CN214125862U - Heat dissipation mechanism for computer network equipment - Google Patents
Heat dissipation mechanism for computer network equipment Download PDFInfo
- Publication number
- CN214125862U CN214125862U CN202120342430.7U CN202120342430U CN214125862U CN 214125862 U CN214125862 U CN 214125862U CN 202120342430 U CN202120342430 U CN 202120342430U CN 214125862 U CN214125862 U CN 214125862U
- Authority
- CN
- China
- Prior art keywords
- heat
- plate
- heat transfer
- heat dissipation
- computer network
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a heat dissipation mechanism for computer network equipment, including binding plate and heat transfer plate, the both sides fixedly connected with side ear of binding plate, the inside joint of side ear has the tightening bolt, the spring has been cup jointed on the tightening bolt, one side welded connection of binding plate has the copper bar, the one end joint of copper bar has the mounting plate, the utility model discloses a smooth surface and the equipment that needs the heat dissipation of binding plate one side are laminated, heat conduction is carried out, the copper bar on the binding plate leads the heat to the end, the copper bar is laminated with the heat transfer plate, transmits the heat to the heat transfer plate, the heat transfer plate leads in and out cold water through inlet tube and outlet pipe, heat exchange plate inside exchanges heat with cold water through the heat transfer pipe groove, promotes heat transfer efficiency, fixedly connected heat conduction frame on the heat transfer plate, connects the fin on the heat conduction frame, fan external power supply, the fan starts and drives the air current, carries out the forced air cooling heat dissipation through a plurality of fins, through water-cooling and forced air cooling combination, promote radiating efficiency, the radiating effect is good.
Description
Technical Field
The utility model relates to a heat dissipation technical field of mechanism especially relates to a heat dissipation mechanism for computer network equipment.
Background
Network devices and components are physical entities connected into a network. The variety of network devices is great and increasing. Servers are the most important devices on computer networks. A server refers to a device that runs corresponding application software in a network environment and provides shared information resources and services for users in the network. Network equipment all has great heat dissipation demand, and ordinary heat radiation structure is simple, can't carry out the multiple spot heat dissipation, and the laminating area is little, and the radiating efficiency is low, and the result of use is poor, for this reason, proposes the heat dissipation mechanism who is used for computer network equipment.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough of prior art, the utility model provides a heat dissipation mechanism for computer network equipment produces the multiple spot laminating heat dissipation, the technological effect that the radiating efficiency is high.
In order to solve the technical problem, the utility model provides a following technical scheme: a heat dissipation mechanism for computer network equipment, including attaching plate and heat transfer plate, the both sides fixedly connected with side ear of attaching plate, the inside joint of side ear has the bolt of screwing up, it has cup jointed the spring on the bolt to screw up, one side welded connection of attaching plate has the copper bar, the one end joint of copper bar has the mounting plate, the bottom bolted connection mounting plate of heat transfer plate, the heat transfer plate is connected in the laminating of copper bar one end, the inside of heat transfer plate is provided with the heat transfer pipe groove, the one end of heat transfer plate is connected with inlet tube and outlet pipe, fixedly connected with heat conduction frame on the heat transfer plate, connect a plurality of fins on the heat conduction frame, it is a plurality of the inside joint of fin has the fan.
As an optimal technical scheme of the utility model, the inside setting of side ear and spring assorted draw-in groove, the gasket is connected to the one end of spring.
As a preferred technical scheme of the utility model, one side of attaching plate is the smooth surface, the copper bar is connected with the multiunit in attaching plate one side.
As a preferred technical scheme of the utility model, the heat exchange tube groove is snakelike setting, heat exchange tube groove evenly distributed is inside the heat transfer board.
As an optimal technical scheme of the utility model, inlet tube and outlet pipe internal diameter equal, all be connected with the sealing washer on inlet tube and the outlet pipe.
As an optimized technical scheme of the utility model, the heat conduction frame is the U-shaped, the heat conduction frame width is fin width fifth.
As an optimal technical scheme of the utility model, it is a plurality of the fin is inside to be set up with fan assorted groove, the fan sets up and puts at a plurality of fin central points.
Compared with the prior art, the utility model discloses the beneficial effect that can reach is:
1. the utility model discloses a smooth surface and the equipment that needs the heat dissipation of laminating board one side, carry out the heat conduction, copper bar on the laminating board leads the heat to the end, copper bar and heat transfer board laminating, transmit the heat on the heat transfer board, the heat transfer board is led in through inlet tube and outlet pipe and is derived cold water, heat transfer board inside is through heat transfer pipe groove and cold water heat transfer, promote heat exchange efficiency, fixed connection heat conduction frame on the heat transfer board, connect the fin on the heat conduction frame, the fan external power supply, the fan starts to drive the air current, carry out the forced air cooling heat dissipation through a plurality of fins, combine with forced air cooling through water-cooling, promote the radiating efficiency, the radiating effect is;
2. the utility model discloses a plurality of attaching plates and the laminating of the network equipment heat dissipation part of different positions, contact the heat dissipation, the copper bar carries out the length customization according to different demands, can install according to the actual demand, and application scope is wide, and the heat transfer pipe groove is snakelike setting, and the heat transfer pipe groove evenly distributed is inside the heat transfer board; the heat exchange contact area is improved through the heat exchange tube grooves which are uniformly distributed in a snake shape, cold water and heat can exchange heat quickly, and the heat dissipation efficiency is improved.
Drawings
FIG. 1 is a front perspective view of the present invention;
fig. 2 is a schematic diagram of a rear perspective structure of the present invention;
FIG. 3 is a front view of the present invention;
fig. 4 is a left side view structure diagram of the present invention;
fig. 5 is a schematic view of the internal structure of the heat exchange plate of the present invention.
Wherein: 1. attaching a plate; 2. a lateral ear; 3. screwing down the bolt; 4. a spring; 5. a copper bar; 6. a fastening plate; 7. a heat exchange plate; 8. a heat exchange pipe groove; 9. a water inlet pipe; 10. a water outlet pipe; 11. a heat conducting frame; 12. a fin; 13. a fan.
Detailed Description
In order to make the technical means, the creation features, the achievement purposes and the functions of the invention easy to understand, the invention is further explained below with reference to the specific embodiments, but the following embodiments are only the preferred embodiments of the invention, not all. Based on the embodiments in the implementation, other embodiments obtained by those skilled in the art without any creative work belong to the protection scope of the present invention. The experimental methods in the following examples are conventional methods unless otherwise specified, and materials, reagents and the like used in the following examples are commercially available unless otherwise specified.
Example (b):
as shown in fig. 1-5, a heat dissipation mechanism for computer network equipment, including attaching plate 1 and heat transfer plate 7, attaching plate 1's both sides fixedly connected with side ear 2, the inside joint of side ear 2 has tightening bolt 3, tightening bolt 3 is last to have cup jointed spring 4, one side welded connection of attaching plate 1 has copper bar 5, the one end joint of copper bar 5 has mounting plate 6, the bottom bolted connection mounting plate 6 of heat transfer plate 7, heat transfer plate 7 is connected in the laminating of copper bar 5 one end, the inside of heat transfer plate 7 is provided with heat exchange tube groove 8, the one end of heat transfer plate 7 is connected with inlet tube 9 and outlet pipe 10, fixedly connected with heat conduction frame 11 on the heat transfer plate 7, connect a plurality of fins 12 on the heat conduction frame 11, the inside joint of a plurality of fins 12 has fan 13.
In other embodiments, a clamping groove matched with the spring 4 is arranged in the side lug 2, and one end of the spring 4 is connected with a gasket; can carry out the screens to the one end of spring 4 through the inside draw-in groove of side ear 2, the gasket that 4 one ends of spring are connected avoids one end and screws up 3 direct contact of bolt, influences the knob of screwing up bolt 3.
In other embodiments, one side of the attaching plate 1 is a smooth surface, and the copper bars 5 are connected with multiple groups on one side of the attaching plate 1; the attaching plate 1 with the smooth surface is closely attached to the equipment needing heat dissipation, the heat conduction effect is good, quick heat conduction is achieved through the multiple groups of copper bars 5, and heat conduction is quick.
