CN219459657U - Brazing water-cooling radiator and power supply - Google Patents
Brazing water-cooling radiator and power supply Download PDFInfo
- Publication number
- CN219459657U CN219459657U CN202320864106.0U CN202320864106U CN219459657U CN 219459657 U CN219459657 U CN 219459657U CN 202320864106 U CN202320864106 U CN 202320864106U CN 219459657 U CN219459657 U CN 219459657U
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- water
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- conducting plate
- heat conducting
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- 238000001816 cooling Methods 0.000 title claims abstract description 52
- 238000005219 brazing Methods 0.000 title description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 126
- 230000003014 reinforcing effect Effects 0.000 claims description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 239000003351 stiffener Substances 0.000 claims 4
- 230000000694 effects Effects 0.000 abstract description 13
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 238000009434 installation Methods 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052755 nonmetal Inorganic materials 0.000 description 4
- 238000005728 strengthening Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The application discloses water-cooling radiator and power braze, it includes: a first heat-conducting plate; a second heat conductive plate spaced apart from one side of the first heat conductive plate; the water cooling plate is positioned between the first heat conduction plate and the second heat conduction plate; a water flow channel is arranged in the water cooling plate, and a water inlet and a water outlet are arranged on the water cooling plate; one end of the water flow channel is communicated with the water inlet, and the other end of the water flow channel is communicated with the water outlet; the side surface of the water cooling plate, which is close to the first heat conducting plate, and the side surface of the second heat conducting plate are both planes and are respectively attached to the first heat conducting plate and the second heat conducting plate, so that the installation space of the surface of the water cooling plate is increased, the first heat conducting plate and the second heat conducting plate are more conveniently installed, the contact area between the first heat conducting plate, the second heat conducting plate and the water cooling plate is increased, and the heat dissipation effect is improved when the power device is installed on the surface of the first heat conducting plate and the second heat conducting plate.
Description
Technical Field
The utility model relates to the technical field of power supply equipment, in particular to a brazing water-cooling radiator and a power supply.
Background
In the existing power supply module, a water-cooled radiator is generally adopted to radiate heat of a main control circuit board or a power device, and a water flow channel is punched on a plate material to be formed when the water-cooled radiator is used for preparing the water-cooled board so as to introduce a cold source into the water flow channel, thereby realizing radiating and cooling; after the water flow channel is stamped and formed, the position of the plate corresponding to the water flow channel is outwards protruded, so that when devices to be heat-dissipated, such as a main control circuit board, with larger surface area are assembled on the plate, only contact between the main control circuit board and part of the protruded part of the water flow channel can be realized, the contact area is small, and finally, the heat-dissipating effect is poor.
Accordingly, the prior art is still in need of improvement and development.
Disclosure of Invention
The utility model aims to solve the technical problems by providing a brazing water-cooling radiator and a power supply aiming at the defects in the prior art, and aims to improve the radiating effect.
The technical scheme adopted for solving the technical problems is as follows:
a brazed water cooled heat sink, comprising:
a first heat-conducting plate;
a second heat conductive plate spaced apart from one side of the first heat conductive plate;
the water cooling plate is positioned between the first heat conduction plate and the second heat conduction plate;
the side surface of the water cooling plate, which is close to the first heat conducting plate, and the side surface of the second heat conducting plate are both planes and are respectively attached to the first heat conducting plate and the second heat conducting plate; a water flow channel is arranged in the water cooling plate, and a water inlet and a water outlet are arranged on the water cooling plate; one end of the water flow channel is communicated with the water inlet, and the other end of the water flow channel is communicated with the water outlet.
The brazed water-cooled heat sink further comprises:
a plurality of reinforcing ribs arranged at intervals in the water flow path;
one end of the reinforcing rib is arranged towards the direction of the first heat conducting plate and is connected with the inner wall of the water flow channel; the other end of the heat conducting plate is arranged towards the direction of the second heat conducting plate and is connected with the inner wall of the water flow passage.
The brazing water-cooling radiator is characterized in that the reinforcing ribs are cylindrical reinforcing ribs.
The brazing water-cooling radiator is characterized in that the reinforcing ribs are metal heat conduction reinforcing ribs or nonmetal heat conduction reinforcing ribs.
The brazed water-cooled heat sink further comprises:
the two convex parts are symmetrically arranged along the width direction of the water flow channel and are connected with the inner side wall of the water flow channel; the two bosses are located upstream of and near the bend of the water flow channel.
The brazing water-cooling radiator is characterized in that the protruding portion is a circular arc protruding portion.
The brazed water-cooled heat sink further comprises:
and the heat conduction device is arranged on the surface of the first heat conduction plate and/or the surface of the second heat conduction plate.
The brazing water-cooling radiator comprises a heat-conducting aluminum tank and/or a heat-conducting cement block.
A power supply comprising the brazed water cooled heat sink of any one of the above, further comprising:
the main control circuit board is arranged on the first heat conducting plate or the second heat conducting plate.
The beneficial effects are that: in this application the water-cooling board becomes planar structure, makes the installation space increase of the surface of water-cooling board, more be convenient for with first heat-conducting board with when the second heat-conducting board is installed, can increase first heat-conducting board the second heat-conducting board with area of contact between the water-cooling board, thereby first heat-conducting board with when second heat-conducting board surface mounting power device promotes the radiating effect.
Drawings
FIG. 1 is a schematic diagram of the power supply described in the present application;
FIG. 2 is a schematic view of a portion of a brazed water cooled radiator described herein;
FIG. 3 is a schematic view of an exploded construction of a brazed water cooled radiator as described herein;
fig. 4 is an enlarged partial schematic view at a in fig. 3.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more clear and clear, the present utility model will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
The inventor finds that the existing power module generally adopts a water-cooled radiator to radiate heat of a main control circuit board or a power device, and the water-cooled radiator adopts a water runner formed by punching a plate material when the water-cooled board is prepared so as to introduce a cold source into the water runner, thereby realizing radiating and cooling.
After the water flow passage is punched and formed, the plate corresponding to the water flow passage is outwards raised to form raised part with the shape the same as that of the water flow passage and corresponding to the water flow passage. In the prior art, when the main control circuit board or other power devices are cooled, the main control circuit board or other power devices are directly attached to the board. Due to the fact that the protruding portions on the surface of the plate are arranged, the area, suitable for assembling the device to be cooled, of the surface of the plate is small, when the device to be cooled, such as a main control circuit board, with a large surface area is assembled on the plate, only the contact between the main control circuit board and the protruding portions of the water flow channels can be achieved, the device to be cooled cannot be in contact with the whole surface of the plate, the contact area between the device to be cooled and the plate is small, and finally the heat dissipation effect is poor.
To solve the above technical problems, the present application provides a brazed water-cooled radiator, as shown in fig. 1 and 3, including: a first heat-conducting plate 1, a second heat-conducting plate 2 and a water-cooling plate 3; the first heat-conducting plate 1 and the second heat-conducting plate 2 are arranged opposite to each other, and a gap is arranged between the first heat-conducting plate 1 and the second heat-conducting plate 2. The first heat-conducting plate 1 and the second heat-conducting plate 2 have heat conductivity and rapid temperature equalization performance; and the first heat-conducting plate 1 and the second heat-conducting plate 2 are both in flat plate structures, so that the surfaces of the first heat-conducting plate 1 and the second heat-conducting plate 2 can be assembled with a main control circuit board or other power devices to be subjected to heat dissipation.
The water cooling plate 3 is positioned between the first heat conducting plate 1 and the second heat conducting plate 2; the side surface of the water cooling plate 3, which is close to the first heat conducting plate 1, and the side surface of the second heat conducting plate 2 are both planes, namely, the water cooling plate 3 is also of a flat plate structure, and the two planes of the water cooling plate 3 are respectively attached to the first heat conducting plate 1 and the second heat conducting plate 2. A cavity structure is integrally formed in the water cooling plate 3, and the cavity structure forms a water runner; the water cooling plate 3 is provided with a water inlet and a water outlet, one end of the water flow channel 4 is communicated with the water inlet, and the other end of the water flow channel is communicated with the water outlet, so that a water flow circulation loop is formed in the water cooling plate 3 to radiate heat of the power device.
In this application, because the surface of water-cooling board 3 is planar structure, make the installation space increase on the surface of water-cooling board 3, when being convenient for more install external structure, can increase its area of contact with external structure between, thereby promote the radiating effect. In addition, in the application, the first heat-conducting plate 1 and the second heat-conducting plate 2 are arranged on two side planes of the water-cooling plate 3, so that the main control circuit board or other power devices in the power supply are installed in a matched mode through the first heat-conducting plate 1 and the second heat-conducting plate 2, the main control circuit board or other power devices are not directly contacted with the water-cooling plate 3, heat conduction and heat diffusion are conducted on heat emitted by the main control circuit board or other power devices by utilizing the heat conduction performance of the first heat-conducting plate 1 and the heat conduction performance of the second heat-conducting plate 2, heat dissipation and cooling are achieved, meanwhile, the temperature balance of the power devices is improved, and the temperature difference of all parts of the power devices is avoided.
In one embodiment of the present application, the first heat-conducting plate 1 and the second heat-conducting plate 2 are attached to the water-cooling plate 3 by brazing. The water inlet is provided with a water inlet pipe joint 30, and the water outlet is provided with a water outlet pipe joint 40 (shown in fig. 1 and 3).
