CN213276558U - Computer radiating fin structure - Google Patents
Computer radiating fin structure Download PDFInfo
- Publication number
- CN213276558U CN213276558U CN202022651198.3U CN202022651198U CN213276558U CN 213276558 U CN213276558 U CN 213276558U CN 202022651198 U CN202022651198 U CN 202022651198U CN 213276558 U CN213276558 U CN 213276558U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- heat
- fixing plate
- computer
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a computer radiating fin structure, which comprises a main heat conducting fixed plate, wherein the top of the main heat conducting fixed plate is fixedly connected with a fin base, the top of the fin base is fixedly connected with a radiating fin, the surface of the radiating fin is connected with a heat conducting copper pipe in a penetrating way, one end of the heat conducting copper pipe is fixedly connected with an auxiliary heat conducting fixed plate, the top of the main heat conducting fixed plate is fixedly connected with a supporting column, the top end of the supporting column is fixedly connected with an installation frame, the inner side of the installation frame is fixedly connected with a fan bracket, and the inner side of the fan bracket is fixedly connected with a radiating fan, the structure of the utility model is stable, the integral heat radiation can be carried out, the special structure carries out the heat radiation treatment aiming at the condition that the computer generates heat, the condition that the equipment is paralyzed after the single structure is damaged is avoided.
Description
Technical Field
The utility model relates to a computer fin structure belongs to computer fin equipment technical field.
Background
The heat dissipation module is a module unit applied to heat dissipation purposes of systems, devices, equipment and the like as the name implies, the heat dissipation module is specially used for a heat dissipation device of a notebook computer at present, and the heat dissipation module is used for a desktop computer, a projector and the like which are named by using a heat pipe in a later expansion mode.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem who solves overcomes current defect, a computer cooling fin structure is provided, stable in structure can carry out the wholeness heat dissipation, special structure carries out the heat dissipation to the condition that the computer is generated heat in many places and handles, the complexity of installation has been reduced, be favorable to practicing thrift the cost, the multiple fan carries out the heat dissipation simultaneously and handles, the operation fault tolerance of messenger's this device obtains promoting, avoid single structure to damage the paralytic condition of back equipment to appear, can effectively solve the problem in the background art.
In order to solve the technical problem, the utility model provides a following technical scheme:
the utility model provides a computer fin structure, includes main heat conduction fixed plate, main heat conduction fixed plate top fixedly connected with fin base, fin base top fixedly connected with heat radiation fins, heat radiation fins surface through connection has the heat conduction copper pipe, the vice heat conduction fixed plate of heat conduction copper pipe one end fixedly connected with, main heat conduction fixed plate top fixedly connected with support column, support column top fixedly connected with installation frame, the inboard fixedly connected with fan support of installation frame, the inboard fixedly connected with radiator fan of fan support.
Further, the surfaces of the main heat conduction fixing plate and the auxiliary heat conduction fixing plate are provided with fixing bolt holes, and the bottom surfaces of the main heat conduction fixing plate and the auxiliary heat conduction fixing plate are located on the same horizontal line.
Further, one side of the top of the main heat conducting fixing plate is fixedly connected with a power connector, and one side of the power connector is electrically connected with a heat radiation fan through a wire.
Further, the fan support is distributed on the inner side of the installation frame in parallel, and a space is reserved between the bottom of the fan support and the heat dissipation fins.
Further, the heat dissipation fins are distributed on the top surface of the fin base in an array mode, and holes matched in structure are formed in the connection positions of the heat dissipation fins and the heat conduction copper pipes.
Furthermore, the support columns are distributed at four corners of the top of the main heat conducting fixing plate in an array mode, and the inner sides of the support columns are fixedly connected to the fin base.
The utility model discloses beneficial effect:
1. the utility model relates to a computer fin structure, through being equipped with heat conduction copper pipe and vice heat conduction fixed plate, stable in structure can carry out the wholeness heat dissipation, and special structure carries out the heat dissipation to the condition that the computer multi-spot generates heat and handles, has reduced the complexity of installation, is favorable to practicing thrift the cost.
2. The utility model relates to a computer fin structure, through being equipped with cooling fan and heat radiation fins, the radiating effect is good, and the multiple fan carries out the heat dissipation simultaneously and handles, makes the operation fault-tolerant rate of this device obtain promoting, avoids the paralytic condition of single structural damage back equipment to appear, and then satisfies the user demand of user to this device.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention.
