CN219802661U - Printed wiring board with bonding pad protection structure - Google Patents
Printed wiring board with bonding pad protection structure Download PDFInfo
- Publication number
- CN219802661U CN219802661U CN202321086343.5U CN202321086343U CN219802661U CN 219802661 U CN219802661 U CN 219802661U CN 202321086343 U CN202321086343 U CN 202321086343U CN 219802661 U CN219802661 U CN 219802661U
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- CN
- China
- Prior art keywords
- fixedly connected
- printed wiring
- magnet
- wiring board
- elastic sheet
- Prior art date
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Links
- 230000001681 protective effect Effects 0.000 claims abstract description 23
- 238000001816 cooling Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000005389 magnetism Effects 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000428 dust Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 4
- 239000006096 absorbing agent Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a printed wiring board with a bonding pad protection structure, and relates to the technical field of printed wiring boards. The printed circuit board with the bonding pad protection structure comprises a printed circuit board main body, wherein a fixing disc is fixedly connected to the inside of the printed circuit board main body, and a first elastic sheet is fixedly connected to the inner side wall of the fixing disc. According to the utility model, the protective shell is arranged to cover and protect the pad range on the back of the printed circuit board main body, so that external dust and water vapor are difficult to adhere to the surface of the pad, the protection performance is enhanced, the protective shell and the printed circuit board main body can be quickly disassembled and assembled by arranging the first elastic sheet, the second elastic sheet, the limiting rod and the like, the practicability is enhanced, the heat generated in the protective shell can be quickly dissipated by arranging the heat dissipating device, and the heat can be quickly exchanged with external cold air by the heat dissipating plate and the cooling plate, so that the efficiency is enhanced.
Description
Technical Field
The utility model relates to the technical field of printed circuit boards, in particular to a printed circuit board with a bonding pad protection structure.
Background
The printed circuit board adopts a lamination method to plate, and a common multi-layer board is used as a core board to laminate, and the connection function between the inner parts of all layers of circuits is realized by using the processes of drilling and in-hole metallization. Compared with a common multilayer board with through holes only, the HDI is provided with blind holes and buried holes accurately to reduce the number of the through holes, save the wiring area of the PCB and greatly improve components.
Patent No. CNl 14641138A discloses a circuit board preparation method and a circuit board thereof, and relates to the field of circuit board processing. The method comprises the following steps: separating the carrier and cutting; electroplating the upper surface and the lower surface of the separation carrier respectively to form copper plating layers on the surfaces of the first metal carrier and the second metal carrier; respectively laminating a prepreg and a copper foil on the upper surface and the lower surface of the separation carrier, and laminating to obtain a multilayer initial integrated circuit board; performing first processing treatment on the multilayer initial integrated circuit board to obtain a target integrated circuit board; performing board separation treatment on the target integrated circuit board along the first metal carrier and the second metal carrier to obtain a first initial circuit board and a second initial circuit board; respectively carrying out second processing treatment on the first initial circuit board and the second initial circuit board to obtain a first target circuit board and a second target circuit board;
and patent number CN217608212U, a shielded circuit board is disclosed, comprising: a circuit board main body provided with a bonding pad structure; the base is suitable for being welded and connected with the circuit board main body; the suction positions are respectively formed on a pair of diagonal parts of the end face of the base, which is away from the main body of the circuit board; the shielding cover is suitable for being covered on the end face of the base, which is away from the circuit board main body;
the printed circuit boards in the two patents and the printed circuit boards in the prior art are not provided with the printed circuit board bonding pad protection structure, when working in the air with high humidity, the temperature of the printed circuit board is higher than the normal temperature, so that the bonding pad can be easily short-circuited because of water vapor gathering water drops, and the damage to components is easily caused.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides the printed wiring board with the pad protection structure, and solves the problem that the range of the pad of the printed wiring board is not provided with the protection structure.
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the utility model provides a printed wiring board with pad protection architecture, includes the printed wiring board main part, the inside fixedly connected with fixed disk of printed wiring board main part, fixedly connected with first elastic sheet on the inside lateral wall of fixed disk, fixedly connected with second elastic sheet on the inside lateral wall of fixed disk, the surface of second elastic sheet is supported and is connected with the gag lever post, the first magnet of top fixedly connected with of gag lever post, the laminating of the top of first magnet has the second magnet, the top fixedly connected with of second magnet is at the inner wall of fixed disk, the bottom fixedly connected with shell of gag lever post, shell's inside fixedly mounted has heat abstractor.
