CN218920830U - Heat abstractor and electronic equipment - Google Patents
Heat abstractor and electronic equipment Download PDFInfo
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- CN218920830U CN218920830U CN202222875027.8U CN202222875027U CN218920830U CN 218920830 U CN218920830 U CN 218920830U CN 202222875027 U CN202222875027 U CN 202222875027U CN 218920830 U CN218920830 U CN 218920830U
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- liquid cooling
- cooling plate
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- cooling board
- heat
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- 239000007788 liquid Substances 0.000 claims abstract description 302
- 238000001816 cooling Methods 0.000 claims abstract description 257
- 239000012530 fluid Substances 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 12
- 239000000110 cooling liquid Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 238000007664 blowing Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
The application provides a heat abstractor and electronic equipment, electronic equipment include casing, electron device and heat abstractor, and heat abstractor and electron device all are located the casing, and heat abstractor includes: the liquid cooling board, the liquid cooling board includes first liquid cooling board, second liquid cooling board and third liquid cooling board, first liquid cooling board is connected in the non-marginal zone of a second liquid cooling board side, and first liquid cooling board and second liquid cooling board are located different planes, first liquid cooling board still connects the non-marginal zone of a side at the third liquid cooling board, and first liquid cooling board and third liquid cooling board are located different planes, second liquid cooling board and third liquid cooling board are connected respectively on the opposite both sides of first liquid cooling board, and second liquid cooling board and third liquid cooling board set up relatively, wherein, be equipped with first runner in the first liquid cooling board, be equipped with the second runner in the second liquid cooling board, be equipped with the third runner in the third liquid cooling board, the both sides of first liquid cooling board all are used for installing electronic device, effectively utilize the both sides of first liquid cooling board dispel the heat.
Description
Technical Field
The application relates to the technical field of heat dissipation, in particular to a heat dissipation device and electronic equipment.
Background
Some electronic equipment power is big, the consumption is high, the heat dissipation demand is high, simultaneously it is harsh to the environmental requirement, generally require heat abstractor can not cause power surrounding air disturbance, consequently, adopt liquid cooling heat dissipation's mode to dispel the heat to electronic equipment generally, but at present usually set up electronic equipment on a bottom plate of the casing of electronic equipment, then a liquid cooling board is connected in the casing bottom plate outside of power, carry out liquid cooling heat dissipation to electronic equipment on the bottom plate through the liquid cooling board, liquid cooling board can only indirectly carry out liquid cooling heat dissipation to electronic equipment in this kind of structure, the radiating effect is not enough, in addition all electronic equipment all set up on a side of bottom plate, when electronic equipment quantity is great, electronic equipment's bottom plate area is also bigger, the utilization ratio of space in the casing is lower.
Disclosure of Invention
Therefore, the application provides a heat dissipating device and an electronic device to solve the technical problems.
A first aspect of the present application provides a heat dissipating device, comprising: the liquid cooling plate, the liquid cooling plate includes first liquid cooling plate, second liquid cooling plate and third liquid cooling plate, first liquid cooling plate is connected the non-marginal area of a second liquid cooling plate side, just first liquid cooling plate with the second liquid cooling plate is located different planes, first liquid cooling plate still connects the non-marginal area of a third liquid cooling plate side, just first liquid cooling plate with the third liquid cooling plate is located different planes, the second liquid cooling plate with the third liquid cooling plate is located on the opposite both sides of first liquid cooling plate, just the second liquid cooling plate with the relative setting of third liquid cooling plate, wherein, be equipped with first runner in the first liquid cooling plate, be equipped with the second runner in the second liquid cooling plate, be equipped with the third runner in the third liquid cooling plate.
The second aspect of the application provides an electronic device, the electronic device includes a housing, an electronic device and the foregoing heat dissipation device, the heat dissipation device includes a first liquid cooling plate, two sides of the first liquid cooling plate are all used for installing the electronic device, the heat dissipation device and the electronic device are all located in the housing.
