CN112306168B

CN112306168B - Server

Info

Publication number: CN112306168B
Application number: CN202010795717.5A
Authority: CN
Inventors: 舒建军; 杨斌
Original assignee: Xidong Technology Co ltd
Current assignee: Shenzhen Megabyte Technology Co.,Ltd.
Priority date: 2020-08-10
Filing date: 2020-08-10
Publication date: 2023-03-28
Anticipated expiration: 2040-08-10
Also published as: CN112306168A

Abstract

The invention discloses a server, which comprises: the power supply module comprises a shell, a plurality of computing boards, a control module, a power supply module, an electric connection board and a heat dissipation module, wherein the second accommodating space is suitable for assembling the power supply module; the plurality of force calculation plates are arranged in a first accommodating space in the shell, and each force calculation plate is slidably arranged in the first accommodating space; the power calculation board, the power supply module and the power supply module are connected with the electric connection board respectively, the power supply module supplies power to the power calculation board through the electric connection board, and the power supply module supplies power to the control module through the electric connection board. According to the server provided by the invention, the modular arrangement of the server is realized, the server is simple and orderly in structure, and the force calculation board and the modules can be independently disassembled, assembled and maintained. In addition, dual circuit powering of the server may be achieved.

Description

Server

Technical Field

The invention relates to the technical field of servers, in particular to a server.

Background

In the related art, the server generally has a plurality of modules, for example, a power module, an algorithm board, a heat dissipation module, a control module, and the like, and the plurality of modules are generally fixedly mounted on a housing of the server, and the plurality of modules cannot be individually detached or mounted, which is inconvenient for the detachment and maintenance of parts. Meanwhile, the arrangement positions of the modules are messy, so that the structure of the server is not neat enough. In addition, the power module needs to simultaneously supply power to a plurality of computing boards and the control module. The power supply stability is lower on the one hand, and on the other hand, when power supply failure occurs, the position of the failure cannot be rapidly checked. In addition, the disassembly and assembly of a plurality of modules of the server are complex and low in efficiency.

Disclosure of Invention

The present invention is directed to solving at least one of the problems of the prior art. Therefore, an object of the present invention is to provide a server, which has a simple and neat structure, is easy to assemble and disassemble, and has good stability.

The server according to an embodiment of the present invention is characterized by including: a housing configured as a frame structure, the housing having at least first, second, third, and fourth receiving spaces therein, wherein the second receiving space is adapted to be fitted with a power supply module; the plurality of force calculation plates are arranged in the first accommodating space in the shell in parallel along a first direction, each force calculation plate is arranged perpendicular to the first direction, and each force calculation plate can be arranged in the first accommodating space in a sliding mode; the control module is slidably arranged in a third accommodating space of the shell, and the third accommodating space is positioned between the first accommodating space and the second accommodating space; the power supply module can be slidably arranged in a fourth accommodating space of the shell, and the fourth accommodating space is positioned between the first accommodating space and the second accommodating space and is distributed at intervals in the first direction with the third accommodating space; the electric connecting plate is arranged in the shell, the force calculation plate, the power supply module, the control module and the power supply module are respectively connected with the electric connecting plate, the power supply module supplies power to the force calculation plate through the electric connecting plate, and the power supply module supplies power to the control module through the electric connecting plate; and the heat dissipation module at least dissipates heat of the computing plates.

According to the server provided by the embodiment of the invention, the force calculation plate, the power supply module, the control module and the power supply module are respectively arranged in the first accommodating space, the second accommodating space, the third accommodating space and the fourth accommodating space, so that the server is modularly arranged, has a simple and neat structure, and is favorable for independent disassembly and assembly and maintenance of the force calculation plate and the modules. Meanwhile, the force calculation board, the control module and the power supply module are all slidably arranged in the shell, so that the modules can be conveniently disassembled and maintained. In addition, the power supply module supplies power to the computing board through the electric connecting board, the power supply module supplies power to the control module through the electric connecting board, and double-circuit power supply of the server can be achieved, so that the stability of the server is improved.

In some examples, the server further includes a power module slidably disposed in the second accommodating space of the housing, and an extending direction of the power module is identical to an extending direction of the computing force plate.

In some examples, the power module is a plurality of power modules arranged along the first direction, and each power module is suitable for supplying power to 2-4 computing boards.

In some examples, the force computing board is provided with a voltage reduction circuit module, the power supply module is configured to convert a first alternating voltage of a first alternating current accessed from the outside into a direct current and supply the direct current to the voltage reduction circuit module, and the voltage reduction circuit module reduces the direct current and supplies power to a force computing chip on the force computing board.

In some examples, a first dc voltage of the dc power converted by the power module is 48V, and a second dc voltage of the dc power stepped down by the step-down circuit module of the computing board is 12V.

In some examples, the power supply module converts a second alternating voltage of an external second alternating current into a third direct current voltage of 12V and then supplies power to the control module.

In some examples, the first alternating voltage and the second alternating voltage range from 220V to 380V.

In some examples, the control module includes a control board body, a first circuit board disposed at one end of the control board body, the first circuit board being provided with a first control signal interface and a second control signal interface, the first control signal interface being adapted to be connected to the first port of the electrical connection board to realize signal connection, and the second control signal interface being adapted to be connected to the second port of the electrical connection board to transmit current; the both sides of third accommodation space have the sliding strip, the both sides of control plate body are equipped with the slide, the control plate body passes through the sliding strip is in slip in the slide realizes removal in the third accommodation space.

In some examples, the power supply module includes a power supply board body, and a second circuit board disposed at one end of the power supply board body, where the second circuit board is provided with a first current interface and a second current interface, the first current interface is adapted to be connected to a third port of the electrical connection board to access an external voltage, and the second current interface is adapted to be connected to a fourth port of the electrical connection board to transmit a current.

In some examples, the computing force board, the control module and the power supply module are all located on one side of the electrical connection board along a second direction, and the second direction is parallel to the extending direction of the computing force board.

In some examples, the electrical connection board includes: the PCB substrate is provided with two contact areas which are respectively connected with a positive electrode and a negative electrode of a power supply, two side surfaces of each contact area are respectively provided with a first contact surface and a second contact surface which are suitable for being in contact with a conductor, and a plurality of through holes are formed in each contact area; first and second conductive layers disposed on the first and second contact surfaces, respectively; a third conductive layer disposed within the via and electrically connected to the first and second conductive layers; a first conductive strip secured to and electrically connected with the first conductive layer, the first conductive strip adapted to connect to the power module; a second conductive strip connected to and in electrical connection with the second conductive layer, the second conductive strip in electrical connection with the computing board.

In some examples, the first and second conductive layers are each configured as a conductive film plated on the first and second contact surfaces.

In some examples, the third conductive layer is configured as a conductive film plated on the sidewall of the via hole, or is composed of a conductive material passing through the via hole.

In some examples, the PCB substrate further has a screw hole, and the first and second conductive strips and the PCB substrate are connected by a screw; the through holes are arranged around the screw holes, and the diameter ratio of the through holes to the screw holes ranges from 1/10 to 1/100.

In some examples, the first conductive strip includes: a first conductive sheet connected to the first conductive layer; the second conducting strip is connected with the power supply module; and the connecting sheet is connected between the first conducting sheet and the second conducting sheet.

In some examples, the connecting pieces are configured in an L-shape and are vertically connected to the first and second conductive sheets, respectively.

In some examples, the electrical connection board further includes: the two conductive connecting plates are respectively connected with the second conductive strips of the two contact areas so as to be respectively connected with the positive electrode and the negative electrode of a power supply, a plurality of conductive pins are arranged on each conductive connecting plate, the conductive pins on the two conductive connecting plates are in one-to-one correspondence to form a plurality of pairs of conductive pins, and each pair of conductive pins is in one-to-one correspondence with each force calculation plate and is electrically connected with the force calculation plate so as to supply power to the force calculation plate; and the insulating layer is arranged between the two conductive connecting plates to avoid short circuit between the conductive connecting plates for connecting the positive pole and the negative pole of the power supply.

In some examples, the two conductive connection plates are parallel in a length direction of the PCB substrate and spaced apart by a predetermined gap in a height direction of the PCB substrate, and the plurality of conductive pins are uniformly spaced apart in the length direction of each conductive connection plate; the insulating layer is arranged at the positive pole of the conductive connecting plate.

In some examples, the end of the computing board facing the electric connection board is provided with a mounting seat, a first fitting piece is arranged in the mounting seat, and the electric conduction pin is detachably matched with the first fitting piece to connect or disconnect the power supply path of the computing board.

In some examples, one of a hook and a slot is arranged in the mounting seat, the other of the hook and the slot is arranged on the conductive pin, and the electric connection between the computing board and the conductive pin is realized through the matching of the hook and the slot.

In some examples, the mounting seat is provided with a mounting hole, the inner side wall of the mounting hole is provided with a spring sheet protruding towards the axis of the mounting hole, the conductive pin is formed into a cylinder, and the conductive pin is inserted into the mounting hole and is in abutting connection with the spring sheet.

In some examples, both ends of the spring are fixed to the inner side walls of the mounting hole, and the middle portion of the spring protrudes toward the axis of the mounting hole.

In some examples, one end of the spring plate is fixed to an inner side wall of the mounting hole, and the other end is tilted.

In some examples, the mounting seat is further provided with a round hole, the round hole is arranged opposite to the mounting hole, so that the round hole and the mounting hole can penetrate through the mounting seat, and the diameter of the round hole is larger than that of the conductive pin and smaller than that of the mounting hole.

In some examples, the computing power board includes: the force calculating plate body is provided with a force calculating chip; the baffle is arranged at one end, far away from the electric connecting plate, of the force calculation plate body, and the baffle is configured to close the opening of the first accommodating space after the force calculation plate is accommodated in the first accommodating space; the handle is arranged on one side, far away from the electric connection plate, of the baffle plate.

In some examples, sliding grooves are formed in the first accommodating space, the sliding grooves are distributed at the top and the bottom of the first accommodating space, the housing is further formed with an open side communicated with the first accommodating space, and a fixing part is arranged at the edge of the open side of the housing; the force calculation plate is slidably arranged on the sliding groove, and the top edge and the bottom edge of the force calculation plate are respectively matched in the sliding grooves at the top and the bottom of the first accommodating space. One end of the force calculation plate is provided with a plug-pull piece, and the plug-pull piece is detachably mounted on the fixing portion and at least partially covers the open side.

In some examples, the fixing part comprises a fixing hole at one edge of the open side and a positioning hole at the other edge of the open side, the plug is fixed at the fixing hole by a fastener, and the plug is provided with a positioning pin which is matched in the positioning hole; the first accommodating spaces are multiple, and a partition plate extending along a first direction is arranged between every two adjacent first accommodating spaces.

In some examples, the force computing board plate further includes a heat sink for dissipating heat of the force computing chip, the force computing board is disposed in the first accommodating space of the housing and is slidable toward the front side of the housing, the heat dissipation module is disposed at the rear end of the housing and is positioned corresponding to the force computing board, and the heat dissipation module includes at least one fan for dissipating heat of the force computing board.

In some examples, the force computing board further comprises a voltage reduction circuit module, wherein the voltage reduction circuit module is arranged on the force computing board body and is spaced from the force computing chip in a second direction, and the second direction is parallel to the extending direction of the force computing board; the heat dissipation module includes: at least one first cooling plate disposed on the voltage step-down circuit module; the water cooling plate is arranged on one side surface of the force calculation plate body; and the heat pipe is arranged on the force calculation plate body, one end of the heat pipe is lapped on the first cooling plate, and the other end of the heat pipe is lapped on the water cooling plate.

In some examples, the first cooling plate includes a plurality of first cooling plates arranged at intervals on the voltage-reducing circuit module, each first cooling plate corresponding to at least one heat pipe.

In some examples, the first cooling plate includes one, and one end of all the heat pipes is lapped on the first cooling plate.

In some examples, the server further comprises a second cooling plate, the second cooling plate is arranged on one side surface of the water cooling plate, which faces away from the force calculation plate body, and the other ends of all the heat pipes are lapped on the second cooling plate.

In some examples, at least one of the first cooling plate and the second cooling plate has at least one elongated slot therein adapted to receive a portion of the heat pipe.

In some examples, the first cooling plate and the second cooling plate are both aluminum alloy plates.

In some examples, a thermally conductive gel that can adjust the height of the first cooling plate is disposed between the voltage-dropping circuit module and the first cooling plate.

In some examples, each of the heat pipes comprises: a first heat pipe section lapped on one side of the water cooling plate; the distance between the second heat pipe section and the force calculation plate body is smaller than that between the first heat pipe section and the force calculation plate body; a connection tube section connected between the first heat pipe section and the second heat pipe section to form a stepped structure.

In some examples, the relationship between the height h of the connecting pipe section and the horizontal length L of the connecting pipe section satisfies: h/L is more than or equal to 1/20 and less than or equal to 1/2.

In some examples, the arcuate transitions between the first heat pipe segment and the connection pipe segment, and between the second heat pipe segment and the connection pipe segment, each have an arcuate radius equal to or greater than two diameters of the heat pipe.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic diagram of a server according to an embodiment of the present invention;

FIG. 2 is a schematic diagram of a server according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of a circuit board structure according to an embodiment of the present invention;

FIG. 4 is a schematic diagram of a circuit board structure according to an embodiment of the present invention;

FIG. 5 is a schematic diagram of a circuit board according to an embodiment of the invention;

FIG. 6 isbase:Sub>A cross-sectional view taken at A-A of FIG. 5;

fig. 7 is an enlarged view at B of fig. 6;

FIG. 8 is an enlarged view at C of FIG. 7;

FIG. 9 is a schematic block diagram of a control module according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a power supply module according to an embodiment of the present invention.

FIG. 11 is a schematic block diagram of a server according to an embodiment of the present invention;

FIG. 12 is a schematic block diagram of a server according to an embodiment of the present invention;

fig. 13 is a schematic structural view of an electrical connection board according to an embodiment of the present invention;

FIG. 14 is a schematic structural diagram of a force calculation plate according to an embodiment of the invention;

FIG. 15 is a schematic structural view of a mount according to an embodiment of the invention;

FIG. 16 is a sectional view of a partial structure of a force calculation plate according to an embodiment of the present invention;

fig. 17 is an enlarged view at D of fig. 16;

FIG. 18 is a schematic diagram of a server according to an embodiment of the invention;

FIG. 19 is a schematic structural diagram of a force calculation plate according to an embodiment of the invention; .

FIG. 20 is a cross-sectional view at E-E according to FIG. 2;

FIG. 21 is a cross-sectional view at F-F according to FIG. 2;

FIG. 22 is a schematic diagram of a force computing plate according to an embodiment of the invention;

FIG. 23 is an enlarged view at G according to FIG. 22;

FIG. 24 is a schematic diagram of a force computing plate according to an embodiment of the invention

FIG. 25 is an enlarged view at H according to FIG. 24;

FIG. 26 is a schematic structural diagram of a force calculation plate according to an embodiment of the invention;

fig. 27 is a schematic structural view of an electrical connection board according to an embodiment of the present invention;

fig. 28 is a partial structural view of a heat dissipation module according to an embodiment of the invention;

FIG. 29 is a schematic diagram of a server according to an embodiment of the invention;

FIG. 30 is a schematic block diagram of a server according to an embodiment of the present invention;

FIG. 31 is a block diagram of a server according to an embodiment of the present invention;

fig. 32 is a schematic structural diagram of an algorithm board according to an embodiment of the invention.

Reference numerals:

a server 1000; a force calculation board 210; a mounting seat 211; a mounting hole 213; a reed 214; a force calculation board body 215; a baffle 216; a handle 217; a computational power chip 218; a circular hole 219; a plug-in member 210a; positioning pins 210b; a fastener 210c;

a power supply module 220; a housing 230; the first accommodation space 231; the second accommodation space 232; the third accommodation space 233; the fourth accommodating space 234; a slide bar 235; a chute 236; open side 237; a fixed portion 238; fixing holes 2381; positioning hole 2382; a partition 239;

a control module 240; a control panel body 241; a chute 242; a first control signal interface 243; the guide positioning seats 244; a second control signal interface 245; a first circuit board 246; a power supply module 250; a power supply board body 251; a first current interface 252; a second current interface 253; a second circuit board 254;

a heat dissipation module 260; a first cooling plate 261; a water-cooling plate 262; a heat pipe 263; a first heat pipe segment 264; a second heat pipe section 265; a connecting tube section 266; a second cooling plate 267; an elongated slot 268; a fan 269; a voltage step-down circuit block 270; a fifth port 280; a fastening screw 290;

an electric connection plate 100; a PCB substrate 10; a contact region 11; a first contact surface 111; a second contact surface 112; a through hole 113; screw holes 114; a guide positioning post 115; a first port 116; a second port 117; a third port 118; a fourth port 119; a first conductive layer 20; a second conductive layer 30; a third conductive layer 40; a first conductive strip 50; a first conductive sheet 51; the second conductive sheet 52; a through hole 521; a connecting piece 53; a second conductive strip 60; a conductive connecting plate 70; the conductive pins 71; an insulating layer 80.

Detailed Description

Embodiments of the present invention will be described in detail below, and the embodiments described with reference to the drawings are exemplary.

A server according to an embodiment of the present invention is described below with reference to fig. 1 to 29, including: the power module comprises a housing 230, a plurality of computing boards 210, a control module 240, a power supply module 250, an electrical connection board 100 and a heat dissipation module 260.

As shown in fig. 1 and 2, the housing 230 is configured as a frame structure, and the housing 230 has at least a first accommodating space 231, a second accommodating space 232, a third accommodating space 233, and a fourth accommodating space 234 therein, wherein the second accommodating space 232 is adapted to be fitted with the power supply module 220.

A plurality of force computing plates 210 are juxtaposed in a first direction (e.g., a left-right direction as viewed in fig. 1 and 2) within a first accommodating space 231 within the housing 230, each force computing plate 210 is disposed perpendicular to the first direction, and each force computing plate 210 is slidably disposed within the first accommodating space 231. The force calculation plate 210 can be detached from the housing 230 by pushing or pulling the force calculation plate 210, and the detachment and installation convenience of the force calculation plate 210 is improved.

The control module 240 is slidably disposed in a third receiving space 233 of the housing 230, the third receiving space 233 being located between the first receiving space 231 and the second receiving space 232. The power supply module 250 is slidably disposed in a fourth receiving space 234 of the housing 230, and the fourth receiving space 234 is located between the first receiving space 231 and the second receiving space 232 and spaced apart from the third receiving space 233 in the first direction. The control module 240 and the power supply module 250 can be detached from the housing 230 by being pushed or pulled, so that the detachment convenience is improved. The heat dissipation module 260 dissipates heat at least to the plurality of computing boards 210. Thus, the modular arrangement of the server 1000 can be realized, and the independent maintenance and disassembly and assembly of a plurality of modules can be facilitated.

The electric connection board 100 is arranged in the shell 230, the computing power board 210, the power supply module 220, the control module 240 and the power supply module 250 are respectively connected with the electric connection board 100, the power supply module 220 supplies power to the computing power board 210 through the electric connection board 100, and the power supply module 250 supplies power to the control module 240 through the electric connection board 100. Thus, double-circuit power supply of the server 1000 can be realized, the two circuits do not interfere with each other, and the stability of the circuits can be improved. Meanwhile, different voltages can be introduced into the two circuits, and different voltages can be provided for the force calculation board 210 and the control module 240, so that the adaptability is improved, and the power supply safety and stability can be further improved. In addition, when one circuit breaks down, the other circuit is not affected, the condition that one part of the same circuit is abnormal to cause the damage of the other part of the same circuit can be avoided, and the troubleshooting and maintenance efficiency can be improved.

