CN216600537U - Integrated circuit board with heat radiation structure - Google Patents
Integrated circuit board with heat radiation structure Download PDFInfo
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- CN216600537U CN216600537U CN202122151272.XU CN202122151272U CN216600537U CN 216600537 U CN216600537 U CN 216600537U CN 202122151272 U CN202122151272 U CN 202122151272U CN 216600537 U CN216600537 U CN 216600537U
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- substrate
- supporting frame
- heat dissipation
- substrate supporting
- push
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Abstract
The utility model relates to an integrated circuit board with a heat dissipation structure, which comprises a substrate, wherein the substrate is arranged on a substrate supporting frame, positioning units are respectively arranged on two sides of the substrate supporting frame, and the two positioning units are symmetrically arranged along the substrate supporting frame; the upper part of the substrate supporting frame is provided with an upright post for supporting the substrate, and the upright post enables a ventilation space to be formed between the substrate supporting frame and the substrate; the upper part of the substrate supporting frame is provided with upper radiating holes, and the lower part of the substrate supporting frame is provided with lower radiating holes corresponding to the upper radiating holes. The utility model has the advantages that: simple structure, convenient to use, through setting up radiator fan, base plate braced frame and positioning unit, the base plate forms the heat dissipation space with base plate braced frame to fix through positioning unit, positioning unit also is provided with the base plate fin, and through multistage heat radiation structure's setting, the effectual quick heat dissipation that has carried out to the base plate.
Description
Technical Field
The utility model relates to an integrated circuit board with a heat dissipation structure, and relates to the field of circuit board heat dissipation.
Background
The heat dissipation of circuit board becomes the key that influences circuit board life-span and efficiency, how to give off the heat that the chip of circuit board produced to the air naturally through the fin, is the main problem that circuit board faced at present, and the design of current heat radiation structure for the radiating effect is unsatisfactory, and heat dispersion is influenced by the heat-sinking ability weak.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides an integrated circuit board with a heat dissipation structure, and the technical scheme of the utility model is as follows:
an integrated circuit board with a heat dissipation structure comprises a substrate, wherein the substrate is arranged on a substrate supporting frame, positioning units are respectively arranged on two sides of the substrate supporting frame, and the two positioning units are symmetrically arranged along the substrate supporting frame; the upper part of the substrate supporting frame is provided with an upright post for supporting the substrate, and the upright post enables a ventilation space to be formed between the substrate supporting frame and the substrate; an upper heat dissipation hole is formed in the upper portion of the substrate supporting frame, a lower heat dissipation hole corresponding to the upper heat dissipation hole is formed in the lower portion of the substrate supporting frame, and a frame heat dissipation fin is mounted on the inner wall of the substrate supporting frame between the upper heat dissipation hole and the lower heat dissipation hole; the fan support that is the toper setting is installed to base plate braced frame's lower part the radiator fan that corresponds with lower part louvre is installed to the lower part of fan support, the backup pad is installed to the lower part of fan support.
Each positioning unit comprises a fixed block, a push-pull cushion block, a spring and a screw rod, wherein the fixed block is fixedly arranged on the substrate supporting frame, the screw rod is arranged along the horizontal direction, the rod part of the screw rod penetrates through the fixed block and is provided with the push-pull cushion block, and the push-pull cushion block is in sliding fit with the substrate supporting frame; the head of the screw is positioned at the outer side of the fixed block, and a rod part between the head of the screw and the fixed block is sleeved with a spring; one end of the spring is connected to the fixing block, the other end of the spring is connected to the head, and the rod part is in sliding fit with the fixing block.
And a substrate radiating fin is arranged on the inner side of the fixed block, and the substrate radiating fin is adjacent to the substrate.
The cross section of the push-pull cushion block is arranged in a step shape, and the substrate is clamped by the push-pull cushion block when being placed on the push-pull cushion block.
The fan bracket is provided with a flow guide hole.
The utility model has the advantages that: simple structure, convenient to use, through setting up radiator fan, base plate braced frame and positioning unit, the base plate forms the heat dissipation space with base plate braced frame to fix through positioning unit, positioning unit also is provided with the base plate fin, and through multistage heat radiation structure's setting, the effectual quick heat dissipation that has carried out to the base plate.
Drawings
Fig. 1 is a schematic view of the main structure of the present invention.
Detailed Description
The utility model will be further described with reference to specific embodiments, and the advantages and features of the utility model will become apparent as the description proceeds. These examples are illustrative only and do not limit the scope of the present invention in any way. It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the utility model, and that such changes and modifications may be made without departing from the spirit and scope of the utility model.