The brazed water-cooled radiator further comprises a plurality of reinforcing ribs 5, as shown in fig. 3 and 4, the plurality of reinforcing ribs 5 being arranged at intervals in the water flow passage 4. The reinforcing ribs 5 are arranged in an extending manner along the arrangement direction of the first heat-conducting plate 1 and the second heat-conducting plate 2; specifically, one end of the reinforcing rib 5 is arranged towards the first heat conducting plate 1 and is connected with the inner wall of the water flow channel 4; the other end is arranged towards the second heat-conducting plate 2 and is connected with the inner wall of the water flow channel 4.
In this application set up a plurality of strengthening ribs 5 in the water flow path 4, and make strengthening rib 5 follow first heat-conducting plate 1 with the direction of arrangement of second heat-conducting plate 2 respectively with the both sides inner wall connection of water flow path 4, thereby pass through strengthening rib 5 is right in the water-cooling plate 3 water flow path 4 department strengthens, avoids brazing in-process water flow path 4 department lateral wall produces to expand, or warp because of intensity is not enough.
Meanwhile, since the reinforcing ribs 5 are located in the water flow channel 4, when water is introduced into the water flow channel 4, the reinforcing ribs 5 can split the water flow to generate turbulence, so that the water flow is fully dispersed in the water flow channel 4, the convection heat exchange area is increased, the convection heat exchange effect of the liquid and the inside of the water cooling plate 3 is improved, and the heat dissipation effect is further improved.
In one embodiment of the present embodiment, the reinforcing ribs 5 are disposed at the center of the water flow path 4 in the width direction of the water flow path 4.
In one implementation manner of this embodiment, the reinforcing ribs 5 are cylindrical reinforcing ribs 5, so that no matter in which direction the water flows, the blocking and dispersing effects of the cylindrical reinforcing ribs 5 on the water flow are the same, and therefore no limitation on the water flow direction is needed; even if the water inlet direction and the water outlet direction are reversed, the normal running of the water flow is not affected. The central axis of the cylindrical reinforcing rib 5 is parallel to the arrangement direction of the first heat-conducting plate 1 and the second heat-conducting plate 2.
In an implementation manner of this embodiment, the reinforcing ribs 5 are metal heat-conducting reinforcing ribs 5 or nonmetal heat-conducting reinforcing ribs 5, that is, the reinforcing ribs 5 may be made of metal or nonmetal. Whether the reinforcing ribs 5 are made of metal or nonmetal, the reinforcing ribs 5 have heat conduction performance.
In this embodiment, the reinforcing ribs 5 support the water flow channel 4, and simultaneously transfer heat on the surface of the water cooling plate 3 into the water flow channel 4, so that the liquid in the water flow channel 4 can exchange heat with the reinforcing ribs 5, thereby further improving the heat dissipation effect.
In one embodiment of the present application, the water flow channel 4 is a curved water flow channel 4; the brazing water-cooled radiator further comprises two protruding portions 6, as shown in fig. 4, wherein the two protruding portions 6 are symmetrically arranged along the width direction of the water flow channel 4 and are connected with the inner side wall of the water flow channel 4. The two projections 6 are located upstream of the bend 41 of the water channel 4 and close to the bend 41 of the water channel 4.
In this embodiment, the width of the corresponding position in the water channel 4 is narrowed by the two protruding portions 6, and the width of the water channel 4 downstream of the two protruding portions 6 is widened compared with the width of the position of the two protruding portions 6, so that the flow rate of the liquid is increased after passing through the two protruding portions 6, thereby accelerating the flow through the curve 41 of the water channel 4, and improving the overall flow rate in the water channel 4, so as to improve the circulation speed of the liquid in the water channel 4, and further improve the heat dissipation effect.
In one embodiment of this embodiment, the protruding portion 6 is a circular arc protruding portion, so that the protruding portion 6 is in a state of being higher at the middle and lower at the two sides along the water flow direction, so that the liquid flow is guided by the interaction of the two protruding portions 6.
The brazing water-cooling radiator further comprises a heat conducting device 7, and the heat conducting device 7 is arranged on the surface of the first heat conducting plate 1 (shown in fig. 2) and/or the surface of the second heat conducting plate 2. The heat conduction devices 7 are multiple, and an accommodating space is defined between the heat conduction devices 7, and the accommodating space is used for accommodating a main control circuit board or other power devices.
The heat conducting device 7 is close to the main control circuit board or other power devices, so that heat generated by the main control circuit board or other power devices is transmitted to the water cooling plate 3 after passing through the heat conducting device 7, the first heat conducting plate 1 or the second heat conducting plate 2 in turn; the heat generated by the main control circuit board or other power devices can be transferred to the water cooling plate 3 through the heat conduction device 7 besides being directly contacted with the first heat conduction plate 1 or the second heat conduction plate 2, so that the heat dissipation effect is further improved.
In one embodiment of the present application, the heat conducting device 7 includes a heat conducting aluminum can and/or a heat conducting cement block.
