CN221150010U - Integrated circuit board of anti signal interference - Google Patents
Integrated circuit board of anti signal interference Download PDFInfo
- Publication number
- CN221150010U CN221150010U CN202322963842.4U CN202322963842U CN221150010U CN 221150010 U CN221150010 U CN 221150010U CN 202322963842 U CN202322963842 U CN 202322963842U CN 221150010 U CN221150010 U CN 221150010U
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- CN
- China
- Prior art keywords
- fixedly connected
- integrated circuit
- circuit board
- base plate
- signal interference
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- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000004065 semiconductor Substances 0.000 claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims abstract description 12
- 238000001816 cooling Methods 0.000 claims abstract description 6
- 230000007246 mechanism Effects 0.000 claims abstract description 5
- 238000005057 refrigeration Methods 0.000 claims description 5
- 239000003990 capacitor Substances 0.000 abstract description 5
- 230000009471 action Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 210000000438 stratum basale Anatomy 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the field of integrated circuit boards and discloses an integrated circuit board resistant to signal interference, which comprises a substrate, wherein a shielding cover is arranged in the middle of the top of the substrate, a semiconductor refrigerating sheet is fixedly connected to the top of the shielding cover, clamping seats are fixedly connected to the lower parts of the front side and the rear side of the shielding cover, clamping pins penetrate through the tops of the clamping seats, a shell is fixedly connected between the tops of the clamping pins, holes which are uniformly distributed penetrate through the tops of the shell, a heat dissipation mechanism is arranged in the shell, a control chip is fixedly connected to the middle of the top of the substrate, and a capacitor is arranged on the right side of the control chip. According to the integrated circuit board with the signal interference resistance, provided by the utility model, through the mutual matching among the shielding cover, the semiconductor refrigerating sheet, the cooling fan and the shell, heat generated by the integrated circuit board is efficiently transferred and discharged to an external space, and the heat dissipation performance is improved.
Description
Technical Field
The utility model relates to the technical field of integrated circuit boards, in particular to an integrated circuit board resistant to signal interference.
Background
The integrated circuit board is a carrier for carrying an integrated circuit, but the integrated circuit board is often called an integrated circuit board, and is mainly composed of silica gel, so that the integrated circuit board is generally green, and can be classified into television sets, audio sets, video discs, video recorders, computers (microcomputers), electronic musical instruments, communication sets, cameras, remote controls, languages, alarms and various special purposes according to the application.
Through retrieval, the prior Chinese patent publication number is: CN211743147U provides an anti-interference integrated circuit, and this patent is through the cooperation of circuit board body, pad, electronic components, shield cover, stratum basale, conducting layer and inoxidizing coating use, can effectually solve current outage integrated circuit board and have the relatively poor problem of shield cover stability.
Although the above patent may prevent signals from interfering with the integrated circuit board, the anti-interference integrated circuit also has the following problems: the device shield cover and the integrated circuit board have larger gaps, heat generated by the integrated circuit can not be timely led out to the outside, the shield cover only depends on natural heat dissipation, the heat dissipation performance is poor, the working stability of the integrated circuit board is easily influenced, the device shield cover is fixed only by virtue of the buckle, the substrate can not be well attached, and the shielding effect is poor.
To solve the above problems, an integrated circuit board resistant to signal interference is proposed.
Disclosure of utility model
The utility model aims to provide an integrated circuit board resistant to signal interference, which solves the problems of poor heat dissipation and poor shielding effect of a shielding cover in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an integrated circuit board of anti-signal interference, includes the base plate, base plate top middle part is provided with the shield cover, shield cover top fixedly connected with semiconductor refrigeration piece, both sides lower part equal fixedly connected with cassette around the shield cover, run through and be provided with the bayonet lock between the cassette top, fixedly connected with shell between the bayonet lock top, the shell top runs through and is provided with evenly distributed's trompil, the inside cooling machanism that is provided with of shell, base plate top middle part fixedly connected with control chip, the control chip right side is provided with the electric capacity, and electric capacity and base plate fixed connection, the electric capacity rear side is provided with the inductance, and inductance and base plate fixed connection, the shield cover four corners is provided with fixed subassembly.
Through adopting above-mentioned technical scheme, absorb and derive heat through the semiconductor refrigeration piece, through the heat that the shield cover shielding interference, transfer integrated circuit board produced.
As a further description of the above technical solution: the heat dissipation mechanism comprises a fan support, fixing pins penetrate through the left side and the right side of the fan support and are fixedly connected with the left side and the right side of the fan support, and two heat dissipation fans are fixedly connected to the top of the fan support.
By adopting the technical scheme, the heat conducted out of the semiconductor refrigerating sheet is discharged to the outside through the heat radiating mechanism.
As a further description of the above technical solution: the fixing assembly comprises a bolt, the lower end of the bolt penetrates through and is in threaded connection with a nut pair, a spring is arranged on the upper side of the nut pair, and the bolt penetrates through the spring.