In other embodiments, the heat exchange tube grooves 8 are arranged in a serpentine shape, and the heat exchange tube grooves 8 are uniformly distributed in the heat exchange plate 7; through snakelike evenly distributed's heat transfer pipe groove 8 promotion heat transfer area of contact, let cold water and the quick heat transfer of heat, promote the radiating efficiency.
In other embodiments, the inner diameters of the water inlet pipe 9 and the water outlet pipe 10 are equal, and the water inlet pipe 9 and the water outlet pipe 10 are both connected with sealing rings; evenly advance water and go out water through inlet tube 9 and the outlet pipe 10 of equant, the heat transfer is even, and seals when the sealing washer on inlet tube 9 and the outlet pipe 10 can carry out water piping connection, avoids the leakage of rivers.
In other embodiments, the heat conducting frame 11 is U-shaped, and the width of the heat conducting frame 11 is one fifth of the width of the fins 12; the heat conduction frame 11 through the U-shaped carries out the fixed of multiunit fin 12, and the joint is connected more stably, and the width is the better quick heat conduction that carries on of heat conduction frame 11 of one fifth of fin 12, and the heat conduction efficiency is high.
In other embodiments, grooves matched with the fans 13 are formed in the plurality of fins 12, the fans 13 are arranged at the center positions of the plurality of fins 12, the grooves matched in the plurality of fins 12 can be used for matched clamping installation of the fans 13, and the fans 13 at the center positions can be used for central air guiding, so that heat dissipation is facilitated.
The utility model discloses a theory of operation: when the heat exchange plate is used, the attachment plate 1 is attached to network heat dissipation equipment, the tightening bolts 3 are clamped on the side lugs 2 on two sides of the attachment plate 1 and connected with the equipment through the tightening bolts 3, the springs 4 are sleeved on the tightening bolts 3, when the tightening bolts 3 are fastened with the equipment, the attachment plate 1 is extruded and attached to the equipment through the springs 4 and tightly attached, the smooth surface on one side of the attachment plate 1 is attached to the equipment needing heat dissipation to conduct heat, the copper bars 5 on the attachment plate 1 conduct the heat to the tail end, the copper bars 5 are attached to the heat exchange plate 7 to transfer the heat to the heat exchange plate 7, the heat exchange plate 7 conducts and conducts cold water through the water inlet pipe 9 and the water outlet pipe 10, the heat exchange efficiency is improved by conducting heat exchange between the heat exchange plate 7 and the cold water through the heat exchange pipe groove 8, the heat exchange plate 7 is fixedly connected with the heat conduction frame 11, the fins 12 are connected to the heat conduction frame 11, the fan 13 is externally connected with a power supply, the fan 13 is started to drive air flow, and conducts air cooling heat dissipation through the plurality of the fins 12, the heat exchange tube grooves 8 are arranged in a snake shape, and the heat exchange tube grooves 8 are uniformly distributed in the heat exchange plates 7; through snakelike evenly distributed's heat transfer pipe groove 8 promotion heat transfer area of contact, let cold water and the quick heat transfer of heat, promote the radiating efficiency.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It should be understood by those skilled in the art that the present invention is not limited by the above embodiments, and the description in the above embodiments and the description is only preferred examples of the present invention, and is not intended to limit the present invention, and that the present invention can have various changes and modifications without departing from the spirit and scope of the present invention, and these changes and modifications all fall into the scope of the claimed invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (7)
1. A heat dissipation mechanism for computer network equipment, including rigging board (1) and heat transfer board (7), its characterized in that: two sides of the attaching plate (1) are fixedly connected with side lugs (2), the inner parts of the side lugs (2) are clamped with tightening bolts (3), a spring (4) is sleeved on the tightening bolt (3), one side of the attaching plate (1) is welded and connected with a copper bar (5), one end of the copper bar (5) is clamped with a fastening plate (6), the bottom of the heat exchange plate (7) is connected with the fastening plate (6) through a bolt, one end of the copper bar (5) is jointed and connected with a heat exchange plate (7), a heat exchange pipe groove (8) is arranged inside the heat exchange plate (7), one end of the heat exchange plate (7) is connected with a water inlet pipe (9) and a water outlet pipe (10), fixedly connected with heat conduction frame (11) on heat transfer board (7), connect a plurality of fins (12) on heat conduction frame (11), it is a plurality of fin (12) inside joint has fan (13).
