CN218100130U

CN218100130U - Radiator for server CPU

Info

Publication number: CN218100130U
Application number: CN202221349683.8U
Authority: CN
Inventors: 朱超; 徐金博; 高丙午
Original assignee: Dongguan City Hao Electronic Technology Co ltd
Current assignee: Dongguan City Hao Electronic Technology Co ltd
Priority date: 2022-05-31
Filing date: 2022-05-31
Publication date: 2022-12-20
Anticipated expiration: 2032-05-31

Abstract

The utility model belongs to the technical field of the radiator, especially, relate to a radiator for server CPU, including first heat dissipation mechanism, second heat dissipation mechanism, first heat conduction copper pipe, second heat conduction copper pipe and heat-conducting plate, the heat-conducting plate install in first heat dissipation mechanism, install a gasket on the heat-conducting plate, first heat conduction copper pipe install in first heat dissipation mechanism, the one end of second heat conduction copper pipe install in first heat dissipation mechanism, the other end of second heat conduction copper pipe outwards extend and install in the second heat dissipation mechanism, first heat dissipation mechanism with second heat dissipation mechanism passes through second heat conduction copper pipe interconnect is the T type setting, first heat dissipation mechanism with second heat dissipation mechanism is the T style of calligraphy and connects, helps the air current to pass through, with heat conduction extremely in the second heat dissipation mechanism to evenly dispel the heat.

Description

Radiator for server CPU

Technical Field

The utility model belongs to the technical field of the radiator, especially, relate to a radiator for server CPU.

Background

The CPU can generate a large amount of heat when working, if the heat is not dissipated in time, the heat is easy to crash, the CPU can be burnt out, and the CPU radiator is used for radiating the CPU. The radiator plays a decisive role in the stable operation of the CPU, and it is very important to choose a good radiator when assembling the computer.

At present, most radiators for server CPUs on the market are uneven in heat conduction distribution and unreasonable in air flow channel setting, so that air flow cannot smoothly circulate in the radiators, the radiating effect is poor, and the radiating efficiency of the radiators is affected. Thus, it is actually necessary to design a heat sink for a server CPU.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a radiator for server CPU aims at solving among the prior art because of heat conduction distributes inhomogeneous, airflow channel sets up unreasonable, leads to the technical problem that the radiating efficiency of radiator reduces.

In order to achieve the above object, an embodiment of the present invention provides a heat sink for a server CPU, including a first heat dissipation mechanism, a second heat dissipation mechanism, a first heat conduction copper pipe, a second heat conduction copper pipe and a heat conduction plate, the heat conduction plate install in the first heat dissipation mechanism, install a gasket on the heat conduction plate, the first heat conduction copper pipe install in the first heat dissipation mechanism, the one end of the second heat conduction copper pipe install in the first heat dissipation mechanism, the other end of the second heat conduction copper pipe outwards extend and install in the second heat dissipation mechanism, the first heat dissipation mechanism with the second heat dissipation mechanism passes through the second heat conduction copper pipe interconnect and be the setting of T type, the first heat dissipation mechanism is connected with the mainboard through a connection component in a matching manner.

Optionally, first heat dissipation mechanism includes first heat dissipation backplate, a plurality of cooling tube recesses of a side-mounting of first heat dissipation backplate, first heat dissipation copper pipe with the one end of second heat dissipation copper pipe install in the cooling tube recess, the opposite side of first heat dissipation backplate is provided with a rectangular channel, the heat-conducting plate install in the rectangular channel, make the heat-conducting plate with first heat conduction copper pipe with the contact of second heat conduction copper pipe.

Optionally, a plurality of heat dissipation fins are further disposed on one side of the first heat dissipation back plate, and the heat dissipation fins cover one side of the first heat dissipation back plate.

Optionally, first heat dissipation backplate is equipped with a plurality of first mounting holes and mounting groove, the mounting groove is located the opposite side of first heat dissipation backplate, first mounting hole set up in the mounting groove and run through first heat dissipation backplate, first heat dissipation backplate passes through the coupling assembling cooperation first mounting hole with the mounting groove is fixed in the mainboard.

Optionally, the connecting assembly includes a limiting ring, a first positioning stud and a buffer spring, the limiting ring is accommodated in the mounting groove, an annular groove is formed in the tail of the first positioning stud and is matched with the limiting ring, the buffer spring is sleeved into the first positioning stud, and the buffer spring is located between the head of the first positioning stud and the first heat dissipation back plate.

Optionally, the second heat dissipation mechanism includes a second heat dissipation back plate, a back plate groove is formed in one side of the second heat dissipation back plate, and the other end of the second heat conduction copper pipe is installed in the back plate groove.

Optionally, a plurality of heat dissipation fins are arranged on the other side of the second heat dissipation back plate, and the plurality of heat dissipation fins are uniformly distributed on the other side of the second heat dissipation back plate.