In an embodiment of the present application, the first heat-conducting plate 1 and the second heat-conducting plate 2 are provided with threaded holes 8 and studs 9 (as shown in fig. 2), and the threaded holes 8 are used for being matched with corresponding screws to fix corresponding power devices, so that the power devices are positioned on the first heat-conducting plate 1 or the second heat-conducting plate 2, and the power devices are convenient to assemble and disassemble. The studs 9 are also used for being matched with corresponding power devices to position the power devices on the first heat-conducting plate 1 or the second heat-conducting plate 2, so that the power devices can be conveniently assembled and disassembled.
The application also provides a power supply comprising the brazed water-cooled radiator according to any one of the above; the power supply further comprises a shell 10 and a main control circuit board 20, wherein the brazing water-cooling radiator and the main control circuit board 20 are both positioned in the shell 10; the main control circuit board 20 is disposed on the first heat-conducting plate 1 (as shown in fig. 1) or the second heat-conducting plate 2.
In summary, the water cooling plate is in a planar structure, so that the installation space of the surface of the water cooling plate is increased, the first heat conducting plate and the second heat conducting plate are more convenient to install, and meanwhile, the contact area between the first heat conducting plate, the second heat conducting plate and the water cooling plate can be increased, so that the heat dissipation effect is improved when the power devices are installed on the surfaces of the first heat conducting plate and the second heat conducting plate.
It is to be understood that the utility model is not limited in its application to the examples described above, but is capable of modification and variation in light of the above teachings by those skilled in the art, and that all such modifications and variations are intended to be included within the scope of the appended claims.
Claims (9)
1. A brazed water cooled radiator, comprising:
a first heat-conducting plate;
a second heat conductive plate spaced apart from one side of the first heat conductive plate;
the water cooling plate is positioned between the first heat conduction plate and the second heat conduction plate;
the side surface of the water cooling plate, which is close to the first heat conducting plate, and the side surface of the second heat conducting plate are both planes and are respectively attached to the first heat conducting plate and the second heat conducting plate; a water flow channel is arranged in the water cooling plate, and a water inlet and a water outlet are arranged on the water cooling plate; one end of the water flow channel is communicated with the water inlet, and the other end of the water flow channel is communicated with the water outlet.
2. The brazed water cooled heat sink of claim 1, further comprising:
a plurality of reinforcing ribs arranged at intervals in the water flow path;
one end of the reinforcing rib is arranged towards the direction of the first heat conducting plate and is connected with the inner wall of the water flow channel; the other end of the heat conducting plate is arranged towards the direction of the second heat conducting plate and is connected with the inner wall of the water flow passage.
3. The brazed water cooler of claim 2, wherein the stiffener is a cylindrical stiffener.
4. The brazed water cooler of claim 2, wherein the stiffener is a metallic or non-metallic thermally conductive stiffener.
5. The brazed water cooled heat sink of claim 1, further comprising:
the two convex parts are symmetrically arranged along the width direction of the water flow channel and are connected with the inner side wall of the water flow channel; the two bosses are located upstream of and near the bend of the water flow channel.
6. The brazed water cooler of claim 5, wherein the protrusions are circular arc protrusions.
7. The brazed water cooled heat sink of claim 1, further comprising:
and the heat conduction device is arranged on the surface of the first heat conduction plate and/or the surface of the second heat conduction plate.
8. The brazed water cooler of claim 7, wherein the heat conducting means comprises a heat conducting aluminum can and/or a heat conducting cement block.
9. A power supply comprising the brazed water-cooled heat sink of any one of claims 1 to 8, further comprising:
the main control circuit board is arranged on the first heat conducting plate or the second heat conducting plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320864106.0U CN219459657U (en) | 2023-04-10 | 2023-04-10 | Brazing water-cooling radiator and power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320864106.0U CN219459657U (en) | 2023-04-10 | 2023-04-10 | Brazing water-cooling radiator and power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219459657U true CN219459657U (en) | 2023-08-01 |
Family
ID=87380470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320864106.0U Active CN219459657U (en) | 2023-04-10 | 2023-04-10 | Brazing water-cooling radiator and power supply |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219459657U (en) |
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2023
- 2023-04-10 CN CN202320864106.0U patent/CN219459657U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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Address after: 518100, Building 4, West Half Floor, 601, 701, Building 301, 401, 501, Fubilun Technology Factory, Tantou Community, Songgang Street, Bao'an District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Lianming Power Supply Co.,Ltd. Country or region after: China Address before: 518100 10th floor, 11th floor, 1st workshop, 9th floor, 2nd workshop, No. 128, Shangnan East Road, Huangpu Community, Xinqiao Street, Bao'an District, Shenzhen, Guangdong Patentee before: SHENZHEN LIANMING POWER Co.,Ltd. Country or region before: China |