CN217985507U - Circuit board with heat radiation structure - Google Patents
Circuit board with heat radiation structure Download PDFInfo
- Publication number
- CN217985507U CN217985507U CN202220203977.3U CN202220203977U CN217985507U CN 217985507 U CN217985507 U CN 217985507U CN 202220203977 U CN202220203977 U CN 202220203977U CN 217985507 U CN217985507 U CN 217985507U
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- circuit board
- heat dissipation
- board body
- heat
- clamping
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Abstract
The utility model relates to a circuit board with heat radiation structure, including circuit board body, with circuit board body detachable connections's heat dissipation support, be provided with the heat dissipation through-hole on the circuit board body, circuit board body lower extreme is provided with the heat conduction pad that shape and circuit board body shape are the same, and the heat conduction pad lower extreme is provided with the fin, and the fin below is provided with the fan, fan and circuit board body electric connection. The utility model discloses a through setting up heat dissipation support, heat dissipation through-hole, heat conduction pad, fin and fan can in time give off the circuit board heat, make the circuit board temperature remain throughout in the within range of suitable electronic components operation, prolonged the life of circuit board.
Description
Technical Field
The utility model relates to a circuit board with heat radiation structure, especially a circuit board with heat radiation structure.
Background
A printed wiring board is a short term for a printed wiring board, and a conductive pattern formed by making a printed wiring, a printed element, or a combination of both on an insulating material according to a predetermined design is generally called a printed circuit, and a conductive pattern for providing electrical connection between components on an insulating substrate is called a printed wiring, so that a finished board of a printed circuit or a printed wiring is called a printed wiring board, also called a printed board or a printed circuit board. The circuit board is in the use, needs to install electronic components on the circuit board, and electronic components can produce the heat at the operation in-process, and along with the electronic components who installs on the circuit board is more and more, the heat of production also can be higher and more, and the high heat can lead to electronic components's damage, but current circuit board mostly all does not have heat radiation structure, uses just to generate heat after a period and damages, uses to get up to have the limitation.
SUMMERY OF THE UTILITY MODEL
To current not enough, the utility model provides a circuit board with heat radiation structure.
The utility model provides a technical scheme that its technical problem adopted is: the circuit board with the heat dissipation structure comprises a circuit board body and a heat dissipation support which is detachably connected with the circuit board body, wherein a heat dissipation through hole is formed in the circuit board body, a heat conduction pad which is the same as the circuit board body in shape is arranged at the lower end of the circuit board body, a cooling fin is arranged at the lower end of the heat conduction pad, a fan is arranged below the cooling fin, and the fan is electrically connected with the circuit board body.
Preferably, the heat dissipation support comprises a base, supports and two clamping mechanisms used for clamping the circuit board body, the clamping mechanisms are detachably connected with the circuit board body, the two clamping mechanisms are arranged at the left end and the right end of the circuit board body relatively, the two supports are arranged, the two clamping mechanisms are correspondingly arranged on the two supports in a sliding mode, and the two supports are arranged on the base in a sliding mode.
Preferably, the clamping mechanism comprises a clamping part and a connecting part, one end of the connecting part is detachably connected with the clamping part, the clamping part is detachably connected with the circuit board body, and the other end of the connecting part is slidably connected with the support.
Preferably, the clamping part comprises two U-shaped clamping jaws, the two U-shaped clamping jaws are hinged at the open ends, and the bottom ends of the two U-shaped clamping jaws are correspondingly matched and clamped at two sides of one end of the circuit board body.
Preferably, the U-shaped clamping jaw is a hollow U-shaped clamping jaw, two sides of the bottom end of the U-shaped clamping jaw are communicated with a conduction pipe, and a refrigerant is arranged in the conduction pipe.
Preferably, the plurality of heat dissipation through holes are arranged, and the plurality of heat dissipation through holes are arranged on the circuit board body in an array mode.
Preferably, the heat dissipation through hole is internally provided with a circular graphite heat dissipation layer, and the graphite heat dissipation layer is matched with the heat dissipation through hole.
Preferably, an insulating heat-conducting fin is arranged at the edge of the upper end of the circuit board body.
Preferably, the thermal pad is an insulating thermal pad.
Preferably, the heat sink is a heat sink having the same shape as the circuit board body.
The beneficial effects of the utility model reside in that: the utility model discloses a through setting up heat dissipation support, heat dissipation through-hole, heat conduction pad, fin and fan can in time give off the circuit board heat, make the circuit board temperature remain throughout in the within range of suitable electronic components operation, prolonged the life of circuit board.
Drawings
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic top view of an embodiment of the present invention;
FIG. 3 is an enlarged schematic view of A of FIG. 1;
part names and serial numbers in the figure: 1-circuit board body 10-heat dissipation through hole 11-graphite heat dissipation layer 12-insulating heat conducting sheet 2-heat dissipation support 21-base 22-support 23-clamping mechanism 231-clamping part 2311-U-shaped clamping claw 2312-conduction pipe 2313-torsion spring 2314-extension block 232-connection part 3-heat conducting pad 30-heat conducting hole 4-heat dissipation fin 40-heat dissipation hole 5-fan.
Detailed Description
To more clearly illustrate the objects, technical solutions and advantages of the embodiments of the present invention, the present invention will be further described with reference to the accompanying drawings and embodiments, which are clearly and completely described, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by a person of ordinary skill in the art without creative efforts belong to the protection scope of the present invention. Furthermore, directional terms as referred to in the present disclosure, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", etc., refer only to the direction of the attached drawings, and directional terms used are intended to better and more clearly illustrate and understand the present invention rather than to indicate or imply the orientation the present invention must have, and therefore should not be construed as limiting the present invention.
The embodiment of the utility model is shown in fig. 1 to fig. 3, a circuit board with a heat dissipation structure, which comprises a circuit board body 1 and a heat dissipation bracket 2 detachably connected with the circuit board body 1, wherein the circuit board body 1 is provided with a plurality of heat dissipation through holes 10, the plurality of heat dissipation through holes 10 are arranged on the circuit board body 1 in an array, the heat dissipation through holes 10 are arranged in an array, the air throughput can be uniformly increased, the annular graphite heat dissipation layer 11 is arranged in the heat dissipation through hole 10, the graphite heat dissipation layer 11 is matched with the heat dissipation through hole 10, preferably, the graphite heat dissipation layer 11 is the graphite heat dissipation layer 11 enclosed by graphite heat dissipation fins end to end, the graphite heat dissipation fins are also called heat conduction graphite flakes, and have unique crystal grain orientation, and heat is uniformly conducted along two directions, the lamellar structure can be well adapted to any surface, the heat dissipation performance is excellent, the lower end of the circuit board body 1 is provided with the heat conduction pad 3 with the same shape as that of the circuit board body 1, that is, the heat conduction holes 30 corresponding to the heat dissipation through holes 10 are arranged on the heat conduction pad 3, the heat conduction pad 3 is the insulating heat conduction pad 3, the lower end of the heat conduction pad 3 is provided with the heat dissipation fins 4, the heat dissipation fins 4 are the heat dissipation fins 4 with the same shapes as that of the circuit board body 1, that is, the heat dissipation holes 40 are arranged on the heat dissipation fins 4, the fan 5 is arranged below the heat dissipation holes 10, that is arranged at the position right below the circuit board body 1, the circuit board body 1 is arranged at the air outlet side of the fan 5, the heat dissipation through holes 40, the fan 30 blows air blown out by the fan 5, that is electrically connected with the circuit board body 1, that is electrically connected with the circuit board 1.
Further improvement, as shown in fig. 1 to 3, the heat dissipation bracket 2 includes a base 21, two supports 22 and two clamping mechanisms 23 for clamping the circuit board body 1, the clamping mechanisms 23 are detachably connected to the circuit board body 1, the two clamping mechanisms 23 are oppositely disposed at the left and right ends of the circuit board body 1, the two supports 22 are disposed, the two clamping mechanisms 23 are correspondingly slidably disposed on the two supports 22, the two supports 22 are both slidably disposed on the base 21, that is, one clamping mechanism 23 is mounted on one support 22, the other clamping mechanism 23 is mounted on the other support 22, the clamping mechanism 23 vertically slides in the support 22, the two supports 22 horizontally slide on the base 21, the two supports 22 do not affect each other, can simultaneously slide leftward, can simultaneously slide rightward, can simultaneously slide relatively, does not limit the shape and size of the circuit board body 1, and can be used.
In a further modification, as shown in fig. 1 to 3, the clamping mechanism 23 includes a clamping portion 231, and a connecting portion 232 with one end detachably connected to the clamping portion 231, the clamping portion 231 is detachably connected to the circuit board body 1, and the other end of the connecting portion 232 is slidably connected to the support 22, that is, one end of the clamping portion 231 is used for clamping the circuit board body 1, the other end of the clamping portion 231 is detachably connected to one end of the connecting portion 232, and the other end of the connecting portion 232 is slidably connected to the support 22.
In a further modification, as shown in fig. 1 to 3, the clamping portion 231 includes two U-shaped clamping jaws 2311, the two U-shaped clamping jaws 2311 are hinged at the open ends, the bottom ends of the two U-shaped clamping jaws 2311 are correspondingly clamped at two sides of one end of the circuit board body 1 in a matched manner, preferably, the two U-shaped clamping jaws 2311 are hinged at the open ends of the two U-shaped clamping jaws 2311, a torsion spring 2313 is arranged on the hinged shaft, the two U-shaped clamping jaws 2311 are respectively provided with an extending block 2314 extending outwards at the open ends, one end of one extending block 2314 is detachably connected with the connecting portion 232, the other extending block 2314 is empty, and the torsion spring 2313 abuts between the two extending blocks 2314.
In a further improvement, as shown in fig. 1 to 3, the U-shaped clamping jaw 2311 is a hollow U-shaped clamping jaw 2311, two sides of the bottom end of the U-shaped clamping jaw 2311 are both communicated with a conduction pipe 2312, a refrigerant is arranged in the conduction pipe 2312, and the refrigerant arranged in the hollow U-shaped clamping jaw 2311 can accelerate heat dissipation at the edge of the circuit board body 1, namely accelerate heat dissipation of the circuit board body 1.
In a further improvement, as shown in fig. 1 to 3, an insulating heat conducting sheet 12 is disposed at an upper end edge of the circuit board body 1, and the insulating heat conducting sheet 12 can transfer heat of the clamping portion 231 to dissipate heat in multiple directions.
It will be understood that modifications and variations are possible to those skilled in the art in light of the above teachings and that all such modifications and variations are considered to be within the purview of the invention as set forth in the appended claims.
Claims (10)
1. The utility model provides a circuit board with heat radiation structure which characterized in that: the heat dissipation support comprises a circuit board body and a heat dissipation support body detachably connected with the circuit board body, wherein a heat dissipation through hole is formed in the circuit board body, a heat conduction pad with the same shape as the circuit board body is arranged at the lower end of the circuit board body, a cooling fin is arranged at the lower end of the heat conduction pad, a fan is arranged below the cooling fin, and the fan is electrically connected with the circuit board body.
2. The wiring board with a heat dissipation structure of claim 1, wherein: the heat dissipation support comprises a base, supports and clamping mechanisms used for clamping the circuit board body, the clamping mechanisms are detachably connected with the circuit board body, the two clamping mechanisms are arranged at the left end and the right end of the circuit board body relatively, the two supports are arranged, the two clamping mechanisms are correspondingly arranged on the two supports in a sliding mode, and the two supports are arranged on the base in a sliding mode.
3. The wiring board with a heat dissipation structure according to claim 2, wherein: the clamping mechanism comprises a clamping part and a connecting part, one end of the connecting part is detachably connected with the clamping part, the clamping part is detachably connected with the circuit board body, and the other end of the connecting part is slidably connected with the support.
4. The wiring board with a heat dissipation structure of claim 3, wherein: the clamping part comprises two U-shaped clamping jaws, the two U-shaped clamping jaws are hinged at the opening end, and the bottom ends of the two U-shaped clamping jaws are correspondingly matched and clamped at two sides of one end of the circuit board body.
5. The wiring board with a heat dissipation structure of claim 4, wherein: the U-shaped clamping jaw is a hollow U-shaped clamping jaw, two sides of the bottom end of the U-shaped clamping jaw are communicated with a conduction pipe, and a refrigerant is arranged in the conduction pipe.
6. The wiring board with a heat dissipation structure of claim 1, wherein: the heat dissipation through holes are arranged in a plurality of numbers, and the heat dissipation through holes are arranged on the circuit board body in an array mode.
7. The wiring board with a heat dissipation structure of claim 1, wherein: the annular graphite heat dissipation layer is arranged in the heat dissipation through hole and matched with the heat dissipation through hole.
8. The wiring board with a heat dissipation structure of claim 1, wherein: and an insulating heat-conducting fin is arranged at the edge of the upper end of the circuit board body.
9. The wiring board with a heat dissipation structure of claim 1, wherein: the thermal pad is an insulating thermal pad.
10. The wiring board with a heat dissipation structure of claim 1, wherein: the radiating fin is the radiating fin with the same shape as the circuit board body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220203977.3U CN217985507U (en) | 2022-01-25 | 2022-01-25 | Circuit board with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220203977.3U CN217985507U (en) | 2022-01-25 | 2022-01-25 | Circuit board with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217985507U true CN217985507U (en) | 2022-12-06 |
Family
ID=84255007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220203977.3U Active CN217985507U (en) | 2022-01-25 | 2022-01-25 | Circuit board with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217985507U (en) |
-
2022
- 2022-01-25 CN CN202220203977.3U patent/CN217985507U/en active Active
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