CN212846695U

CN212846695U - Display card radiator

Info

Publication number: CN212846695U
Application number: CN202022144470.9U
Authority: CN
Inventors: 朱超; 徐金博; 高丙午
Original assignee: Dongguan City Hao Electronic Technology Co ltd
Current assignee: Dongguan City Hao Electronic Technology Co ltd
Priority date: 2020-09-25
Filing date: 2020-09-25
Publication date: 2021-03-30
Anticipated expiration: 2030-09-25

Abstract

The utility model discloses a display card radiator, it includes: the casing, install in casing one side and be used for with the radiating seat of main chip laminating heat conduction and install in the casing opposite side and with the radiating fan that the radiating seat corresponds the heat dissipation, the casing is installed on the circuit board, radiating seat one side is installed and is used for the radiating conducting strip of heat conduction to other components and parts, is provided with on this conducting strip with the radiating heat conduction pad of other components and parts laminating heat conduction. The utility model discloses in set up the conducting strip through the bottom at the radiating seat to paste the heat conduction pad that carries out heat conduction on can pasting electronic components on the conducting strip, so that other electronic components of display card owner chip side can quick effectual heat dissipation, promote the whole radiating effect of display card, and then promote the life of display card.

Description

Display card radiator

The technical field is as follows:

the utility model relates to an integrated circuit heat dissipation technical field refers in particular to a display card radiator.

Background art:

due to the continuous rising of the core working frequency and the video memory working frequency of the video card, the heat productivity of the video card chip is also rapidly promoted. The number of transistors of the display chip reaches or even exceeds the number in the CPU, and such high integration inevitably increases the amount of heat generated, and in order to solve these problems, the display card adopts a necessary heat dissipation manner. Especially for the over-frequency enthusiasts and users needing to work for a long time, the excellent heat dissipation mode is a necessary item for selecting the display card. The heat dissipation mode of the graphics card is divided into a form of a heat dissipation sheet and a heat dissipation sheet matched with a fan, and the heat dissipation sheet is also called as an active heat dissipation mode and a passive heat dissipation mode. Besides the display chip is provided with the radiating fins, the active radiating is also provided with the radiating fan, and the display card with higher working frequency needs the active radiating. Because higher operating frequencies result in higher heat, it is difficult to satisfy the heat dissipation requirement by installing only one heat sink, so that the fan is needed to help, and is more important for users who use more frequently and for users who need to use for a long time.

Active heat dissipation on the present market usually only carries out heat conduction heat dissipation to the main chip of display card, and what adopt to other supplementary electronic components is derived along with the circuit board will dispel the heat, leads to supplementary electrical components and parts not in time to dispel the heat like this, often is in high temperature operating condition for supplementary components and parts's life reduces by a wide margin, and work efficiency also can not reach the best, has not only drawn down the work efficiency of display card in the long term, still reduces the life of display card.

In view of the above, the present inventors propose the following.

The utility model has the following contents:

an object of the utility model is to overcome prior art not enough, provide a display card radiator.

In order to solve the technical problem, the utility model discloses a following technical scheme: this display card radiator includes: the casing, install in casing one side and be used for with the radiating seat of main chip laminating heat conduction and install in the casing opposite side and with the radiating fan that the radiating seat corresponds the heat dissipation, the casing is installed on the circuit board, radiating seat one side is installed and is used for the radiating conducting strip of heat conduction to other components and parts, is provided with on this conducting strip with the radiating heat conduction pad of other components and parts laminating heat conduction.

Further, in the above technical solution, the heat conducting sheet is L-shaped, at least three fixing legs are formed on the inner side of the heat conducting sheet, a through hole for a screw to pass through is formed on each fixing leg, and a tapered counter bore is formed on one side of the through hole; and three threaded holes which are matched and corresponding to the through holes are formed in the heat radiating seat.

Furthermore, in the above technical solution, the heat conducting plate is further formed with a plurality of strip-shaped holes for heat dissipation, and the heat conducting pad includes a first heat conducting pad and a second heat conducting pad respectively installed on two right-angle sides of the heat conducting plate.

Further, in the above technical solution, a plurality of heat dissipation fins are formed on the outer side of the heat dissipation seat, and the heat dissipation fins are curved to one side; the radiating seat is used for installing one side of the heat conducting fin is further provided with four riveting holes, the other side of the radiating seat is provided with three first installation holes used for installing the heat conducting fin on the shell, the riveting holes are distributed in four corners of the radiating seat and are provided with rivets, and the first installation holes are arranged in a triangular mode.

Furthermore, in the above technical solution, a second mounting hole recessed inwards is formed in the middle of the housing, a support frame for mounting the fan and the heat dissipation seat is arranged at one end of the second mounting hole, the heat dissipation seat is mounted at one side of the support frame, and the fan is mounted at the other side of the support frame and located in the second mounting hole.

Furthermore, in the above technical solution, the support frame includes a first force arm, a second force arm, and a third force arm extending from an inner wall of the second mounting hole to a middle portion, a ring formed at an intersection of the first force arm, the second force arm, and the third force arm, and a mounting base mounted on the first force arm, the second force arm, and the third force arm and attached to the ring, the heat dissipation base is mounted on the first force arm, the second force arm, and the third force arm through a first screw, and the first screw is further used to fix the mounting base and the fan to the first force arm, the second force arm, and the third force arm.

Furthermore, in the above technical solution, a convex pillar for positioning the blade in the fan is formed in the middle of the mounting seat, and the blade rotates around the convex pillar.

Furthermore, in the above technical solution, the inner side of the housing is provided with a plurality of first wire buckles for fixing the wire harness, the inner side of the housing is further provided with a wire slot and a positioning block for positioning the wire harness, the inner wall of the second mounting hole is formed with a second wire buckle extending to the inner side of the housing, and one side of the mounting seat is formed with a clamping strip extending to be aligned with the second wire buckle and used for fixing the wire harness.

Furthermore, in the above technical solution, a plurality of third mounting holes for fixing with the circuit board are formed on the housing, and a support pillar for supporting the housing is further disposed on the inner side of the housing and pressing against the circuit board.

After the technical scheme is adopted, compared with the prior art, the utility model has following beneficial effect: the utility model discloses in set up the conducting strip through the bottom at the radiating seat to paste the heat conduction pad that carries out heat conduction on can pasting electronic components on the conducting strip, so that other electronic components of display card owner chip side can quick effectual heat dissipation, promote the whole radiating effect of display card, and then promote the life of display card.

Description of the drawings:

fig. 1 is a perspective view of the present invention;

fig. 2 is a front view of the present invention;

fig. 3 is a rear view of the present invention;

fig. 4 is a first perspective view of the housing of the present invention;

fig. 5 is a second perspective view of the middle housing of the present invention;

FIG. 6 is a perspective view of the heat sink of the present invention;

FIG. 7 is a front view of the heat sink of the present invention;

fig. 8 is a perspective view of the middle heat-conducting fin of the present invention.

Description of reference numerals:

1 casing 11 second mounting hole 12 first line buckle

13 wire casing 14 positioning block 15 second wire buckle

16 third mounting hole 17 support column 2 heat sink

21 threaded hole 22 heat radiating fin 23 riveting hole

24 first mounting hole 3 fan 4 heat conducting fin

41 fixing foot 42 through hole 43 counter bore

44 strip-shaped holes 5, first heat-conducting pads 6 and second heat-conducting pads

7 first force arm 72 first force arm of support bracket 71

73 third force arm 74 ring 75 mounting seat

751, post 752 and line 8 first screw

9 rivet

The specific implementation mode is as follows:

the present invention will be further described with reference to the following specific embodiments and accompanying drawings.

As shown in fig. 1 to 8, a graphics card heat sink includes: the heat dissipation structure comprises a shell 1, a heat dissipation seat 2 and a fan 3, wherein the heat dissipation seat 2 is arranged on one side of the shell 1 and used for being attached to a main chip to conduct heat, the fan 3 is arranged on the other side of the shell 1 and corresponds to the heat dissipation seat 2, the shell 1 is arranged on a circuit board, a heat conduction sheet 4 used for conducting heat and dissipating heat to other components is arranged on one side of the heat dissipation seat 2, and a heat conduction pad attached to other components to conduct heat and dissipate heat is arranged on the heat conduction sheet. Set up conducting strip 4 through the bottom at radiating seat 2 to paste the heat conduction pad that carries out heat conduction on can pasting electronic components on conducting strip 4, so that other electronic components of display card owner chip side can quick effectual heat dissipation, promote the whole radiating effect of display card, and then promote the life of display card. The heat radiating seat 2 and the heat conducting fins 4 are made of aluminum materials, the heat conducting pad is a flexible soft pad with viscosity, and the shell 1 is made of PC materials.

The heat conducting fin 4 is in an L shape, at least three fixing feet 41 are formed on the inner side of the heat conducting fin, a through hole 42 for a screw to pass through is formed on each fixing foot 41, and a conical counter bore 43 is formed on one side of the through hole 42; the heat radiation seat 2 is provided with three threaded holes 21 corresponding to the through holes 42 in a matching manner. The screw 9 is a countersunk screw, and the heat conducting sheet 4 is fixed on the heat radiating seat 2 in a detachable mode by adopting the screw, so that the universality of the heat radiating seat 2 can be improved, the heat radiating seat 2 can be used on display cards or other chips of different types more flexibly, meanwhile, a counter bore 43 is arranged at one end of a through hole 42 for the screw to pass through, the countersunk part of the screw can be positioned in the counter bore 43 after the screw is installed, the end surface of the heat conducting sheet 4 is flat, and the use of the heat conducting pad is not influenced.

The heat conducting strip 4 is further formed with a plurality of strip-shaped holes 44 for heat dissipation, and the heat conducting pad comprises a first heat conducting pad 5 and a second heat conducting pad 6 which are respectively arranged on two right-angle edges of the heat conducting strip 4.

A plurality of radiating fins 22 are formed on the outer side of the radiating seat 2, and the radiating fins 22 are in an arc shape bent towards one side; the heat dissipation seat 2 is used for installing one side of the heat conducting fin 4 is further provided with four riveting holes 23, the other side of the heat dissipation seat 2 is provided with three first installation holes 24 used for installing on the shell 1, the riveting holes 23 are distributed on four corners of the heat dissipation seat 2 and are provided with rivets 9, and the first installation holes 24 are arranged in a triangular shape. Rivet 9 supports after the radiator is installed and presses on the circuit board to prop up radiating seat 2, avoid radiating seat 2 directly to support and press and influence the use of main chip on the main chip, and install in conducting strip 4 on radiating seat 2 then plays the distance that reduces radiating seat 2 and other components and parts, makes the heat conduction pad of pasting on conducting strip 4 can directly contact with other components and parts, in order to reach the effect of heat conduction, and simultaneously, flexible heat conduction pad also can play certain cushioning effect, alleviates radiating seat 2 and to electronic components's extrusion.

The middle part shaping of casing 1 has the second mounting hole 11 of indent, and the one end of this second mounting hole 11 is provided with and is used for the installation fan 3 with the support frame 7 of radiating seat 2, radiating seat 2 install in one side of support frame 7, fan 3 install in the opposite side of support frame 7 is located in the second mounting hole 11. The fan 3 is installed in the second mounting hole 11 which is sunken inwards, the outer side of the shell 1 is flat after installation, the structure of the radiator is more compact, the occupied space is smaller, and the installation of other parts is facilitated.

The supporting frame 7 comprises a first force arm 71, a second force arm 72 and a third force arm 73 extending from the inner wall of the second mounting hole 11 to the middle, a ring 74 formed at the intersection of the first force arm 71, the second force arm 72 and the third force arm 73, and a mounting base 75 mounted on the first force arm 71, the second force arm 72 and the third force arm 73 and attached to the ring 74, the heat dissipation base 2 is mounted on the first force arm 71, the second force arm 72 and the third force arm 73 through a first screw 8, and the first screw 8 is further used for fixing the mounting base 75 and the fan 3 on the first force arm 71, the second force arm 72 and the third force arm 73.

A boss 751 for positioning a blade of the fan 3 is formed in the middle of the mounting seat 75, and the blade rotates around the boss 751.

The inner side of the shell 1 is provided with a plurality of first wire buckles 12 for fixing the wire harness, the inner side of the shell 1 is further provided with a wire slot 13 and a positioning block 14 for positioning the wire harness, a second wire buckle 15 extending to the inner side of the shell 1 is formed on the inner wall of the second mounting hole 11, and a wire clamping strip 752 extending to be aligned with the second wire buckle 15 and used for fixing the wire harness is formed on one side of the mounting seat 75. The first wire buckles 12, the wire grooves 13, the positioning blocks 14 and the second wire buckles 15 for fixing the wire harnesses are arranged on the inner side of the shell 1, so that the wiring of the wire harnesses in the radiator is clear and clear, and the work of the radiator is not influenced.

A plurality of third mounting holes 16 for fixing with the circuit board are formed on the housing 1, and a supporting column 17 for supporting the housing 1 is further arranged on the inner side of the housing 1 and is pressed against the circuit board. The stability of the housing 1 after installation is improved by arranging a plurality of support columns 17 for snap-fixing and supporting the housing 1 inside the housing 1.

To sum up, the utility model discloses during the use, fix heat-dissipating seat 2 bottom on the main chip of display card through the heat conduction glue laminating to conduct the heat that main chip produced to heat-dissipating seat 2 and transmit to radiating fin 22 department, again by fan 3 with the heat of heat-dissipating seat 2 suck the discharge, in this process, the arc clearance that forms between the radiating fin 22 that is arc after fan 3 produces suction, can make the circulation of air through the arc clearance faster, and then faster takes the heat out; and the heat conducting sheet 4 and the heat conducting pad arranged at the bottom of the heat radiating seat 2 can conduct heat generated by other electronic components to the heat radiating seat 2 in time, so that the auxiliary heat radiating effect is achieved, the integral heat radiating effect of the display card is improved, and the service life of the display card is prolonged.

Of course, the above description is only an exemplary embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent changes and modifications made by the constructions, features, and principles of the present invention in accordance with the claims of the present invention are intended to be included in the scope of the present invention.

Claims

1. A graphics card heat sink, comprising: casing (1), install in casing (1) one side and be used for with main chip laminating heat conduction radiating seat (2) and install in casing (1) opposite side and with radiating seat (2) correspond radiating fan (3), casing (1) is installed on the circuit board, its characterized in that, radiating seat (2) one side is installed and is used for heat conduction radiating conducting strip (4) to other components and parts heat conduction, is provided with on this conducting strip (4) and laminates heat conduction radiating heat conduction pad with other components and parts.

2. The graphics card heat sink of claim 1, wherein: the heat conducting fin (4) is L-shaped, at least three fixing feet (41) are formed on the inner side of the heat conducting fin, a through hole (42) for a screw to pass through is formed in each fixing foot (41), and a conical counter bore (43) is formed on one side of each through hole (42); the heat dissipation seat (2) is provided with three threaded holes (21) which are matched and corresponding to the through holes (42).

3. The graphics card heat sink of claim 2, wherein: the heat conducting sheet (4) is further provided with a plurality of strip-shaped holes (44) for heat dissipation in a forming mode, and the heat conducting pad comprises a first heat conducting pad (5) and a second heat conducting pad (6) which are arranged on two right-angle sides of the heat conducting sheet (4) respectively.

4. The graphics card heat sink of claim 2, wherein: a plurality of radiating fins (22) are formed on the outer side of the radiating seat (2), and the radiating fins (22) are in an arc shape bent towards one side; the radiating seat (2) is used for installing conducting strip (4) one side still is provided with four riveting holes (23), and this radiating seat (2) opposite side is provided with three and is used for installing first mounting hole (24) on casing (1), wherein, rivet hole (23) distribute in on four angles of radiating seat (2) and all install rivet (9), first mounting hole (24) are triangle-shaped and arrange.

5. The graphics card heat sink of claim 4, wherein: the middle part shaping of casing (1) is to second mounting hole (11) of indent, and the one end of this second mounting hole (11) is provided with and is used for the installation fan (3) with support frame (7) of radiating seat (2), radiating seat (2) install in one side of support frame (7), fan (3) install in the opposite side of support frame (7) is located in second mounting hole (11).

6. The graphics card heat sink of claim 5, wherein: the supporting frame (7) comprises a first force arm (71), a second force arm (72), a third force arm (73), a circular ring (74) and a mounting seat (75), wherein the first force arm (71), the second force arm (72) and the third force arm (73) extend from the inner wall of the second mounting hole (11) to the middle part, the circular ring (74) is formed at the intersection of the first force arm (71), the second force arm (72) and the third force arm (73), the mounting seat (75) is mounted on the first force arm (71), the second force arm (72) and the third force arm (73) and is attached to the circular ring (74), the heat radiation seat (2) is arranged on the first force arm (71), the second force arm (72) and the third force arm (73) through a first screw (8), the first screw (8) is also used for fixing the mounting seat (75) and the fan (3) on the first force arm (71), the second force arm (72) and the third force arm (73).

7. The graphics card heat sink of claim 6, wherein: and a convex column (751) for positioning a blade in the fan (3) is formed in the middle of the mounting seat (75), and the blade rotates by taking the convex column (751) as a center.

8. The graphics card heat sink of claim 6, wherein: the wire harness fixing device is characterized in that a plurality of first wire buckles (12) used for fixing wire harnesses are arranged on the inner side of the shell (1), a wire slot (13) and a positioning block (14) used for positioning the wire harnesses are further arranged on the inner side of the shell (1), a second wire buckle (15) extending to the inner side of the shell (1) is formed on the inner wall of the second mounting hole (11), and a clamping line (752) extending to be aligned with the second wire buckle (15) and used for fixing the wire harnesses is formed on one side of the mounting seat (75).

9. The graphics card heat sink of any one of claims 1-8, wherein: the circuit board fixing device is characterized in that a plurality of third mounting holes (16) used for being fixed with the circuit board are formed in the shell (1), and supporting columns (17) which are pressed on the circuit board and used for supporting the shell (1) are further arranged on the inner side of the shell (1).