CN214481932U - Data center computer lab cooling system - Google Patents
Data center computer lab cooling system Download PDFInfo
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- CN214481932U CN214481932U CN202023102865.9U CN202023102865U CN214481932U CN 214481932 U CN214481932 U CN 214481932U CN 202023102865 U CN202023102865 U CN 202023102865U CN 214481932 U CN214481932 U CN 214481932U
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- 238000001816 cooling Methods 0.000 title claims abstract description 137
- 239000007788 liquid Substances 0.000 claims abstract description 152
- 239000000110 cooling liquid Substances 0.000 claims description 19
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 239000002826 coolant Substances 0.000 claims description 14
- 238000005057 refrigeration Methods 0.000 claims description 11
- 238000005507 spraying Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005192 partition Methods 0.000 claims description 7
- 238000004378 air conditioning Methods 0.000 claims description 3
- 238000005265 energy consumption Methods 0.000 abstract description 4
- 239000007921 spray Substances 0.000 description 6
- 238000010622 cold drawing Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000007654 immersion Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
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Abstract
The utility model discloses a data center computer lab cooling system, including the computer lab, be located liquid cooling rack, refrigerating system and the control system of computer lab, refrigerating system includes air conditioner refrigerating system, cooling tower refrigerating system and new trend system, control system links to each other with air conditioner refrigerating system, cooling tower refrigerating system and new trend system respectively. The utility model discloses set up the liquid cooling rack in the computer lab, the liquid cooling rack is not high to computer lab ambient temperature requirement, and computer lab ambient temperature can be improved to 40 ℃ by original 23 ℃, consequently, computer lab ambient temperature only needs to keep just can satisfy the normal operating of server in the rack at 40 ℃, has so significantly reduced computer lab cooling system's air conditioner use amount. The utility model discloses an air conditioner refrigerating system, cooling tower refrigerating system and new trend system dispel the heat to the computer lab environment, and control system can control these three kinds of refrigerating system of this kind and move under the different situation according to actual conditions, reduces the energy consumption, improves the radiating efficiency.
Description
Technical Field
The utility model relates to a data center computer lab cooling system.
Background
With the rapid development of the computer communication industry and the electronic industry, the integration density and the processing capacity of the server are gradually improved, the power consumption of the server is rapidly increased, and the problem of heat dissipation of devices inside the server becomes a technical problem to be solved urgently. Due to the high heat carrying capacity of the liquid working medium, the liquid cooling heat dissipation gradually replaces the traditional air cooling, and becomes the mainstream technology of heat dissipation of the server in the future. The liquid cooling heat dissipation adopts the direct contact with the chip of insulating coolant liquid, takes away chip used heat to carry out high-efficient thermal management to the chip.
Inside the traditional forced air cooling server sets up the chip radiator on the chip surface usually, expands the radiating surface of chip, increases the area of contact of chip and cold air to improve heat exchange efficiency. Traditional air cooling machine room has higher requirement on the whole temperature of the machine room, requires to be constant at 23 +/-1 ℃ all the year round, can meet the heat dissipation requirement on a server, mainly depends on an air conditioner to carry out environmental refrigeration, and thus the energy consumption of the machine room is high.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a data center computer lab cooling system that the energy consumption is few, the radiating efficiency is high.
The above object of the present invention is achieved by the following technical measures: the utility model provides a data center computer lab cooling system, its characterized in that, it includes the computer lab, is located the liquid cooling rack, refrigerating system and the control system of computer lab, refrigerating system includes air conditioner refrigerating system, cooling tower refrigerating system and new trend system, control system links to each other with air conditioner refrigerating system, cooling tower refrigerating system and new trend system respectively.
The utility model discloses set up the liquid cooling rack in the computer lab, the liquid cooling rack is not high to computer lab ambient temperature requirement, and computer lab ambient temperature can be improved to 40 ℃ by original 23 ℃, consequently, computer lab ambient temperature only needs to keep just can satisfy the normal operating of server in the rack at 40 ℃, has so significantly reduced computer lab cooling system's air conditioner use amount.
The utility model discloses an air conditioner refrigerating system, cooling tower refrigerating system and new trend system dispel the heat to the computer lab environment, and these three kinds of refrigerating system can move under the different situation. When the liquid cooling rack during operation, the heat of server discharges in the computer lab, leads to computer lab ambient temperature to rise, and the refrigerating system of computer lab can start through control system, cools down to the computer lab, and the heat is finally discharged in the atmosphere, has realized the cooling purpose to server in computer lab and the computer lab. When the environmental temperature of the machine room is less than or equal to a set temperature (for example 38 ℃), the control system controls to start the fresh air system to cool; when the environmental temperature of the machine room is higher than the set temperature, the control system controls to start the cooling tower refrigeration system to cool; the air conditioning system is mainly used for cooling the machine room when a person maintains the system, so that the control system can control the three refrigeration systems to operate under different conditions according to actual conditions, the energy consumption is reduced, and the heat dissipation efficiency is improved.
Liquid cooling rack includes the cabinet body and installs a plurality of integral type liquid cooling servers at the cabinet is internal, integral type liquid cooling server arranges the multilayer on vertical, integral type liquid cooling server includes airtight shell, liquid cooling structure, the device that generates heat, radiator and fan, the radiator constitutes circulation circuit through liquid inlet pipe way and drain pipe and liquid cooling structural connection respectively, the inner space partition of airtight shell is two cavities, is liquid cooling room and coolant liquid radiating chamber respectively, the device that generates heat and liquid cooling structure are located the liquid cooling room, radiator and fan are located the coolant liquid radiating chamber, it has air intake and air outlet to open respectively on coolant liquid radiating chamber and the cabinet body.
The liquid cooling structure is the cold drawing, the cold drawing contacts with the device that generates heat, liquid inlet pipe and drain pipe link to each other with the cold drawing respectively.
The liquid cooling structure includes the liquid cooling room and fills the coolant liquid that the indoor submergence of liquid cooling generates heat the device, just have the space between the liquid level of coolant liquid and the top surface of liquid cooling room, the liquid inlet pipe way is connected with the upper portion of liquid cooling room and communicates with this space, the liquid outlet pipe way is connected with the bottom of liquid cooling room.
The liquid cooling structure includes the liquid cooling room and is full of the coolant liquid of liquid cooling room, the liquid inlet pipe way is connected with the upper portion of liquid cooling room, the liquid outlet pipe way is connected with the bottom of liquid cooling room.
The liquid cooling structure includes the liquid cooling room and locates the board that sprays of liquid cooling room top surface, it has the hole of spraying to spray board cavity and its bottom surface and open, the liquid inlet pipe way with the board that sprays is connected, the liquid outlet pipe way is connected with the bottom of liquid cooling room.
Airtight shell is the cuboid, liquid cooling room and coolant liquid heat dissipation room arrange side by side and separate by the baffle, the fan is towards the baffle, the both sides wall of coolant liquid heat dissipation room is opened respectively has the air intake, it has the air outlet to open on the lateral wall that coolant liquid heat dissipation room and baffle are relative, it has air intake and the air outlet corresponding with the air intake and the air outlet of coolant liquid heat dissipation room to open on the cabinet body.
Compared with the prior art, the utility model discloses the effect that is showing as follows has:
the utility model discloses it is not high to the computer lab ambient temperature requirement, adopt air conditioner refrigerating system, cooling tower refrigerating system and new trend system to dispel the heat to the computer lab environment, these three kinds of refrigerating system can move under the different situation, have replaced the full air conditioner refrigeration requirement of preceding air-cooled mode, and it is power consumptive to have significantly reduced the computer lab, has improved the radiating efficiency.
Do a good deal of the utility model discloses only need adopt the liquid cooling server, and need not adjust other facilities of computer lab, more be favorable to the construction and the implementation of computer lab.
The utility model discloses can reduce system's fault area, the trouble is locked on single liquid cooling server, can be faster, more accurate find the problem point.
The utility model discloses can be applied to all kinds of IDC computer rooms, edge computer room, communication computer lab, communication base station, outdoor rack, outdoor base station etc. and the application place is extensive.
Drawings
The present invention will be described in further detail with reference to the following drawings and specific embodiments.
Fig. 1 is a plan view of embodiment 1 of the present invention;
fig. 2 is a side view of the integrated liquid cooling cabinet according to embodiment 1 of the present invention;
fig. 3 is a top view of the integrated liquid cooling cabinet according to embodiment 1 of the present invention;
fig. 4 is a side view of a liquid cooling server according to embodiment 1 of the present invention;
fig. 5 is a side view of a liquid cooling server according to embodiment 2 of the present invention;
fig. 6 is a side view of a liquid cooling server according to embodiment 3 of the present invention;
fig. 7 is a side view of a liquid cooling server according to embodiment 4 of the present invention.
Detailed Description
Example 1
As shown in fig. 1-4, be the utility model relates to a data center computer lab cooling system, it includes computer lab 1, is located the liquid cooling rack 2, refrigerating system and the control system of 1 multirow in computer lab, and refrigerating system includes air conditioner refrigerating system 3, cooling tower refrigerating system 4 and new trend system 5, and control system links to each other with air conditioner refrigerating system 3, cooling tower refrigerating system 4 and new trend system 5 respectively.
The liquid cooling cabinet 2 comprises a cabinet body 6 and a plurality of integrated liquid cooling servers 7 installed in the cabinet body 6 through a rack, the integrated liquid cooling servers 7 are vertically distributed in multiple layers, each integrated liquid cooling server 7 comprises a rectangular closed shell 8, a liquid cooling structure, a heating device 9, a radiator 10 and a fan 11, the radiator 10 is connected with the liquid cooling structure through a liquid inlet pipeline 12 and a liquid outlet pipeline 13 to form a circulation loop, the inner space of the closed shell 8 is divided into two chambers which are distributed in parallel by a partition plate 18, the two chambers are respectively a liquid cooling chamber 14 and a cooling liquid radiating chamber 15, the heating device 9 and the liquid cooling structure are located in the liquid cooling chamber 14, the radiator 10 and the fan 11 are located in the cooling liquid radiating chamber 15, the fan 11 faces the partition plate 18, air inlets 22 are formed in two side walls of the cooling liquid radiating chamber 15 respectively, air outlets 23 are formed in the side walls of the cooling liquid radiating chamber 15 opposite to the partition plate 18, the cabinet body 6 is provided with an air inlet and an air outlet which correspond to the air inlet and the air outlet of the cooling liquid heat dissipation chamber 15. The embodiment adopts the liquid cooling mode of spraying, and the liquid cooling structure includes liquid cooling chamber 14 and locates the spray plate 21 of 14 top surfaces of liquid cooling chamber, and spray plate 21 cavity and its bottom surface are opened and are had spraying hole 24, and the exit linkage of the one end of feed liquor pipeline 12 and radiator 10, the other end and spray plate 21 are connected, and drain pipe 13 is connected with the bottom of liquid cooling chamber 14, and the import of radiator 10 is connected through circulating pump 17 to the rethread. The cooling liquid 19 is sprayed onto the heating device 9 from the spraying holes of the spraying plate 21, flows to the radiator 10 from the liquid outlet pipeline 13 after taking away the heat of the heating device 9, is radiated by the fan 11, then flows to the liquid inlet pipeline 12, and circulates in the way.
Example 2
As shown in fig. 5, the difference between this embodiment and embodiment 1 is that the liquid cooling structure is different, the liquid cooling structure in this embodiment is a cold plate 16, the cold plate 16 is in contact with the heat generating device 9, the liquid inlet pipe 12 is connected to the outlet of the heat sink 10 and the inlet of the cold plate 16, one end of the liquid outlet pipe 13 is connected to the outlet of the cold plate 16, and the other end is connected to the inlet of the heat sink 10 through a circulating pump 17. The cooling liquid 19 exchanges heat with the heating device 9 in the cold plate 16, flows from the liquid outlet pipeline 13 to the radiator 10 after taking away the heat of the heating device 9, is radiated by the fan 11, then flows to the liquid inlet pipeline 12, and circulates in the way.
Example 3
As shown in fig. 6, the present embodiment is different from embodiment 1 in a liquid cooling structure, and the present embodiment adopts a semi-immersion flowing liquid cooling mode, the liquid cooling structure includes a liquid cooling chamber 14 and a cooling liquid 19 filled in the liquid cooling chamber 14 and immersing the heat generating device 9, a gap 20 is provided between a liquid level of the cooling liquid 19 and a top surface of the liquid cooling chamber 14, a liquid inlet pipe 12 is connected with an upper portion of the liquid cooling chamber 14 and is communicated with the gap 20, and a liquid outlet pipe 13 is connected with a bottom portion of the liquid cooling chamber 14. The cooling liquid 19 carries away the heat of the heat generating device 9, flows from the liquid outlet pipe 13 to the radiator 10, is radiated by the fan 11, then flows to the liquid inlet pipe 12, and circulates in this way.
Example 4
As shown in fig. 7, the difference between this embodiment and embodiment 1 lies in that the liquid cooling structure is different, and this embodiment adopts an immersion flowing liquid cooling method, and the liquid cooling structure includes a liquid cooling chamber 14 and a cooling liquid 19 filled in the liquid cooling chamber 14, the liquid inlet pipe 12 is connected to the upper portion of the liquid cooling chamber 14, and the liquid outlet pipe 13 is connected to the bottom of the liquid cooling chamber 14. The cooling liquid 19 carries away the heat of the heat generating device 9, flows from the liquid outlet pipe 13 to the radiator 10, is radiated by the fan 11, then flows to the liquid inlet pipe 12, and circulates in this way.
The embodiments of the present invention are not limited to the above, and according to the above-mentioned contents of the present invention, according to the common technical knowledge and the conventional means in the field, the liquid cooling structure of the present invention has other embodiments, therefore, the present invention can also make other modifications, replacements or changes in various forms, all falling within the scope of the present invention.
Claims (7)
1. The utility model provides a data center computer lab cooling system which characterized in that: the air-cooling refrigeration system comprises a machine room, a liquid-cooling cabinet positioned in the machine room, a refrigeration system and a control system, wherein the refrigeration system comprises an air-conditioning refrigeration system, a cooling tower refrigeration system and a fresh air system, and the control system is respectively connected with the air-conditioning refrigeration system, the cooling tower refrigeration system and the fresh air system.
2. The data center room cooling system of claim 1, wherein: the liquid cooling rack includes the cabinet body and installs a plurality of integral type liquid cooling servers at the internal cabinet, integral type liquid cooling server arranges the multilayer on vertical, integral type liquid cooling server includes airtight shell, liquid cooling structure, device, radiator and fan generate heat, the radiator constitutes circulation circuit through inlet line and drain pipe and liquid cooling structural connection respectively, the inner space of airtight shell is for two cavities, is liquid cooling room and coolant liquid radiating chamber respectively, device and liquid cooling structure that generate heat are located the liquid cooling room, radiator and fan are located the coolant liquid radiating chamber, it has air intake and air outlet to open respectively on coolant liquid radiating chamber and the cabinet body.
3. The data center room cooling system of claim 2, wherein: the liquid cooling structure is a cold plate, the cold plate is in contact with the heating device, and the liquid inlet pipeline and the liquid outlet pipeline are respectively connected with the cold plate.
4. The data center room cooling system of claim 2, wherein: the liquid cooling structure comprises a liquid cooling chamber and cooling liquid filled in the liquid cooling chamber for immersing the heating device, a gap is formed between the liquid level of the cooling liquid and the top surface of the liquid cooling chamber, the liquid inlet pipeline is connected with the upper part of the liquid cooling chamber and communicated with the gap, and the liquid outlet pipeline is connected with the bottom of the liquid cooling chamber.
5. The data center room cooling system of claim 2, wherein: the liquid cooling structure comprises a liquid cooling chamber and cooling liquid filled in the liquid cooling chamber, the liquid inlet pipeline is connected with the upper portion of the liquid cooling chamber, and the liquid outlet pipeline is connected with the bottom of the liquid cooling chamber.
6. The data center room cooling system of claim 2, wherein: the liquid cooling structure comprises a liquid cooling chamber and a spraying plate arranged on the top surface of the liquid cooling chamber, the spraying plate is hollow, the bottom surface of the spraying plate is provided with spraying holes, the liquid inlet pipeline is connected with the spraying plate, and the liquid outlet pipeline is connected with the bottom of the liquid cooling chamber.
7. The data center room cooling system according to any one of claims 2 to 6, wherein: the sealed shell is a rectangular body, the liquid cooling chamber and the cooling liquid heat dissipation chamber are arranged side by side and are separated by the partition plate, the fan faces the partition plate, air inlets are formed in two side walls of the cooling liquid heat dissipation chamber respectively, air outlets are formed in the side walls, opposite to the partition plate, of the cooling liquid heat dissipation chamber, and air inlets and air outlets corresponding to the air inlets and the air outlets of the cooling liquid heat dissipation chamber are formed in the cabinet body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023102865.9U CN214481932U (en) | 2020-12-21 | 2020-12-21 | Data center computer lab cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023102865.9U CN214481932U (en) | 2020-12-21 | 2020-12-21 | Data center computer lab cooling system |
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| Publication Number | Publication Date |
|---|---|
| CN214481932U true CN214481932U (en) | 2021-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023102865.9U Active CN214481932U (en) | 2020-12-21 | 2020-12-21 | Data center computer lab cooling system |
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| CN (1) | CN214481932U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490392A (en) * | 2021-06-18 | 2021-10-08 | 杭州华宏通信设备有限公司 | Intelligent DC cabin with energy-saving cooling function |
| CN114828515A (en) * | 2022-03-08 | 2022-07-29 | 上海艾涛信息科技发展有限公司 | Data center computer room cooling system |
-
2020
- 2020-12-21 CN CN202023102865.9U patent/CN214481932U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113490392A (en) * | 2021-06-18 | 2021-10-08 | 杭州华宏通信设备有限公司 | Intelligent DC cabin with energy-saving cooling function |
| CN114828515A (en) * | 2022-03-08 | 2022-07-29 | 上海艾涛信息科技发展有限公司 | Data center computer room cooling system |
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Effective date of registration: 20240722 Granted publication date: 20211022 |