CN217509342U - Centralized heat dissipation structure - Google Patents

Abstract

The utility model relates to a centralized heat radiation structure, including casing and soaking board, the inside circuit board that is equipped with of casing, be equipped with high-power consumption component on the circuit board, the casing corresponds the through-hole has been seted up to high-power consumption component's position, be equipped with the heat conduction piece on the soaking board, the heat conduction piece is worn to locate the through-hole and with high-power consumption component butt, the periphery that the through-hole is close to soaking board one end is equipped with the support boss, support the boss with the soaking board butt, in order form the clearance between soaking board and the casing. The utility model discloses can be when reducing the temperature of high-power consumption component, the heat transfer that the restriction other electronic component produced to the soaking board, furthest utilizes the heat-sinking capability, reduces the waste of heat-sinking capability.

Description

Centralized heat dissipation structure

Technical Field

The utility model relates to a heat abstractor technical field particularly, relates to a concentrate heat radiation structure.

Background

With the technical development and the improvement of the living standard of people, people have higher requirements on the functions, the applicability and the like of the vehicle-mounted domain controller, and technical personnel are promoted to improve the control and interaction capacity of the domain controller. The overall performance of the domain controller is improved, that is, the performance of important electronic components (such as chips) in a pcba (printed Circuit Board assembly) of the domain controller is enhanced, so that the overall power consumption of the electronic components is increased, the increase of the power consumption of the electronic components increases the heat generated during the operation of the electronic components, and if the electronic components cannot be dissipated in time, the function of the electronic components is reduced or even the electronic components are disabled, which is not imaginable for a vehicle-mounted domain controller. For a vehicle-mounted domain controller, various electronic components have different heat dissipation requirements, most of the electronic components such as resistors, inductors, capacitors and the like have almost no heat dissipation requirements, and the main heat dissipation object is a chip. In addition, the heat dissipation requirements of different chips depend on the chip design and the working power consumption, in most cases, only a small part of high-power-consumption elements (the heat power consumption accounts for 50% of the total heat power consumption) have high heat dissipation requirements, and other chips can meet the heat dissipation requirements by using simple heat dissipation methods such as natural heat dissipation.

Chinese patent No. CN212992827U discloses a heat dissipation structure for a chip, in which a heat collecting element is disposed on the heat dissipation element to effectively prevent heat from flowing back, and this structure conducts all the heat generated by the chip to the heat dissipation assembly, but the low power consumption chip with lower heat dissipation requirement also utilizes the heat dissipation element to dissipate heat, which is unnecessary, and this will cause waste of heat dissipation capability of the heat dissipation assembly, and at the same time, will affect the heat dissipation effect of the high power consumption element. In addition, for the conventional fin type VC radiator, the heat transmission between the heat dissipation boss and the electronic component (such as a chip) to be cooled is performed through the heat conducting medium, which means that the heat of all the electronic components (no matter a low power consumption chip or a high power consumption component) is conducted to the heat dissipation fins for cooling, and this heat dissipation mode has a higher requirement on the heat dissipation capability of the radiator, and meanwhile, unnecessary waste of the heat dissipation capability is caused. Therefore, how to perform centralized heat dissipation on the high-power electronic components on the PCBA is a problem that needs to be solved urgently.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a concentrate heat radiation structure, can be when reducing the temperature of high-power consumption component, the heat transfer to the radiator that restriction other electronic component produced, furthest utilizes the heat-sinking capability, reduces the waste of heat-sinking capability.

The utility model provides a concentrate heat radiation structure, includes casing and soaking board, the inside circuit board that is equipped with of casing, be equipped with the high power consumption component on the circuit board, the casing corresponds the through-hole has been seted up to the position of high power consumption component, be equipped with the heat conduction piece on the soaking board, the heat conduction piece is worn to locate the through-hole and with high power consumption component butt, the periphery that the through-hole is close to soaking board one end is equipped with the support boss, support the boss with the soaking board butt, in order form the clearance between soaking board and the casing.

In above-mentioned technical scheme, the heat conduction piece can carry out the soaking with high-power consumption component heat transfer to soaking plate, supports the soaking plate through supporting the boss, can remove other positions and the casing of heat conduction piece with the soaking plate and keep apart, avoids the heat to pass through casing transmission to soaking plate, when effectively reducing high-power consumption component temperature that generates heat, restricts the heat transfer to the radiator of other electronic component productions, furthest utilizes the heat-sinking capability of radiator, reduces the waste of heat-sinking capability.

Furthermore, a plurality of heat conducting pieces are embedded on the soaking plate, and the heat conducting pieces extend towards the edge of the circuit board by taking the heat conducting blocks as centers.

In above-mentioned technical scheme, can evenly transmit the heat of heat conduction piece to the edge of soaking board through the heat-conducting piece to improve heat dispersion.

Further, the heat conducting member is a flat heat pipe.

In above-mentioned technical scheme, flat heat pipe adopts heat conduction metal to make, and its inside can set up endothermic fluid, can disperse the heat to the soaking plate fast.

Further, the heat conduction block is provided with a contact surface used for being abutted to the high power consumption element, the periphery of the contact surface is raised to form a convex edge, and the convex edge is sleeved on the periphery of the high power consumption element.

In the technical scheme, the convex edge can position the heat conduction block on one hand, so that the heat conduction block is accurately aligned with the high-power-consumption element, and on the other hand, the contact area between the heat conduction block and the high-power-consumption element can be increased, and the heat dissipation efficiency is improved.

Further, a heat conducting medium is arranged between the contact surface and the high-power-consumption element.

In the technical scheme, the heat of the high-power-consumption element can be more transferred to the heat conducting block through the heat conducting medium.

Furthermore, the vapor chamber further comprises heat radiating fins, and the heat radiating fins are arranged on one side, far away from the shell, of the vapor chamber.

In above-mentioned technical scheme, radiating fin can be with the heat of soaking plate disperse to the air fast in, improve heat dispersion.

Further, the heat dissipation structure further comprises at least one fan, wherein a mounting groove is formed in each heat dissipation fin, and the fan is arranged in the mounting groove.

In the technical scheme, the fan can improve the heat dissipation capacity of the heat dissipation fins and improve the heat dissipation efficiency of the heat sink.

Further, the heat conduction block is in interference fit with the shell.

In the technical scheme, the heat conduction block and the shell are in interference fit, thermal contact resistance exists between the heat conduction block and the shell, heat conduction from the side face of the heat conduction block to the shell can be reduced, it is further guaranteed that heat from a high-power-consumption element can be transmitted through the heat conduction block more, and meanwhile, the dustproof and waterproof effect inside the shell can be achieved.

Compared with the prior art, the beneficial effects of the utility model are that: carry out the soaking through heat conduction piece with high-power consumption component heat transfer to soaking plate, the heat is dispelled the heat on transmitting to the radiating fin by the soaking plate again, keep apart other positions of soaking plate and casing through supporting the boss, avoid the heat to transmit to the soaking plate through the casing, when effectively reducing high-power consumption component heating temperature, the heat transfer that the restriction other electronic component produced is to the soaking plate, furthest utilizes the heat-sinking capability, reduce the waste of heat-sinking capability, with the requirement to whole domain controller heat-sinking capability that reduces, and then reduction in production cost.

Drawings

Fig. 1 is a schematic structural diagram of a centralized heat dissipation structure according to an embodiment of the present invention.

Fig. 2 is a schematic structural view of a vapor chamber of a concentrated heat dissipation structure according to an embodiment of the present invention.

The reference numbers illustrate:

the heat dissipation device comprises a shell 1, an upper cover 11, a supporting boss 111, a lower cover 12, a soaking plate 2, a heat conduction block 21, a contact surface 211, a convex edge 212, a heat conduction piece 22, a circuit board 3, a high-power-consumption element 31, a heat dissipation fin 4 and a fan 5.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Examples

The concentrated heat dissipation structure is mainly used for electronic equipment such as vehicle-mounted domain controllers, has the advantages of quickly reducing the temperature of high-power-consumption electronic elements, limiting the effect of transferring heat generated by low-power-consumption electronic elements to the vapor chamber 2, realizing concentrated heat dissipation of the high-power-consumption electronic elements and utilizing the heat dissipation capacity of the heat dissipation structure to the maximum extent. The specific structure of the concentrated heat dissipation structure is explained in detail below with reference to the accompanying drawings.

As shown in fig. 1 and fig. 2, in a preferred embodiment, the concentrated heat dissipation structure of the present application mainly includes a housing 1 and a soaking plate 2. Wherein, casing 1 includes upper cover 11 and lower cover 12, and upper cover 11 and lower cover 12 can the lock vacuole formation, are equipped with circuit board 3 in the cavity, are equipped with at least one high power consumption component 31 and a plurality of low-power consumption component on the circuit board 3, and the through-hole has been seted up to casing 1 corresponding high power consumption component 31's position.

It is understood that the high power consumption element 31 in this embodiment is a chip with high heat generation power, and in other embodiments, the high power consumption element 31 may be other electronic elements with high heat generation power.

Soaking plate 2 adopts high coefficient of thermal conductivity's metal to make, is equipped with heat conduction piece 21 on the heat-conducting plate, and heat conduction piece 21 is located soaking plate 2's lower terminal surface and vertical downwardly extending, and through-hole is worn to locate by heat conduction piece 21, and the lower extreme and the 31 butt of high power consumption component of heat conduction piece 21 can transmit the heat of high power consumption component 31 to soaking plate 2 fast through heat conduction piece 21 to realize rapid cooling.

Exemplarily, the heat conduction block 21 is made of a metal material with high thermal conductivity such as pure copper and pure aluminum, and is connected to the soaking plate 2 in a welding manner, the lower end surface of the heat conduction block 21 is provided with a contact surface 211 for abutting against the high power consumption element 31, a convex edge 212 is formed by protruding the periphery of the contact surface 211, the convex edge 212 and the contact surface 211 are matched to form a groove body matched with the shape of the high power consumption element 31, during installation, the convex edge 212 can be sleeved on the periphery of the high power consumption element 31, on one hand, the heat conduction block 21 can be positioned, so that the heat conduction block 21 is accurately aligned with the high power consumption element 31, on the other hand, the contact area between the heat conduction block 21 and the high power consumption element 31 can be increased, and the heat dissipation efficiency is improved.

In this embodiment, the heat conducting block 21 is preferably in interference fit with the housing 1, so that thermal contact resistance exists between the two, heat conduction from the side surface of the heat conducting block 21 to the housing 1 can be reduced, it is further ensured that more heat from the high power consumption component 31 can be transferred through the heat conducting block 21, and meanwhile, dust and water prevention inside the housing 1 can be achieved.

In order to further improve the heat dissipation efficiency, a heat conducting medium is disposed between the contact surface 211 and the high power consumption element 31, the heat conducting medium may be a conventional material such as heat conducting gel or heat conducting silicone grease, and the heat of the high power consumption element 31 can be more transferred to the heat conducting block 21 through the heat conducting medium.

The periphery that the through-hole of upper cover 11 is close to 2 one ends of soaking board is equipped with supports boss 111, support boss 111 protrusion in the up end of upper cover 11 and with 2 lower terminal surface butts of soaking board, thereby support 2 top at upper cover 11 with soaking board, make and form the clearance between 2 soaking board and the casing 1, the clearance can be kept apart with other positions that the soaking board 2 removed heat conduction piece 21 and casing 1, avoid the heat to pass through casing 1 and transmit to 2 soaking board, when effectively reducing high-power consumption component 31 heating temperature, the heat transfer that restriction other electronic component produced to the radiator, furthest utilizes the heat-sinking capability of radiator, reduce the waste of heat-sinking capability.

The soaking plate 2 is embedded with a plurality of heat conducting pieces 22, and the plurality of heat conducting pieces 22 extend towards the edge of the circuit board 3 by taking the heat conducting block 21 as the center. Illustratively, one end of the heat-conducting member 22 is connected to the upper end of the heat-conducting block 21, and the other end extends to near the edge of the soaking plate 2, thereby rapidly dissipating the heat of the heat-conducting block 21 to the whole soaking plate 2.

In the present embodiment, the heat conducting member 22 is a flat heat pipe, which is a hollow structure, the heat conducting member 22 is made of an existing metal material with a high thermal conductivity coefficient, such as aluminum alloy or copper alloy, and a heat absorbing fluid is disposed inside the heat conducting member, for example, the heat absorbing fluid may be acetone, liquid ammonia, pure water, etc., and the heat of the heat conducting block 21 can be uniformly transferred to the edge of the soaking plate 2 through the heat conducting member 22, so as to improve the heat dissipation performance.

The concentrated heat dissipation structure further comprises heat dissipation fins 4, and the heat dissipation fins 4 are arranged on one side, far away from the shell 1, of the soaking plate 2. For example, the heat dissipation fins 4 may be made of high thermal conductivity metal materials such as pure aluminum, pure copper, aluminum alloy, and copper alloy, and the thickness of the heat dissipation fins 4 is preferably 0.3mm to 0.8mm, and the spacing between the fins is preferably 1mm to 3 mm. The heat of the soaking plate 2 can be quickly dissipated to the air through the radiating fins 4, and the radiating performance is improved.

The concentrated heat dissipation structure further comprises at least one fan 5, wherein the heat dissipation fins 4 are provided with mounting grooves, and the fan 5 is detachably arranged in the mounting grooves. The heat dissipation capability of the heat dissipation fins 4 can be improved by the fan 5, and the heat dissipation efficiency of the heat sink is improved.

This application carries out the soaking with 31 heat transfer of high power consumption component to soaking plate 2 through heat conduction piece 21, the heat is transmitted by soaking plate 2 again and is dispelled the heat on radiating fin 4, keep apart other positions of soaking plate 2 and casing 1 through supporting boss 111, avoid the heat to transmit to soaking plate 2 through casing 1, when effectively reducing high power consumption component 31 heating temperature, the heat transfer that the restriction other electronic component produced is to soaking plate 2, furthest utilizes the heat-sinking capability, reduce the waste of heat-sinking capability, with the requirement to whole domain controller heat-sinking capability that reduces, and then reduction in production cost.

In the description of the present invention, it is to be understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.

Claims (8)

1. The utility model provides a concentrate heat radiation structure, its characterized in that, includes casing and soaking board, the inside circuit board that is equipped with of casing, be equipped with the high power consumption component on the circuit board, the casing corresponds the through-hole has been seted up to the position of high power consumption component, be equipped with the heat conduction piece on the soaking board, the heat conduction piece is worn to locate the through-hole and with high power consumption component butt, the periphery that the through-hole is close to soaking board one end is equipped with the support boss, support the boss with the soaking board butt, in order to form the clearance between soaking board and the casing.

2. The structure of claim 1, wherein the soaking plate is embedded with a plurality of heat conducting members, and the plurality of heat conducting members extend toward the edge of the circuit board with the heat conducting block as a center.

3. The structure of claim 2, wherein the heat conduction member is a flat heat pipe.

4. The structure of claim 1, wherein the heat conduction block has a contact surface for abutting against the high power consumption component, and a periphery of the contact surface is raised to form a convex edge, and the convex edge is sleeved on an outer periphery of the high power consumption component.

5. The structure of claim 4, wherein a heat conducting medium is disposed between the contact surface and the high power consumption element.

6. The structure according to claim 1, further comprising heat dissipating fins provided on a side of the soaking plate away from the case.

7. The centralized heat dissipation structure of claim 6, further comprising at least one fan removably coupled to the heat dissipation fins.

8. The structure of claim 1, wherein the heat conducting block is in interference fit with the through hole.

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