2. The heat dissipation mechanism for a computer network device of claim 1, wherein: the inside of side ear (2) sets up the draw-in groove with spring (4) assorted, the gasket is connected to the one end of spring (4).
3. The heat dissipation mechanism for a computer network device of claim 1, wherein: one side of the attaching plate (1) is a smooth surface, and the copper bars (5) are connected with a plurality of groups on one side of the attaching plate (1).
4. The heat dissipation mechanism for a computer network device of claim 1, wherein: the heat exchange pipe grooves (8) are arranged in a snake shape, and the heat exchange pipe grooves (8) are uniformly distributed in the heat exchange plate (7).
5. The heat dissipation mechanism for a computer network device of claim 1, wherein: the inner diameters of the water inlet pipe (9) and the water outlet pipe (10) are equal, and the water inlet pipe (9) and the water outlet pipe (10) are both connected with sealing rings.
6. The heat dissipation mechanism for a computer network device of claim 1, wherein: the heat conduction frame (11) is U-shaped, and the width of the heat conduction frame (11) is one fifth of the width of the fins (12).
7. The heat dissipation mechanism for a computer network device of claim 1, wherein: grooves matched with the fans (13) are formed in the plurality of fins (12), and the fans (13) are arranged in the center positions of the plurality of fins (12).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120342430.7U CN214125862U (en) | 2021-02-05 | 2021-02-05 | Heat dissipation mechanism for computer network equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202120342430.7U CN214125862U (en) | 2021-02-05 | 2021-02-05 | Heat dissipation mechanism for computer network equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
CN214125862U true CN214125862U (en) | 2021-09-03 |
Family
ID=77496841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202120342430.7U Active CN214125862U (en) | 2021-02-05 | 2021-02-05 | Heat dissipation mechanism for computer network equipment |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN214125862U (en) |
-
2021
- 2021-02-05 CN CN202120342430.7U patent/CN214125862U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN215418156U (en) | Microchannel copper-aluminum composite relieving liquid cooling radiator | |
CN115079795A (en) | Liquid cooling server and liquid cooling heat dissipation hard disk module thereof | |
CN216313680U (en) | Liquid cooling plate assembly for server CPU | |
CN214125862U (en) | Heat dissipation mechanism for computer network equipment | |
CN109637989B (en) | Parallel pipeline liquid cooling radiator for radiating high-power IGBT | |
CN207674758U (en) | A kind of water-cooling type semiconductor cooling device | |
CN212434709U (en) | Heat dissipation plate, heat dissipation assembly and battery module | |
CN212081454U (en) | Refrigerant radiator, electrical box and air conditioning unit | |
CN211429863U (en) | Composite circuit board with high heat dissipation performance | |
CN213241061U (en) | Notebook cooling fin mechanism | |
CN210861872U (en) | Cooling device on speed reducer | |
CN220191317U (en) | Water-cooling radiator for reducing explosion-proof frequency converter | |
CN213754191U (en) | Motor heat dissipation assembly and heat dissipation motor | |
CN213122869U (en) | Radiator with heat conducting copper pipe for accelerating heat conduction | |
CN210157554U (en) | Machine box | |
CN218548419U (en) | Heat radiation assembly | |
CN218163399U (en) | Electronic load power module unit and device | |
CN221409548U (en) | Heat radiation system of heating equipment | |
CN215453746U (en) | Display and terminal equipment | |
CN220693565U (en) | Radiator | |
CN220528432U (en) | Heat dissipation mechanism and radiator | |
CN218918066U (en) | Active heat dissipation structure of all-in-one machine | |
CN218915170U (en) | Heat radiation system and air conditioner | |
CN218100130U (en) | Radiator for server CPU | |
CN220963322U (en) | Radiating fin structure and chip radiator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |