CN216218277U - Heat radiator for power device in controller - Google Patents
Heat radiator for power device in controller Download PDFInfo
- Publication number
- CN216218277U CN216218277U CN202122664577.0U CN202122664577U CN216218277U CN 216218277 U CN216218277 U CN 216218277U CN 202122664577 U CN202122664577 U CN 202122664577U CN 216218277 U CN216218277 U CN 216218277U
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- power device
- circuit board
- control circuit
- controller
- power
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Abstract
The utility model discloses a heat sink of power device in controller, which can reduce the occupied space and cost, comprising: the casing, set up the control panel in the casing and set up bottom plate on the casing, the control panel include: the control circuit board is provided with at least one row of power devices, so that a power device area is formed on the control circuit board; the front surface of the power device is attached to the control circuit board, the back surface of the power device is attached to the shell through the heat-conducting insulating film, and the bottom plate is provided with a convex supporting part which is opposite to the power device area, so that the back surface of the power device area on the control circuit board is attached to the convex supporting part. The heat radiator of the power device can be widely applied to various controllers of electric automobiles and the like.
Description
Technical Field
The utility model relates to a heat dissipation device of a power device, in particular to a heat dissipation device of a power device in a controller.
Background
At present, in a control board of a conventional controller, for heat dissipation of a power device, the power device is generally mounted on an edge of a control board so that the power device is sandwiched between a housing and a bottom plate in the controller. Therefore, the control panel needs to occupy larger space, and correspondingly, the shell and the bottom plate of the controller need to be correspondingly enlarged, so that the size of the controller is increased, and the cost is increased.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: the heat sink for power device in controller can reduce the occupied space of control board and thus lower cost.
In order to solve the technical problems, the technical scheme adopted by the utility model is as follows: a heat dissipation device for a power device in a controller, comprising: casing, the control panel of setting in the casing and set gradually bottom plate on the casing, the control panel include: the control circuit board is provided with at least one row of power devices, so that a power device area is formed on the control circuit board; the front surface of the power device is attached to the control circuit board, the back surface of the power device is attached to the shell through the heat-conducting insulating film, and the bottom plate is provided with a convex supporting part which is opposite to the power device area, so that the back surface of the power device area on the control circuit board is attached to the convex supporting part.
As a preferred scheme, in the heat dissipation apparatus for a power device in a controller, a soft rubber pad is further disposed between the control circuit board and the bottom plate, a protruding portion matched with the protruding support portion is disposed on the soft rubber pad, and the back of the power device region on the control circuit board is attached to the protruding support portion on the bottom plate through the protruding portion on the soft rubber pad; as a further preferred scheme, a plurality of pressing pad columns are further arranged on the soft rubber pad.
As a preferred scheme, in the heat dissipation device for a power device in a controller, a soft rubber pad is further arranged between the control circuit board and the bottom plate, an opening matched with the raised supporting part is arranged on the soft rubber pad, and the raised supporting part on the bottom plate penetrates through the opening on the soft rubber pad and is pressed on the control circuit board; as a further preferred scheme, a plurality of pressing pad columns are further arranged on the soft rubber pad; an annular bulge is arranged on the soft rubber pad around the edge of the opening.
In the heat dissipation device for power devices in a controller, preferably, the inner side of the casing is provided with a heat dissipation platform facing the power devices on the control circuit board, and the back surfaces of all the power devices are attached to the heat dissipation platform through a heat conductive insulating film.
As a preferable scheme, in the heat dissipation device for a power device in a controller, a plurality of heat dissipation fins are arranged on the outer side of the housing corresponding to the heat dissipation platform.
As a preferable scheme, in the heat dissipation device for a power device in the controller, the power device is a power MOS transistor.
The utility model has the beneficial effects that: the heat dissipation device of the power device can arrange the power device in the board area of the control circuit board, thereby reducing the area of the control circuit board, reducing the volume of the whole controller and further reducing the cost. In addition, the heat dissipation effect of the power device is greatly improved by arranging the heat dissipation platform on the inner side of the shell and arranging the heat dissipation fins on the outer side of the shell.
Drawings
Fig. 1 is a schematic diagram of an exploded structure of a controller according to the present invention.
Fig. 2 is a schematic front view of the controller shown in fig. 1.
Fig. 3 is a schematic sectional view taken along the line a-a in fig. 2.
Fig. 4 is a schematic diagram of an exploded structure of another controller according to the present invention.
Reference numerals in fig. 1 to 4 are respectively; 1. the heat dissipation structure comprises a shell, 11, a heat dissipation boss, 12, a heat conduction insulating film, 13, a heat dissipation fin, 2, a control panel, 20, a control circuit board, 21, a power MOS tube, 3, a soft rubber pad, 31, a protruding part, 32, a compression pad column, 33, an annular protruding part, 4, a bottom plate, 41, a protruding supporting part, 5 and a screw.
Detailed Description
The following describes in detail a specific embodiment of a heat dissipation device for a power device in a controller according to the present invention with reference to the accompanying drawings:
the first embodiment is as follows:
as shown in fig. 1, fig. 2 and fig. 3, the heat dissipation apparatus for a power device in a controller according to the present invention includes: casing 1, setting are in control panel 2 in the casing 1 and set gradually soft cushion 3 and bottom plate 4 on the casing 1, control panel 2 include: the control circuit board 20, there are a row of power MOS tubes 21 on the control circuit board 20, thus form the power device area on the control circuit board 20, the front of the power MOS tube 21 is leaned on the said control circuit board 20; the inner side of the casing 1 is provided with a heat dissipation boss 11 as a heat dissipation platform facing a row of power MOS transistors 21 on the control circuit board 20, and the back surfaces (heat dissipation surfaces) of the row of power MOS transistors 21 are attached to the heat dissipation boss 11 through a heat conduction insulating film 12; a plurality of radiating fins 13 are arranged on the outer side of the shell 1 corresponding to the radiating bosses 11; the bottom plate 4 is provided with a convex supporting part 41 which is opposite to the power device area on the control circuit board 20, the soft rubber pad 3 is provided with a convex part 31 matched with the convex supporting part 41, and the back surface of the power device area on the control circuit board 20 is attached to the convex supporting part 41 on the bottom plate 4 through the convex part 31 on the soft rubber pad 3. In this embodiment, the soft rubber pad 3 is further provided with a plurality of pressing pad columns 32.
Example two:
as shown in fig. 4, another heat dissipation apparatus for a power device in a controller according to the present invention is different from the first embodiment in that: the soft rubber pad 3 is provided with an opening matched with the convex supporting part 41 and an annular convex part 33 arranged around the edge of the opening, so that the convex supporting part 41 passes through the opening and is directly pressed on the control circuit board 20.
During actual installation, the screws 5 are inserted through the mounting through holes on the bottom plate 4 and screwed into the corresponding mounting threaded holes of the housing 1 (which is conventional in the art and will not be described herein).
In summary, the present invention is only a preferred embodiment, and not intended to limit the scope of the utility model, and all equivalent changes and modifications made in the shape, structure, characteristics and spirit of the present invention described in the claims should be included in the scope of the present invention.
Claims (10)
1. A heat dissipation device for a power device in a controller, comprising: the casing, set up the control panel in the casing and set up bottom plate on the casing, the control panel include: the control circuit board is provided with at least one row of power devices, so that a power device area is formed on the control circuit board; the power device is characterized in that the front surface of the power device is attached to the control circuit board, the back surface of the power device is attached to the shell through the heat-conducting insulating film, and the bottom plate is provided with a convex supporting part which is opposite to the power device area, so that the back surface of the power device area on the control circuit board is attached to the convex supporting part.
2. The heat dissipation device of a power device in a controller as claimed in claim 1, wherein a soft rubber pad is further disposed between the control circuit board and the bottom board, a protrusion portion matched with the protrusion support portion is disposed on the soft rubber pad, and a back surface of the power device area on the control circuit board is attached to the protrusion support portion on the bottom board through the protrusion portion on the soft rubber pad.
3. The heat dissipating device for a power device in a controller as claimed in claim 2, wherein the soft rubber pad is further provided with a plurality of pressing pad posts.
4. The heat dissipation device of a power device in a controller as claimed in claim 1, wherein a soft rubber pad is further disposed between the control circuit board and the bottom board, an opening matched with the protruding support portion is disposed on the soft rubber pad, and the protruding support portion on the bottom board penetrates through the opening on the soft rubber pad and presses against the control circuit board.
5. The heat dissipating device for a power device in a controller as claimed in claim 4, wherein the soft rubber pad is further provided with a plurality of pressing pad posts.
6. The heat dissipating device for a power device in a controller as claimed in claim 4, wherein an annular protrusion is formed on the soft rubber pad around the opening.
7. The heat dissipating device for power devices in a controller according to any one of claims 1 to 6, wherein a heat dissipating platform is provided on the inner side of the housing facing the power devices on the control circuit board, and the back surfaces of all the power devices are abutted against the heat dissipating platform through a thermally conductive insulating film.
8. The heat dissipating device for a power device in a controller according to claim 7, wherein a plurality of heat dissipating fins are provided on the outer side of the housing corresponding to the heat dissipating platform.
9. The heat sink for power devices in a controller as claimed in claim 7, wherein said power device is a power MOS transistor.
10. The heat dissipating device for a power device in a controller of claim 8, wherein the power device is a power MOS transistor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122664577.0U CN216218277U (en) | 2021-11-02 | 2021-11-02 | Heat radiator for power device in controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122664577.0U CN216218277U (en) | 2021-11-02 | 2021-11-02 | Heat radiator for power device in controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216218277U true CN216218277U (en) | 2022-04-05 |
Family
ID=80899814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122664577.0U Active CN216218277U (en) | 2021-11-02 | 2021-11-02 | Heat radiator for power device in controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216218277U (en) |
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2021
- 2021-11-02 CN CN202122664577.0U patent/CN216218277U/en active Active
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