CN213522784U

CN213522784U - Heat radiator for electronic circuit board

Info

Publication number: CN213522784U
Application number: CN202022752942.9U
Authority: CN
Inventors: 崔茂星
Original assignee: Shenzhen Pengjinleke Electronic Technology Co ltd
Current assignee: Shenzhen Pengjinleke Electronic Technology Co ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-06-22
Anticipated expiration: 2030-11-25

Abstract

A heat sink for an electronic circuit board comprises a clamping assembly, a telescopic assembly, a heat sink assembly and a liquid cooling assembly; the telescopic assembly is arranged on the clamping assembly and forms a square frame structure with the clamping assembly; the heat sink assembly and the liquid cooling assembly are disposed on the telescopic assembly. The utility model clamps electronic circuit boards with different specifications by arranging the clamping component and the telescopic component, and simultaneously arranges the clamping plate and the elastic connecting component to prevent the electronic circuit boards from being damaged; the liquid cooling assembly is arranged, and a water source flowing in the cooling pipe is utilized to dissipate heat of the electronic circuit board, so that the electronic circuit board is prevented from being unsmooth in heat dissipation in the working process and being incapable of working normally; through setting up the fin subassembly, increase dual heat abstractor on the basis of liquid cooling subassembly, improve the utility model discloses a radiating efficiency to utilize the sliding connection of crisscross slip fin and fixed fin each other, clean the dust on fin surface, effectively avoid the fin on the dust pile up and lead to the heat dissipation not smooth.

Description

Heat radiator for electronic circuit board

Technical Field

The utility model relates to a ventilation equipment technical field especially relates to a heat abstractor of electronic circuit board.

Background

Integrated circuits are heavily used in computer components. It is well known that high temperatures are a rival of integrated circuits. The high temperature can not only cause the unstable operation of the system and shorten the service life, but also possibly burn some parts. The heat that causes the high temperature does not come from outside the computer, but inside the computer, or inside the integrated circuit. The radiator is used for absorbing the heat and then radiating the heat into the case or out of the case, so that the temperature of the computer components is ensured to be normal. Most heat sinks absorb heat by contacting the surfaces of heat-generating components, and then transfer the heat to a remote location by various methods, such as air in a chassis, and then the chassis transfers the hot air to the outside of the chassis, thereby dissipating heat from the computer.

The existing heat dissipation device of the electronic circuit board has simple structure and poor heat dissipation effect, and can not realize effective heat dissipation aiming at electronic circuit boards with different specifications; the commonly used heat sink structure is prone to dust accumulation, resulting in poor heat dissipation.

SUMMERY OF THE UTILITY MODEL

Objects of the invention

In order to solve the technical problems existing in the background technology, the utility model provides a heat dissipation device of an electronic circuit board, which clamps the electronic circuit boards with different specifications by arranging a clamping component and a telescopic component, and prevents the electronic circuit boards from being damaged by arranging a clamping plate and an elastic connecting component; by arranging the liquid cooling assembly, the electronic circuit board is cooled by using a water source flowing in the cooling pipe, so that the electronic circuit board is prevented from being incapable of working normally due to unsmooth heat dissipation in the working process; through setting up the fin subassembly, increase dual heat abstractor on the basis of liquid cooling subassembly, improve the utility model discloses a radiating efficiency to utilize the sliding connection of crisscross slip fin and fixed fin each other, clean the dust on fin surface, effectively avoid the fin on the dust pile up and lead to the heat dissipation not smooth.

(II) technical scheme

The utility model provides a heat dissipation device of an electronic circuit board, which comprises a clamping component, a telescopic component, a heat dissipation sheet component and a liquid cooling component; the telescopic assembly is arranged on the clamping assembly and forms a square frame structure with the clamping assembly; the heat sink assembly and the liquid cooling assembly are arranged on the telescopic assembly; the clamping assembly comprises a clamping plate, a mounting plate and an elastic connecting part; the mounting plates are arranged in a plurality of groups, and the mounting plates are arranged at two ends of the telescopic assembly; the elastic connecting component is arranged on the mounting plate; the clamping plates are arranged in a plurality of groups, the plurality of groups of clamping plates are arranged on the elastic connecting component, and the plurality of groups of clamping plates are arranged in parallel; the telescopic component comprises a sliding plate, a sleeve plate and a second elastic piece; the sliding plates are arranged in a plurality of groups and are respectively arranged at the two ends of the sleeve plate in a sliding manner; the second elastic piece is arranged in the sleeve plate, and two ends of the second elastic piece are respectively arranged at two ends of the plurality of groups of sliding plates which are close to each other; the radiating fin component comprises a sliding radiating fin, a fixed radiating fin and a cleaning piece; the sliding heat radiating fins are arranged on the sliding plate; the fixed radiating fins are arranged on the sleeve plate and are staggered with the sliding radiating fins; the cleaning piece is arranged on one side of the fixed radiating fin close to the sliding radiating fin; a sliding groove is arranged on the sleeve plate; the liquid cooling assembly comprises a water tank, a cooling box and a cooling pipe; the water tank and the cooling box are arranged on the telescopic assembly; the cooling box is positioned at one side close to the electronic circuit board; the cooling pipe is communicated with the water tank and is arranged on the cooling box.

