CN218679476U - Printed circuit board with good heat dissipation performance - Google Patents
Printed circuit board with good heat dissipation performance Download PDFInfo
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- CN218679476U CN218679476U CN202222509409.9U CN202222509409U CN218679476U CN 218679476 U CN218679476 U CN 218679476U CN 202222509409 U CN202222509409 U CN 202222509409U CN 218679476 U CN218679476 U CN 218679476U
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- circuit board
- heat dissipation
- heat
- printed circuit
- fixedly arranged
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model relates to a printed circuit board technical field discloses a printed circuit board that heat dispersion is good, including the roof, the fixed four support columns that are provided with in roof top one side, four the equal fixed screw that is provided with in support column top, four the screw top all is provided with fixing bolt, four the fixed backup pad that is provided with in screw top, the backup pad runs through four screws and passes through fixing bolt and connect on the support column, the fixed heat dissipation channel that is provided with in backup pad bottom, the fixed a plurality of radiating fin that set up in heat dissipation channel top. The utility model relates to an among the printed circuit board that heat dispersion is good, the inside electric motor of heat radiation structure can drive the heat dissipation fan and dispel the heat, and a plurality of radiating fin on rethread heat dissipation passageway top dispel the heat to the circuit board, play good radiating effect, and the fin of roof top one side also can dispel the heat when heat radiation structure carries out the radiating, and diversified dispels the heat and has prevented the damage of circuit board.
Description
Technical Field
The utility model relates to a printed circuit board technical field especially relates to a printed circuit board that heat dispersion is good.
Background
The circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property, the existing circuit board has a plurality of electronic elements, the heat generated by the work of the electronic elements is more and more, and the temperature of the circuit board is high, so the heat dissipation requirement of the circuit board is higher and higher, the area with dense circuit lines of the circuit board or the part or the circuit part through which large current passes needs to meet good heat dissipation performance, otherwise the printed circuit board is deformed due to high temperature, the service life of the printed circuit board is shortened, and the stability and the service life of electronic products are also reduced.
Upon retrieval, the prior patent (publication number: CN 211457512U) discloses a printed circuit board. Although this patent technique improves radiating efficiency and heat dispersion, realizes quick heat dissipation, but has heat radiation structure too complicated, the trouble problem of installation to lead to printed circuit board's use level to hang down. Therefore, those skilled in the art have provided a printed circuit board with good heat dissipation performance to solve the above problems in the background art.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the shortcoming that exists among the prior art, and the printed circuit board that heat dispersion is good that proposes, the inside electric motor of heat radiation structure can drive the heat dissipation fan and dispel the heat, a plurality of radiating fin on rethread radiating passage top dispel the heat to the circuit board, play good radiating effect, the fin of roof top one side also can dispel the heat when heat radiation structure carries out the heat dissipation, diversified dispelling the heat has prevented the damage of circuit board, the life of circuit board has still been prolonged simultaneously, the backup pad runs through four screws and passes through fixing bolt and connect on the support column, fix that can be fine with the backup pad and support the heat radiation structure operation, good basis has been laid for the heat radiation structure operation, heat radiation structure's stability has been improved, the backup pad runs through four screws and passes through fixing bolt and connect on the support the heat radiation structure operation, good basis has been laid for the heat radiation structure operation, the stability of heat radiation structure still is convenient for the installation simultaneously, and efficiency is improved.
In order to achieve the above purpose, the utility model provides a following technical scheme: a printed circuit board with good heat dissipation performance comprises a top plate, wherein four support columns are fixedly arranged on one side of the top end of the top plate, screws are fixedly arranged at the top ends of the four support columns, fixing bolts are arranged at the top ends of the four screws, support plates are fixedly arranged at the top ends of the four screws, the support plates penetrate through the four screws and are connected to the support columns through the fixing bolts, heat dissipation channels are fixedly arranged at the bottom ends of the support plates, and a plurality of heat dissipation fins are fixedly arranged at the top ends of the heat dissipation channels; a heat dissipation structure is fixedly arranged at the top end of the supporting plate, an electric motor is fixedly arranged in the heat dissipation structure, a heat dissipation fan is fixedly arranged at the top end of the electric motor, a shell is fixedly arranged on one side of the top end of the top plate, and a plurality of processors are fixedly arranged on one side of the heat dissipation structure;
through the technical scheme, the inside electric motor of heat radiation structure can drive the heat dissipation fan and dispel the heat, a plurality of radiating fins on rethread radiating channel top dispel the heat to the circuit board, play good radiating effect, the fin of roof top one side also can dispel the heat when heat radiation structure carries out the heat dissipation, diversified dispelling the heat has prevented the damage of circuit board, the life of circuit board has still been prolonged simultaneously, the backup pad runs through four screws and passes through fixing bolt and connect on the support column, can be fine fixed and support the heat radiation structure operation with the backup pad, good basis has been laid down for the heat radiation structure operation, the stability that has improved heat radiation structure still is convenient for install simultaneously, and the efficiency is improved.
Furthermore, a cooling fin is fixedly arranged on one side, close to the shell, of the top end of the top plate;
through above-mentioned technical scheme, the fin can dispel the heat to the inside connector of casing.
Furthermore, two conductive blocks are fixedly arranged on one side of the radiating fin;
through above-mentioned technical scheme, the conducting block plays electrically conductive effect.
Further, a cooling layer is fixedly arranged at the bottom end of the top plate;
through above-mentioned technical scheme, the further cooling of going on of cooling layer is to the circuit board.
Further, a bottom plate is fixedly arranged at the bottom end of the cooling layer;
through above-mentioned technical scheme, bottom plate and cooling layer and roof fixed connection.
Furthermore, a plurality of limiting nuts are fixedly arranged at the top end of the bottom plate;
through above-mentioned technical scheme, stop nut prevents bottom plate and roof dislocation skew.
Furthermore, first bolts are fixedly arranged at the top ends of the limit nuts, and the bottom plate penetrates through the cooling layer and the top plate through the limit nuts and is fixedly connected with the cooling layer and the top plate through the first bolts;
through above-mentioned technical scheme, the bottom plate passes through first bolt and cooling layer and roof fixed connection.
Furthermore, a connector is fixedly arranged on one side of the top end of the bottom plate;
through above-mentioned technical scheme, the connector corresponds with the casing.
The utility model discloses following beneficial effect has:
1. the utility model provides a pair of printed circuit board that heat dispersion is good, the inside electric motor of heat radiation structure can drive the heat dissipation fan and dispel the heat, and a plurality of radiating fin on rethread heat dissipation channel top dispel the heat to the circuit board, play good radiating effect.
2. The utility model provides a printed circuit board that heat dispersion is good, the fin of roof top one side also can dispel the heat when heat radiation structure carries out the heat dissipation, and diversified dispels the heat and has prevented the damage of circuit board, has still prolonged the life of circuit board simultaneously.
3. The utility model provides a printed circuit board that heat dispersion is good, backup pad run through four screws and pass through fixing bolt and connect on the support column, with the backup pad can be fine fixed and support the heat radiation structure operation, for the heat radiation structure operation has laid good basis, the stability that has improved heat radiation structure still is convenient for install simultaneously, raises the efficiency.
Drawings
Fig. 1 is an isometric view of a printed circuit board with good heat dissipation performance according to the present invention;
fig. 2 is a bottom plate structure view of the printed circuit board with good heat dissipation performance provided by the present invention;
FIG. 3 is an enlarged view taken at A in FIG. 1;
fig. 4 is the utility model provides a supporting structure chart of printed circuit board that heat dispersion is good
Fig. 5 is the utility model provides a printed circuit board's heat dissipation structure chart that heat dispersion is good.
Illustration of the drawings:
1. a top plate; 2. a cooling layer; 3. a base plate; 4. a conductive block; 5. a heat sink; 6. a housing; 7. a first bolt; 8. a processor; 9. a heat dissipation fan; 10. a support pillar; 11. a limit nut; 12. a connector; 13. a heat dissipation structure; 14. a support plate; 15. a heat dissipating fin; 16. a heat dissipation channel; 17. fixing the bolt; 18. a screw; 19. an electric motor.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides an embodiment: a printed circuit board with good heat dissipation performance comprises a top plate 1, wherein four supporting columns 10 are fixedly arranged on one side of the top end of the top plate 1, screws 18 are fixedly arranged at the top ends of the four supporting columns 10, fixing bolts 17 are arranged at the top ends of the four screws 18, supporting plates 14 are fixedly arranged at the top ends of the four screws 18, the supporting plates 14 penetrate through the four screws 18 and are connected to the supporting columns 10 through the fixing bolts 17, heat dissipation channels 16 are fixedly arranged at the bottom ends of the supporting plates 14, and a plurality of heat dissipation fins 15 are fixedly arranged at the top ends of the heat dissipation channels 16; the fixed heat radiation structure 13 that is provided with in backup pad 14 top, the fixed electric motor 19 that is provided with in heat radiation structure 13 inside, the fixed heat dissipation fan 9 that is provided with in 19 tops of electric motor, the fixed casing 6 that is provided with in top one side of roof 1, the fixed a plurality of treater 8 that are equipped with in heat radiation structure 13 one side.
One side that 1 top of roof is close to casing 6 is fixed and is provided with fin 5, fin 5 can dispel the heat to the inside connector 12 of casing 6, fin 5 one side is fixed and is provided with two conducting blocks 4, conducting block 4 plays the electrically conductive effect, 1 bottom mounting of roof is provided with cooling layer 2, cooling layer 2 is further gone on and is cooled down the circuit board, 2 bottom mounting of cooling layer is provided with bottom plate 3, bottom plate 3 and cooling layer 2 and 1 fixed connection of roof, 3 fixed tops of bottom plate are provided with a plurality of stop nuts 11, stop nut 11 prevents bottom plate 3 and 1 dislocation skew of roof, 11 tops of a plurality of stop nuts all fix and are provided with first bolt 7, bottom plate 3 runs through with cooling layer 2 and roof 1 through a plurality of stop nuts 11, by first bolt 7 fixed connection, bottom plate 3 is through first bolt 7 and 2 and roof 1 fixed connection of cooling layer, 3 top one side of bottom plate is fixed and is provided with connector 12, connector 12 is corresponding with casing 6.
The working principle is as follows: bottom plate 3 runs through with cooling layer 2 and roof 1 through a plurality of stop nut 11, by first bolt 7 fixed connection, this moment, connector 12 and casing 6 fixed connection, backup pad 14 runs through four screws 18 and connects on support column 10 through fixing bolt 17, with the fixed and support heat radiation structure 13 operation that backup pad 14 can be fine, this moment, the inside electric motor 19 of heat radiation structure 13 can drive heat dissipation fan 9 and dispel the heat, good radiating effect plays, the life of improvement circuit board.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (8)
1. The utility model provides a printed circuit board that heat dispersion is good, includes roof (1), its characterized in that: four supporting columns (10) are fixedly arranged on one side of the top end of the top plate (1), screws (18) are fixedly arranged at the top ends of the four supporting columns (10), fixing bolts (17) are arranged at the top ends of the four screws (18), a supporting plate (14) is fixedly arranged at the top ends of the four screws (18), the supporting plate (14) penetrates through the four screws (18) and is connected to the supporting columns (10) through the fixing bolts (17), a heat dissipation channel (16) is fixedly arranged at the bottom end of the supporting plate (14), and a plurality of heat dissipation fins (15) are fixedly arranged at the top end of the heat dissipation channel (16);
the fixed heat radiation structure (13) that is provided with in backup pad (14) top, heat radiation structure (13) inside is fixed and is provided with electric motor (19), electric motor (19) top is fixed and is provided with heat dissipation fan (9), roof (1) top one side is fixed and is provided with casing (6), heat radiation structure (13) one side is fixed and is equipped with a plurality of treater (8).
2. The printed circuit board with good heat dissipation performance according to claim 1, wherein: and a cooling fin (5) is fixedly arranged on one side of the top end of the top plate (1) close to the shell (6).
3. The printed circuit board with good heat dissipation performance according to claim 2, wherein: and two conductive blocks (4) are fixedly arranged on one side of the radiating fin (5).
4. The printed circuit board with good heat dissipation performance according to claim 1, wherein: and a cooling layer (2) is fixedly arranged at the bottom end of the top plate (1).
5. The printed circuit board with good heat dissipation performance according to claim 4, wherein: and a bottom plate (3) is fixedly arranged at the bottom end of the cooling layer (2).
6. The printed circuit board with good heat dissipation performance according to claim 5, wherein: the top end of the bottom plate (3) is fixedly provided with a plurality of limiting nuts (11).
7. The printed circuit board with good heat dissipation performance according to claim 6, wherein: a plurality of the top ends of the limit nuts (11) are fixedly provided with first bolts (7), and the bottom plate (3) penetrates through the cooling layer (2) and the top plate (1) through the limit nuts (11) and is fixedly connected with the first bolts (7).
8. The printed circuit board with good heat dissipation performance according to claim 5, wherein: and a connector (12) is fixedly arranged on one side of the top end of the bottom plate (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222509409.9U CN218679476U (en) | 2022-09-21 | 2022-09-21 | Printed circuit board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222509409.9U CN218679476U (en) | 2022-09-21 | 2022-09-21 | Printed circuit board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218679476U true CN218679476U (en) | 2023-03-21 |
Family
ID=85559687
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222509409.9U Active CN218679476U (en) | 2022-09-21 | 2022-09-21 | Printed circuit board with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218679476U (en) |
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2022
- 2022-09-21 CN CN202222509409.9U patent/CN218679476U/en active Active
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