According to the server 1000 of the embodiment of the invention, the computing force board 210, the power module 220, the control module 240 and the power supply module 250 are respectively arranged in the first accommodating space 231, the second accommodating space 232, the third accommodating space 233 and the fourth accommodating space 234, so that the server 1000 is modularly arranged, the server 1000 is simple and neat in structure, and the computing force board 210 and a plurality of modules can be independently disassembled and maintained. Meanwhile, the force calculation plate 210, the control module 240 and the power supply module 250 are slidably disposed in the housing 230, so that the modules can be conveniently disassembled and maintained. In addition, the power module 220 supplies power to the computing board 210 through the electrical connection board 100, and the power module 250 supplies power to the control module 240 through the electrical connection board 100, so that dual-circuit power supply of the server 1000 can be realized, and the stability of the server 1000 is improved.

In some examples, the server 1000 may include the power module 220, the power module 220 may be slidably disposed in the second receiving space 232 of the housing 230, and an extending direction of the power module 220 may be identical to an extending direction of the force calculation plate 210. The force calculation board 210, the control module 240 and the power supply module 250 are all located on one side of the electrical connection board 100 in the front-rear direction, which is parallel to the extending direction of the force calculation board 210. In this way, the connection between the electrical connection board 100 and the computing board 210, the connection between the electrical connection board 100 and the control module 240, and the connection between the electrical connection board 100 and the power supply module 250 can be facilitated.

Further, the power module 220 may be plural and arranged in the left-right direction, and each power module 220 is adapted to supply power to 2-4 computing boards 210. For example, server 1000 has 12 computing boards 210 and four power modules 220, each power module 220 adapted to supply power to 3 computing boards 210, such that server 1000 is computationally powerful.

According to an embodiment of the present invention, the force calculation board 210 is provided with a voltage reduction circuit module, the power supply module 220 is configured to convert a first alternating voltage of a first alternating current externally connected into a direct current and supply the direct current to the voltage reduction circuit module, and the voltage reduction circuit module reduces the direct current and supplies power to the force calculation chip on the force calculation board 210. Through the setting of the voltage reduction circuit module, high voltage can be converted into low voltage, and power is supplied to the power calculation chip on the power calculation board 210, so that the dual-circuit power supply of the server 1000 is facilitated. For example, the voltage reduction circuit module may be provided on the force calculation board 210.

In some embodiments, the first dc voltage of the dc power converted by the power module 220 is 48V, and the second dc voltage of the dc power after being stepped down by the step-down circuit module of the force computing board 210 is 12V, and then the dc power is input to the force computing chip on the force computing board 210 for power supply. In some embodiments, the power supply module 250 converts the second alternating voltage of the external second alternating current into a third direct voltage of 12V and then supplies power to the control module 240, so that the dual-circuit power supply of the server 1000 can be realized, and the stability of the circuit can be improved.

In some examples, the first ac voltage and the second ac voltage range from 220V to 380V, different voltages may be introduced to the two circuits, different voltages may be provided to the force calculation board 210 and the control module 240, and power supply safety and stability may be further improved. For example, the first ac voltage may be 380V or 220V, and the second ac voltage may be 220V.

With reference to fig. 1, 4 and 9, the control module 240 may include a control board body 241, a first circuit board 246 disposed at one end (e.g., the rear end as shown in fig. 1) of the control board body 241, the first circuit board 246 being provided with a first control signal interface 243 and a second control signal interface 245, the first control signal interface 243 being adapted to be connected to the first port 116 of the electrical connection board 100 to realize signal connection, and the second control signal interface 245 being adapted to be connected to the second port 117 of the electrical connection board 100 to transmit current. The electrical connection board 100 may be disposed at a rear end of the control module 240, so that the first control signal interface 243 is connected to the electrical connection board 100 to realize signal connection. The control board body 241 may carry the first circuit board 246 to ensure stable connection of the first circuit board 246 with the electrical connection board 100.

The third accommodating space 233 may have sliding bars at both sides thereof, and the control plate body 241 may have sliding ways 242 at both sides thereof, and the control plate body 241 may be moved in the third accommodating space 233 by the sliding of the sliding bars in the sliding ways 242. Through the arrangement of the sliding strip and the sliding rail 242, the control module 240 can be conveniently detached, and the signal connection between the control module 240 and the electrical connection board 100 can be switched on or off through the sliding control board body 241. Referring to fig. 9, the control module 240 and the power supply module 250 may further include a guiding positioning seat 244, and the electrical connection board 100 is provided with a guiding positioning column 115 that may extend into the guiding positioning seat 244, so as to facilitate the installation and positioning of the control module 240 and the electrical connection board 100, and the power supply module 250 and the electrical connection board 100, so as to further improve the installation efficiency of the control module 240 and the electrical connection board 100, and the power supply module 250 and the electrical connection board 100.

As shown in fig. 4 and 10, the power supply module 250 may include a power supply board body 251, and a second circuit board 254 disposed at one end of the power supply board body 251, the second circuit board 254 being provided with a first current interface 252 and a second current interface 253, the first current interface 252 being adapted to be connected to the third port 118 of the electrical connection board 100 to access an external voltage, and the second current interface 253 being adapted to be connected to the fourth port 119 of the electrical connection board 100 to transmit a current, so that the power supply module 250 may access the external voltage and connect the voltage to the electrical connection board 100 electrically connected to the control module 240, so that the power supply module 250 supplies power to the control module 240.

In some embodiments, power module 250 may include a protective cover (not shown) that may cover second circuit board 254 to protect second circuit board 254. Meanwhile, the protective cover may be provided with an opening opened toward the electrical connection plate 100 to facilitate connection of the first current port 252, the second current port 253, and the guide positioning seat 244 with the electrical connection plate 100.

In the example of fig. 1 and 10, both sides of the fourth receiving space 234 may also have sliding bars, both sides of the power supply board body 251 may also be provided with sliding rails 242, the power supply board body 251 may be moved in the fourth receiving space 234 by the sliding of the sliding bars in the sliding rails 242 to facilitate the detachment of the power supply module 250, and the electrical connection between the power supply module 250 and the electrical connection board 100 may be turned on or off by sliding the power supply board body 251.

For example, 380V or 220V ac voltage is introduced from the outside, the ac voltage is converted into 48V dc voltage by the power module 220, and the force computing board 210 may be provided with a voltage reduction circuit module to reduce the voltage to 12V, and then the voltage is input to the force computing chip on the force computing board 210 for power supply. Meanwhile, the power supply module 250 may receive a 220V voltage from the outside or the electrical connection board 100, convert the 220V ac voltage into a 12V dc voltage through the power supply module 250, and then supply power to the control module 240, so that the control module 240 and the computing power board 210 are separately supplied with power, thereby implementing dual circuit power supply of the server 1000.

The server 1000 may be provided with a fifth port 280 for receiving an external voltage (e.g., 220V ac voltage), the second port 117 may be connected to the first current interface 252, so that the voltage can be connected to the power supply module 250 through the electrical connection board 100, the first circuit board 246 may be a step-down circuit board, so that the step-down voltage (e.g., the 220V ac voltage is reduced to 12V dc voltage) can be further reduced, and the second current interface 253 of the power supply module 250 (e.g., the second current interface 253 may be a gold finger interface) may be plugged into the fourth port 119 of the electrical connection board 100, so as to connect the voltage to the electrical connection board 100 to supply power to the control module 240.

Specifically, the electrical connection board 100 can conduct current to the first port 116, and the control module 240 can have a first control signal interface 243 and a second control signal interface 245. For example, the first control signal interface 243 may be connected with the first port 116 to receive current, so that the power supply module 250 may supply power to the control module 240. A second control signal interface 245 can be connected to the second port 117 of the electrical connection board 100 to transmit information, such as sending control information and receiving feedback information. Of course, the electrical connection board 100 can also conduct current to the second port 117, the second control signal interface 245 can be connected with the second port 117 to receive current, and the first control signal interface 243 can be connected with the first port 116 to transmit information, which is not limited herein.

For example, as shown in fig. 9 and 10, the first circuit board 246 and the second circuit board 254 may protrude from the control board body 241 and the power supply board body 251 at the rear end as shown in fig. 4, respectively, so that a plurality of interfaces and a plurality of ports can be correspondingly connected, and the connection is stable. The first circuit board 246 may be fixedly mounted to the control board 241 by a plurality of fastening screws 290, and the second circuit board 254 may be fixedly mounted to the power supply board 251 by a plurality of fastening screws 290, so as to improve the connection stability.

For example, the control board body 241, the power supply board body 251 and the protection cover may be made of metal materials, so as to ensure that the structural strength of the control module 240 and the power supply module 250 is good, and meanwhile, the control board body 241, the power supply board body 251 may be provided with the slide rail 242, so as to facilitate the sliding fit between the slide rail 242 and the slide bar, ensure the smooth sliding of the slide rail 242 and the slide bar, facilitate the detachable connection between the control board body 241, the power supply board body 251 and the housing 230, thereby improving the reliability of the connection or disconnection of the electrical connection between the control module 240 and the electrical connection board 100 and the power supply module 250.

In some embodiments, power board 210, control module 240, and power module 250 are all located on one side of electrical connection board 100 along a second direction (e.g., a front-to-back direction as shown in fig. 1 and 2) that is parallel to the direction of extension of power board 210 to facilitate connection of electrical connection board 100 with power board 210, control module 240, and power module 250.