Preferably, the elastic connection member includes a connection rod, a first elastic member and a guide sleeve rod; the connecting rod is sleeved on the guide sleeve rod in a sliding manner; one end of the first elastic piece is arranged on the connecting rod, and the other end of the first elastic piece is arranged on the guide sleeve rod.

Preferably, the first elastic member is provided as a first spring.

Preferably, the sliding plate is provided with a clamping block; the clamping block is clamped with the sleeve plate.

Preferably, the cleaning member is provided as a cleaning brush.

Preferably, the cooling pipe is disposed on the cooling tank in an "S" shape.

Preferably, the sheathing plate and the sliding plate are provided as a lattice-shaped heat radiating plate.

Preferably, the mounting plate is vertically connected to the sliding plate.

Preferably, the second elastic member is provided as a second spring.

Compared with the prior art, the above technical scheme of the utility model following profitable technological effect has:

the electronic circuit boards with different specifications are clamped by arranging the clamping assembly and the telescopic assembly, and the electronic circuit boards are prevented from being damaged by arranging the clamping plate and the elastic connecting part;

secondly, the liquid cooling assembly is arranged, and a water source flowing in the cooling pipe is utilized to dissipate heat of the electronic circuit board, so that the electronic circuit board is prevented from being unsmooth in heat dissipation in the working process and being incapable of working normally;

thirdly, through setting up the fin subassembly, increase dual heat abstractor on the basis of liquid cooling subassembly, improve the utility model discloses a radiating efficiency to utilize the sliding connection of crisscross slip fin and fixed fin each other, clean the dust on fin surface, effectively avoid the fin on the dust pile up and lead to the heat dissipation not smooth.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation device of an electronic circuit board according to the present invention.

Fig. 2 is a schematic structural diagram of a heat dissipation device of an electronic circuit board according to the present invention.

Fig. 3 is a schematic structural diagram of a heat dissipation device of an electronic circuit board according to the present invention.

Fig. 4 is a partially enlarged view of a portion a in fig. 1.

Fig. 5 is a partially enlarged view of fig. 2 at B.

Fig. 6 is a partially enlarged view of C in fig. 1.

Reference numerals: 1. a clamping assembly; 2. a telescoping assembly; 3. a heat sink assembly; 4. a liquid cooling assembly; 5. a clamping plate; 6. mounting a plate; 7. an elastic connection member; 8. a connecting rod; 9. a first elastic member; 10. a guide loop bar; 11. a sliding plate; 12. sheathing; 13. a second elastic member; 14. a clamping block; 15. sliding the heat sink; 16. fixing the radiating fin; 17. a cleaning member; 18. a sliding groove; 19. a water tank; 20. a cooling tank; 21. a cooling tube; 22. an electronic circuit board.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.

As shown in fig. 1-6, the heat dissipation device for an electronic circuit board of the present invention comprises a clamping assembly 1, a telescopic assembly 2, a heat dissipation plate assembly 3 and a liquid cooling assembly 4; the telescopic component 2 is arranged on the clamping component 1 and forms a square frame structure with the clamping component 1; the radiating fin component 3 and the liquid cooling component 4 are arranged on the telescopic component 2; the clamping assembly 1 comprises a clamping plate 5, a mounting plate 6 and an elastic connecting part 7; the mounting plates 6 are provided with a plurality of groups, and the mounting plates 6 are arranged at two ends of the telescopic assembly 2; the elastic connecting component 7 is arranged on the mounting plate 6; the clamping plates 5 are arranged in a plurality of groups, the clamping plates 5 are arranged on the elastic connecting part 7, and the clamping plates 5 are arranged in parallel; the telescopic assembly 2 comprises a sliding plate 11, a sleeve plate 12 and a second elastic piece 13; the sliding plates 11 are arranged in a plurality of groups and are respectively arranged at two ends of the sleeve plate 12 in a sliding manner; the second elastic piece 13 is arranged in the sleeve plate 12, and two ends of the second elastic piece 13 are respectively arranged at two ends of the plurality of groups of sliding plates 11 which are close to each other; the heat sink assembly 3 includes a sliding heat sink 15, a fixed heat sink 16, and a cleaning member 17; the sliding heat sink 15 is disposed on the sliding plate 11; the fixed radiating fins 16 are arranged on the sleeve plate 12 and are staggered with the sliding radiating fins 15; the cleaning member 17 is disposed on the side of the fixed heat sink 16 adjacent to the sliding heat sink 15; the sleeve plate 12 is provided with a sliding groove 18; the liquid cooling assembly 4 comprises a water tank 19, a cooling box 20 and a cooling pipe 21; the water tank 19 and the cooling tank 20 are arranged on the telescopic assembly 2; the cooling box 20 is located on a side close to the electronic circuit board 22; the cooling pipe 21 communicates with the water tank 19 and is provided in the cooling tank 20.