In this application, the both sides of first liquid cooling board all can install the electron device, be equipped with first runner in the first liquid cooling board, be equipped with the second runner in the second liquid cooling board, be equipped with the third runner in the third liquid cooling board first runner the second runner with when the third runner lets in the coolant liquid, first liquid cooling board the second liquid cooling board with the third liquid cooling board all can dispel the heat to the electron device attached its surface, the liquid cooling board with do not use the interval power casing between the electron device, the radiating effect is better, in addition first liquid cooling board is connected the non-marginal zone of a second liquid cooling board side, just first liquid cooling board with the second liquid cooling board is located different planes, first liquid cooling board still is connected the non-marginal zone of a side of third liquid cooling board, just first liquid cooling board with the third liquid cooling board is located different planes, second liquid cooling board with the third liquid cooling board is connected respectively first liquid cooling board just can be used in the second liquid cooling board has the second liquid cooling board, therefore the electronic device can be installed to the both sides, and the electronic device can be more than the second liquid cooling board, the electronic device is installed to the second liquid cooling board, and the electronic device has more reasonable the both sides.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic exploded view of an electronic device according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present disclosure;
fig. 3 is a schematic perspective view of an electronic device according to an embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of FIG. 3 at E-E;
FIG. 5 isbase:Sub>A schematic cross-sectional view of FIG. 3 at A-A;
FIG. 6 isbase:Sub>A schematic cross-sectional view of FIG. 3 at A-A;
FIG. 7 is a schematic cross-sectional view of FIG. 3 at C-C;
FIG. 8 is a schematic cross-sectional view of FIG. 3 at B-B;
FIG. 9 is a schematic cross-sectional view of FIG. 3 at B-B;
FIG. 10 is a schematic cross-sectional view of FIG. 3 at D-D;
fig. 11 is a top view of fig. 10.
Detailed Description
The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without undue burden, are within the scope of the present application.
In the description of the present application, unless explicitly stated and limited otherwise, the term "coupled" is to be interpreted broadly, as for example, being either fixedly coupled, detachably coupled, or integrally coupled; can be directly connected, can also be indirectly connected through an intermediate medium, and can also be the communication between the two elements; may be a communication connection; may be an electrical connection. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
Referring to fig. 1 to fig. 4, fig. 1 is an exploded schematic view of an electronic device according to an embodiment of the present application; fig. 2 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present disclosure; fig. 3 is a schematic perspective view of an electronic device according to an embodiment of the present application; fig. 4 is a schematic cross-sectional view of fig. 3 at E-E.
As shown in fig. 1, in some embodiments, the electronic apparatus 1 includes a heat dissipating device 2, a housing 3, and an electronic device 4, where the heat dissipating device 2 and the electronic device 4 are both located in the housing 3, and referring to fig. 2, the heat dissipating device 2 includes a first liquid cooling plate 11, and two sides of the first liquid cooling plate 11 are used for mounting the electronic device 4.
Specifically, the electronic device 1 may be a radio frequency power supply.
As shown in fig. 2-4, in some embodiments, the heat dissipating device 2 includes: the liquid cooling board 10, the liquid cooling board 10 includes first liquid cooling board 11, second liquid cooling board 12 and third liquid cooling board 13, first liquid cooling board 11 connects the non-marginal area of a side of second liquid cooling board 12, just first liquid cooling board 11 with second liquid cooling board 12 is located different planes, first liquid cooling board 11 still connects the non-marginal area of a side of third liquid cooling board 13, just first liquid cooling board 11 with third liquid cooling board 13 is located different planes, second liquid cooling board 12 with third liquid cooling board 13 is located on the opposite both sides of first liquid cooling board 11, just second liquid cooling board 12 with third liquid cooling board 13 sets up relatively, wherein, be equipped with first runner 110 in the first liquid cooling board 11, be equipped with second runner 120 in the second liquid cooling board 12, be equipped with third runner 130 in the third liquid cooling board 13.
In this application, as shown in fig. 1-4, both sides of the first liquid cooling plate 11 may be used to mount the electronic device 4, a first flow channel 110 is disposed in the first liquid cooling plate 11, a second flow channel 120 is disposed in the second liquid cooling plate 12, a third flow channel 130 is disposed in the third liquid cooling plate 13, when the cooling liquid is introduced into the first flow channel 110, the second flow channel 120 and the third flow channel 130, the first liquid cooling plate 11, the second liquid cooling plate 12 and the third liquid cooling plate 13 may both be used to perform liquid cooling heat dissipation on the electronic device 4 attached to the surface thereof, and the heat dissipation effect is better between the liquid cooling plate 10 and the electronic device 4 without spacing the housing 3 of the electronic device 1, in addition, the first liquid cooling plate 11 is connected to a non-edge area of one side of the second liquid cooling plate 12, and the first liquid cooling plate 11 and the second liquid cooling plate 12 are located on different planes, the first liquid cooling plate 11 is also connected to a non-edge area of the first liquid cooling plate 13, and the second liquid cooling plate 11 and the other than the first liquid cooling plate 11 and the second liquid cooling plate 13 are both sides of the electronic device are mounted on the same plane, and the two sides of the electronic device 4 are more than the first liquid cooling plate 11 and the electronic device 4 are mounted on the same plane, and the two sides of the electronic device are mounted on the two sides of the electronic device 11 and the two sides of the electronic device 4 are more than the first liquid cooling plate 11 and the electronic device is mounted on the two side by the two sides of the first liquid cooling plate 11, the output power of the electronic device, etc. can be increased.