Preferably, the heat dissipating device comprises a heat absorbing plate fixedly connected to the inner wall of the protective shell, the bottom of the heat absorbing plate is fixedly connected with a heat conducting plate at equal intervals, the bottom of the heat conducting plate is fixedly connected with a heat dissipating plate, and the bottom of the heat dissipating plate is fixedly connected with a cooling plate at equal intervals.
Preferably, the fixing disc is annular, and the surface of the first elastic sheet is arc-shaped.
Preferably, the limiting rod is arc-shaped, the magnetism of the first magnet is opposite to that of the second magnet, and the surface of the first magnet is tightly adsorbed on the surface of the second magnet.
Preferably, the protective shell is square, and the first elastic piece and the second elastic piece are metal copper plates.
Preferably, the upper surface laminating of heating panel is in the bottom of protective housing, the quantity of heat conduction board is two, and two the surface of heat conduction board is all fixed connection in protective housing's inside, heat absorption board, heat conduction board and heating panel are the copper, the cooling plate is aluminum plate.
Advantageous effects
The utility model provides a printed wiring board with a pad protection structure. Compared with the prior art, the method has the following beneficial effects:
1. this printed wiring board with pad protection architecture through installing protective housing, can cover the protection to printed wiring board main part back pad scope, makes external dust and steam be difficult to adhere to on the pad surface, has strengthened the protectiveness, through setting up first elastic sheet, second elastic sheet and gag lever post etc. can be fast to dismouting between protective housing and the printed wiring board main part, has strengthened the practicality.
2. This printed wiring board with pad protection architecture through installation heat abstractor, can dispel the heat fast to the inside temperature that produces of protective housing, makes heat can be fast with external cold air exchange through heating panel and cooling plate, has strengthened the high efficiency.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is an enlarged view of FIG. 1 at A;
fig. 3 is a schematic structural diagram of a heat dissipating device according to the present utility model.
In the figure: 1. a printed wiring board main body; 2. a fixed plate; 3. a first elastic sheet; 4. a second elastic sheet; 6. a limit rod; 7. a first magnet; 8. a second magnet; 9. a protective housing; 10. a heat sink; 101. a heat absorbing plate; 102. a heat conductive plate; 103. a heat dissipation plate; 104. and (5) cooling the plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a printed wiring board with pad protection architecture, including printed wiring board main part 1, the inside fixedly connected with fixed disk 2 of printed wiring board main part 1, fixed disk 2 is annular, fixedly connected with first elastic piece 3 on the inside lateral wall of fixed disk 2, the surface of first elastic piece 3 is the arc, fixedly connected with second elastic piece 4 on the inside lateral wall of fixed disk 2, first elastic piece 3 and second elastic piece 4 are the metal copper, the surface of second elastic piece 4 supports and is connected with gag lever post 6, the top fixedly connected with first magnet 7 of gag lever post 6, the top laminating of first magnet 7 has second magnet 8, gag lever post 6 is the arc, the magnetism of first magnet 7 is opposite with the magnetism of second magnet 8, and the surface of first magnet 7 is closely adsorbed on the surface of second magnet 8, the top fixedly connected with at the inner wall of fixed disk 2 of second magnet 8, can fix gag lever post 6 fast through setting up first elastic piece 3, second elastic piece 4, first magnet 7 and second magnet 8;
the bottom of the limiting rod 6 is fixedly connected with a protective shell 9, the protective shell 9 is square, and the protective shell 9 is arranged to cover and protect the range of the bonding pad on the back of the printed circuit board main body 1, so that external dust and water vapor are difficult to adhere to the surface of the bonding pad, and the protection performance is enhanced;
the inside fixed mounting of protecting sheathing 9 has heat abstractor 10, heat abstractor 10 includes the absorber plate 101 of fixed connection at protecting sheathing 9 inner wall, the bottom equidistance fixedly connected with heat-conducting plate 102 of absorber plate 101, the quantity of heat-conducting plate 102 is two, and the equal fixed connection of the surface of two heat-conducting plates 102 is in the inside of protecting sheathing 9, absorber plate 101, heat-conducting plate 102 and heating panel 103 are the copper, the bottom fixedly connected with heating panel 103 of heat-conducting plate 102, the laminating of heating panel 103 is in the bottom of protecting sheathing 9, the equidistant fixedly connected with cooling plate 104 in bottom of heating panel 103, cooling plate 104 is aluminum plate, through installation heat abstractor 10, can carry out quick heat dissipation to the inside temperature that produces of protecting sheathing 9, make heat can exchange with external cold air fast through heating panel 103 and cooling plate 104, the high efficiency has been strengthened.
When the back bonding pad scope of the printed circuit board main body 1 needs to be protected, the protective shell 9 is placed on the back of the printed circuit board main body 1, the surface of the limiting rod 6 is connected to the surfaces of the first elastic sheet 3 and the second elastic sheet 4, the limiting rod 6 slides on the surfaces of the first elastic sheet 3 and the second elastic sheet 4 through pushing the bottom of the protective shell 9, when the surface of the first magnet 7 is tightly attached and adsorbed to the surface of the second magnet 8, the protective shell 9 is fixed, at the moment, the back bonding pad scope of the printed circuit board main body 1 can be covered and protected, external dust and water vapor are difficult to adhere to the bonding pad surface, the protection performance is enhanced, the first elastic sheet 3, the second elastic sheet 4, the limiting rod 6 and the like are arranged, the protective shell 9 and the printed circuit board main body 1 can be quickly disassembled and assembled, the practicability is enhanced, the temperature generated inside the protective shell 9 can be quickly cooled through installing the heat dissipation device 10, the heat dissipation plate 103 and the cooling plate 104 can be quickly exchanged with external cold air, and the high efficiency is enhanced.
And all that is not described in detail in this specification is well known to those skilled in the art.
Claims (6)
1. A printed wiring board with a pad protection structure, comprising a printed wiring board main body (1), characterized in that: the inside fixedly connected with fixed disk (2) of printed wiring board main part (1), fixedly connected with first elastic sheet (3) on the inside lateral wall of fixed disk (2), fixedly connected with second elastic sheet (4) on the inside lateral wall of fixed disk (2), the surface of second elastic sheet (4) is supported and is connected with gag lever post (6), the top fixedly connected with first magnet (7) of gag lever post (6), the laminating of the top of first magnet (7) has second magnet (8), the top fixedly connected with of second magnet (8) is at the inner wall of fixed disk (2), the bottom fixedly connected with protecting sheathing (9) of gag lever post (6), the inside fixedly mounted of protecting sheathing (9) has heat abstractor (10).
2. A printed wiring board with a pad protection structure according to claim 1, wherein: the heat dissipation device (10) comprises a heat absorption plate (101) fixedly connected to the inner wall of the protective shell (9), a heat conduction plate (102) is fixedly connected to the bottom of the heat absorption plate (101) at equal intervals, a heat dissipation plate (103) is fixedly connected to the bottom of the heat conduction plate (102), and a cooling plate (104) is fixedly connected to the bottom of the heat dissipation plate (103) at equal intervals.
3. A printed wiring board with a pad protection structure according to claim 1, wherein: the fixing disc (2) is annular, and the surface of the first elastic sheet (3) is arc-shaped.
4. A printed wiring board with a pad protection structure according to claim 1, wherein: the limiting rod (6) is arc-shaped, the magnetism of the first magnet (7) is opposite to that of the second magnet (8), and the surface of the first magnet (7) is tightly adsorbed on the surface of the second magnet (8).
5. A printed wiring board with a pad protection structure according to claim 1, wherein: the protective shell (9) is square, and the first elastic sheet (3) and the second elastic sheet (4) are metal copper plates.
6. A printed wiring board with a pad protection structure according to claim 2, wherein: the upper surface laminating of heating panel (103) is in the bottom of protective housing (9), the quantity of heat conduction board (102) is two, and two the equal fixed connection of surface of heat conduction board (102) is in the inside of protective housing (9), heat absorption board (101), heat conduction board (102) and heating panel (103) are the copper, cooling plate (104) are aluminum plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321086343.5U CN219802661U (en) | 2023-05-08 | 2023-05-08 | Printed wiring board with bonding pad protection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321086343.5U CN219802661U (en) | 2023-05-08 | 2023-05-08 | Printed wiring board with bonding pad protection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219802661U true CN219802661U (en) | 2023-10-03 |
Family
ID=88156213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321086343.5U Active CN219802661U (en) | 2023-05-08 | 2023-05-08 | Printed wiring board with bonding pad protection structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219802661U (en) |
-
2023
- 2023-05-08 CN CN202321086343.5U patent/CN219802661U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |