when the circuit board is cooled, the two cooling fans 511 operate to cool the circuit board, and the cooling holes 111 convey air to the lower side of the circuit board to cool the circuit board.
The heat discharging element 52 comprises an annular heat radiating pipe 521, a refrigerating box 522, a conveying pump 523 and a plurality of refrigerating sheets 524, the annular heat radiating pipe 521 is arranged in the mounting groove 112 in the mounting plate 11, the annular heat radiating pipe 521 is horizontally arranged in the mounting groove 112, the refrigerating box 522 is arranged at the bottom of the second accommodating cavity 13, the plurality of refrigerating sheets 524 are arranged in the refrigerating box 522 at equal intervals, the conveying pump 523 is arranged at the side of the refrigerating box 522, the refrigerating box 522 and the conveying pump 523 are connected through a hose, one end of the annular heat radiating pipe 521 is communicated with the conveying pump 523, and the other end of the annular heat radiating pipe 521 is communicated with the refrigerating box 522; when dispelling the heat, the work of delivery pump 523 is extracted the water in with refrigeration case 522 through the hose, and the water of a plurality of refrigeration piece 524 work in the refrigeration case 522 is refrigerated the water in refrigeration case 522, carry water to annular cooling tube 521 after with the water extraction in, the water of annular cooling tube 521 dispels the heat the operation to the circuit board, and annular cooling tube 521 carries water to refrigeration case 522 in dispelling the heat, and refrigeration piece 524 carries out the refrigeration operation to water.
A plurality of heat discharging holes 14 are formed in the side wall of the installation box 1, and a wire outlet hole 15 is formed in the side wall of one side of the installation box 1; the heat dissipation holes 14 can dissipate heat generated by the operation of the circuit board in the installation box 1, and the wire outlet holes 15 can convey a plurality of wires on the circuit board outwards through the wire outlet holes 15.
The working principle of the invention is as follows: when the dust removing device is used, after a circuit board works for a long time, a large amount of dust is generated on the circuit board, the accumulation of the dust can influence the heat dissipation operation of the circuit board, the two rotating motors 43 work to drive the two rotating screw rods 42 to rotate, the two rotating screw rods 42 rotate to drive the movable plate 41 to move in the movable groove 16, the movable plate 41 moves to drive the dust removing rods 44 to move, the dust removing rods 44 move to drive the dust removing pastes to move, the dust removing pastes move to remove dust on the circuit board, no dust is accumulated on the circuit board after dust removal, when the circuit board is used, the heat dissipation effect on the circuit board is not good due to the accumulated dust, the normal operation of the circuit board is not influenced, when the movable plate 41 moves, the movable plate 41 drives the dust removing pipes 45 to move, and the dust removing pipes 45 move to drive the dust removing nozzles 46 to move to remove dust on the circuit, prevent some dust residual places on the circuit board from carrying out comprehensive cleaning operation, when the circuit board is radiated, the swing motor 32 rotates to drive the rotating sleeve 33 to rotate, the rotating sleeve 33 rotates to drive the box cover 2 to rotate, the rotating sleeve 33 rotates to drive the second rotating rod 35 to rotate, the second rotating rod 35 rotates to drive the first rotating rod 34 to rotate on the mounting frame 31 through the universal ball 36, the first rotating rod 34 rotates to drive the swing fan 37 to rotate to radiate the circuit board on the mounting plate 11, the swing motor 32 works to drive the swing fan 37 to rotate so as to uniformly convey the air discharged by the swing fan 37 to the circuit board, thereby realizing uniform radiating operation of the circuit board, when the circuit board is radiated, the two radiating fans 511 work to radiate the circuit board, the plurality of radiating holes 111 convey the air to the lower part of the circuit board to radiate the circuit board, when dispelling the heat, the work of delivery pump 523 is extracted the water in with refrigeration case 522 through the hose, and the water of a plurality of refrigeration piece 524 work in the refrigeration case 522 is refrigerated the water in refrigeration case 522, carry water to annular cooling tube 521 after with the water extraction in, the water of annular cooling tube 521 dispels the heat the operation to the circuit board, and annular cooling tube 521 carries water to refrigeration case 522 in dispelling the heat, and refrigeration piece 524 carries out the refrigeration operation to water.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (6)
1. The heat dissipation device of the system integrated circuit board is characterized by comprising an installation box (1), a box cover (2), a rotating assembly (3), a dust removal assembly (4) and a heat dissipation assembly (5), wherein the box cover (2) is arranged on the installation box (1), the installation box (1) is hinged with the box cover (2), an installation plate (11) is arranged in the installation box (1), the installation box (1) is divided into a first accommodating cavity (12) and a second accommodating cavity (13) by the installation plate (11), four support seats (6) which are arranged in a rectangular shape are arranged on the side wall of the second accommodating cavity (13), the bottom of the installation plate (11) is arranged on the four support seats (6), the rotating assembly (3) is arranged on the box cover (2), the rotating assembly (3) is rotatably connected with the box cover (2), the dust removal assembly (4) is arranged on the installation box (1) and is positioned in the first accommodating cavity (12), the dust removal assembly (4) is rotatably connected with the mounting box (1), the heat dissipation assembly (5) comprises a heat dissipation member (51) and a heat exhaust member (52), the heat dissipation member (51) is arranged in the second accommodating cavity (13), the output end of the heat dissipation member (51) faces the bottom of the mounting plate (11), one end of the heat exhaust member (52) is arranged in the second accommodating cavity (13), and the other end of the heat exhaust member (52) is arranged on the mounting plate (11);
rotating assembly (3) includes installing frame (31), swing motor (32), rotation sleeve (33), first rotation pole (34), second rotation pole (35), universal ball (36) and swing fan (37), swing motor (32) set up at the top of case lid (2) and the vertical downward setting of output shaft of swing motor (32), rotation sleeve (33) sets up on the output shaft of swing motor (32), installing frame (31) sets up on the inside lateral wall of case lid (2), universal ball (36) set up in the bottom of installing frame (31) and rotate with installing frame (31) and be connected, the one end and the universal ball (36) of first rotation pole (34) are connected, swing fan (37) set up the other end at first rotation pole (34), second rotation pole (35) are the setting of L type, the one end and the rotation sleeve (33) fixed connection of second rotation pole (35), the other end of the second rotating rod (35) is arranged on the first rotating rod (34);
the dust removal assembly (4) comprises a moving plate (41), two rotating screw rods (42), two rotating motors (43) and a plurality of dust removal rods (44), wherein the two rotating screw rods (42) are symmetrically arranged on the installation box (1), the two rotating screw rods (42) are rotationally connected with the installation box (1), the two rotating motors (43) are symmetrically arranged on the side wall of the installation box (1), the output shafts of the two rotating motors (43) are respectively and fixedly connected with the two rotating screw rods (42), the moving plate (41) is arranged on the two rotating screw rods (42), the moving plate (41) is in threaded connection with the two rotating screw rods (42), threaded holes in threaded connection with the two rotating screw rods (42) are formed in the moving plate (41), a moving groove (16) in sliding fit with the moving plate (41) is formed in the inner wall of the first accommodating cavity (12), the dust removing rods (44) are arranged at the bottom of the moving plate (41) at equal intervals, the dust removing rods (44) are made of rubber materials, and dust removing paste is arranged at the lower end of each dust removing rod (44).
2. The heat dissipating device of a system on board as claimed in claim 1, wherein: the bottom of the moving plate (41) is provided with a plurality of dust suction pipes (45) which are arranged at equal intervals, and the bottom of each dust suction pipe (45) is provided with a dust suction nozzle (46) communicated with the dust suction pipe.
3. The heat dissipating device of a system on board as claimed in claim 1, wherein: be equipped with a plurality of louvres (111) on mounting panel (11), be equipped with mounting groove (112) that supply heat extraction spare (52) to install on mounting panel (11), still be equipped with a plurality of fin (113) of setting in mounting groove (112) on mounting panel (11), be equipped with four mounting hole (114) that are the rectangle and distribute on mounting panel (11).
4. The heat dissipating device of a system on board as claimed in claim 1, wherein: the heat dissipation member (51) comprises two heat dissipation fans (511), the two heat dissipation fans (511) are symmetrically arranged at the bottom of the second accommodating cavity (13), and the output ends of the two heat dissipation fans (511) face the bottom of the mounting plate (11).
5. The heat dissipation device of claim 4, wherein: heat dissipation spare (52) include annular cooling tube (521), refrigeration case (522), delivery pump (523) and a plurality of refrigeration piece (524), annular cooling tube (521) set up in mounting groove (112) in mounting panel (11), annular cooling tube (521) level sets up in mounting groove (112), refrigeration case (522) set up the bottom that holds chamber (13) at the second, and is a plurality of refrigeration piece (524) equidistant setting is in refrigeration case (522), delivery pump (523) set up the side in refrigeration case (522), be connected through the hose between refrigeration case (522) and delivery pump (523), the one end and the delivery pump (523) of annular cooling tube (521) are linked together, the other end and the refrigeration case (522) of annular cooling tube (521) are linked together.
6. The heat dissipating device of a system on board as claimed in claim 1, wherein: the side wall of the installation box (1) is provided with a plurality of heat discharging holes (14), and the side wall of one side of the installation box (1) is provided with a wire outlet hole (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910792332.0A CN110491844B (en) | 2019-08-26 | 2019-08-26 | Heat radiator for system integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910792332.0A CN110491844B (en) | 2019-08-26 | 2019-08-26 | Heat radiator for system integrated circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
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| CN111530115A (en) * | 2020-01-10 | 2020-08-14 | 爱景节能科技（上海）有限公司 | Double-frequency-conversion plate type heat exchange cold dryer and control method thereof |
| CN112506326B (en) * | 2020-12-25 | 2022-06-24 | 广东视控达智能科技有限公司 | Heat abstractor is used in computer maintenance |
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| CN208207672U (en) * | 2018-03-28 | 2018-12-07 | 河北工业职业技术学院 | A kind of computer mainframe box with dustproof effect |
| CN108922874B (en) * | 2018-06-26 | 2020-06-12 | 温州亚宣飞机械科技有限公司 | Heat radiator for system integrated circuit board |
| CN208423850U (en) * | 2018-06-27 | 2019-01-22 | 苏州中品电子有限公司 | A kind of Table top type charger built-in dust-extraction unit |
| CN208402296U (en) * | 2018-07-20 | 2019-01-18 | 深圳市畅新达电子有限公司 | One kind having fixed moisture-proof inscription plate electronic equipment |
| CN210983265U (en) * | 2020-03-21 | 2020-07-10 | 深圳市宇光科技有限公司 | Computer motherboard easy to dissipate heat |
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Effective date of registration: 20210118 Address after: No.1 Yongjin Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Applicant after: Jiangxi Weigao Electronic Technology Co.,Ltd. Address before: Room 1802, unit 2, building 17, Baizhuang Guandi community, Jiujiang District, Wuhu City, Anhui Province 241000 Applicant before: Tang Wei |
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Address after: No.1 Yongjin Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee after: Jiangxi weiergao Electronics Co., Ltd Address before: No.1 Yongjin Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: Jiangxi weiergao Electronic Technology Co., Ltd |
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