CN215268870U - Computer VNX module - Google Patents

Abstract

The disclosure relates to the technical field of VNX module heat dissipation, in particular to a computer VNX module, which comprises a circuit board, a heat dissipation plate and a cover plate, wherein a plurality of heating electronic components are arranged on the circuit board, the inner wall of the heat dissipation plate is provided with a plurality of bosses, the bosses correspond to the heating electronic components one to one, and the bosses are in indirect contact with the heating electronic components through heat-conducting insulating pads and are used for conducting out heat of the heating electronic components so as to realize heat dissipation; the cover plate and the heat dissipation plate form an accommodating space for accommodating the circuit board, and the cover plate and the circuit board are fixedly connected with the heat dissipation plate, namely the circuit board is fixed inside the heat dissipation plate and the cover plate by the heat dissipation plate and the cover plate. In the use, on heat accessible bellying transmission to the heating panel in the electronic components that generate heat, the transmission stroke is short can dispel the heat fast, improves the radiating effect. Meanwhile, when the computer VNX module is assembled, the heat dissipation plate, the circuit board and the cover plate are directly fixed, and the computer VNX module has the advantages of simple structure and convenience in assembly.

Description

Computer VNX module

Technical Field

The present disclosure relates to the technical field of VNX module heat dissipation, and in particular, to a computer VNX module.

Background

High temperatures have a severe impact on most electronic components, which can lead to failure of the electronic components, thereby causing failure of the entire device. The heat dissipation treatment is to control the temperature of all heat-generating electronic components inside the electronic equipment so that the temperature does not exceed a specified maximum allowable temperature under the working environment condition of the equipment. The heat dissipation method in the equipment is to provide a low-thermal-resistance optimal path heat conduction channel between a heat source and a heat sink to ensure that heat is smoothly transferred out, and the heat conduction by utilizing metal is the most basic heat transfer method, so that the heat path is easy to control.

Along with the development of electronic technology, electronic components and equipment are increasingly miniaturized, the heat flux density of an integrated circuit is greatly increased due to the use of high-power heating electronic components, the VNX original model traditional structure is that a heat dissipation structure is put into a square-shaped structure for heat dissipation, but the heat dissipation effect cannot meet the heat dissipation requirement of the electronic components.

SUMMERY OF THE UTILITY MODEL

To address the above technical problem or at least partially address the above technical problem, the present disclosure provides a computer VNX module.

The present disclosure provides a computer VNX module comprising:

the circuit board is provided with a plurality of heating electronic components;

the inner wall of the heat dissipation plate is provided with a plurality of protruding parts, the protruding parts and the electronic components which generate heat are arranged in a one-to-one correspondence mode, the protruding parts are in indirect contact with the electronic components which generate heat through heat conduction insulating pads, and the heat conduction insulating pads and the protruding parts are used for conducting out heat of the electronic components which generate heat;

the cover plate and the heat dissipation plate form an accommodating space for accommodating the circuit board, and the cover plate and the circuit board are fixedly connected with the heat dissipation plate.

Optionally, the heights of the electronic component and the protruding portion which generate heat in each group are the same.

Optionally, the cover plate is provided with a first hole, the circuit board is provided with a second hole, and the heat dissipation plate is provided with a threaded hole;

the cover plate and the circuit board are connected to the heat dissipation plate through fasteners penetrating through the first hole, the second hole and the threaded holes.

Optionally, the fastener includes a screw, the screw passes through the first hole and the second hole in sequence, and the tail of the screw is in threaded connection with the threaded hole.

Optionally, the first holes are located at four corners of the cover plate, the second holes are located at four corners of the circuit board, and the threaded holes are located at four corners of the heat dissipation plate.

Optionally, a connecting column is arranged on the heat dissipation plate, and the threaded hole is formed in the connecting column.

Optionally, the height of the connecting column is higher than that of the electronic component.

Optionally, the heat dissipation plate includes a plate body, a top plate and two side plates, the top plate is located at the top of the plate body, and the two side plates are located at two sides of the plate body;

the connecting columns are located at four corners of the plate body.

Optionally, two of the side plates and the top plate are provided with limiting bosses for limiting the circuit board.

Compared with the prior art, the technical scheme provided by the embodiment of the disclosure has the following advantages:

the computer VNX module provided by the embodiment of the disclosure comprises a circuit board, a heat dissipation plate and a cover plate, wherein the circuit board is provided with a plurality of heating electronic components, the inner wall of the heat dissipation plate is provided with a plurality of bosses, the bosses and the heating electronic components are arranged in a one-to-one correspondence manner, the bosses and the heating electronic components are indirectly contacted through a heat conduction insulating pad, and the heat conduction insulating pad and the bosses are used for conducting out heat of the heating electronic components so as to realize heat dissipation; the cover plate and the heat dissipation plate form an accommodating space for accommodating the circuit board, and the cover plate and the circuit board are fixedly connected with the heat dissipation plate, namely the circuit board is fixed inside the heat dissipation plate and the cover plate by the heat dissipation plate and the cover plate. In the use, on heat accessible bellying transmission to the heating panel in the electronic components that generate heat, the transmission stroke is short can dispel the heat fast, improves the radiating effect. Meanwhile, when the computer VNX module is assembled, the heat dissipation plate, the circuit board and the cover plate are directly fixed, and the computer VNX module has the advantages of simple structure and convenience in assembly.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and together with the description, serve to explain the principles of the disclosure.

