CN221200357U - Backboard integrated type semiconductor heat dissipation module - Google Patents
Backboard integrated type semiconductor heat dissipation module Download PDFInfo
- Publication number
- CN221200357U CN221200357U CN202322891641.8U CN202322891641U CN221200357U CN 221200357 U CN221200357 U CN 221200357U CN 202322891641 U CN202322891641 U CN 202322891641U CN 221200357 U CN221200357 U CN 221200357U
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- CN
- China
- Prior art keywords
- heat dissipation
- board
- computer
- semiconductor heat
- plane
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 30
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 21
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 2
- 238000005192 partition Methods 0.000 abstract description 9
- 238000005057 refrigeration Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a backboard integrated semiconductor heat dissipation module, which comprises a computer backboard, wherein a semiconductor heat dissipation mechanism is arranged on one side of the computer backboard, a partition board is arranged on the other side of the computer backboard, the partition board encloses a partition cabin, the partition board consists of a plane board and a protruding board, an auxiliary heat dissipation port is arranged on the side edge of the protruding board, a condensed water guide plate is arranged in the protruding board, the plane board is obliquely arranged, and a condensed water outlet is arranged on the side edge of the plane board; the utility model has simple structure and novel design, and can ensure that condensed water does not enter the main board to protect computer components.
Description
Technical Field
The utility model relates to the technical field of semiconductor heat sinks, in particular to a back plate integrated semiconductor heat dissipation module.
Background
Because the notebook computer is much smaller than the desktop computer, the heat dissipation of the notebook computer is always a problem that is difficult to solve, the effect of the built-in heat dissipation fan is not ideal, a user often selects an external heat radiator, but the light is dissipated by the external heat dissipation fins, the effect is not good, and the optimal heat dissipation mode is semiconductor heat dissipation at present.
The Chinese patent with publication number CN206892720U discloses an external semiconductor refrigeration type radiator of a notebook computer, a refrigeration groove is formed by arranging a sealing rubber strip on a base, and a semiconductor refrigeration piece is used for refrigeration, the notebook computer is placed on the sealing rubber strip, so that the notebook computer covers a notch of the refrigeration groove to form a refrigeration space, and air is conveyed into the refrigeration space by an air suction pump, so that cold air in the refrigeration space can be pressed into the notebook computer, and an excellent heat dissipation effect can be achieved.
In practical application, because the cooling effect of the semiconductor radiator is good, a higher temperature difference can occur between the inside and the outside of the computer, condensed water can be formed on the computer backboard, and the condensed water can damage components such as a CPU (central processing unit) of the computer due to untimely discharge.
Disclosure of Invention
The present utility model is directed to a back-plate integrated semiconductor heat dissipation module, which solves the above-mentioned problems in the prior art. In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a backplate integrated form semiconductor heat dissipation module, includes the computer backplate, one side of computer backplate is equipped with semiconductor heat dissipation mechanism, and the opposite side is equipped with the baffle, the baffle has enclosed into the compartment, the baffle comprises plane board and protruding board, the side of protruding board is equipped with supplementary thermovent, is located the inside comdenstion water guide plate that is equipped with of protruding board, the plane board is the slope and arranges, the side of plane board is equipped with the comdenstion water export.
Preferably, the semiconductor heat dissipation mechanism comprises a base, an outer shell is arranged on the base, a TEC refrigeration chip is arranged in the outer shell, and a plurality of heat dissipation fans are further arranged in the outer shell.
Preferably, the heat conducting fins are arranged in the partition, and graphite layers are arranged on two sides of each heat conducting fin.
Preferably, the computer backboard is provided with a plurality of fixing screws and screw holes, and the computer backboard is also provided with a foldable support frame.
Compared with the prior art, the utility model has the beneficial effects that: the utility model has novel design, utilizes reasonable mechanical structure, skillfully plays the inherent potential of each element, and ensures that the condensed water does not enter the main board by arranging the baffle plate on the computer backboard and arranging the condensed water guide plate inside the baffle plate, so that the condensed water generated by the temperature difference between the inside and the outside is gathered on the guide plate and finally flows out from the condensed water outlet through the condensed water guide plate, thereby protecting the computer components.
Drawings
FIG. 1 is a side view of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the front structure of a computer backboard according to the present utility model;
FIG. 3 is a schematic diagram of the back structure of the computer back plate according to the present utility model;
FIG. 4 is a cross-sectional view of a septum of the present utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the back plate integrated semiconductor heat dissipation module comprises a computer back plate 1, wherein a plurality of fixing screws and screw holes are arranged on the computer back plate 1, and a foldable support frame 4 is further arranged on the computer back plate 1, so that the fixation of a computer is realized, and the use of a user is facilitated when the computer is elevated; one side of the computer backboard 1 is provided with a semiconductor heat dissipation mechanism 2, the semiconductor heat dissipation mechanism 2 comprises a base 21, the base 21 is embedded in the computer backboard 1, the bottom of the base 21 is made of red copper, an outer shell 22 is arranged on the base 21, a TEC refrigerating chip is arranged in the outer shell 22, a plurality of heat dissipation fans 23 are further arranged, and the TEC refrigerating chip is matched with the heat dissipation fans 23 to dissipate heat.
The other side of the computer backboard 1 is provided with a partition board 3, the partition board 3 encloses a compartment 31, the partition board 3 isolates the inner wall of the computer backboard 1 and the computer motherboard which are possibly formed with condensed water, the compartment 31 is internally provided with heat conducting fins 37, both sides of the heat conducting fins 37 are respectively provided with a graphite layer, the heat conducting fins 37 are used for transferring heat generated by a CPU to the base 21, the semiconductor heat dissipation mechanism 2 dissipates heat, and the graphite layers can enhance the heat conducting performance of the heat conducting fins 37.
The partition plate 3 is composed of a plane plate 32 and a protruding plate 33, an auxiliary heat dissipation opening 34 is arranged on the side edge of the protruding plate 33, the computer backboard 1 inside the protruding plate 33 is arranged in a mountain mode, namely, the center is high, the two sides are low, a condensate water guide plate 35 is formed, the plane plate 32 is arranged in an inclined mode, a condensate water outlet 36 is formed on the side edge of the plane plate 32, condensate water formed due to temperature difference flows out of the condensate water outlet 36 through the condensate water guide plate 35, and therefore the condensate water is prevented from entering the main board, and computer components are protected.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. The utility model provides a backplate integrated form semiconductor heat dissipation module, includes computer backplate (1), its characterized in that: one side of computer backplate (1) is equipped with semiconductor cooling mechanism (2), and the opposite side is equipped with baffle (3), baffle (3) have enclosed compartment (31), baffle (3) are constituteed by plane board (32) and protruding board (33), the side of protruding board (33) is equipped with supplementary thermovent (34), is located protruding board (33) inside is equipped with comdenstion water guide plate (35), plane board (32) are the slope and arrange, the side of plane board (32) is equipped with comdenstion water export (36).
2. The back-plane integrated semiconductor heat dissipation module of claim 1, wherein: the semiconductor heat dissipation mechanism (2) comprises a base (21), wherein the base (21) is provided with an outer shell (22), a TEC refrigerating chip is arranged in the outer shell (22), and a plurality of heat dissipation fans (23) are further arranged.
3. The back-plane integrated semiconductor heat dissipation module of claim 1, wherein: a heat conduction fin (37) is arranged in the compartment (31), and graphite layers are arranged on two sides of the heat conduction fin (37).
4. The back-plane integrated semiconductor heat dissipation module of claim 1, wherein: the computer backboard (1) is provided with a plurality of fixing screws and screw holes, and the computer backboard (1) is also provided with a foldable supporting frame (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322891641.8U CN221200357U (en) | 2023-10-27 | 2023-10-27 | Backboard integrated type semiconductor heat dissipation module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322891641.8U CN221200357U (en) | 2023-10-27 | 2023-10-27 | Backboard integrated type semiconductor heat dissipation module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221200357U true CN221200357U (en) | 2024-06-21 |
Family
ID=91517107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322891641.8U Active CN221200357U (en) | 2023-10-27 | 2023-10-27 | Backboard integrated type semiconductor heat dissipation module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221200357U (en) |
-
2023
- 2023-10-27 CN CN202322891641.8U patent/CN221200357U/en active Active
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