In an alternative embodiment, the elastic connection means 7 comprise a connection rod 8, a first elastic element 9 and a guide sleeve rod 10; the connecting rod 8 is sleeved on the guide sleeve rod 10 in a sliding manner; one end of the first elastic member 9 is provided on the connecting rod 8 and the other end is provided on the guide sleeve rod 10.

In an alternative embodiment, the first elastic member 9 is provided as a first spring.

In an alternative embodiment, the sliding plate 11 is provided with a latch 14; the latch 14 is engaged with the strap 12.

In an alternative embodiment the cleaning member 17 is provided as a cleaning brush.

In an alternative embodiment, the cooling tubes 21 are arranged in an "S" shape on the cooling box 20.

In an alternative embodiment, the jacket plate 12 and the sliding plate 11 are provided as a grid-like heat-radiating plate.

In an alternative embodiment, the mounting plate 6 is attached perpendicularly to the slide plate 11.

In an alternative embodiment, the second elastic member 13 is provided as a second spring.

The utility model discloses a theory of use as follows: placing the electronic circuit board 22 between the two groups of clamping plates 5, pulling the sliding plate 11 to slide on the sleeve plate 12, so that the clamping assembly 1 clamps the electronic circuit board 22; the fixed radiating fins 16 and the sliding radiating fins 15 generate friction in the sliding process, and the cleaning piece 17 cleans dust on the sliding radiating fins 15; meanwhile, the liquid in the cooling tube 20 carries out liquid cooling on the electronic circuit board 22, so that double heat dissipation is realized.

It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.

Claims

1. A heat dissipating double-fuselage of the electronic breadboard, characterized by, including holding assembly (1), flexible assembly (2), heat sink assembly (3) and liquid cooling assembly (4); the telescopic component (2) is arranged on the clamping component (1) and forms a square frame structure with the clamping component (1); the radiator component (3) and the liquid cooling component (4) are arranged on the telescopic component (2);

the clamping assembly (1) comprises a clamping plate (5), a mounting plate (6) and an elastic connecting part (7); the mounting plates (6) are arranged in a plurality of groups, and the mounting plates (6) are arranged at two ends of the telescopic assembly (2); the elastic connecting part (7) is arranged on the mounting plate (6); the clamping plates (5) are arranged in a plurality of groups, the clamping plates (5) are arranged on the elastic connecting part (7), and the clamping plates (5) are arranged in parallel;

the telescopic assembly (2) comprises a sliding plate (11), a sleeve plate (12) and a second elastic piece (13); the sliding plates (11) are arranged in a plurality of groups and are respectively arranged at two ends of the sleeve plate (12) in a sliding manner; the second elastic piece (13) is arranged in the sleeve plate (12), and two ends of the second elastic piece (13) are respectively arranged at two ends of the plurality of groups of sliding plates (11) which are close to each other;

the heat sink assembly (3) comprises a sliding heat sink (15), a fixed heat sink (16) and a cleaning member (17); the sliding radiating fins (15) are arranged on the sliding plate (11); the fixed radiating fins (16) are arranged on the sleeve plate (12) and are staggered with the sliding radiating fins (15); the cleaning piece (17) is arranged on one side of the fixed radiating fin (16) close to the sliding radiating fin (15); a sliding groove (18) is arranged on the sleeve plate (12);

the liquid cooling assembly (4) comprises a water tank (19), a cooling box (20) and a cooling pipe (21); the water tank (19) and the cooling tank (20) are arranged on the telescopic assembly (2); the cooling box (20) is positioned at one side close to the electronic circuit board (22); the cooling pipe (21) is communicated with the water tank (19) and is arranged on the cooling box (20).

2. A heat dissipating device of an electronic circuit board according to claim 1, wherein the elastic connecting member (7) comprises a connecting rod (8), a first elastic member (9) and a guide bush rod (10); the connecting rod (8) is sleeved on the guide sleeve rod (10) in a sliding manner; one end of the first elastic piece (9) is arranged on the connecting rod (8), and the other end is arranged on the guide sleeve rod (10).

3. A heat sink for electronic circuit boards according to claim 2, characterised in that the first resilient member (9) is provided as a first spring.

4. The heat sink for electronic circuit boards according to claim 1, wherein the sliding plate (11) is provided with a latch (14); the clamping block (14) is clamped with the sleeve plate (12).

5. A heat sink for electronic circuit boards according to claim 1, characterised in that the cleaning member (17) is arranged as a cleaning brush.

6. A heat dissipating device for electronic circuit boards according to claim 1, wherein the cooling pipe (21) is provided in an "S" shape on the cooling box (20).

7. A heat dissipating device for an electronic circuit board according to claim 1, wherein the sheathing board (12) and the sliding board (11) are provided as a grid-like heat dissipating board.

8. A heat sink for electronic circuit boards according to claim 1, wherein the mounting plate (6) is attached perpendicularly to the slide plate (11).

9. A heat sink for electronic circuit boards according to claim 1, characterised in that the second resilient member (13) is provided as a second spring.