The side edges of the second liquid cooling plate 12 and the area spaced from the side edges by a predetermined distance (e.g., 0-5 cm) belong to edge areas, and the side edges of the third liquid cooling plate 13 and the area spaced from the side edges by a predetermined distance (e.g., 0-5 cm) belong to edge areas.
In some embodiments, the first liquid cooling plate 11 is located on a first plane, the second liquid cooling plate 12 is located on a second plane, the third liquid cooling plate 13 is located on a third plane, the second plane is parallel to the third plane, and the first plane is perpendicular to the second plane and the third plane.
That is, the second liquid cooling plate 12 is parallel to the third liquid cooling plate 13, the first liquid cooling plate 11 is in a perpendicular relationship with the second liquid cooling plate 12 and the third liquid cooling plate 13, and the first liquid cooling plate 11, the second liquid cooling plate 12 and the third liquid cooling plate 13 may be assembled together or may be integrally formed, and in such a parallel perpendicular positional relationship, the assembly is more preferable in terms of production and processing than when the first liquid cooling plate 11 is in a crossing but non-perpendicular relationship with the second liquid cooling plate 12 and the third liquid cooling plate 13.
In other embodiments, the second liquid cooling plate 12 is in a space crossing relationship with the third liquid cooling plate 13, and the first liquid cooling plate 11 is in a space crossing relationship with the second liquid cooling plate 12 and the third liquid cooling plate 13, respectively.
In some embodiments, opposite sides of the first liquid cooling plate 11 are respectively connected to intermediate positions of the second liquid cooling plate 12 and the third liquid cooling plate 13.
The middle position refers to a center line position between two opposite sides of the second liquid cooling plate 12 and an area with a preset distance (for example, 0-5 cm) from the center line position.
When the opposite sides of the first liquid cooling plate 11 are respectively connected to the middle positions of the second liquid cooling plate 12 and the third liquid cooling plate 13, the heights of the second liquid cooling plate 12 and the third liquid cooling plate 13 may be designed according to the height of the electronic device 4 with the highest height (the heights herein are described according to the placement positions shown in the drawings, and when other placement angles are adopted, the description may be made by lengths, widths, etc., and should not be construed as limiting the second liquid cooling plate 12 and the third liquid cooling plate 13).
Referring to fig. 3-9, fig. 5 isbase:Sub>A schematic cross-sectional view of fig. 3 atbase:Sub>A-base:Sub>A; FIG. 6 isbase:Sub>A schematic cross-sectional view of FIG. 3 at A-A; FIG. 7 is a schematic cross-sectional view of FIG. 3 at C-C; FIG. 8 is a schematic cross-sectional view of FIG. 3 at B-B; fig. 9 is a schematic cross-sectional view of fig. 3 at B-B.
In some embodiments, as shown in fig. 3-7, the first flow channel 110 is in communication with the interior of the second flow channel 120.
When the first flow channel 110 is communicated with the second flow channel 120, the first flow channel 110 and the second flow channel 120 may share a liquid inlet and a liquid outlet, compared with the first flow channel 110 in which the first liquid cooling plate 11 is provided with the liquid inlet and the liquid outlet, the second flow channel 120 in which the second liquid cooling plate 12 is provided with the liquid inlet and the liquid outlet, and only one of the first liquid cooling plate 11 and the second liquid cooling plate 12 is provided with the liquid inlet and the liquid outlet, so that the liquid leakage risk can be reduced, because in some embodiments, the liquid inlet and the liquid outlet in the first liquid cooling plate 11 and the second liquid cooling plate 12 need to be connected with a pipeline, and the liquid leakage risk can be reduced at the connection part, so that the liquid leakage risk can be reduced after the liquid inlet and the liquid outlet are reduced.