FIG. 1 is a schematic view of the overall structure of a computer heat sink structure according to the present invention;
FIG. 2 is a schematic top view of the computer heat sink structure of the present invention;
FIG. 3 is a schematic side view of the structure of a computer heat sink of the present invention;
FIG. 4 is a schematic view of the structure of the fin base of the computer heat sink structure of the present invention;
reference numbers in the figures: 1. a main heat-conducting fixing plate; 2. a fin base; 3. heat dissipation fins; 4. a heat conducting copper pipe; 5. an auxiliary heat conducting fixing plate; 6. a support pillar; 7. a mounting frame; 8. a fan bracket; 9. a heat radiation fan; 10. fixing bolt holes; 11. and a power supply connector.
Detailed Description
The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.
As shown in fig. 1-4, a computer heat sink structure comprises a main heat conducting fixing plate 1, a fin base 2 is fixedly connected to the top of the main heat conducting fixing plate 1, a heat dissipating fin 3 is fixedly connected to the top of the fin base 2, a heat conducting copper pipe 4 is connected to the surface of the heat dissipating fin 3 in a penetrating manner, the heat conducting copper pipe 4 and an auxiliary heat conducting fixing plate 5 are structurally stable, and can assist in overall heat dissipation, a special structure performs heat dissipation treatment for the multi-place heating condition of a computer, so that the installation complexity is reduced, and the cost is saved, an auxiliary heat conducting fixing plate 5 is fixedly connected to one end of the heat conducting copper pipe 4, a support column 6 is fixedly connected to the top of the main heat conducting fixing plate 1, an installation frame 7 is fixedly connected to the top of the support column 6, a fan support 8 is, the radiating fan 9 is matched with the radiating fins 3, so that the radiating effect is good, the multiple fans perform radiating treatment simultaneously, the operation fault tolerance of the device is improved, the condition that the device is paralyzed after the single structure is damaged is avoided, and the use requirement of a user on the device is further met.
As shown in fig. 1-4, fixing bolt holes 10 are formed in the surfaces of the main heat conducting fixing plate 1 and the auxiliary heat conducting fixing plate 5, the bottom surfaces of the main heat conducting fixing plate 1 and the auxiliary heat conducting fixing plate 5 are located on the same horizontal line, a power connector 11 is fixedly connected to one side of the top of the main heat conducting fixing plate 1, one side of the power connector 11 is electrically connected to a heat dissipation fan 9 through a wire, the fan brackets 8 are arranged in parallel at the inner side of the mounting frame 7, a space is left between the bottom of each fan bracket 8 and each heat dissipation fin 3, the heat dissipation fins 3 are arranged on the top surface of the fin base 2 in an array manner, holes with matched structures are formed at the joints of the heat dissipation fins 3 and the heat conduction copper tubes 4, the support columns 6 are arranged in four corners of the top of the main heat conducting fixing plate 1 in an array manner, the inner sides of the, and the structure is simplified, the influence on the air flow is avoided, and the normal operation of heat dissipation is ensured.
The utility model discloses a theory of operation: when using, through installing main heat conduction fixed plate 1 and vice heat conduction fixed plate 5 respectively in the assigned position, use power connection 11 to insert external power source, heat conduction copper pipe 4 transmission heat to heat radiation fins 3, the work of cooling fan 9 produces the air current and carries out the heat dissipation processing, installation frame 7 cooperation support column 6 structure plays the supplementary effect of support to cooling fan 9's installation, has guaranteed the normal clear of heat dissipation, and stable in structure, plays certain guard action.
The above is the preferred embodiment of the present invention, and the technical personnel in the field of the present invention can also change and modify the above embodiment, therefore, the present invention is not limited to the above specific embodiment, and any obvious improvement, replacement or modification made by the technical personnel in the field on the basis of the present invention all belong to the protection scope of the present invention.