Referring to fig. 1, the present invention relates to an integrated circuit board with a heat dissipation structure, which includes a substrate 11, wherein the substrate 11 is mounted on a substrate support frame 7, two positioning units are respectively mounted on two sides of the substrate support frame 7, and the two positioning units are symmetrically arranged along the substrate support frame 7; a column 9 for supporting a substrate 11 is mounted on the upper part of the substrate support frame 7, and the column 9 forms a ventilation space between the substrate support frame 7 and the substrate 11; an upper heat dissipation hole 10 is formed in the upper portion of the substrate support frame 7, a lower heat dissipation hole 5 corresponding to the upper heat dissipation hole is formed in the lower portion of the substrate support frame 7, and a frame heat dissipation fin 8 is mounted on the inner wall of the substrate support frame 7 between the upper heat dissipation hole 10 and the lower heat dissipation hole 5; the fan support 2 that is the toper setting is installed to the lower part of base plate braced frame 7 the radiator fan 3 that corresponds with lower part louvre 5 is installed to the lower part of fan support 2, backup pad 1 is installed to the lower part of fan support 2.
Each positioning unit comprises a fixed block 13, a push-pull cushion block 14, a spring 17 and a screw rod, wherein the fixed block 13 is fixedly arranged on the substrate supporting frame 7, the screw rod is arranged along the horizontal direction, the push-pull cushion block 14 is arranged after the rod part 15 of the screw rod penetrates through the fixed block 13, and the push-pull cushion block 14 is in sliding fit with the substrate supporting frame 7; the head 16 of the screw is positioned at the outer side of the fixed block 13, and a spring 17 is sleeved on the rod part 15 between the head 16 of the screw and the fixed block 13; one end of the spring 17 is connected to the fixed block 13, the other end is connected to the head 16, and the rod 15 is in sliding fit with the fixed block 13.
A substrate heat sink 12 is provided inside the fixed block 13, and the substrate heat sink 12 is provided adjacent to the substrate 11.
The cross section of the push-pull cushion block 14 is arranged in a step shape, and the substrate 11 is clamped by the push-pull cushion block 14 when being placed on the push-pull cushion block 14.
The fan bracket 2 is provided with a flow guide hole 4.
The working principle of the utility model is as follows: the substrate is arranged between the two positioning units, the push-pull cushion block clamps the substrate under the action of the spring, a heat dissipation space is formed between the substrate and the substrate supporting frame, heat dissipation is carried out through the upper heat dissipation holes 10, the lower heat dissipation holes 5 and the flow guide holes 4 which are arranged on the substrate heat dissipation frame, and the flow of air flow is accelerated under the action of the heat dissipation fan, so that the heat dissipation effect is more obvious; a substrate heat sink 12 is further provided on the fixing block 13 on the side of the substrate to dissipate heat from the side of the substrate.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.
Claims (5)
1. An integrated circuit board with a heat dissipation structure comprises a substrate, and is characterized in that the substrate is arranged on a substrate supporting frame, positioning units are respectively arranged on two sides of the substrate supporting frame, and the two positioning units are symmetrically arranged along the substrate supporting frame; the upper part of the substrate supporting frame is provided with an upright post for supporting the substrate, and the upright post enables a ventilation space to be formed between the substrate supporting frame and the substrate; an upper heat dissipation hole is formed in the upper portion of the substrate supporting frame, a lower heat dissipation hole corresponding to the upper heat dissipation hole is formed in the lower portion of the substrate supporting frame, and a frame heat dissipation fin is mounted on the inner wall of the substrate supporting frame between the upper heat dissipation hole and the lower heat dissipation hole; the fan support that is the toper setting is installed to the lower part of base plate braced frame the radiator fan that corresponds with lower part louvre is installed to the lower part of fan support, the backup pad is installed to the lower part of fan support.
2. The integrated circuit board with the heat dissipation structure as recited in claim 1, wherein each of the positioning units comprises a fixed block, a push-pull pad, a spring, and a screw, the fixed block is fixedly mounted on the substrate supporting frame, the screw is horizontally disposed, a rod of the screw passes through the fixed block and is then mounted with the push-pull pad, and the push-pull pad is slidably engaged with the substrate supporting frame; the head of the screw is positioned at the outer side of the fixed block, and a rod part between the head of the screw and the fixed block is sleeved with a spring; one end of the spring is connected to the fixing block, the other end of the spring is connected to the head, and the rod part is in sliding fit with the fixing block.
3. The ic board with a heat dissipating structure as claimed in claim 2, wherein a substrate heat sink is disposed at an inner side of the fixing block, the substrate heat sink being disposed adjacent to the substrate.
4. The integrated circuit board with a heat dissipation structure as claimed in claim 2 or 3, wherein the cross-section of the push-pull pad is stepped, and the substrate is clamped by the push-pull pad when being placed on the push-pull pad.
5. The printed circuit board with a heat dissipation structure as recited in claim 4, wherein the fan bracket is provided with a plurality of flow guiding holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122151272.XU CN216600537U (en) | 2021-09-07 | 2021-09-07 | Integrated circuit board with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122151272.XU CN216600537U (en) | 2021-09-07 | 2021-09-07 | Integrated circuit board with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600537U true CN216600537U (en) | 2022-05-24 |
Family
ID=81638027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122151272.XU Active CN216600537U (en) | 2021-09-07 | 2021-09-07 | Integrated circuit board with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216600537U (en) |
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2021
- 2021-09-07 CN CN202122151272.XU patent/CN216600537U/en active Active
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