Optionally, two ends of the second heat dissipation back plate are provided with second mounting holes, the second mounting holes are matched with a second positioning stud, the second positioning stud comprises a second screw and a second nut which is arranged in a hexagonal shape, the second screw penetrates through the second mounting holes, and the second nut is abutted to the second heat dissipation back plate.

Optionally, the number of the first heat conduction copper pipes is 2, the two first heat conduction copper pipes are symmetrically arranged on the side edge of the heat conduction plate, and the first heat conduction copper pipes are arranged in an arc shape.

Optionally, the number of the second heat conduction copper pipes is 2, one ends of the two second heat conduction copper pipes are symmetrically arranged in the middle of the heat conduction plate and located between the two first heat conduction copper pipes, and the other ends of the two second heat conduction copper pipes are installed in the second heat dissipation mechanism.

The embodiment of the utility model provides an above-mentioned one or more technical scheme for in server CPU's radiator have one of following technological effect at least:

the utility model discloses a set up first heat conduction copper pipe with second heat conduction copper pipe with the heat-conducting plate contacts each other, with the heat conduction extremely in the first heat dissipation mechanism, still pass through second heat conduction copper pipe will first heat dissipation mechanism with second heat dissipation mechanism is the T style of calligraphy and connects, helps the air current to pass through, with the heat conduction extremely in the second heat dissipation mechanism to evenly dispel the heat, prevent the too high influence radiating effect of first heat dissipation mechanism local temperature improves the radiating efficiency of radiator.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is an exploded schematic view of a heat sink for a server CPU according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of a heat sink for a server CPU according to an embodiment of the present invention;

fig. 3 is another schematic structural diagram of a heat sink for a server CPU according to an embodiment of the present invention;

fig. 4 is a schematic structural view of a hidden heat dissipation fin of a heat sink for a CPU of a server according to an embodiment of the present invention;

fig. 5 is a schematic structural view of a first heat dissipation backplate provided in an embodiment of the present invention.

Wherein, in the figures, the respective reference numerals:

100. a first heat dissipation mechanism; 110. a first heat dissipation backplate; 111. a heat dissipating fin; 112. a first mounting hole; 113. mounting grooves; 114. a radiating pipe groove; 115. a rectangular groove; 200. a second heat dissipation mechanism; 210. a second heat dissipation back plate; 211. a back plate groove; 212. heat dissipation fins; 213. a second mounting hole; 220. a second locating stud; 221. a second screw; 222. a second nut; 300. a first heat conducting copper tube; 400. a second heat conducting copper pipe; 500. a heat conducting plate; 501. a gasket; 600. a connection assembly; 610. a limiting ring; 620. a first positioning stud; 630. an annular groove; 640. a buffer spring.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary and intended to explain the embodiments of the present invention and are not to be construed as limiting the present invention.

In the description of the embodiments of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings, which is only for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element so indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly, e.g., as fixed or detachable connections or as an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the embodiments of the present invention can be understood by those skilled in the art according to specific situations.

In an embodiment of the present invention, as shown in fig. 1 to 5, there is provided a heat sink for a server CPU, including a first heat dissipation mechanism 100, a second heat dissipation mechanism 200, a first heat conduction copper pipe 300, a second heat conduction copper pipe 400 and a heat conduction plate 500, wherein the heat conduction plate 500 is installed in the first heat dissipation mechanism 100, a gasket 501 is installed on the heat conduction plate 500, and the gasket 501 is connected with an external CPU (not shown) through resin. The first heat conduction copper pipe 300 is installed in the first heat dissipation mechanism 100, one end of the second heat conduction copper pipe 400 is installed in the first heat dissipation mechanism 100, the other end of the second heat conduction copper pipe 400 extends outwards and is installed in the second heat dissipation mechanism 200, and both the first heat conduction copper pipe 300 and the second heat conduction copper pipe 400 are in contact with the heat conduction plate 500. The first heat dissipation mechanism 100 and the second heat dissipation mechanism 200 are connected to each other through the second thermal copper tube 400 and are arranged in a T shape, and the first heat dissipation mechanism 100 is connected to a motherboard (not shown) through a connection assembly 600 in a matching manner.

The utility model discloses a set up first heat conduction copper pipe 300 with second heat conduction copper pipe 400 with heat-conducting plate 500 contacts each other, with the heat conduction extremely in the first heat dissipation mechanism 100, still pass through second heat conduction copper pipe 400 will first heat dissipation mechanism 100 with second heat dissipation mechanism 200 is the T style of calligraphy and connects, helps the air current to pass through, with the heat conduction extremely in the second heat dissipation mechanism 200 to evenly dispel the heat, prevent the too high influence radiating effect of first heat dissipation mechanism 100 local temperature improves the radiating efficiency of radiator.