In order to more clearly illustrate the embodiments or technical solutions in the prior art of the present disclosure, the drawings used in the description of the embodiments or prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is an exploded view of a VNX module of the prior art;

FIG. 2 is a block diagram of a computer VNX module according to an embodiment of the disclosure;

FIG. 3 is an exploded view of a computer VNX module according to an embodiment of the disclosure;

FIG. 4 is a partial enlarged view of portion A of the present disclosure based on FIG. 3;

fig. 5 is a partial cross-sectional view of a computer VNX module according to an embodiment of the disclosure.

Wherein the content of the first and second substances,

1. a circuit board; 11. an electronic component; 12. a second hole; 13. non-heating electronic components; 2. a heat dissipation plate; 21. a boss portion; 22. a threaded hole; 23. connecting columns; 24. a plate body; 25. a top plate; 26. a side plate; 27. a limiting boss; 3. a cover plate; 31. a first hole; 4. a thermally conductive insulating pad; 5. a fastener.

Detailed Description

In order that the above objects, features and advantages of the present disclosure may be more clearly understood, aspects of the present disclosure will be further described below. It should be noted that the embodiments and features of the embodiments of the present disclosure may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present disclosure, but the present disclosure may be practiced in other ways than those described herein; it is to be understood that the embodiments disclosed in the specification are only a few embodiments of the present disclosure, and not all embodiments.

Referring to fig. 1, a module in the prior art includes a frame 1a, a heat dissipation structure 2a, a PCB 3a, and a chip 4a, where the chip 4a is mainly a heat source, and thus the heat dissipation structure 2a is mainly for guiding out heat in the chip 4a, but a main heat dissipation path of the module is that the chip 4a transfers heat to the heat dissipation structure 2a, the heat dissipation structure 2a transfers heat to the frame 1a, and the frame 1a transfers heat to a side wall and an upper cover of the frame, and then transfers heat to the outside through the side wall and the upper cover. Because the contact thermal resistance between the inside of the square-shaped frame and the heat exchange surface of the heat dissipation structure is larger, the temperature difference generated from the heat dissipation structure to the surface of the square-shaped frame is larger, the heat dissipation effect is not ideal, particularly, the heat dissipation effect for a high-power chip is poorer, and the heat dissipation requirement cannot be met. Moreover, the heat dissipation structure 2a in the prior art needs four cross flat head screws to be fixed on the PCB 3a, the upper cover needs to be fixed on the square frame 1a through two cross countersunk head screws, then the heat dissipation structure 2a needs four cross countersunk head screws to be fixed on the square frame 1a, and too many structural components lead to complicated structure, so that the assembly is difficult. Meanwhile, the upper cover is limited by an assembly space, the position structure of the mounting screw is thin, and the threaded hole is easy to have the risk of thread sliding.

In this regard, embodiments of the present disclosure provide a computer VNX module to solve the above problems, and solve the problems of non-ideal heat dissipation effect, complex structure and difficult assembly.

The computer VNX module of the present embodiment will be described in detail by way of specific embodiments.

Referring to fig. 2 to 5, the present disclosure provides a computer VNX module, including a circuit board 1, a heat dissipation plate 2, and a cover plate 3, where the circuit board 1 is provided with a plurality of heat-generating electronic components 11, an inner wall of the heat dissipation plate 2 is provided with a plurality of protrusions 21, the protrusions 21 are arranged in one-to-one correspondence with the heat-generating electronic components 11, the protrusions 21 are in indirect contact with the heat-generating electronic components 11 through a heat-conducting insulating pad, and the heat-conducting insulating pad 4 and the protrusions 21 are used for guiding out heat of the heat-generating electronic components 11, so as to achieve heat dissipation; the cover plate 3 and the heat dissipation plate 2 form an accommodating space for accommodating the circuit board 1, and the cover plate 3 and the circuit board 1 are both fixedly connected with the heat dissipation plate 2, that is, the circuit board 1 is fixed inside the heat dissipation plate 2 and the cover plate 3 by the heat dissipation plate 2 and the cover plate 3. In the use process, heat in the electronic component 11 generating heat can be transferred to the heat dissipation plate 2 through the convex part 21, the transfer stroke is short, heat can be dissipated quickly, and the heat dissipation effect is improved. Meanwhile, when the computer VNX module is assembled, the heat dissipation plate 2, the circuit board 1 and the cover plate 3 are directly fixed, and the heat dissipation plate has the advantages of simple structure and convenience in assembly.

The computer VNX module can be a single sub-module meeting VNX standard, and comprises two specifications of a 12.5mm module and a 19mm module, and the structural composition of the 12.5mm module is similar to that of the 19mm module.

In addition, the circuit board 1 may be a PCB board.

The computer VNX module described above meets the VITA74 standard of VNX.

The VNX is the standard of a new generation of high-reliability and miniature computer platform, and has more obvious advantages in the application scene of being sensitive to the size, weight, power consumption, performance and cost of equipment. VNX, products applied to severe environments such as national defense and key safety industries are continuously developed by taking market demands as traction, various components such as SBC, chassis, functional interface board cards and back boards are provided, various operating systems are supported, and comprehensive software support and technical service are provided. VNX products are widely used in satellites, missiles and airplanes, and can provide products with high quality, high performance, high reliability and long life cycle.

In some embodiments, the heights of each group of the heat-generating electronic components 11 and the bosses 21 are the same, and the heights of the heat-generating electronic components 11 are different, so that the heights of each group of the bosses 21 and the heat-generating electronic components 11 are the same, and the interference problem is avoided.

The heat-conducting insulating pad 4 located between the protruding portion 21 and the heat-generating electronic component 11 conducts heat and also plays an insulating role. In order to reduce the contact thermal resistance between the electronic component and the protruding part, a proper thermal interface material (a heat conduction insulating pad 4) needs to be selected, the thermal interface material applied to the environment needs to meet the requirements of insulation, high thermal conductivity of the thermal interface material, good wettability of the surface, softness and compressibility, can play a role in damping and buffering, can adjust errors generated by a structural component during processing and assembling through compression of the thermal interface material, can be repeatedly used, has good manufacturability, the flexible insulating heat conduction pad is the best choice, a gap needs to be reserved between the electronic component 11 and the protruding part 21 during design, and the compression amount is controlled within 20%.

During design, a protruding portion 21 is formed above the electronic component 11 to be subjected to heat conduction treatment, and the protruding portion 21 and the electronic component 11 are indirectly contacted through a heat conduction insulating pad, so that a complete heat conduction channel is formed. Since the electronic component 11 is a main heat generating source, the heat sink 2 is provided with the projection 21 having a size equal to the area of the electronic component 11 at a position corresponding to the electronic component 11, so that the heat of the electronic component 11 is quickly dissipated.

The height of the protruding portion 21 is calculated by measuring the height of the electronic component 11, then obtaining the height difference between the electronic component 11 and the connecting column 23, and finally subtracting the height of the heat-conducting insulating pad 4 (after compression), so that the height of the protruding portion 21 can correspond to the height of the electronic component 11.

The electronic component 11 includes a heat generating component and a heat non-generating component (e.g., the heat non-generating electronic component 13), the heat dissipating surface of the high-power heat generating electronic component 11 needs to be in complete contact with the heat dissipating surface of the protrusion 21, and the heat non-generating electronic component 13 (or the low-power electronic component) does not have the protrusion 21.

There is safe distance between apron 3 and the circuit board 1 when the design, safe distance is greater than 2mm, and foretell powerful electronic components 11 can arrange in the front of circuit board 1, and the high capacitive resistance who is less than 2mm and the high non-heat dissipation components and parts that are less than 2mm can arrange in the back of circuit board 1, increase the circuit board and arrange the area of components and parts.

The electronic component 11 may be a chip, and the protruding portion 21 may be a step.

In some embodiments, the cover plate 3 is provided with a first hole 31, the circuit board 1 is provided with a second hole 12, and the heat dissipation plate 2 is provided with a threaded hole 22; the cover plate 3 and the circuit board 1 are attached to the heat radiating plate 2 by fasteners 5 inserted through the first holes 31, the second holes 12 and the screw holes 22. Since the circuit board 1 and the cover plate 3 only need to be directly fixed to the heat radiating plate 2 by the fastening member 5, assembling and positioning are very convenient.

Wherein, the fastener 5 comprises a screw, the screw passes through the first hole 31 and the second hole 12 in sequence, and the tail part of the screw is in threaded connection with the threaded hole 22. When the screw is installed, only the moment is required to be worked according to the size of the corresponding screw, and the use is very convenient.

In addition, the first holes 31 are located at the four corners of the cover plate 3, the second holes 12 are located at the four corners of the circuit board 1, and the screw holes 22 are located at the four corners of the heat dissipation plate 2. Therefore, the whole module is assembled only by four screws, so that the installation is fast and the cost is saved.

In some embodiments, the heat dissipation plate 2 is provided with a connection column 23, the connection column 23 is provided with a threaded hole 22, and the connection column 23 is provided to facilitate screwing of a screw, so as to improve the fixing effect.

The connecting post 23 may be a cylindrical boss.

In some embodiments, the heat dissipation plate 2 includes a plate body 24, a top plate 25 and two side plates 26, wherein the top plate 25 is located on the top of the plate body 24, and the two side plates 26 are located on two sides of the plate body 24; the connecting posts 23 are located at the four corners of the plate body 24. The plate body 24, the top plate 25 and the two side plates 26 are integrally formed to form the heat dissipation plate 2, so that the structure is simplified, the strength is increased, the assembly procedures are reduced, the number of parts is reduced, and the processing cost is reduced. Meanwhile, when the computer VNX module is plugged in and pulled out, the top plate 25 is not easy to deform. And the heat radiating plate 2 is an open structure, which facilitates the installation of the circuit board 1 and the cover plate 3.

Wherein, set up spacing boss 27 on two curb plates 26 and the roof 25 for spacing circuit board 1, it is more accurate that circuit board 1 fixes a position at the assembling process, has improved the precision after whole computer VNX module assembles.

In addition, the convex portion 21 can transfer heat to the board body 24, and then the board body 24 transfers heat to the side plate 26 and the top plate 25, respectively, and then transfers heat to the outside through the side plate 26 and the top plate 25, so that heat in the electronic component 11 can be dissipated.

The thickness of the side plate 26 is not less than 2 mm.

The thickness of the heat radiating surface of the heat radiating plate 2, i.e., the plate body 24, is not less than 3 mm.

In summary, in the use process of the computer VNX module provided by the embodiment of the present disclosure, heat in the heat-generating electronic component 11 can be transferred to the plate body 24 of the heat dissipation plate 2 through the protrusion 21, then transferred to the side plate 26 and the top plate 25 of the heat dissipation plate 2 through the plate body 24, and then transferred to the outside, and the heat dissipation process is short, so that the heat dissipation can be performed quickly, and the heat dissipation effect is improved. Meanwhile, when the computer VNX module is assembled, the heat dissipation plate 2, the circuit board 1 and the cover plate 3 are directly fixed, and the heat dissipation plate has the advantages of simple structure and convenience in assembly.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present disclosure, which enable those skilled in the art to understand or practice the present disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims (9)

1. A computer VNX module, comprising:

the circuit board (1), a plurality of electronic components (11) that generate heat are arranged on the circuit board (1);

the heat dissipation plate (2), the inner wall of the heat dissipation plate (2) is provided with a plurality of protruding parts (21), the protruding parts (21) are arranged in one-to-one correspondence with the electronic components (11) which generate heat, the protruding parts (21) are indirectly contacted with the electronic components (11) which generate heat through heat conduction insulating pads (4), and the heat conduction insulating pads (4) and the protruding parts (21) are used for guiding out the heat of the electronic components (11) which generate heat;

the cover plate (3), the cover plate (3) with the heating panel (2) form the accommodation space for accommodating the circuit board (1), and the cover plate (3) with the circuit board (1) are fixedly connected with the heating panel (2).

2. The computer VNX module of claim 1, wherein the height of each group of heat generating electronic components (11) plus the bumps (21) is the same.

3. The module VNX of claim 1, wherein the cover plate (3) is provided with a first hole (31), the circuit board (1) is provided with a second hole (12), and the heat dissipation plate (2) is provided with a threaded hole (22);

the cover plate (3) and the circuit board (1) are connected to the heat dissipation plate (2) through fasteners (5) penetrating through the first hole (31), the second hole (12) and the threaded holes (22).

4. The computer VNX module according to claim 3, characterized in that the fastener (5) comprises a screw which passes through the first hole (31) and the second hole (12) in turn, and the tail of the screw is screwed with the threaded hole (22).

5. The computer VNX module according to claim 3, wherein the first holes (31) are located at the four corners of the cover plate (3), the second holes (12) are located at the four corners of the circuit board (1), and the threaded holes (22) are located at the four corners of the heat dissipation plate (2).

6. Computer VNX module as claimed in claim 3, wherein the heat sink (2) is provided with a connecting stud (23), the connecting stud (23) being provided with the threaded hole (22).

7. The computer VNX module of claim 6, wherein the connecting posts (23) have a height greater than a height of the electronic component (11).

8. The computer VNX module according to claim 6, characterized in that the heat dissipation plate (2) comprises a plate body (24), a top plate (25) and two side plates (26), the top plate (25) being located on top of the plate body (24), the two side plates (26) being located on both sides of the plate body (24);

the connecting columns (23) are positioned at four corners of the plate body (24).

9. The computer VNX module according to claim 8, wherein two of the side panels (26) and the top panel (25) are provided with a retaining boss (27) for retaining the circuit board (1).

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