As shown in fig. 3-6 and 8-9, in some embodiments, the first flow channel 110 is in communication with the interior of the third flow channel 130.
When the first flow channel 110 is communicated with the inside of the third flow channel 130, the first flow channel 110 and the third flow channel 130 may share a liquid inlet and a liquid outlet, compared with the first flow channel 110 in which the first liquid cooling plate 11 is provided with the liquid inlet and the liquid outlet, the third flow channel 130 in which the third liquid cooling plate 13 is provided with the liquid inlet and the liquid outlet, the liquid leakage risk may be reduced by only providing one of the first liquid cooling plate 11 and the third liquid cooling plate 13 with the liquid inlet and the liquid outlet, because in some embodiments, the liquid leakage risk may be required to be provided at the connection point between the liquid inlet and the liquid outlet of the first liquid cooling plate 11 and the liquid outlet of the third liquid cooling plate 13, and therefore, the liquid leakage risk may be reduced after the liquid inlet and the liquid outlet are reduced.
As shown in fig. 3-9, in some embodiments, the first flow channel 110 is in communication with the second flow channel 120 and the third flow channel 130.
When the first flow channel 110 is communicated with the second flow channel 120 and the third flow channel 130, the first flow channel 110, the second flow channel 120 and the third flow channel 130 may share a liquid inlet and a liquid outlet, compared with the case that the first flow channel 110 is provided with the liquid inlet and the liquid outlet on the first liquid cooling plate 11, the second flow channel 120 is provided with the liquid inlet and the liquid outlet on the second liquid cooling plate 12, and the third flow channel 130 is provided with the liquid inlet and the liquid outlet, or two of the flow channels share a liquid inlet and a liquid outlet, and the liquid leakage risk can be further reduced by adopting three flow channels to share a liquid inlet and a liquid outlet.
In some embodiments, the liquid cooling plate 10 is provided with a liquid inlet 14 and a liquid outlet 15, when the first flow channel 110 is communicated with the second flow channel 120 and the third flow channel 130, the liquid inlet 14 is disposed at a junction between the second liquid cooling plate 12 and the first liquid cooling plate 11, and the liquid outlet 15 is disposed at a junction between the third liquid cooling plate 13 and the first liquid cooling plate 11.
The second flow channel 12 includes a plurality of branch flow channels, and the branch flow channels are mutually communicated, so when the cooling liquid enters from the liquid inlet 14, the cooling liquid enters each branch flow channel respectively, then is collected at the other end of the second flow channel 120, which is opposite to the liquid inlet 14 and is located at the junction of the first flow channel 110, and is collected in the first flow channel 110, the first flow channel 110 has only one main flow channel, the cooling liquid flows through the first flow channel 110 and enters the junction of the first flow channel 110 and the third flow channel 130, the third flow channel 130 also includes a plurality of branch flow channels, and the branch flow channels are mutually communicated, because the cooling liquid enters each branch flow channel after entering the third flow channel 130, and finally is collected at the liquid outlet 15.
Therefore, the liquid inlet 14 is disposed at the junction of the second liquid cooling plate 12 and the first liquid cooling plate 11, and the liquid outlet 15 is disposed at the junction of the third liquid cooling plate 13 and the first liquid cooling plate 11, so that when the cooling liquid enters the second flow passage 120, the cooling liquid can enter each branch flow passage of the second flow passage 120 as synchronously as possible, and simultaneously can also enter the first liquid cooling plate 11 quickly, and the liquid outlet 15 is disposed at the junction of the third liquid cooling plate 13 and the first liquid cooling plate 11, so that the cooling liquid can flow out of the first flow passage 110 more quickly, so as to dissipate heat of the electronic device 4 better.
As shown in fig. 2 and 4, in some embodiments, the first liquid cooling plate 11, the second liquid cooling plate 12 and the third liquid cooling plate 13 are integrally formed.
The first fluid cooling plate 11, the second fluid cooling plate 12 and the third fluid cooling plate 13 are integrally formed, so that the first flow channel 110 in the first fluid cooling plate 11, the second flow channel 120 in the second fluid cooling plate 12 and the third flow channel 130 in the third fluid cooling plate 13 are communicated with each other, and the first flow channel 110 in the first fluid cooling plate 11, the second flow channel 120 in the second fluid cooling plate 12 and the third flow channel 130 in the third fluid cooling plate 13 are not communicated with each other easily in an assembled manner.