Referring to fig. 1 to 8 and 27 in combination, the electrical connection board 100 may include a PCB substrate 10, a first conductive layer 20, a second conductive layer 30, a first conductive strip 50, and a second conductive strip 60, the PCB substrate 10 having two contact regions 11 connected to a positive electrode and a negative electrode of a power supply, respectively, two sides of each contact region 11 having a first contact surface 111 and a second contact surface 112 adapted to contact a conductor, respectively, and the two sides of the contact region 11 referring to two sides in a front-rear direction as shown in fig. 3 and 4, for example. Each contact region 11 has a plurality of through holes 113 therein. Referring to fig. 7 and 8 in conjunction with fig. 3, the first contact surface 111 and the second contact surface 112 are disposed opposite to each other in, for example, the front-rear direction of fig. 3, the through hole 113 penetrates in, for example, the front-rear direction of fig. 3, and the through hole 113 penetrates the first contact surface 111 and the second contact surface 112.

The first conductive layer 20 is disposed on the first contact surface 111, the second conductive layer 30 is disposed on the second contact surface 112, and the third conductive layer 40 is disposed in the through hole 113 and electrically connects the first conductive layer 20 and the second conductive layer 30. As such, the plurality of vias 113 may be made metallized holes. The term "plated hole" refers to a method of plating the walls of the insulated through holes 113 with a conductive layer by electroless plating and electroplating so as to be reliably connected to each other, and the walls of the through holes 113 may each be provided with a third conductive layer 40 so as to be connected to each other.

The first conductive strip 50 is fixed to the first conductive layer 20 and electrically connected to the first conductive layer 20, the first conductive strip 50 is adapted to be connected to the power module 220, the second conductive strip 60 is connected to the second conductive layer 30 and electrically connected to the second conductive layer 30, and the second conductive strip 60 is electrically connected to the computing board 210 of the server 200. Thus, the current flow path may be: the power module 220 conducts the current to the first conductive strip 50, then to the third conductive layer 40 through the first conductive layer 20, then to the second conductive layer 30, and then to the chip on the force computing board 210 through the second conductive strip 60, so that the power module supplies power to the force computing board.

Thus, the first conductive layer 20, the second conductive layer 30, and the third conductive layer 40 thus provided may be connected to one body, so that both side surfaces of the PCB substrate 10 in the front-rear direction may be connected to one conductor. In this manner, the reliability of the structure of the electrical connection plate 100 can be ensured without having to dig the electrical connection plate 100 to pass a conductive strip through the electrical connection plate 100 to achieve electrical conduction. Meanwhile, the restriction of the electrical connection plate 100 on the structures of the first and second

conductive strips

50 and 60 can be avoided, so that the first and second

conductive strips

50 and 60 can be set to be larger or smaller according to the needs, and can be in various forms, so that the electrical connection plate 100 can be applied to various servers 200. In addition, the PCB substrate 10 thus configured avoids coupling between the first conductive strip 50 and the second conductive strip 60, and only the first conductive strip 50 or the second conductive strip 60 can be assembled and disassembled, which facilitates the assembly and disassembly of the electrical connection board 100, and improves replacement efficiency and maintenance efficiency.

In some embodiments, the first conductive layer 20 and the second conductive layer 30 are each configured as a conductive film plated on the first contact surface 111 and the second contact surface 112. The conductive film can be a conductive film, and the conductive film has good adhesion with the first contact surface 111 and the second contact surface 112, so that the first conductive layer 20 and the first contact surface 111, and the second conductive layer 30 and the second contact surface 112 can be effectively adhered to each other, and smooth passing of current is ensured. For example, the first and second

conductive layers

20 and 30 may cover the entire first and second contact surfaces 111 and 112, respectively. Alternatively, as shown in fig. 8, the first conductive layer 20 and the second conductive layer 30 may be evacuated from the plurality of through holes 113, and both the first conductive layer 20 and the second conductive layer 30 are in contact with the third conductive layer 40, so as to ensure effective electrical connection between the first conductive layer 20, the second conductive layer 30 and the third conductive layer 40.

According to one embodiment of the present invention, the third conductive layer 40 may be configured as a conductive film plated on the sidewall of the through hole 113 to ensure efficient transmission of current. Alternatively, the third conductive layer 40 may be composed of a conductive material passing through the via hole 113. In this way, the first conductive layer 20, the second conductive layer 30 and the third conductive layer 40 can be communicated, so that the two sides of the electrical connection board 100 can be communicated into one conductor.

In the example of fig. 3 and 27, the PCB substrate 10 may further have a screw hole 114, and the first conductive strip 50, the second conductive strip 60 and the PCB substrate 10 are connected by a screw, so that the connection stability of the first conductive strip 50, the second conductive strip 60 and the PCB substrate 10 is ensured, and at the same time, the arrangement is convenient for disassembly. For example, two contact areas 11 are provided with screw holes 114, and the first conductive strip 50 and the second conductive strip 60 are riveted or bolted to the PCB substrate 10. A plurality of through holes 113 may be provided around the screw holes 114. The diameter ratio of the through hole 113 to the screw hole 114 may range from 1/10 to 1/100, so that the connection between the first conductive strip 50 and the second conductive strip 60 and the PCB substrate 10 is ensured, and the effective electrical connection between the first conductive layer 20, the second conductive layer 30 and the third conductive layer 40 is ensured.

In some embodiments, as shown in fig. 4 and 6, the first conductive strip 50 may include a first conductive sheet 51, a second conductive sheet 52, and a connecting sheet 53, the first conductive sheet 51 is connected to the first conductive layer 20, and the second conductive sheet 52 is connected to the power module 220. The connection piece 53 is connected between the first conductive sheet 51 and the second conductive sheet 52. The first conductive sheet 51, the second conductive sheet 52 and the connecting sheet 53 are arranged in this way, so that the connection of the first conductive strip 50 and the power module 220 can be facilitated. For example, the first conductive plate 51, the second conductive plate 52 and the connecting piece 53 may be integrally formed to ensure structural strength of the first conductive strip 50.

Alternatively, referring to fig. 4, 6, and 7, the connection pieces 53 may be configured in an L-shape and perpendicularly connected to the first conductive sheet 51 and the second conductive sheet 52, respectively. For example, the first conductive sheet 51 and the second conductive sheet 52 may be made of copper or copper alloy, so that the ductility and the conductivity of the first conductive sheet 51 and the second conductive sheet 52 are good. Meanwhile, the connecting piece 53 made of copper or copper alloy has good flexibility, is convenient to process and has good structural reliability.

The power module 220 may be disposed in the second accommodating space 232 of the housing 230, and the L-shaped connecting piece 53 may be disposed to facilitate the second conductive piece 52 extending into the second accommodating space 232, so that the stability of connection between the power module 220 and the first conductive strip 50 may be further improved while the connection is made. The second conductive sheet 52 may be provided with a through hole 521, and a screw may pass through the through hole 521 to firmly connect the power module 220 and the first conductive strip 50. In addition, the connecting pieces 53 are vertically connected to the first conductive sheet 51 and the second conductive sheet 52, respectively, so that the occupied space can be reduced, and the internal parts of the server 200 can be compact.

In some examples, referring to fig. 4 and 7, the electrical connection board 100 may further include two conductive connection boards 70 and an insulating layer 80, the two conductive connection boards 70 are respectively connected to the second conductive strips 60 of the two contact areas 11 to respectively connect the positive pole and the negative pole of the power supply, each conductive connection board 70 is provided with a plurality of conductive pins 71, and the conductive pins 71 on the two conductive connection boards 70 form a plurality of pairs of conductive pins 71 in a one-to-one correspondence. For example, the two conductive pins 71 aligned in the up-down direction of fig. 4 may be a pair of conductive pins 71. Each pair of conductive pins 71 corresponds to each force computing plate 210 one by one and is electrically connected to supply power to the force computing plates 210. An insulating layer 80 is provided between the two conductive connection plates 70 to avoid short circuits between the conductive connection plates 70 connecting the positive and negative poles of the power supply.

Therefore, through the arrangement of the conductive pins 71, the electric connection board 100 can be directly plugged in the force calculation boards 210, the arrangement of screws is omitted, the steps of disassembling and assembling the screws are avoided, the assembling or disassembling can be facilitated, the operation steps are simplified, and the maintenance efficiency is improved. In addition, a plurality of pairs of conductive pins 71 of the electrical connection board 100 can be respectively connected with a plurality of computing power boards 210 so as to simultaneously supply power to the plurality of computing power boards 210, and a plurality of electrical connection boards 100 are not required, so that the integration level of the server 200 is improved, and the cost and the operation steps are reduced.

For example, the conductive connecting plate 70 disposed at the upper end as shown in fig. 4 is connected to the contact region 11 disposed at the left end as shown in fig. 4, and the contact region 11 may be connected to the negative electrode of the power source, so that the conductive connecting plate 70 is connected to the negative electrode of the power source. The conductive connecting plate 70 provided at the lower end as shown in fig. 4 is connected to the contact region 11 provided at the right end as shown in fig. 4, and the contact region 11 may be connected to the positive electrode of the power supply, so that the conductive connecting plate 70 is connected to the positive electrode of the power supply, thereby realizing the current transmission.

As shown in fig. 4 and 5, the two conductive connection plates 70 are parallel in a length direction of the PCB substrate 10 (e.g., left and right directions as in fig. 4) and spaced apart by a predetermined gap in a height direction of the PCB substrate 10 (e.g., up and down directions as in fig. 4), and a plurality of conductive pins 71 are uniformly spaced apart in the length direction of each conductive connection plate 70 to facilitate connection with the plurality of force calculation plates 210.

The insulating layer 80 may be disposed at the positive electrode of the conductive connecting plate 70. The insulating layer 80 can be an insulating material coated or plated on the conductive connecting plate 70 of the positive electrode, and the insulating layer 80 thus arranged has good stability, so that short circuit between the two conductive connecting plates 70 can be effectively avoided. Of course, the insulating layer may be provided on the negative electrode of the conductive connecting plate 70, which is not limited herein.

In some embodiments, as shown in fig. 14, 16, and 17, an end of computing force plate 210 facing electrical connection plate 100 has a mounting seat 211. Each force calculation plate 210 is provided with two mounting seats 211 arranged up and down, and each pair of conductive pins 71 can extend into the two mounting seats 211. The mounting seat 211 may be a conductive member to conduct current when the conductive pin 71 is inserted into the mounting seat 211. The mounting seats 211 may be disposed on one side of the plate body of the force computing plate 210 (for example, one side of the left-right direction in fig. 11), that is, two mounting seats 211 of the same force computing plate 210 may be disposed on the left side of the plate body of the force computing plate 210 at the same time, or two mounting seats 211 may be disposed on the right side of the plate body of the force computing plate 210 at the same time. The mounting seat 211 may be a protruding structure protruding from the plate body of the force calculation plate 210, so as to facilitate the insertion of the conductive pin 71, and ensure the structural reliability of the force calculation plate 210. A first mating member may be provided in the mounting seat 211, and the conductive pin 71 may be detachably mated with the first mating member. By the arrangement of the first fitting member, the installation can be facilitated, and the reliability of the installation of the conductive pin 71 and the installation seat 211 can be improved.

In some examples, one of a hook and a slot may be disposed in the mounting seat 211, and the other of the hook and the slot may be disposed on the conductive pin 71, so that the force calculating board 210 and the conductive pin 71 can be electrically connected through the engagement of the hook and the slot. Meanwhile, the installation stability of the installation seat 211 and the conductive pin 71 can be ensured through the arrangement of the clamping hook and the clamping groove.

In other examples, as shown in fig. 14 to 17, the mounting seat 211 may be provided with a mounting hole 213, the inner sidewall of the mounting hole 213 has a spring 214 protruding toward the axis of the mounting hole 213, the conductive pin 71 is formed as a cylinder, and the conductive pin 71 is inserted into the mounting hole 213 to be in abutting connection with the spring 214. The spring 214 is a conductive material. When the conductive pin 71 extends into the mounting hole 213, the conductive pin 71 can press the spring 214 toward the inner sidewall of the mounting hole 213, so as to ensure a certain interaction force between the conductive pin 71 and the conductive socket, and further ensure effective contact between the conductive pin 71 and the conductive socket, thereby realizing current conduction between the conductive pin 71 and the conductive socket, and ensuring reliability of electrical connection between the electrical connection board 100 and the computation board 210.

As shown in fig. 15-17, one end (e.g., the front end as shown in fig. 16) of the mounting seat 211 may be further provided with a circular hole 219, and the circular hole 219 is disposed opposite to the mounting hole 213, so that the circular hole 219 and the mounting hole 213 may penetrate through the mounting seat 211. The aperture of the round hole 219 can be slightly larger than the diameter of the conductive pin 71, and the aperture of the round hole 219 is smaller than that of the mounting hole 213, the round hole 219 has a positioning function on the conductive pin 71, and further, the position eccentricity of the conductive pin 71 caused by processing and assembling errors or stress and other reasons can be avoided, so that the situation that the deformation of the reed 214 in a certain direction is larger and the deformation of the reed 214 in the other relative direction is smaller is avoided, and the uniform contact between the conductive pin 71 and the reed 214 is ensured.

For example, referring to fig. 17, two mounting seats 211 disposed on the same force calculation plate 210 may be staggered in the vertical direction, so that after one conductive pin 71 is inserted into the mounting seat 211 disposed at the upper end, the conductive pin 71 may extend out of the mounting seat 211, and after the other conductive pin 71 is inserted into the mounting seat 211 disposed at the lower end, the conductive pin 71 may not extend out of the mounting seat 211. The guide pin may be attached to the electrical connection plate 100 by a screw, or the guide pin may be integrally formed with the electrical connection plate 100.

Further, as shown in fig. 14 and 15, both ends of the spring 214 may be fixed to inner side walls of the mounting hole 213 with the middle portion of the spring 214 projecting toward the axis of the mounting hole 213. Thus, the conductive pin 71 can be conveniently inserted into the mounting hole 213, and the conductive pin 71 can be favorably pressed against the spring 214 toward the inner side wall of the mounting hole 213 to generate an interaction force. For example, the side of the spring 214 facing the conductive pin 71 may be curved to reduce the friction between the guide pin and the conductive socket.

In some examples, one end of the spring 214 can be fixed to the inner sidewall of the mounting hole 213 and the other end can be tilted. Thus, the conductive pin 71 can be conveniently inserted into the mounting hole 213, and a certain interaction force between the conductive pin 71 and the conductive seat can be ensured, so that an effective contact between the conductive pin 71 and the conductive seat can be ensured.

In some embodiments, as shown in fig. 24-26, computing power board 210 may include: the force computing plate body 215, the baffle plate 216 and the handle 217, and a force computing chip 218 can be arranged on the force computing plate body 215. The baffle plate 216 is disposed at an end of the force computing board body 215 far from the electrical connection board 100, and the baffle plate 216 is configured such that the force computing board 210 is accommodated in the first accommodating space 231, and the opening of the first accommodating space 231 is closed by the baffle plate 216, thereby protecting the force computing board body 215 and the force computing chip 218, etc. located in the housing 230. A handle 217 may be provided on a side of the blocking plate 216 away from the electrical connection board 100, and by providing the handle 217, a user may control the movement of the computation board 210 by pushing and pulling the handle 217. Of course, the handle 217 may be disposed on a plurality of modules such as the heat dissipation module 260 to facilitate movement of the modules.

It should be noted that the force computing board 210 according to the embodiment of the present invention may be an air cooling force computing board or a liquid cooling force computing board. In some examples, the force computing board 210 is an air-cooled force computing board, the force computing board body 215 may further include a heat sink for dissipating heat of the force computing chip 218, the force computing board 210 is disposed in the first receiving space 231 of the housing 230 and is slidable toward the front side of the housing 230, and the heat dissipation module 260 is disposed at the rear end of the housing 230 and is located corresponding to the force computing board 210, so that the heat dissipation module 260 can effectively dissipate heat of the force computing board 210. In addition, the force computing plate 210 can be further cooled by the arrangement of the cooling fins.

As shown in fig. 2 and 28, the heat sink module 260 includes at least one fan 269 to dissipate heat from the force plate 210. For example, the number of the air-cooling computation force plates is 12, and the fans 269 are four groups each including two fans arranged in the up-down direction of fig. 2. Each set of fans 269 is aligned in the left-right direction as shown in fig. 2, and each set of fans 269 can dissipate heat from 3 force plates 210. Each set of fans 269 can have a socket that is electrically connected to electrical connection board 100 such that connection of thermal module 260 to electrical connection board 100 does not require wires to make the server simple and tidy.

In other examples, as shown in fig. 18-26, computing force plate 210 may be a liquid-cooled computing force plate. In some embodiments, with reference to fig. 19 and fig. 22, the force calculating board 210 may further include a voltage reducing circuit module 270, and the voltage reducing circuit module 270 may be electrically connected to the power module 220 of the server 1000 to reduce voltage, and then input the voltage to the force calculating chip 218 for supplying power. The voltage step-down circuit module 270 is disposed on the force computing board body 215 and spaced apart from the force computing chip 218 in a second direction (e.g., a front-rear direction as shown in fig. 18), which is parallel to the extending direction of the force computing board 210.

The heat dissipation module 260 may include at least one first cooling plate 261, a water cooling plate 262, and at least one heat pipe 263, the first cooling plate 261 being disposed on the voltage drop circuit module 270, the water cooling plate 262 being disposed on one side surface of the force computing plate body 215, and the heat pipe 43 being disposed on the force computing plate body 215. It should be noted that the medium in the pipe of the "water-cooling plate 262" is not particularly limited to water, and may be various liquids. The heat pipe 263 is a heat transfer element with high heat conductivity, which transfers heat by evaporation and condensation of liquid in the pipe, when one end of the heat pipe 263 is heated, the liquid is vaporized by heat, the vapor goes from the heated end to the other end, the temperature of the other end is low, the vapor is liquefied by cold, and the condensed liquid can return to the heated end by, for example, capillary force. The liquid in the heat pipe 263 is continuously vaporized and liquefied by the reciprocating circulation, the liquid absorbs and emits a large amount of heat respectively during vaporization and liquefaction, the two ends of the heat pipe 263 have temperature difference, and the heat can be quickly conducted, so that the refrigeration effect can be achieved.

Meanwhile, the water cooling plate 262 and the first cooling plate 41 can also play a role in heat dissipation. The voltage reduction circuit module 270 can transfer heat to the first cooling plate 261, the first cooling plate 261 can dissipate heat, and the first cooling plate 261 can transfer heat to the heat pipe 263, so that the heat dissipation of the heat dissipation module 260 can be realized, and the heat dissipation effect is improved. In addition, since the water-cooling plate 262 has a certain thickness, by providing the first cooling plate 261, it is possible to easily control a difference in height between both ends of the heat pipe 263, so as to facilitate the installation of the heat pipe 263. In addition, one end of the heat pipe 263 is lapped on the first cooling plate 261, the first cooling plate 261 can be large in contact area with the voltage reduction circuit module 270, the contact area between the heat dissipation module 260 and the voltage reduction circuit module 270 is increased, the heat transfer efficiency and effect are improved, and therefore the voltage reduction circuit module 270 can be effectively cooled.

From this, through set up heat pipe 263 on calculation board plate body 21, and the one end of heat pipe 263 is taken on first cooling plate 261, and the other end is taken on water-cooling plate 262, can establish the heat transfer passageway, and then can omit radiator fan's setting, reduced the energy consumption, the cost is reduced and can make server 1000 noiselessness when the heat dissipation, radiating effect and thermal stability are good simultaneously, and can realize remote heat dissipation. Meanwhile, the utilization efficiency of the water cooling plate 262 is increased, and the heat dissipation efficiency of the voltage reduction circuit module 270 can be improved. In addition, the problems of heat dissipation cascade, hot air reflux and the like of the voltage reduction circuit modules 270 on a plurality of computation boards 20 are avoided, and further the diversified design of the voltage reduction circuit modules 270 can be facilitated. In addition, the first cooling plate 261, the water cooling plate 262 and the heat pipe 263 of the heat dissipation module 260 are cooperatively arranged, so that the heat dissipation effect can be further improved.

The voltage reduction circuit module 270 may have an inductance module and a mos (field effect transistor), and the heat pipe 263 may effectively dissipate heat of the inductance module and the mos, so as to avoid overheating of the inductance module and the mos, and ensure working stability of the voltage reduction circuit module 270. Of course, in other embodiments, the voltage step-down circuit module 270 may also be other structures that need heat dissipation, such as a power supply and a circuit board. By designing one water cooling plate 262, the power calculating chip 218 of the power calculating plate body 215 can be radiated, and the voltage reduction circuit module 270 on the power calculating plate body 215 can be radiated, so that the heat radiation capability of the water cooling plate 262 is fully utilized, and the fanless design is realized.

In some embodiments, the first cooling plate 261 may include a plurality of first cooling plates 261 arranged at intervals on the voltage-reduction circuit module 270, each first cooling plate 261 corresponding to at least one heat pipe 263. In other embodiments, the first cooling plate 261 may include one, and one end of all the heat pipes 263 is lapped on the first cooling plate 261. The layout design of the voltage step-down circuit block 270 may be selected from various designs. For example, the design of the nearby power supply is distributed, or the concentrated power supply and the concentrated heat dissipation are performed. The heat dissipation module 260 may be configured for the design of the voltage reduction circuit module 270 to further improve the heat dissipation effect.

For example, the heat pipe 263 may be a copper pipe or an aluminum alloy pipe, so that the heat pipe 263 has good structural strength, can perform effective heat dissipation, and has good flexibility, thereby facilitating the heat pipe 263 to be configured into various shapes in cooperation with the design of the voltage reduction circuit module 270 and the water cooling plate 262.

In some embodiments, as shown in fig. 19, 22 and 23, the server 1000 may further include a second cooling plate 267, the second cooling plate 267 is disposed on a side surface of the water cooling plate 262 facing away from the force plate body 215, and the other ends of all the heat pipes 263 are lapped on the second cooling plate 267. As such, by the arrangement of the first cooling plate 261 and the second cooling plate 267, good thermal contact can be achieved, so as to improve heat dissipation efficiency and heat dissipation effect.

For example, first cooling plate 261 and second cooling plate 267 can be aluminum alloy plate, and aluminum alloy plate's heat conductivity is good, and the hardness is higher, and then can make first cooling plate 261 and second cooling plate 267 compromise heat dispersion and structural strength, have guaranteed the radiating effect. Of course, the first cooling plate 261 and the second cooling plate 267 may also be made of various materials with good thermal conductivity, such as copper or copper alloy.

In some examples, with reference to fig. 19-21 and 23, at least one of the first cooling plate 261 and the second cooling plate 267 has at least one elongated slot 268 therein, the elongated slot 268 adapted to receive a portion of the heat pipe 263. The heat pipe 263 may engage multiple sidewalls of the slot 268. So, the installation of heat pipe 263 of can being convenient for on the one hand guarantees that heat pipe 263 sets up the stability on two cooling plates, and on the other hand can improve the area of contact of heat pipe 263 and two cooling plates for it has more excellent radiating efficiency and radiating effect. For example, the first cooling plate 261 and the second cooling plate 267 are each provided with a plurality of slots 268, and the slots 268 provided in the first cooling plate 261 and the slots 268 provided in the second cooling plate 267 have the same slot width and are arranged oppositely, so that the installation of the heat pipe 263 can be facilitated.

According to an embodiment of the present invention, in conjunction with fig. 19, 23, and 25, each heat pipe 263 may include a first heat pipe segment 264 that overlaps a side of the water cooling plate 262, a second heat pipe segment 265 that overlaps a side of the first cooling plate 261, and a connecting pipe segment 266, the second heat pipe segment 265 being located a smaller distance from the force calculation plate body 215 than the first heat pipe segment 264 is located from the force calculation plate body 215. The connection section 266 connects between the first heat pipe section 264 and the second heat pipe section 265 to form a stepped structure. Through the arrangement of the connecting pipe section 266, the height difference between the first heat pipe section 264 arranged on the water cooling plate 262 and the second heat pipe section 265 arranged on the voltage reduction circuit module 270 can be adapted, the effective attachment of the second heat pipe section 265 and the voltage reduction circuit module 270 is ensured, and the heat dissipation effect is further improved. Additionally, the connecting tube segment 266 so positioned may also facilitate movement of liquid from the first heat pipe segment 264 toward the second heat pipe segment 265.

In some examples, a thermally conductive gel that can adjust the height of the first cooling plate 261 is disposed between the voltage-drop circuit module 270 and the first cooling plate 261. For example, the heat pipes 263 may be mounted to the elongated slots 268 of the two cooling plates using solder paste, solder, or an interference fit. After the heat pipe 263 and the two cooling plates are installed to form an integral structure, the second cooling plate 267 of the integral structure may be installed on the water cooling plate 262 through screws, and when the first cooling plate 261 is installed on the voltage reduction circuit module 270, a certain height difference may exist between components of the first cooling plate 261 and the voltage reduction circuit module 270 due to manufacturing, and the first cooling plate 261 and the voltage reduction circuit module 270 are not attached tightly enough to affect the heat dissipation efficiency. According to the invention, by designing the heat pipe connecting pipe section 266, after the second cooling plate 41 is installed on the water cooling plate 262, the first cooling plate 261 is attached to the voltage reduction circuit module 270 through the deformation of the connecting pipe section 266, and the deformation can reach a millimeter level, for example, the height difference of 1-5mm is adjusted. Through the adjustment of the deformation of the heat pipe 263, the height difference of a few tenths of millimeters may still exist between the voltage-reducing circuit module 270 and the water-cooling plate 262, so that the heat-conducting gel may be disposed between the voltage-reducing circuit module 270 and the first cooling plate 261.

The heat conduction gel is deformable under the effect of power to can adjust the height of first cooling plate 261 through extrusion heat conduction gel, realize that first cooling plate 261 can the setting of floating for step-down circuit module 270, thereby can utilize heat conduction gel to absorb the slight tolerance of the rank below 1 millimeter, be favorable to first cooling plate 261 and step-down circuit module 270's good contact, thereby reach the heat dissipation purpose. Of course, in other examples, a thermal pad may be disposed between the voltage step-down circuit module 270 and the first cooling plate 261.

According to one embodiment of the present invention, the relationship between the height h of the connecting tube section 266 and the horizontal length L of the connecting tube section 266 satisfies: h/L is more than or equal to 1/20 and less than or equal to 1/2. Therefore, while the height difference between the first heat pipe section 264 and the second heat pipe section 265 is ensured, the deformation of the connecting pipe section 266 after being stressed can be realized, and the installation of the first cooling plate 261 on the voltage reduction circuit module 270 can be ensured.

In some embodiments, as shown in fig. 25, the first heat pipe section 264 and the connecting pipe section 266, and the second heat pipe section 265 and the connecting pipe section 266 are all in arc transition with an arc radius equal to or larger than twice the diameter of the heat pipe 263, so that the structural reliability of the heat pipe 263 can be further improved.

With reference to fig. 21 and 25, the plurality of heat pipes 263 may be adjusted according to the structural shape of the heat source, and in the parallel direction of the plurality of heat pipes 263, the first cooling plate 261 may be set to have different heights, so that the second pipe sections of the plurality of heat pipes 263 have different heights, and may be further attached to the heat source, so as to improve the heat dissipation efficiency and the heat dissipation effect.

It should be noted that the larger the temperature difference between the two ends of the heat pipe 263 is, the more beneficial to the rapid conduction of heat at the two ends is, and further beneficial to improving the heat dissipation efficiency and the heat dissipation effect of the heat pipe 263 to the heat source. The internal tubes of the water-cooling plate 262 may be arranged in a serpentine shape, and at least a portion of the tubes may be disposed opposite to the first heat pipe section 264 or the second cooling plate 267, so that the water-cooling plate 262 may dissipate heat from the first heat pipe section 264, thereby improving the heat dissipation efficiency and effect of the heat pipe 263.

Referring to fig. 20, the cross-section of the duct may be an isosceles trapezoid. The two bases of the trapezoid may be disposed toward the force calculating chip 218 and the second cooling plate 267, respectively, such that the opposite surfaces of the duct and the force calculating chip 218 and the second cooling plate 267 are linear. Thus, compared with the cross section of a circle, a square, a triangle and the like, the water cooling plate 262 arranged in this way is convenient for reducing the distance between the inner pipeline and the force calculating chip 218 and between the inner pipeline and the first heat pipe section 264, the contact area and the flow area of the trapezoid structure are large, the uniform temperature heat dissipation of the water cooling plate 262 is facilitated, the flow resistance can be reduced, the heat dissipation efficiency and the heat dissipation effect are improved, the temperature of the first heat pipe section 264 can be effectively reduced, and the temperature difference between the two ends of the heat pipe 263 is improved. For example, the bottom side of the longer pipe section may be disposed toward the first heat pipe section 264, so that the area of the opposite surface of the pipe facing the first heat pipe section 264 is larger, thereby further reducing the temperature of the first heat pipe section 264, and improving the heat dissipation efficiency and the heat dissipation effect of the heat pipe 263 to the heat source. In addition, the thickness of the water cooled plate 262 may also be reduced. In addition, the bottom edge of the trapezoid and the waist line can be in arc transition so as to facilitate the circulation of liquid in the pipeline.

In the example of fig. 26, the force computing board 210 may further include a baffle plate 216 and a handle 217, the baffle plates 216 are disposed at an end of the force computing board body 215 away from the voltage step-down circuit module 270, the force computing boards 210 are disposed in the accommodating space of the housing 230, the baffle plate 216 closes an opening of the accommodating space, and the handle 217 is disposed at a side of the baffle plate 216 away from the electrical connection board. The force calculation board 210 is slidably disposed in the accommodating space, and the force calculation board 210 can be disposed in or detached from the accommodating space by pulling or pushing the handle 217.

Referring to fig. 1-2 in combination with fig. 29, the server 1000 may include 12 force calculation boards 210, the force calculation boards 210 may be air-cooled force calculation boards, and the electrical connection board may be provided with 12 pairs of conductive pins 71, so that the electrical connection board 100 may simultaneously supply power to the 12 force calculation boards 210, thereby eliminating the need to provide wires, ensuring neatness and convenient assembly and disassembly of the server 1000, and simultaneously ensuring high force calculation of the server 1000. With reference to fig. 18 and 29, the electrical connection board 100 may be provided with interfaces respectively electrically connected to the control module 240 and the power supply module 250, and meanwhile, the server may include 12 liquid cooling computer boards, and the electrical connection board 100 may be provided with 12 pairs of conductive pins 71, so that the electrical connection board 100 may simultaneously supply power to the 12 computer boards, thereby avoiding the need of providing a wire, and ensuring tidiness of the server 1000 and facilitating disassembly and assembly. Meanwhile, the server 1000 is computationally intensive.

In some embodiments, as shown in fig. 30 to 32, a slide groove 236 may be disposed in the first accommodation space 231. The sliding grooves 236 are distributed at the top and bottom of the first accommodating space 231, the housing 230 is further formed with an open side 237 communicated with the first accommodating space 231, the open side 237 is positioned at the front side of the housing 230, the housing 230 is provided with a fixing portion 238 at the edge of the open side 237, the force computing plate 210 is slidably disposed on the sliding grooves 236, and the top edge and the bottom edge of the force computing plate 210 are respectively fitted in the sliding grooves 236 at the top and the bottom of the first accommodating space 231. Here, "top" refers to the upper end as shown in FIG. 1 and "bottom" refers to the lower end as shown in FIG. 1. One end (e.g., the front end as shown in fig. 1) of the computing force plate 210 is provided with a plug 210a, and the plug 210a is detachably mounted to the fixing portion 238 and at least partially covers the open side 237.

The setting of spout 236 can play the guide effect to calculation board 210 on the one hand, can realize calculation board 210 and install and fix accurately, can reduce the fixed degree of difficulty of installation, and on the other hand, can be convenient for calculation board 210 and the slidable setting of casing 230. The friction force between the force calculation plate 210 and the sliding groove 236 is small, so that the force calculation plate 210 can be taken out from the first accommodating space 231 more easily.

The plugging piece 210a is mounted on the fixing portion 238, so that the force computing board 210 can be mounted and fixed in the first accommodating space 231 on the housing 230, the mounting stability and firmness of the force computing board 210 in the first accommodating space 231 can be further improved by the cooperation of the plugging piece 210a and the fixing portion 238, in addition, the plugging piece 210a at least partially covers the opening side 237, so that the opening side 237 of the first accommodating space 231 can be covered, the force computing board 210 is located in the relatively closed first accommodating space 231, the force computing board 210 can be protected, external foreign objects can be prevented from entering the first accommodating space 231 and damaging the force computing board 210, the structural reliability of the force computing board 210 can be improved, and the service life of the server 1000 can be prolonged.

Therefore, the force computing plate 210 can be slidably arranged on the sliding groove 236, and the plug piece 210a can be detachably mounted on the fixing portion 238, so that the force computing plate 210 can be detachably arranged in the first accommodating space 231 of the housing 230, which not only can reduce the difficulty of mounting or dismounting the force computing plate 210, but also can realize the mounting and dismounting of a single force computing plate 210 in the first accommodating space 231 of the housing 230, and can avoid mutual interference, thereby facilitating the dismounting and mounting of the single force computing plate 210. When a single computing force plate 210 needs to be replaced or repaired, only the single computing force plate 210 can be detached, so that the normal work of other computing force plates 210 is not influenced, the working efficiency of the server 1000 can be ensured, and the structure of the server 1000 can be optimized.

In some examples, the fixing portion 238 can include a fixing hole 2381 at one side edge of the open side 237 and a positioning hole 2382 at the other side edge of the open side 237, and the plug 210a can be fixed at the fixing hole 2381 by the fastener 210 c. The number of the fixing holes 2381 and the positioning holes 2382 may be plural.

Wherein, fastener 210c can be the hand screw, fixed orifices 2381 can be the screw hole, the screw is worn to establish plug piece 210a and is cooperateed through the screw hole of external force and an open side 237 side edge, fix the installation of plug piece 210a at an open side 237 side edge through threaded connection, again because plug piece 210a is connected with calculation power board 210 and is formed calculation power board 210 altogether, thereby can realize calculation power board 210's installation fixed, can improve calculation power board 210's installation stability and fastness. Wherein, set up fastener 210c into hand screw, can directly twist hand screw with the hand when plug piece 210a is installed or is dismantled, need not to use other auxiliary device to can further reduce the degree of difficulty of calculation power board 210 installation or dismantlement, improve dismantlement efficiency.

The plug 210a may be provided with a positioning pin 210b, and the positioning pin 210b is fitted in the positioning hole 2382. The positioning pin 210b is inserted into the positioning hole 2382 and fixed by inserting, so that the force calculation plate 210 is further installed in the first accommodation space 231, which can further improve the installation stability and firmness of the force calculation plate 210.

Wherein, fixed portion 238 can be set up in opening side 237 upper and lower side edge, that is to say, when fixed orifices 2381 set up in opening side 237 upper side edge, locating hole 2382 can set up in opening side 237 lower side edge, when fixed orifices 2381 set up in opening side 237 lower side edge, locating hole 2382 can set up in opening side 237 upper side edge, so can make calculation force board 210 upper and lower side atress more even, make calculation force board 210's installation fixed more stable firm. In addition, through the combination of positioning and fixing, the installation mode of the plug piece 210a is simple and convenient, the fixing is reliable, the number of the fasteners 210c can be reduced, and the disassembly difficulty is reduced.

With reference to fig. 30 and 31, the baffle 28 may cover the open side 237 of the first receiving space 231, so as to further seal the first receiving space 231, so that the first receiving space 231 is in a relatively closed state, thereby preventing foreign objects from entering the first receiving space 231 and damaging the force computing plate 210, and improving the service life of the force computing plate 210.

Further, set up handle 29 in one side that baffle 28 is kept away from calculation power board 210, so, handle 29, baffle 28 and calculation power board 210 can interconnect fixedly in proper order, form a part of calculation power board 210 jointly, exert suitable power alright easily plug calculation power board 210 to handle 29 like this, in addition, install baffle 28 detachably at fixed part 238 again, thereby can realize plug piece 210a and whole calculation power board 210's installation and dismantlement, wherein, handle 29 can convenience of customers exerts external force to calculation power board 210, can make server 1000's structural design more ingenious, can improve user's use experience.

Calculation power board 210 and spout 236's cooperation sets up, to calculation power board 210 to the effect of leading in advance, the setting of conducting pin 71 and mount pad 211, accurate direction when installation calculation power board 210 has been realized, multiple direction cooperation can improve calculation power board 210's installation effectiveness and steadiness, thereby can omit the setting of a plurality of screws, set up the screw into hand screw, can realize need not with the help of external force of server 1000, can dismantle a plurality of modules, and can guarantee the installation reliability of a plurality of modules. It should be noted that any of the above installation and matching manners may be applied to any module, and are not described herein again.

As shown in fig. 1 and 30, the first receiving spaces 231 may be multiple, a partition 239 extending along the first direction (for example, the front-back direction shown in fig. 1) is disposed between the adjacent first receiving spaces 231, the partition 239 may make each first receiving space 231 independent from each other, and the partition 239 may be made of a material having good heat dissipation and flame retardancy, so that not only can the temperature of the force computing plate 210 be further reduced, but also the reliability of the force computing plate 210 is improved, and when the temperature of the force computing plate 210 in one first receiving space 231 is too high, the force computing plate 210 in another first receiving space 231 is prevented from being affected, and thus the reliability of the server 1000 may be improved.

In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are merely for convenience of description and simplicity of description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

In the description of the present invention, "a plurality" means two or more.

Other components of the server 1000 according to embodiments of the present invention, such as the inductance modules and mos tubes, etc., and the operation thereof, are known to those of ordinary skill in the art and will not be described in detail herein.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example.

While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A server, comprising:

a housing configured as a frame structure, the housing having at least first, second, third, and fourth receiving spaces therein, wherein the second receiving space is adapted to be fitted with a power supply module;

the plurality of force calculation plates are arranged in the first accommodating space in the shell in parallel along a first direction, each force calculation plate is arranged perpendicular to the first direction, and each force calculation plate can be arranged in the first accommodating space in a sliding mode;

the control module is slidably arranged in a third accommodating space of the shell, and the third accommodating space is positioned between the first accommodating space and the second accommodating space;

the power supply module is slidably arranged in a fourth accommodating space of the shell, and the fourth accommodating space is positioned between the first accommodating space and the second accommodating space and is distributed at intervals in the first direction with the third accommodating space;

the electric connecting plate is arranged in the shell, the force calculation plate, the power supply module, the control module and the power supply module are respectively connected with the electric connecting plate, the power supply module supplies power to the force calculation plate through the electric connecting plate, and the power supply module supplies power to the control module through the electric connecting plate; and

and the heat dissipation module at least dissipates heat of the plurality of computation force plates.

2. The server according to claim 1, further comprising a power module, wherein the power module is slidably disposed in the second accommodating space of the housing, and an extending direction of the power module is identical to an extending direction of the computing force board.

3. The server according to claim 2, wherein the power module is plural and arranged along the first direction, and each power module is adapted to supply power to 2-4 computing boards.

4. The server according to any one of claims 1 to 3, wherein the computing board is provided with a voltage reduction circuit module, the power supply module is configured to convert a first alternating voltage of a first alternating current externally connected into a direct current and supply the direct current to the voltage reduction circuit module, and the voltage reduction circuit module reduces the direct current and supplies power to the computing chip on the computing board.

5. The server according to claim 4, wherein a first DC voltage of the DC power converted by the power supply module is 48V, and a second DC voltage of the DC power reduced by the voltage reduction circuit module of the computing board is 12V.

6. The server according to claim 4, wherein the power supply module converts a second alternating voltage of an external second alternating current into a third direct current voltage of 12V and then supplies power to the control module.

7. The server according to claim 6, wherein the first AC voltage and the second AC voltage range from 220V to 380V.

8. The server according to claim 1, wherein the control module comprises a control board body, and a first circuit board arranged at one end of the control board body, wherein the first circuit board is provided with a first control signal interface and a second control signal interface, the first control signal interface is suitable for being connected with the first port of the electric connection board to realize signal connection, and the second control signal interface is suitable for being connected with the second port of the electric connection board to transmit current;

the both sides of third accommodation space have the sliding strip, the both sides of control plate body are equipped with the slide, the control plate body passes through the sliding strip is in slip in the slide realizes removal in the third accommodation space.

9. The server according to claim 8, wherein the power supply module includes a power supply board body, and a second circuit board disposed at one end of the power supply board body, the second circuit board is provided with a first current interface and a second current interface, the first current interface is adapted to be connected to the third port of the electrical connection board to access an external voltage, and the second current interface is adapted to be connected to the fourth port of the electrical connection board to transmit a current.

10. The server according to claim 1, wherein the computing board, the control module, and the power supply module are located on one side of the electrical connection board in a second direction, the second direction being parallel to an extending direction of the computing board.

11. The server according to claim 1, wherein the electrical connection board comprises:

the PCB substrate is provided with two contact areas which are respectively connected with a positive electrode and a negative electrode of a power supply, two side surfaces of each contact area are respectively provided with a first contact surface and a second contact surface which are suitable for being in contact with a conductor, and a plurality of through holes are formed in each contact area;

first and second conductive layers disposed on the first and second contact surfaces, respectively;

a third conductive layer disposed within the via and electrically connected to the first and second conductive layers;

a first conductive strip secured to and electrically connected with the first conductive layer, the first conductive strip adapted to connect to the power module;

a second conductive strip connected to and in electrical connection with the second conductive layer, the second conductive strip in electrical connection with the computing board.

12. The server of claim 11, wherein the first and second conductive layers are each configured as a conductive film plated on the first and second contact surfaces.

13. The server of claim 12, wherein the third conductive layer is configured as a conductive film plated on a sidewall of the through hole or is composed of a conductive material passing through the through hole.

14. The server according to claim 11, wherein the PCB substrate further has a screw hole, and the first conductive strip and the second conductive strip are connected to the PCB substrate by a screw; the through holes are arranged around the screw holes, and the diameter ratio of the through holes to the screw holes ranges from 1/10 to 1/100.

15. The server of claim 11, wherein the first conductive strip comprises:

a first conductive sheet connected to the first conductive layer;

the second conducting strip is connected with the power supply module;

the connecting sheet is connected between the first conducting sheet and the second conducting sheet.

16. The server according to claim 15, wherein the connecting pieces are configured in an L-shape and are vertically connected to the first conductive piece and the second conductive piece, respectively.

17. The server of claim 11, wherein the electrical connection board further comprises:

the two conductive connecting plates are respectively connected with the second conductive strips of the two contact areas so as to be respectively connected with the positive electrode and the negative electrode of a power supply, a plurality of conductive pins are arranged on each conductive connecting plate, the conductive pins on the two conductive connecting plates are in one-to-one correspondence to form a plurality of pairs of conductive pins, and each pair of conductive pins is in one-to-one correspondence with each force calculation plate and is electrically connected with the force calculation plate so as to supply power to the force calculation plate;

and the insulating layer is arranged between the two conductive connecting plates to avoid short circuit between the conductive connecting plates for connecting the positive pole and the negative pole of the power supply.

18. The server according to claim 17, wherein the two conductive connection plates are parallel in a length direction of the PCB substrate and spaced apart by a predetermined gap in a height direction of the PCB substrate, and a plurality of the conductive pins are arranged at regular intervals in the length direction of each conductive connection plate;

the insulating layer is arranged at the positive pole of the conductive connecting plate.

19. The server of claim 17, wherein the computing board has a mounting seat at an end facing the electrical connection board, a first mating member is disposed in the mounting seat, and the conductive pin is detachably engaged with the first mating member to connect or disconnect the power supply path of the computing board.

20. The server according to claim 19, wherein one of a hook and a slot is provided in the mounting seat, the other of the hook and the slot is provided on the conductive pin, and the computing board and the conductive pin are electrically connected through cooperation of the hook and the slot.

21. The server according to claim 19, wherein the mounting base is provided with a mounting hole, the inner side wall of the mounting hole is provided with a spring sheet protruding towards the axis of the mounting hole, the conductive pin is formed into a cylinder, and the conductive pin is inserted into the mounting hole and is in abutting connection with the spring sheet.

22. The server of claim 21, wherein both ends of the spring are fixed to inner sidewalls of the mounting hole, and a middle portion of the spring protrudes toward an axis of the mounting hole.

23. The server of claim 21, wherein one end of the spring is fixed to an inner sidewall of the mounting hole, and the other end is tilted.

24. The server according to claim 21, wherein the mounting base is further provided with a circular hole, the circular hole is disposed opposite to the mounting hole, so that the circular hole and the mounting hole can pass through the mounting base, and the diameter of the circular hole is larger than the diameter of the conductive pin and smaller than the diameter of the mounting hole.

25. The server of claim 1, wherein the computing board comprises:

the force calculating plate body is provided with a force calculating chip;

the baffle is arranged at one end, far away from the electric connecting plate, of the force calculation plate body, and the baffle is configured to close the opening of the first accommodating space after the force calculation plate is accommodated in the first accommodating space;

the handle is arranged on one side, far away from the electric connection plate, of the baffle plate.

26. The server according to claim 25, wherein sliding grooves are formed in the first accommodating space, the sliding grooves are distributed at the top and the bottom of the first accommodating space, the housing is further formed with an open side communicated with the first accommodating space, and a fixing portion is provided at an edge of the open side of the housing;

the force calculation plate is slidably arranged on the sliding groove, the top edge and the bottom edge of the force calculation plate are respectively matched with the top and the bottom of the first accommodating space in the sliding groove, a plug-pull piece is arranged at one end of the force calculation plate, and the plug-pull piece is detachably arranged on the fixed portion and at least partially covers the open side.

27. The server according to claim 26, wherein the fixing portion includes a fixing hole at one side edge of the open side and a positioning hole at the other side edge of the open side, the plug member is fixed at the fixing hole by a fastener, and the plug member is provided with a positioning pin which is fitted in the positioning hole;

the first accommodating spaces are multiple, and a partition plate extending along a first direction is arranged between every two adjacent first accommodating spaces.

28. The server according to claim 25, wherein the computing board body further comprises a heat sink for dissipating heat of the computing chip, the computing board is disposed in the first receiving space of the housing and is slidable toward the front side of the housing, the heat dissipation module is disposed at the rear end of the housing and is positioned corresponding to the computing board, and the heat dissipation module comprises at least one fan for dissipating heat of the computing board.

29. The server according to claim 25, wherein the force computation board further comprises a voltage reduction circuit module, the voltage reduction circuit module is arranged on the force computation board body and is spaced apart from the force computation chip in a second direction, and the second direction is parallel to the extending direction of the force computation board;

the heat dissipation module includes:

at least one first cooling plate disposed on the voltage step-down circuit module;

the water cooling plate is arranged on one side surface of the force calculation plate body;

and the heat pipe is arranged on the force calculation plate body, one end of the heat pipe is lapped on the first cooling plate, and the other end of the heat pipe is lapped on the water cooling plate.

30. The server of claim 29, wherein the first cooling plate comprises a plurality of spaced apart cooling plates on the voltage step-down circuit module, each first cooling plate corresponding to at least one heat pipe.

31. The server according to claim 29, wherein the first cooling plate comprises one, and wherein one end of all the heat pipes is lapped on the first cooling plate.

32. The server according to claim 29, further comprising a second cooling plate disposed on a side surface of the water cooling plate facing away from the force calculation plate body, wherein the other ends of all the heat pipes are lapped on the second cooling plate.

33. The server according to claim 32, wherein at least one of the first cooling plate and the second cooling plate has at least one elongated slot thereon, the elongated slot adapted to receive a portion of the heat pipe.

34. The server according to claim 32, wherein the first cooling plate and the second cooling plate are each an aluminum alloy plate.

35. The server of claim 29, wherein a thermally conductive gel is disposed between the voltage drop circuit module and the first cooling plate to adjust a height of the first cooling plate.

36. The server according to any one of claims 29-35, wherein each of the heat pipes comprises:

a first heat pipe section lapped on one side of the water cooling plate;

the distance between the second heat pipe section and the force calculation plate body is smaller than that between the first heat pipe section and the force calculation plate body;

a connection tube section connected between the first heat pipe section and the second heat pipe section to form a stepped structure.

37. The server of claim 36, wherein the relationship between the height h of the connecting pipe section and the horizontal length L of the connecting pipe section satisfies:

1/20≤h/L≤1/2。

38. the server of claim 36 wherein the first heat pipe segment and the connection pipe segment and the second heat pipe segment and the connection pipe segment each transition in an arc having a radius equal to or greater than two diameters of the heat pipes.