Specifically, in another embodiment of the present invention, as shown in fig. 1, fig. 2 and fig. 5, the first heat dissipation mechanism 100 includes a first heat dissipation plate 110, a plurality of heat dissipation pipe grooves 114 are installed on one side of the first heat dissipation plate 110, the first heat dissipation copper pipe and one end of the second heat dissipation copper pipe are installed in the heat dissipation pipe grooves 114, a rectangular groove 115 is provided on the other side of the first heat dissipation plate 110, and the heat conduction plate 500 is installed in the rectangular groove 115, such that the heat conduction plate 500 is in contact with the first heat conduction copper pipe 300 and the second heat conduction copper pipe 400.

Specifically, in another embodiment of the present invention, as shown in fig. 1 to 5, the first heat dissipation back plate 110 is provided with a plurality of first mounting holes 112 and mounting grooves 113, the mounting grooves 113 are disposed on the other side of the first heat dissipation back plate 110, the first mounting holes 112 are disposed in the mounting grooves 113 and penetrate through the first heat dissipation back plate 110, and the first heat dissipation back plate 110 is fixed to the main plate through the connection assembly 600 matching the first mounting holes 112 and the mounting grooves 113. Further, the connecting assembly 600 includes a limiting ring 610, a first positioning stud 620 and a buffer spring 640, the limiting ring 610 is accommodated in the mounting groove 113, a circular groove 630 mutually matched with the limiting ring 610 is formed at the tail of the first positioning stud 620, the buffer spring 640 is sleeved in the first positioning stud 620, and the buffer spring 640 is located between the head of the first positioning stud 620 and the first heat dissipation back plate 110. The first positioning stud 620 passes through the first mounting hole 112 and is limited by the limiting ring 610, so that the utility model has the advantages of simple mode and no need of repeated positioning; moreover, the buffer spring 640 is easily sleeved in the first positioning stud 620, and the first positioning stud 620 also easily penetrates through the first mounting hole 112 to be connected with the mainboard in a matching manner, so that the problems of difficulty in connection and low mounting efficiency of the heat dissipation mechanism and the mainboard in the prior art are solved, the purpose of fastening and mounting the first heat dissipation mechanism 100 is achieved on the premise of quick positioning, improvement of mounting efficiency and reduction of production cost, and the practicability is high. Generally, four of the connecting assemblies 600 may mount one of the first heat dissipation mechanisms 100. In this embodiment, the number of the connecting assemblies 600 is 4.

Specifically, in another embodiment of the present invention, as shown in fig. 1 and 4, the second heat dissipation mechanism 200 includes a second heat dissipation back plate 210, one side of the second heat dissipation back plate 210 is provided with a back plate groove 211, and the other end of the second heat conduction copper pipe 400 is installed in the back plate groove 211, so that heat is conducted to the second heat dissipation back plate 210 through the second heat conduction copper pipe 400, and is dissipated by the heat dissipation fins 212.

Specifically, in another embodiment of the present invention, as shown in fig. 1 to 5, a plurality of heat dissipation fins 111 are further disposed on one side of the first heat dissipation back plate 110, and the plurality of heat dissipation fins 111 cover one side of the first heat dissipation back plate 110. Further, a plurality of heat dissipation fins 212 are disposed on the other side of the second heat dissipation back plate 210, and the plurality of heat dissipation fins 212 are uniformly distributed on the other side of the second heat dissipation back plate 210. Through second heat conduction copper pipe 400 will radiating fin 111 with radiating fin 212 links to each other, outside heat dissipation fan to radiating fin 111 air supply, through with first heat dissipation construct with second heat dissipation mechanism 200 is the T type setting, is favorable to the air current to pass through, by second heat conduction copper pipe 400 with heat conduction extremely radiating fin 212 plays balanced radiating effect, prevents first heat dissipation mechanism 100's local high temperature influences the radiating effect, improves whole radiating efficiency.

Further, two ends of the second heat dissipation back plate 210 are provided with second mounting holes 213, the second mounting holes 213 are matched with a second positioning stud 220, the second positioning stud 220 includes a second screw 221 and a second nut 222 arranged in a hexagon, the second screw 221 penetrates through the second mounting holes 213, and the second nut 222 is abutted to the second heat dissipation back plate 210. Therefore, the second heat dissipation mechanism 200 is convenient to mount in a narrow space and convenient to dismount and mount during subsequent maintenance due to the fact that the second positioning stud 220 is rotated to adjust the follow-up connection between the second heat dissipation mechanism 200 and the main board.

Specifically, in another embodiment of the present invention, as shown in fig. 1 to 5, the number of the first heat conducting copper pipes 300 is 2, two of the first heat conducting copper pipes 300 are symmetrically disposed at the side of the heat conducting plate 500, and the first heat conducting copper pipes 300 are disposed in an arc shape. It should be understood that the number of the first thermal copper pipes 300 may be plural, and in this embodiment, the number of the first thermal copper pipes 300 is preferably 2. Further, the number of the second heat conduction copper pipes 400 is 2, one ends of the two second heat conduction copper pipes 400 are symmetrically arranged in the middle of the heat conduction plate 500 and located between the two first heat conduction copper pipes 300, and the other ends of the two second heat conduction copper pipes 400 are installed in the second heat dissipation mechanism 200. The heat of the heat-conducting plate 500 is conducted to the heat-radiating fins 111 by disposing the first heat-conducting copper pipe 300 at the side of the heat-conducting plate 500; the second heat conducting copper tube 400 is disposed in the middle of the heat conducting plate 500, so that the heat of the heat conducting plate 500 is conducted to the heat dissipating fins 212, and thus, the heat is dissipated and conducted, thereby achieving the effects of heat dissipation and temperature reduction. The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a radiator for server CPU, its characterized in that, includes first heat dissipation mechanism, second heat dissipation mechanism, first heat conduction copper pipe, second heat conduction copper pipe and heat-conducting plate, the heat-conducting plate install in first heat dissipation mechanism, install a gasket on the heat-conducting plate, first heat conduction copper pipe install in first heat dissipation mechanism, the one end of second heat conduction copper pipe install in first heat dissipation mechanism, the other end of second heat conduction copper pipe outwards extend and install in second heat dissipation mechanism, first heat dissipation mechanism with second heat dissipation mechanism passes through second heat conduction copper pipe interconnect and be the setting of T type, first heat dissipation mechanism is connected with the mainboard cooperation through a connecting element.

2. The heat sink for the server CPU as claimed in claim 1, wherein the first heat dissipation mechanism comprises a first heat dissipation backplate, one side of the first heat dissipation backplate is provided with a plurality of heat dissipation pipe grooves, one ends of the first heat dissipation copper pipe and the second heat dissipation copper pipe are mounted in the heat dissipation pipe grooves, the other side of the first heat dissipation backplate is provided with a rectangular groove, and the heat conduction plate is mounted in the rectangular groove so that the heat conduction plate is in contact with the first heat conduction copper pipe and the second heat conduction copper pipe.

3. The heat sink for the server CPU as claimed in claim 2, wherein a plurality of heat dissipation fins are further disposed on one side of the first heat dissipation backplate, and the heat dissipation fins cover one side of the first heat dissipation backplate.

4. The heat sink for the CPU of the server according to claim 2, wherein the first heat dissipation backplate is provided with a plurality of first mounting holes and mounting grooves, the mounting grooves are disposed on the other side of the first heat dissipation backplate, the first mounting holes are disposed in the mounting grooves and penetrate through the first heat dissipation backplate, and the first heat dissipation backplate is fixed to the main board by the coupling assembly cooperating with the first mounting holes and the mounting grooves.

5. The heat sink for the server CPU according to claim 4, wherein the connection assembly comprises a limit ring, a first positioning stud and a buffer spring, the limit ring is accommodated in the installation groove, the tail of the first positioning stud is provided with an annular groove matched with the limit ring, the buffer spring is sleeved in the first positioning stud, and the buffer spring is located between the head of the first positioning stud and the first heat dissipation back plate.

6. The heat sink for the server CPU according to claim 1, wherein the second heat dissipation mechanism includes a second heat dissipation backplate, a backplate groove is provided on one side of the second heat dissipation backplate, and the other end of the second heat conduction copper pipe is installed in the backplate groove.

7. The heat sink for the server CPU as claimed in claim 6, wherein a plurality of heat dissipation fins are disposed on the other side of the second heat dissipation back plate, and the heat dissipation fins are uniformly distributed on the other side of the second heat dissipation back plate.

8. The heat sink for the CPU of the server according to claim 7, wherein the second heat dissipation backplate has second mounting holes at two ends thereof, the second mounting holes are engaged with a second positioning stud, the second positioning stud comprises a second screw and a second nut disposed in a hexagon, the second screw passes through the second mounting holes, and the second nut abuts against the second heat dissipation backplate.

9. The heat sink for the CPU of the server according to any one of claims 1 to 8, wherein the number of the first heat conducting copper tubes is 2, two first heat conducting copper tubes are symmetrically arranged at the side edges of the heat conducting plate, and the first heat conducting copper tubes are arranged in an arc shape.

10. The heat sink for the CPU of the server according to any one of claims 1 to 8, wherein the number of the second heat conducting copper tubes is 2, one ends of the two second heat conducting copper tubes are symmetrically disposed in the middle of the heat conducting plate and located between the two first heat conducting copper tubes, and the other ends of the two second heat conducting copper tubes are mounted in the second heat dissipating mechanism.