Through adopting above-mentioned technical scheme, closely laminate shield cover and base plate through fixed subassembly.
As a further description of the above technical solution: the first interface is penetrated and fixedly connected at the left edge of the top of the substrate, and the second interface is penetrated and fixedly connected at the right edge of the top of the substrate.
By adopting the technical scheme, the required electric elements are installed through the substrate, and the circuit is connected through the first interface and the second interface.
As a further description of the above technical solution: the fixing pin penetrates through and is fixedly connected with the shell, and the fan support penetrates through the shell.
Through adopting above-mentioned technical scheme, fix the fan support on the shell through the fixed pin, fix the fan through the fan support.
As a further description of the above technical solution: the bolt penetrates through the shielding cover and the base plate, and the spring is located at the matching position of the bolt and the shielding cover.
Through adopting above-mentioned technical scheme, through bolt fastening shield cover and base plate, through the fixed reinforcement of spring.
As a further description of the above technical solution: the rear side of the control chip is provided with evenly distributed resistors which are fixedly connected with the substrate.
By adopting the technical scheme, the electric element is controlled by the control chip.
As a further description of the above technical solution: the back side of the inductor is provided with an integrated circuit which is fixedly connected with the substrate.
By adopting the technical scheme, the signal is transmitted through the dust collecting circuit.
Compared with the prior art, the utility model has the following beneficial effects:
1. According to the integrated circuit board with the signal interference resistance, provided by the utility model, through the mutual matching among the shielding cover, the semiconductor refrigerating sheet, the cooling fan and the shell, heat generated by the integrated circuit board is efficiently transferred and discharged to an external space, so that the integrated circuit board always works at a stable temperature, and the heat dissipation performance is improved.
2. According to the integrated circuit board resistant to signal interference, the shielding cover can be tightly attached to the substrate through the mutual matching among the bolts, the shielding cover, the springs, the substrate and the nut pairs, and the shielding effect is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a cross-sectional view of the housing of the present utility model;
FIG. 3 is an exploded view of the shield of the present utility model;
fig. 4 is a schematic diagram of a control chip according to the present utility model.
In the figure, 1, a fixing pin; 2. a first interface; 3. a bolt; 4. opening holes; 5. a heat radiation fan; 6. a housing; 7. a clamping seat; 8. a bayonet lock; 9. a fan bracket; 10. a resistor; 11. a substrate; 12. a control chip; 13. an integrated circuit; 14. a second interface; 15. an inductance; 16. a capacitor; 17. a spring; 18. a nut pair; 19. a semiconductor refrigeration sheet; 20. and a shielding case.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
For a further understanding of the present utility model, the present utility model will be described in detail with reference to the drawings.
Referring to fig. 1, an integrated circuit board for resisting signal interference according to the present utility model includes a substrate 11, a control chip 12 is fixedly connected to a middle portion of a top of the substrate 11, a capacitor 16 is disposed on a right side of the control chip 12, the capacitor 16 is fixedly connected to the substrate 11, an inductor 15 is disposed on a rear side of the capacitor 16, the inductor 15 is fixedly connected to the substrate 11, a first interface 2 is penetrated and fixedly connected to a left edge of the top of the substrate 11, a second interface 14 is penetrated and fixedly connected to a right edge of the top of the substrate 11, uniformly distributed resistors 10 are disposed on a rear side of the control chip 12, the resistors 10 are fixedly connected to the substrate 11, an integrated circuit 13 is disposed on a rear side of the inductor 15, and the integrated circuit 13 is fixedly connected to the substrate 11.
The substrate 11 plays an important role in mechanical support, electrical connection, signal transmission and distribution, thermal management, assembly and maintenance. It is a supporting and connecting platform for electronic components in electronic devices, the control chip 12 has functions of controlling and managing other devices or systems, data processing, communication and interfaces, timing and clock management, power management, etc., the inductor 15 plays roles of storing energy, suppressing current variation, filtering and mutual inductance in the circuit,
Referring to fig. 2, a shielding case 20 is arranged in the middle of the top of a substrate 11, a semiconductor refrigerating sheet 19 is fixedly connected to the top of the shielding case 20, clamping seats 7 are fixedly connected to the lower portions of the front side and the rear side of the shielding case 20, clamping pins 8 penetrate through the tops of the clamping seats 7 and are arranged, a shell 6 is fixedly connected between the tops of the clamping pins 8, holes 4 which are uniformly distributed are formed in the penetrating mode of the top of the shell 6, a heat dissipation mechanism is arranged in the shell 6 and comprises a fan bracket 9, fixing pins 1 are fixedly connected to the left side and the right side of the fan bracket 9 in penetrating mode, two heat dissipation fans 5 are fixedly connected to the top of the fan bracket 9, the fixing pins 1 penetrate through the shell 6 and are fixedly connected with the shell 6, and the fan bracket 9 penetrates through the shell 6.
The semiconductor refrigerating sheet 19 absorbs heat by utilizing one side of the refrigerating sheet, transfers heat from the inside of the shielding cover to the refrigerating sheet, radiates heat from the refrigerating sheet to the external environment by utilizing the other side of the refrigerating sheet, and then discharges the heat to the external space by the heat radiation fan 5 in an accelerating way, thereby greatly improving the heat radiation efficiency.
Referring to fig. 3, fixing components are disposed at four corners of the shielding case 20, the fixing components include bolts 3, lower ends of the bolts 3 penetrate through and are in threaded connection with nut pairs 18, springs 17 are disposed on upper sides of the nut pairs 18, the bolts 3 penetrate through the springs 17, the bolts 3 penetrate through the shielding case 20 and the base plate 11, and the springs 17 are located at matching positions of the bolts 3 and the shielding case 20.
The spring 17 can provide a certain elasticity and pre-tightening force, thereby enhancing the stability and reliability of the connection, and simultaneously reducing the influence of external impact and vibration.
The working principle is that when the integrated circuit board starts to work, firstly, the semiconductor refrigerating piece 19 is started, heat generated by the integrated circuit board is transferred to the semiconductor refrigerating piece 19 through the shielding cover 20, under the action of the semiconductor refrigerating piece 19, the heat on the shielding cover 20 is absorbed and discharged through the semiconductor refrigerating piece 19, then the cooling fan 5 is started, under the action of the cooling fan 5, the heat absorbed and discharged by the semiconductor refrigerating piece 19 is taken away by air and discharged to the outside, so that the integrated circuit board always works at a proper and stable temperature, and the shielding cover 20 can be tightly attached to the substrate 11 through the mutual cooperation among the bolts 3, the springs 17 and the nut pairs 18.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. An integrated circuit board resistant to signal interference, comprising a substrate (11), characterized in that: the utility model discloses a semiconductor refrigeration device, including base plate (11), control chip (12), base plate (11), base plate (20), base plate (8), shell (6) are fixed to each other between base plate (11) top middle part is provided with shield cover (20), shield cover (20) top fixedly connected with semiconductor refrigeration piece (19), both sides lower part all fixedly connected with cassette (7) around shield cover (20), run through and be provided with bayonet lock (8) between cassette (7) top, fixedly connected with shell (6) between bayonet lock (8) top, shell (6) top runs through and is provided with evenly distributed's trompil (4), shell (6) inside is provided with cooling machanism, base plate (11) top middle part fixedly connected with control chip (12), control chip (12) right side is provided with electric capacity (16), and electric capacity (16) and base plate (11) fixedly connected with, electric capacity (16) rear side is provided with inductance (15), and electric capacity (15) and base plate (11) fixedly connected with, shield cover (20) four corners are provided with fixed subassembly.
2. The signal interference resistant integrated circuit board of claim 1, wherein: the heat dissipation mechanism comprises a fan support (9), fixing pins (1) are penetrated and fixedly connected at the left side and the right side of the fan support (9), and two heat dissipation fans (5) are fixedly connected at the top of the fan support (9).
3. The signal interference resistant integrated circuit board of claim 1, wherein: the fixing assembly comprises a bolt (3), a nut pair (18) penetrates through the lower end of the bolt (3) and is connected with the bolt in a threaded mode, a spring (17) is arranged on the upper side of the nut pair (18), and the bolt (3) penetrates through the spring (17).
4. The signal interference resistant integrated circuit board of claim 1, wherein: the first interface (2) penetrates through and is fixedly connected with the left edge of the top of the base plate (11), and the second interface (14) penetrates through and is fixedly connected with the right edge of the top of the base plate (11).
5. The signal interference resistant integrated circuit board of claim 2, wherein: the fixing pin (1) penetrates through and is fixedly connected with the shell (6), and the fan bracket (9) penetrates through the shell (6).
6. A signal interference resistant integrated circuit board according to claim 3, wherein: the bolt (3) penetrates through the shielding cover (20) and the base plate (11), and the spring (17) is located at the matching position of the bolt (3) and the shielding cover (20).
7. The signal interference resistant integrated circuit board of claim 1, wherein: the rear side of the control chip (12) is provided with evenly distributed resistors (10), and the resistors (10) are fixedly connected with the substrate (11).
8. The signal interference resistant integrated circuit board of claim 1, wherein: an integrated circuit (13) is arranged on the rear side of the inductor (15), and the integrated circuit (13) is fixedly connected with the substrate (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322963842.4U CN221150010U (en) | 2023-11-02 | 2023-11-02 | Integrated circuit board of anti signal interference |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322963842.4U CN221150010U (en) | 2023-11-02 | 2023-11-02 | Integrated circuit board of anti signal interference |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221150010U true CN221150010U (en) | 2024-06-14 |
Family
ID=91425746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322963842.4U Active CN221150010U (en) | 2023-11-02 | 2023-11-02 | Integrated circuit board of anti signal interference |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221150010U (en) |
-
2023
- 2023-11-02 CN CN202322963842.4U patent/CN221150010U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |