CN212302415U

CN212302415U - Heat radiator

Info

Publication number: CN212302415U
Application number: CN202021335120.4U
Authority: CN
Inventors: 陈群
Original assignee: Kunshan Jianghong Precision Technology Co ltd
Current assignee: Kunshan Jianghong Precision Technology Co ltd
Priority date: 2020-07-09
Filing date: 2020-07-09
Publication date: 2021-01-05
Anticipated expiration: 2030-07-09

Abstract

The utility model discloses a heat abstractor relates to server heat dissipation technical field. The heat dissipation device comprises a substrate, a heat conduction piece, a heat transfer piece and a heat dissipation fin assembly, wherein the heat conduction piece is fixedly arranged on one side of the substrate and can be attached to a heat dissipation piece to be cooled; the heat transfer element is arranged on one side of the substrate, which is opposite to the heat conduction element, and the heat transfer element is in contact with the heat conduction element so as to disperse heat from the heat conduction element; the radiating fin assembly comprises a plurality of radiating fins which are arranged at intervals, the radiating fin assembly is fixedly arranged on one side of the substrate back to the heat conducting piece, and the radiating fin assembly is in contact with the heat conducting piece. The heat dissipation device can disperse and transfer the concentrated heat at the heat conduction part to a plurality of heat dissipation fins for heat dissipation by arranging the heat transfer part, so that the heat of the heat dissipation part to be treated is quickly transferred, and the temperature of the heat dissipation part to be treated is reduced to the preset temperature. And the heat conducting piece, the heat transfer piece and the radiating fin component are connected into a whole through the substrate, so that the integrity and the stability of the radiating device are improved.

Description

Heat radiator

Technical Field

The utility model relates to a server heat dissipation technical field, concretely relates to heat abstractor.

Background

The CPU is a core information processing terminal of the server, and the performance of the CPU directly determines the processing efficiency of the server. When the CPU is in operation, the CPU can continuously generate heat, when the temperature exceeds 90 ℃, the risk of burning out the CPU can be generated, but the CPU can not dissipate heat by itself, so that the heat dissipation device for dissipating heat and cooling the CPU is produced.

The existing heat dissipation device is characterized in that a plurality of heat dissipation fins are directly arranged at the bottom of a CPU (central processing unit) for heat transfer, and then a fan is used for blowing air to transfer the heat of the heat dissipation fins to the air; secondly, the heat conducting plate is arranged at the bottom of the CPU, a plurality of radiating fins are arranged on one side of the heat conducting plate, and then the fan is used for blowing air to realize heat dissipation and cooling.

However, in practical use, because the heating surfaces of the CPU are concentrated, the two heat dissipation methods cannot quickly disperse the heat generated by the CPU in a concentrated manner under the condition that the requirement on the power operation of the CPU is high, so that the server is at risk of being burned. In the second heat dissipation mode, the heat conduction plate and the plurality of heat dissipation fins are poor in connectivity and low in stability.

Accordingly, a heat dissipation device is needed to solve the above problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a heat abstractor can go out the heat transfer of treating the radiating piece fast, improves the safety in utilization of treating the radiating piece, and improves the wholeness and the steadiness of heat abstractor structure simultaneously.

To achieve the purpose, the utility model adopts the following technical proposal:

a heat dissipation device, comprising:

a substrate;

the heat conduction piece is fixedly arranged on one side of the substrate and can be attached to a heat dissipation piece to be dissipated;

a heat transfer member disposed on a side of the substrate opposite to the heat conductive member, the heat transfer member being in contact with the heat conductive member to disperse heat from the heat conductive member;

the heat radiation fin assembly comprises a plurality of heat radiation fins which are arranged at intervals, the heat radiation fin assembly is fixedly arranged on one side of the substrate back to the heat conducting piece, and the heat radiation fin assembly is contacted with the heat transfer piece.

Optionally, the heat dissipation device further comprises a fixing assembly, and the substrate can be detachably and fixedly connected with the machine body where the heat dissipation member is located through the fixing assembly, so that the heat conduction member is attached to the heat dissipation member.

Optionally, the fixing assembly includes a fixing screw, a mounting hole is formed in the substrate, and one end of the fixing screw penetrates through the mounting hole to be in threaded connection with the machine body.

Optionally, the fixing assembly further includes a spring, and the spring is sleeved on the periphery of the fixing screw and compressed between the substrate and the nut of the fixing screw.

Optionally, the fixing assembly further comprises a clamping ring, a clamping groove is formed in one end, penetrating through the mounting hole, of the fixing screw, and the clamping ring is clamped in the clamping groove.

Optionally, the fixing assemblies are provided in plurality, and the fixing assemblies are arranged at intervals along the edge of the substrate.

Optionally, the heat dissipation fin assembly further includes a bottom plate, the bottom plate contacts with the heat transfer member, and a plurality of heat dissipation fins are disposed on one side of the bottom plate away from the heat transfer member.

Optionally, the substrate is provided with a through opening, the heat conducting member is clamped at the opening, and the heat conducting member contacts with the heat transfer member through the opening.

Optionally, a groove is further disposed on the substrate, the groove is communicated with the opening, and the heat transfer element is disposed in the opening and the groove.

Alternatively, the heat transfer member includes a plurality of heat transfer pipes, and the plurality of heat transfer pipes are provided at intervals on the substrate.

The utility model has the advantages that:

the utility model provides a pair of heat abstractor can dispel the heat with the heat dispersion transmission to multi-disc heat radiation fins that heat conduction piece department is concentrated through setting up the heat transfer piece to accelerate the radiating efficiency who will treat the radiating piece, will treat the temperature of radiating piece and fall to predetermined temperature. And the heat conducting piece, the heat transfer piece and the radiating fin component are connected into a whole through the substrate, so that the integrity and the stability of the radiating device are improved.

Drawings

Fig. 1 is a schematic view of an overall structure of a heat dissipation device according to an embodiment of the present invention;

fig. 2 is an exploded schematic view of a heat dissipation device according to an embodiment of the present invention;

fig. 3 is a schematic view of a heat conducting element, a heat transferring element, a fixing assembly and a base plate of a heat dissipation device according to an embodiment of the present invention;

fig. 4 is an exploded view of a heat conducting element, a heat transferring element, a fixing assembly and a substrate in a heat dissipating device according to an embodiment of the present invention.

In the figure:

1. a substrate; 11. mounting holes; 12. an opening; 13. a groove; 2. a heat conductive member; 3. a heat transfer member; 4. a heat radiation fin assembly; 41. heat dissipation fins; 42. a base plate; 5. a fixing assembly; 51. fixing screws; 511. a nut; 512. a card slot; 52. a spring; 53. a snap ring.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.

Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "secured" are to be construed broadly and encompass, for example, both fixed and removable connections; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

As shown in fig. 1 and 2, the heat dissipation device disclosed in this embodiment includes a substrate 1, a heat conduction member 2, a heat transfer member 3, and a heat dissipation fin assembly 4, wherein the substrate 1 is provided with the heat conduction member 2, the heat transfer member 3, and the heat dissipation fin assembly 4. The base plate 1 serves for the fixed connection of the entire device. The heat conducting piece 2 is fixedly arranged on one side of the substrate 1, and the heat conducting piece 2 can be attached to the heat-dissipating piece to conduct heat of the heat-dissipating piece to be dissipated. The heat transfer member 3 is disposed on a side of the substrate 1 opposite to the heat conduction member 2, and the heat transfer member 3 contacts the heat conduction member 2 to dissipate heat from the heat conduction member 2. The heat radiation fin assembly 4 comprises a plurality of heat radiation fins 41 which are arranged at intervals, the heat radiation fin assembly 4 is fixedly arranged on one side of the substrate 1 back to the heat conducting piece 2, and the heat radiation fin assembly 4 is in contact with the heat conducting piece 3 to continuously receive heat transferred by the heat conducting piece 3 and distribute the heat out, so that the heat to be radiated is quickly cooled, the temperature of the heat to be radiated is kept in a preset range, and the use safety is improved. And the heat conducting piece 2, the heat transfer piece 3 and the radiating fin assembly 4 are connected into a whole through the substrate 1, so that the integrity and the stability of the radiating device are improved.

In this embodiment, treat that the radiating piece is CPU, can last its heat dissipation cooling, very convenient through setting up heat-conducting member 2 and CPU laminating. In other embodiments, the heat dissipation member to be mounted may be selected as needed, and the heat dissipation member to be mounted may be attached to the heat conduction member 2.

As shown in fig. 1 to 3, the substrate 1 is a rectangular flat plate, and a rectangular opening 12 is provided at a central position of the substrate 1. Further, the substrate 1 is further provided with a groove 13, the groove 13 is communicated with the opening 12, and exemplarily, a middle portion of the groove 13 is disposed through the opening 12. The grooves 13 may be disposed in a plurality and distributed at intervals on the surface of the substrate 1. In this embodiment, four grooves 13 are provided, two grooves 13 in the middle are linear grooves, and the grooves 13 on both sides are curved grooves to form two back-standing parabolas. Optionally, the edge of the substrate 1 is further provided with a plurality of mounting holes 11 at intervals. Of course, the mounting hole 11 is disposed avoiding the groove 13.

Illustratively, the heat-conductive member 2 is in the form of a rectangular plate so as to be attached to the CPU. Further, the area of the surface of the heat conducting member 2 attached to the CPU is larger than the attached area of the CPU to increase the heat conduction efficiency to the CPU. The heat conducting piece 2 is clamped at the opening 12, the surface of the heat conducting piece is flush with the substrate 1, and the clamping mode is convenient to disassemble, assemble and replace and is very convenient and fast. In this embodiment, the heat conducting member 2 is made of copper material with high thermal conductivity, and in other embodiments, the heat conducting member 2 may be selected as needed, which is not limited to this embodiment.

As shown in fig. 3, the heat transfer member 3 is disposed in the opening 12 and the recess 13, the portion of the heat transfer member 3 located at the opening 12 is attached to the heat conduction member 2, and the heat transfer range of the heat transfer member 3 is larger than that of the heat conduction member 2, so as to continuously transfer the heat of the heat conduction member 2 and disperse the heat. The heat transfer member 3 includes a plurality of heat transfer pipes which are spaced in the grooves 13 of the substrate 1 to increase heat dispersion efficiency. Optionally, the heat transfer element 3 is a sintered heat pipe, and the bottom of the sintered heat pipe is soldered in the groove 13 with solder paste to enhance stability, so that local materials can be conveniently obtained, and the processing flow can be reduced. In actual operation, a sintering heat pipe with the diameter of 6mm can be selected for flattening, the flattening thickness is 3mm so as to eliminate the hollow part of the sintering heat pipe, and the heat transfer efficiency is improved. And also facilitates the attachment of the heat transfer member 3 to the heat conductive member 2. In this embodiment, four heat transfer elements 3 are correspondingly disposed in the four grooves 13.

As shown in fig. 1 and 2, a plurality of heat dissipation fins 41 are arranged at intervals to form a plurality of heat dissipation gaps, and a fan can be used to blow air towards the heat dissipation gaps to accelerate heat dissipation and realize heat dissipation and cooling. The thickness of the material of the radiating fins 41 is 0.2mm, and the gap between every two adjacent radiating fins is 2.0mm, so that the radiating device can achieve the best cooling and temperature control effect on the whole, the operation requirement of 130W of CPU power is met, the actually measured temperature is controlled within 70 ℃, and the risk of burning the CPU due to high temperature is reduced.

Optionally, the heat sink assembly 4 further includes a bottom plate 42, the bottom plate 42 is fixed on the substrate 1, the groove 13 is located between the bottom plate 42 and the substrate 1, and two sides of the heat conducting member 3 are respectively attached to the bottom plate 42 and the heat conducting member 2 to realize heat conduction. The plurality of heat dissipation fins 41 are disposed on a side of the bottom plate 42 away from the heat transfer member 3 for continuously dissipating heat and cooling. It will be appreciated that the base plate 42 is disposed avoiding the mounting hole 11. The heat-conducting member 2, the heat-transferring member 3 and the plurality of heat-radiating fin units 4 are connected to be an integral body through the base plate 1, thereby improving the integrity and the stability of the heat-radiating device.

As shown in fig. 3 and 4, in order to realize that the heat conducting member 2 and the member to be heat-dissipated are always attached and fixed in the heat dissipating process, the heat dissipating apparatus further includes a fixing component 5, and the fixing component 5 fixes the substrate 1 and the member to be heat-dissipated through the mounting hole 11. Alternatively, the fixing member 5 may be provided in plurality, and a plurality of fixing members 5 are provided at intervals along the edge of the substrate 1 to enhance the connection stability with the substrate 1. In this embodiment, four fixing assemblies 5 are disposed at four corners of the rectangular substrate 1 and are correspondingly mounted in the four mounting holes 11. In other embodiments, the number of the fixing components 5 may be set according to the requirement, and is not limited to this embodiment.

Optionally, the fixing assembly 5 includes a fixing screw 51, and one end of the fixing screw 51 passes through the mounting hole 11 to be detachably and fixedly connected with the machine body where the heat dissipation member is to be located. In this embodiment, one end of the fixing screw 51 passes through the mounting hole 11 and is connected to the body thread of the CPU, so as to attach the heat conducting member 2 to the CPU, thereby achieving heat dissipation and cooling.

Optionally, the fixing assembly 5 further includes a spring 52, the spring 52 is sleeved on the periphery of the fixing screw 51 and is compressed between the substrate 1 and the nut 511 of the fixing screw 51, so that the substrate 1 is under the action of elastic thrust, the tightness of the heat conducting element 2 and the heat dissipating element to be attached is ensured, and the heat dissipating effect is ensured.

Optionally, the fixing assembly 5 further includes a snap ring 53, one end of the fixing screw 51 penetrating through the substrate 1 is provided with a snap groove 512, and the snap ring 53 is snapped in the snap groove 512. Even make set screw 51 difficult for following mounting hole 11 not hard up under the effect of spring 52 elastic force through setting up of snap ring 53, strengthened connection stability, further guarantee heat-conducting piece 2 and treat the inseparable nature of heat sink laminating.

Therefore, the utility model provides a heat abstractor can dispel the heat to multi-disc heat radiation fins 41 with the heat dispersion transmission that heat conduction 2 departments are concentrated through setting up heat transfer member 3 to accelerate the radiating efficiency who will treat the radiating piece, will treat the temperature of radiating piece and fall to preset temperature. And the heat conducting piece 2, the heat transfer piece 3 and the radiating fin assembly 4 are connected into a whole through the substrate 1, so that the integrity and the stability of the radiating device are improved.

Further set up fixed subassembly 5, fixed subassembly 5 passes through mounting hole 11 with base plate 1 with treat that the radiating piece is fixed, has guaranteed that heat-conducting element 2 is fixed with the laminating of treating the radiating piece.

The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.

Claims

1. A heat dissipating device, comprising:

a substrate (1);

the heat conducting piece (2) is fixedly arranged on one side of the substrate (1) and can be attached to a to-be-cooled piece;

the heat transfer element (3) is arranged on one side, opposite to the heat conduction element (2), of the substrate (1), and the heat transfer element (3) is in contact with the heat conduction element (2) so as to disperse heat from the heat conduction element (2);

the heat dissipation fin assembly (4) comprises a plurality of heat dissipation fins (41) which are arranged at intervals, the heat dissipation fin assembly (4) is fixedly arranged on one side, back to the heat conducting piece (2), of the substrate (1), and the heat dissipation fin assembly (4) is in contact with the heat transfer piece (3).

2. The heat dissipation device according to claim 1, further comprising a fixing component (5), wherein the substrate (1) is detachably and fixedly connected with a machine body where the heat dissipation member is located through the fixing component (5), so that the heat conduction member (2) is attached to the heat dissipation member.

3. The heat dissipation device according to claim 2, wherein the fixing component (5) comprises a fixing screw (51), the base plate (1) is provided with a mounting hole (11), and one end of the fixing screw (51) passes through the mounting hole (11) to be in threaded connection with the machine body.

4. The heat sink as claimed in claim 3, wherein the fixing assembly (5) further comprises a spring (52), the spring (52) is sleeved on the periphery of the fixing screw (51) and is disposed between the substrate (1) and the nut (511) of the fixing screw (51) in a compressed manner.

5. The heat dissipation device according to claim 3, wherein the fixing assembly (5) further comprises a snap ring (53), a snap groove (512) is formed at one end of the fixing screw (51) penetrating through the mounting hole (11), and the snap ring (53) is snapped in the snap groove (512).

6. The heat sink according to any one of claims 2-5, wherein the fixing member (5) is provided in plurality, and a plurality of fixing members (5) are provided at intervals along the edge of the substrate (1).

7. The heat sink according to any of claims 1-5, wherein the heat sink fin assembly (4) further comprises a base plate (42), the base plate (42) being in contact with the heat transfer member (3), a side of the base plate (42) remote from the heat transfer member (3) being provided with a plurality of heat sink fins (41).

8. The heat sink according to claim 1, wherein the substrate (1) is provided with an opening (12) therethrough, the heat conducting member (2) is clamped at the opening (12), and the heat conducting member (2) contacts the heat transfer member (3) through the opening (12).

9. The heat sink according to claim 8, wherein a groove (13) is further provided on the base plate (1), the groove (13) communicates with the opening (12), and the heat transfer member (3) is disposed in the opening (12) and the groove (13).

10. The heat dissipating device according to any one of claims 1 to 5, wherein the heat transfer member (3) comprises a plurality of heat transfer pipes, and the plurality of heat transfer pipes are provided at intervals on the base plate (1).