Referring to fig. 1, 2 and 10, fig. 10 is a schematic cross-sectional view of fig. 3 at D-D.
As shown in fig. 1, 2 and 10, in some embodiments, the heat dissipating device 2 is located in a closed casing 3, the heat dissipating device 2 further includes a first heat exchanging fin 20, the first heat exchanging fin 20 is disposed on a side of the second liquid cooling plate 12 away from the first liquid cooling plate 11 and extends along a first direction a, and a gap is disposed between two opposite side plates 31 extending along a second direction B in the casing 3 and two ends of the first heat exchanging fin 20, where the first direction a and the second direction B are in a crossed relationship.
Because energy exchange can also be performed between the second liquid cooling plate 12 and the first heat exchanging fin 20, and the temperature of the first heat exchanging fin 20 can also be reduced by heat conduction because the cooling liquid in the second liquid cooling plate 12 is cooled by the cooling liquid, the first heat exchanging fin 20 has a larger area to contact with the air in the housing 3, and therefore, the air in the housing 3 can be cooled.
In some embodiments, the heat dissipating device 2 further includes a second heat exchanging fin 21, the second heat exchanging fin 21 is disposed on a side of the third liquid cooling plate 13 away from the first liquid cooling plate 11 and extends along the first direction a, and a gap is disposed between two opposite side plates 31 extending along the second direction B in the housing 3 and two ends of the second heat exchanging fin 21.
Because energy exchange can also be performed between the third liquid cooling plate 13 and the second heat exchanging fin 21, and because the cooling liquid in the third liquid cooling plate 13 is cooled by passing through, the temperature of the second heat exchanging fin 21 is also reduced by heat conduction, and the second heat exchanging fin 21 has a larger area to contact with the air in the housing 3, so that the air in the housing 3 can be further cooled.
Referring to fig. 1-2 and 10-11, fig. 11 is a top view of fig. 10.
As shown in fig. 1-2 and fig. 10-11, in some embodiments, the heat dissipating device 2 further includes a fan 22, the fan 22 is disposed between one of the side plates 31 extending along the second direction B in the housing 3 and a side of the first liquid cooling plate 11 near the side plate 31, and the fan 22 is used for blowing or exhausting air to circulate air in the housing 3 to dissipate heat of the electronic device 4 disposed on the first liquid cooling plate 11.
The fan 22 may accelerate the circulation of air in the housing 3, and accelerate the heat exchange between the air and the first heat exchange fins 20 and/or the second heat exchange fins 21, so as to accelerate the cooling of the air and accelerate the heat dissipation of the electronic device 4.
The fan 22 may make air flow from the electronic device 4 to the first heat exchanging fin 20 and the second heat exchanging fin 21 on both sides (the direction of the air flow when the fan 22 is used for blowing is indicated by an arrow in fig. 11).
In some embodiments, the first heat exchange fin 20 includes a plurality of first sub-fins 200, and the first sub-fins 200 are disposed on the surface projection of the second liquid cooling plate 12 away from the first liquid cooling plate 11 at the second flow channel 120; and/or the second heat exchange fin 21 includes a plurality of second sub-fins 210, and the second sub-fins 210 are disposed on the surface projection of the third fluid cooling plate 13 away from the first fluid cooling plate 11 side of the third fluid channel 130.
At least a part of the first sub-fins 200 are disposed at the surface projection of the second flow channel 120 on the side of the second liquid cooling plate 12 away from the first liquid cooling plate 11, so that at least a part of the cooling effect of the first sub-fins 200 is better, and in the same way, at least a part of the second sub-fins 210 are disposed at the surface projection of the third flow channel 130 on the side of the third liquid cooling plate 13 away from the first liquid cooling plate 11, so that at least a part of the cooling effect of the second sub-fins 210 is better.
The foregoing is a description of embodiments of the present application, and it should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principles of the embodiments of the present application, and these improvements and modifications are also considered as the protection scope of the present application.
Claims (11)
1. A heat sink, the heat sink comprising: the liquid cooling plate, the liquid cooling plate includes first liquid cooling plate, second liquid cooling plate and third liquid cooling plate, first liquid cooling plate is connected the non-marginal area of a second liquid cooling plate side, just first liquid cooling plate with the second liquid cooling plate is located different planes, first liquid cooling plate still connects the non-marginal area of a third liquid cooling plate side, just first liquid cooling plate with the third liquid cooling plate is located different planes, the second liquid cooling plate with the third liquid cooling plate is located on the opposite both sides of first liquid cooling plate, just the second liquid cooling plate with the relative setting of third liquid cooling plate, wherein, be equipped with first runner in the first liquid cooling plate, be equipped with the second runner in the second liquid cooling plate, be equipped with the third runner in the third liquid cooling plate.
2. The heat sink of claim 1 wherein the first liquid cooling plate is located on a first plane, the second liquid cooling plate is located on a second plane, the third liquid cooling plate is located on a third plane, the second plane is parallel to the third plane, and the first plane is perpendicular to the second plane and the third plane.
3. The heat sink of claim 1, wherein opposite sides of the first liquid cooling plate are connected to intermediate positions of the second liquid cooling plate and the third liquid cooling plate, respectively.
4. The heat sink of claim 1, wherein the first flow passage is in internal communication with the second flow passage and/or the third flow passage.
5. The heat sink of claim 4 wherein the first liquid cooling plate, the second liquid cooling plate, and the third liquid cooling plate are integrally formed.
6. The heat dissipating device of claim 4, wherein the liquid cooling plate is provided with a liquid inlet and a liquid outlet, and when the first flow channel is communicated with the second flow channel and the third flow channel, the liquid inlet is disposed at a junction between the second liquid cooling plate and the first liquid cooling plate, and the liquid outlet is disposed at a junction between the third liquid cooling plate and the first liquid cooling plate.
7. The heat dissipating device of claim 1, wherein the heat dissipating device is located in a closed housing, and further comprising a first heat exchanging fin disposed on a side of the second liquid cooling plate away from the first liquid cooling plate and extending in a first direction, wherein a gap is provided between two opposite side plates extending in a second direction in the housing and two ends of the first heat exchanging fin, and wherein the first direction is in a crossing relationship with the second direction.
8. The heat dissipating device of claim 7, further comprising a second heat exchanging fin disposed on a side of the third liquid cooling plate remote from the first liquid cooling plate and extending in the first direction, wherein a gap is provided between two opposing side plates extending in the second direction in the housing and two ends of the second heat exchanging fin.
9. The heat dissipating device of claim 1, 7 or 8, wherein the heat dissipating device is located in a closed housing, and further comprising a fan disposed between one of the side plates extending in the second direction in the housing and a side of the first liquid cooling plate adjacent to the side plate, wherein the fan is configured to blow or draw air in the housing to circulate air to dissipate heat of the electronic device disposed on the first liquid cooling plate.
10. The heat dissipating device of claim 8, wherein the first heat exchanging fin comprises a plurality of first sub-fins, and the second flow channel is provided with the first sub-fins at a surface projection of the side of the second liquid cooling plate away from the first liquid cooling plate; and/or the second heat exchange fin comprises a plurality of second sub-fins, and the second sub-fins are arranged at the surface projection position of one side of the third liquid cooling plate far away from the first liquid cooling plate in the third flow channel.
11. An electronic device, comprising a housing, an electronic component, and a heat dissipating apparatus according to any one of claims 1 to 10, wherein the heat dissipating apparatus comprises a first liquid cooling plate, two sides of the first liquid cooling plate are used for mounting the electronic component, and the heat dissipating apparatus and the electronic component are both located in the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222875027.8U CN218920830U (en) | 2022-10-29 | 2022-10-29 | Heat abstractor and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222875027.8U CN218920830U (en) | 2022-10-29 | 2022-10-29 | Heat abstractor and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218920830U true CN218920830U (en) | 2023-04-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222875027.8U Active CN218920830U (en) | 2022-10-29 | 2022-10-29 | Heat abstractor and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218920830U (en) |
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2022
- 2022-10-29 CN CN202222875027.8U patent/CN218920830U/en active Active
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Address after: 1101, Building D1, Nanshan Zhiyuan, No. 1001 Xueyuan Avenue, Changyuan Community, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province, 518055 Patentee after: SHENZHEN HANQIANG TECHNOLOGY Co.,Ltd. Address before: Unit ghijklm, block B, 7 / F, building 7, Baoneng Science Park, Qinghu village, Qinghu community, Longhua street, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN HANQIANG TECHNOLOGY Co.,Ltd. |