Claims (6)
1. The utility model provides a computer cooling fin structure, includes main heat conduction fixed plate (1), its characterized in that: the heat radiation type fan is characterized in that a main heat conduction fixing plate (1) is fixedly connected with a fin base (2), the fin base (2) is fixedly connected with heat radiation fins (3), the surface of each heat radiation fin (3) is connected with a heat conduction copper pipe (4) in a penetrating mode, one end of each heat conduction copper pipe (4) is fixedly connected with an auxiliary heat conduction fixing plate (5), a main heat conduction fixing plate (1) is fixedly connected with a support column (6), the support column (6) is fixedly connected with an installation frame (7), an inner side of the installation frame (7) is fixedly connected with a fan support (8), and an inner side of the fan support (8) is fixedly.
2. A computer heat sink structure as claimed in claim 1, wherein: fixing bolt holes (10) are formed in the surfaces of the main heat conducting fixing plate (1) and the auxiliary heat conducting fixing plate (5), and the bottom surfaces of the main heat conducting fixing plate (1) and the auxiliary heat conducting fixing plate (5) are located on the same horizontal line.
3. A computer heat sink structure as claimed in claim 1, wherein: the heat dissipation device is characterized in that a power connector (11) is fixedly connected to one side of the top of the main heat conduction fixing plate (1), and one side of the power connector (11) is electrically connected with the heat dissipation fan (9) through a wire.
4. A computer heat sink structure as claimed in claim 1, wherein: the fan support (8) is arranged on the inner side of the mounting frame (7) in parallel, and a space is reserved between the bottom of the fan support (8) and the heat dissipation fins (3).
5. A computer heat sink structure as claimed in claim 1, wherein: the radiating fins (3) are distributed on the top surface of the fin base (2) in an array mode, and holes matched in structure are formed in the connecting positions of the radiating fins (3) and the heat conduction copper pipes (4).
6. A computer heat sink structure as claimed in claim 1, wherein: the supporting columns (6) are distributed at four corners of the top of the main heat conducting fixing plate (1) in an array mode, and the inner sides of the supporting columns (6) are fixedly connected to the fin bases (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022651198.3U CN213276558U (en) | 2020-11-16 | 2020-11-16 | Computer radiating fin structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022651198.3U CN213276558U (en) | 2020-11-16 | 2020-11-16 | Computer radiating fin structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213276558U true CN213276558U (en) | 2021-05-25 |
Family
ID=75953100
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022651198.3U Active CN213276558U (en) | 2020-11-16 | 2020-11-16 | Computer radiating fin structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213276558U (en) |
-
2020
- 2020-11-16 CN CN202022651198.3U patent/CN213276558U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207098959U (en) | Water cooling substrate and the integrated auxiliary power module of commutation inversion | |
| CN213276558U (en) | Computer radiating fin structure | |
| CN212519778U (en) | Auxiliary heat dissipation structure of mobile reserve power supply | |
| CN105101752A (en) | Charger heat dissipation device | |
| CN210895329U (en) | Module structure for radiating in board | |
| CN210610161U (en) | Inverter device and heat dissipation device thereof | |
| CN218788180U (en) | Automatic change intelligent data center cooling device of regulation | |
| CN210379197U (en) | Power supply module based on novel power battery | |
| CN213276561U (en) | Computer heat dissipation module with high heat dissipation performance | |
| CN210137571U (en) | Electronic radiator with high radiating efficiency | |
| CN219758750U (en) | Computer heat abstractor | |
| CN218679699U (en) | Heat dissipation device and electronic equipment | |
| CN218103954U (en) | High-efficient radiating radiator | |
| CN217563515U (en) | Power electronic power unit | |
| CN219577089U (en) | Gateway shell and Internet of things gateway | |
| CN214125862U (en) | Heat dissipation mechanism for computer network equipment | |
| CN218587095U (en) | Double-sided heat radiation structure of single-tube IGBT in frequency converter | |
| CN218387745U (en) | Switch with high heat dissipation function | |
| CN219513193U (en) | Battery box structure with heat radiation structure | |
| CN215580930U (en) | High-voltage IGBT converter module | |
| CN213754794U (en) | Industrial-grade switch radiator mounting structure | |
| CN211319132U (en) | Computer mainframe that heat dispersion is good | |
| CN220378368U (en) | Heat abstractor and power generation facility | |
| US20230319974A1 (en) | Detachable heat sink | |
| CN217063752U (en) | Communication network safety prevention and control device for communication system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |