CN214841898U

CN214841898U - Semiconductor refrigerator capable of efficiently dissipating cold

Info

Publication number: CN214841898U
Application number: CN202121306538.7U
Authority: CN
Inventors: 吴业和; 代周兴; 陈志满; 梁立昶
Original assignee: Foshan Shunde Dapan Electrical Appliance Industry Co ltd
Current assignee: Foshan Shunde Dapan Electrical Appliance Industry Co ltd
Priority date: 2021-06-10
Filing date: 2021-06-10
Publication date: 2021-11-23
Anticipated expiration: 2031-06-10

Abstract

The utility model discloses a high-efficiency cooling semiconductor refrigerator, which comprises a shell, an inner container, a semiconductor refrigeration assembly and a cooling plate connected with the semiconductor refrigeration assembly, wherein the cooling plate is arranged in the inner container and is separately arranged from the inner wall of the inner container so as to divide the inner container into a storage cavity and a cooling cavity between the cooling plate and the inner container; the cooling plate is provided with a plurality of through holes which are respectively communicated with the cooling cavity and the storage cavity; the utility model discloses a cold drawing will the inner bag is separated into storing chamber and is located cold drawing looses with loose cold chamber between the inner bag for loose cold drawing can be through the mode of just, reverse side to storing chamber and the cold chamber transmission cold volume that looses, loose to be equipped with on the cold drawing a plurality of with loose cold chamber with the through-hole of storing chamber intercommunication can be with higher speed loose the air convection in cold chamber and storing chamber, increases the area of contact with the air, improves scattered cold effect and the cold efficiency that looses.

Description

Semiconductor refrigerator capable of efficiently dissipating cold

Technical Field

The utility model belongs to the technical field of the household electrical appliances technique and specifically relates to a semiconductor refrigerator of high-efficient scattered cold is related to.

Background

The refrigerator refrigerates through the semiconductor refrigeration module who sets up in the shell, and wherein, semiconductor refrigeration module includes semiconductor chip and sets up respectively in the cold junction and the hot junction of semiconductor chip both sides, and the hot junction is used for exothermic, and the cold junction is inserted the storing intracavity from the inner bag rear side and is cooled down through leading the cold drawing to the storing chamber. In order to improve the cold rate that looses of cold junction in the storing intracavity, current semiconductor cold box can set up the fan at the storing intracavity usually, increases the air flow of storing intracavity through the fan to improve the cold rate that looses of cold junction in the storing intracavity, but add the fan and not only increase manufacturing cost, the noise that the fan produced is great moreover, leads to the refrigerator to produce the abnormal sound.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high-efficient cold semiconductor refrigerator that looses aims at solving the not good problem of cold effect that looses of the cold junction among the prior art.

The utility model provides a high-efficiency cooling semiconductor refrigerator, which comprises a shell, an inner container, a semiconductor refrigeration assembly and a cooling plate connected with the semiconductor refrigeration assembly, wherein the cooling plate is arranged in the inner container and is separately arranged from the inner wall of the inner container so as to divide the inner container into a storage cavity and a cooling cavity between the cooling plate and the inner container; the cooling plate is provided with a plurality of through holes, and the through holes are respectively communicated with the cooling cavity and the storage cavity.

In a preferred embodiment, the liner comprises a longitudinal surface arranged in parallel with the cold dissipation plate, a recessed portion protruding from the inside of the liner to the outside of the liner is arranged on the longitudinal surface, and the orthographic projection of the cold dissipation plate is positioned on the recessed portion; the cooling dissipation chamber is arranged between the cooling dissipation plate and the concave part.

In a preferred embodiment, the horizontal distance between the concave part and the cold dissipation plate is 6.5 mm-12 mm.

In a preferred embodiment, the cold dissipation plate is fixedly connected with the concave part through a locking piece.

In a preferred embodiment, the locking member is a screw.

In a preferred embodiment, the inner container further comprises two lateral surfaces connected with the left and right sides of the longitudinal surface; and a plurality of correspondingly arranged shelf placing grooves are formed in the two side surfaces and are respectively positioned on the two sides of the cold dispersing plate.

In a preferred embodiment, a safety distance is arranged between the tail ends of the shelf placing grooves and the plane of the cold dissipation plate.

In a preferred embodiment, a drain hole is formed in the inner container, the drain hole is located below the cold dissipation plate, and the drain hole is communicated with the storage cavity and the cold dissipation cavity.

In a preferred embodiment, a water guide portion protruding from the inside of the inner container to the outside of the inner container is provided below the recess portion, and the drain hole is provided in the water guide portion.

In a preferred embodiment, the through holes are uniformly distributed on the cold dissipation plate from top to bottom. Compared with the prior art, the utility model discloses following beneficial effect has:

the utility model discloses a high-efficiency cold-dissipating semiconductor refrigerator, which is connected with a cold dissipating plate through a semiconductor refrigeration component and is used for transferring cold energy to the cold dissipating plate, the cold dissipating plate is arranged in an inner container and is separately arranged with the inner wall of the inner container so as to divide the inner container into a storage cavity and a cold dissipating cavity between the cold dissipating plate and the inner container, so that the cold dissipating plate can transfer cold energy to the storage cavity and the cold dissipating cavity in a front-back mode; the cold dissipation plate is provided with a plurality of through holes communicated with the cold dissipation cavity and the storage cavity, so that air convection between the cold dissipation cavity and the storage cavity can be accelerated, and the contact area between the cold dissipation plate and air can be increased through the plurality of through holes, so that the cold dissipation area of the cold dissipation plate is increased, and the cold dissipation effect and the cold dissipation efficiency are improved; additionally, the utility model discloses a high-efficient cold semiconductor refrigerator that looses abandons the structure of adding the fan in the inner bag among the prior art, makes the utility model discloses a high-efficient cold semiconductor refrigerator that looses is quieter when using.

Drawings

FIG. 1 is a perspective view of a semiconductor refrigerator with efficient cold dissipation;

FIG. 2 is a front view of a semiconductor refrigerator with efficient cold dissipation;

FIG. 3 is a cross-sectional view of a semiconductor refrigerator with efficient cold dissipation;

fig. 4 is an enlarged schematic view of a in fig. 3.

In the drawings, the reference numerals are respectively as follows:

100-shell, 200-inner bag, 200 a-storage chamber, 200 b-cooling chamber, 210-longitudinal surface, 211-depressed part, 212-locking piece, 213-drain hole, 214-water guide part, 220-lateral surface, 221-shelf placing groove, 230-lower end surface, 300-semiconductor refrigeration component, 400-cooling board, 410-through hole.

Detailed Description

To further clarify the technical measures and effects taken by the present application to achieve the intended purpose, the following detailed description of specific embodiments, components, features and effects according to the present application will be made with reference to the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "an embodiment" refers to not necessarily the same embodiment. Furthermore, particular features, components, or characteristics of one or more embodiments may be combined in any suitable manner.

Referring to fig. 1 to 4, the present invention provides a semiconductor refrigerator with high efficiency cooling, including a housing 100, an inner container 200, a semiconductor refrigeration assembly 300, and a cooling plate 400 connected to the semiconductor refrigeration assembly 300, wherein the cooling plate 400 is disposed in the inner container 200 and is separated from an inner wall of the inner container 200, so as to divide the inner container 200 into a storage chamber 200a and a cooling chamber 200b located between the cooling plate 400 and the inner container 200; the cold dissipation plate 400 is provided with a plurality of through holes 410, and the plurality of through holes 410 are respectively communicated with the cold dissipation cavity 200b and the storage cavity 200 a.

The utility model discloses a semiconductor refrigeration subassembly 300 is connected with cold dissipation board 400 for to cold dissipation board 400 transmission cold volume, compare with the technical scheme that increases the air flow in the storing chamber through the fan of prior art, the cold dissipation board 400 of the utility model sets up in inner bag 200 and separately sets up with the inner wall of inner bag 200, in order to separate into storing chamber 200a and cold dissipation chamber 200b with inner bag 200 (the cold dissipation chamber is located between cold dissipation board 400 and inner bag 200), make cold dissipation board 400 can be through the mode of positive, reverse side to storing chamber 200a and cold dissipation chamber 200b transmission cold volume; moreover, the cooling plate of the utility model adopts innovative structural design, the cooling plate 400 is provided with a plurality of through holes 410 which are communicated with the cooling chamber 200b and the storage chamber 200a, the air convection between the cooling chamber 200b and the storage chamber 200a can be accelerated, and the cooling plate can also increase the contact area with the air through a plurality of through holes, thereby increasing the cooling area of the cooling plate and improving the cooling effect and the cooling efficiency; additionally, the utility model discloses a high-efficient cold semiconductor refrigerator that looses abandons the structure of adding the fan in the inner bag among the prior art, makes the utility model discloses a high-efficient cold semiconductor refrigerator that looses is quieter when using.

The semiconductor refrigeration assembly 300 has a cold end connected to the cold dissipation plate 400 in the inner container, and a hot end located outside the inner container for releasing heat to the outside environment, and the heat can be dissipated by arranging a radiator and/or a cooling fan.

Further, a heat preservation cavity (i.e. a foaming space in the prior art) is arranged between the casing 100 and the inner container 200, and the heat preservation cavity is filled with a foaming material for preserving heat of the inner container, so that the semiconductor refrigerator with high efficiency and cold dissipation has a good refrigerating effect.

In one embodiment, the liner 200 includes a longitudinal surface 210 disposed parallel to the cold dissipation plate 400, a recess 211 protruding from the inside of the liner 200 to the outside of the liner 200 is disposed on the longitudinal surface 210, and an orthographic projection of the cold dissipation plate 400 is located on the recess 211; the heat dissipation chamber 200b is disposed between the heat dissipation plate 400 and the recess 211. The utility model discloses a space is borrowed to the heat preservation chamber to the depressed part for the cold drawing that looses keeps the certain distance in order to form under the prerequisite in scattered cold chamber with the inner wall of inner bag, can not occupy the volume in original storing chamber again, has guaranteed that the storing chamber has sufficient storing space.

Further, the horizontal distance between the concave part 211 and the cold dissipation plate 400 is 6.5 mm-12 mm. The utility model discloses a with the depressed part 211 and the horizontal distance control between the cold drawing of loosing in 6.5mm ~12mm, can not occupy the volume in original storing chamber when forming the cold chamber of loosing, guaranteed that the storing chamber has sufficient storing space.

In an embodiment, the cold dissipation plate 400 is fixedly connected with the concave part 211 through a locking member 212, and the cold dissipation plate of the present invention is fixedly connected with the concave part through the locking member, so as to ensure the installation stability of the cold dissipation plate.

Furthermore, the cold dissipation plate is a rectangular metal plate, the locking pieces are fixedly installed at four corner positions of the cold dissipation plate, and the locking pieces are matched with the fastening pieces which are positioned in the middle of the cold dissipation plate and used for fixing the cold dissipation plate on the semiconductor refrigeration assembly, so that the installation stability of the cold dissipation plate is guaranteed, and the stress balance of the cold dissipation plate is also guaranteed.

In one embodiment, the locking member 212 is a screw, and a screw head of the screw is disposed on the cold plate, so as to facilitate installation, disassembly, and maintenance.

In one embodiment, the inner container 200 further comprises two lateral surfaces 220 connected to left and right sides of the longitudinal surface 210; a plurality of correspondingly arranged shelf placing grooves 221 are formed in the two lateral surfaces 220, and the shelf placing grooves 221 are respectively located on two sides of the cold dissipation plate 400. The utility model discloses a plurality of the shelf standing groove cooperates with the shelf, assembles the shelf standing groove with the shelf on, can carry out layer-stepping management to the storing chamber.

In an embodiment, a safety distance is provided between the end of the plurality of shelf slots 221 (the end refers to the end of the shelf slot close to the cold plate) and the plane where the cold plate is located.

In one embodiment, a drainage hole 213 is formed in the inner container 200, the drainage hole 213 is located below the cold dissipation plate 400, and the drainage hole 213 is communicated with the storage cavity 200a and the cold dissipation cavity 200 b. The utility model discloses a wash port comes to collect the liquid (for example comdenstion water, vegetable juice etc.) in storing chamber and the scattered cold chamber, prevents that the liquid in storing chamber and the scattered cold chamber from piling up.

In one embodiment, a water guide portion 214 protruding from the inside of the inner container 200 to the outside of the inner container 200 is disposed below the recess 211, and the water discharge hole 213 is disposed on the water guide portion 214. The water guide part of the utility model is arranged outside the inner container.

In one embodiment, the through holes 410 are uniformly distributed on the cold plate 400 from top to bottom. The utility model discloses a plurality of through-hole top-down evenly distributed can increase the area of contact of cold drawing and air looses to the cold area that looses of cold drawing has been increased, the cold effect that looses is further improved. And a plurality of through-holes top-down evenly distributed can reduce storing chamber top-down's temperature difference.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. A high-efficiency cold dissipation semiconductor refrigerator comprises a shell, an inner container, a semiconductor refrigeration assembly and a cold dissipation plate connected with the semiconductor refrigeration assembly, and is characterized in that the cold dissipation plate is arranged in the inner container and is separated from the inner wall of the inner container so as to divide the inner container into a storage cavity and a cold dissipation cavity positioned between the cold dissipation plate and the inner container; the cooling plate is provided with a plurality of through holes, and the through holes are respectively communicated with the cooling cavity and the storage cavity.

2. The semiconductor refrigerator with high-efficiency cold dissipation according to claim 1, wherein the inner container comprises a longitudinal surface arranged in parallel with the cold dissipation plate, a concave part protruding from the inner container to the outside of the inner container is arranged on the longitudinal surface, and the orthographic projection of the cold dissipation plate is positioned on the concave part; the cooling dissipation chamber is arranged between the cooling dissipation plate and the concave part.

3. The semiconductor refrigerator with high-efficiency cold dissipation according to claim 2, wherein the horizontal distance between the concave part and the cold dissipation plate is 6.5 mm-12 mm.

4. The semiconductor refrigerator with high cooling efficiency according to claim 2, wherein the cooling plate is fixedly connected with the concave part through a locking member.

5. The semiconductor refrigerator of claim 4, wherein the locking member is a screw.

6. The semiconductor refrigerator of claim 2, wherein the inner container further includes two lateral surfaces connected to left and right sides of the longitudinal surface; and a plurality of correspondingly arranged shelf placing grooves are formed in the two side surfaces and are respectively positioned on the two sides of the cold dispersing plate.

7. The semiconductor refrigerator with high cooling efficiency according to claim 6, wherein a safety distance is provided between the end of the plurality of shelf placing grooves and the plane of the cooling plate.

8. The semiconductor refrigerator with high-efficiency cold dissipation according to claim 2, wherein a drain hole is formed in the inner container, the drain hole is located below the cold dissipation plate, and the drain hole is communicated with the storage chamber and the cold dissipation chamber.

9. The semiconductor refrigerator of claim 8, wherein a water guide part protruding from the inside of the inner container to the outside of the inner container is provided below the recess, and the drain hole is provided in the water guide part.

10. The semiconductor refrigerator with high cooling efficiency according to any one of claims 1 to 9, wherein the plurality of through holes are uniformly distributed on the cooling plate from top to bottom.