CN212781915U - Multiple heat radiation structure of computer chip - Google Patents
Multiple heat radiation structure of computer chip Download PDFInfo
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- CN212781915U CN212781915U CN202021604137.5U CN202021604137U CN212781915U CN 212781915 U CN212781915 U CN 212781915U CN 202021604137 U CN202021604137 U CN 202021604137U CN 212781915 U CN212781915 U CN 212781915U
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- heat dissipation
- radiator
- sleeve
- seat
- radiating
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Abstract
The utility model relates to a computer chip heat dissipation technical field specifically is a multiple heat radiation structure of computer chip, including first radiating seat, the below of first radiating seat is provided with first radiator, and the below of first radiator is provided with the second radiating seat, the below of second radiating seat is provided with the second radiator, and the below of second radiator is provided with the third radiating seat, the below of third radiating seat is provided with unable adjustment base. The utility model discloses a be provided with first heat dissipation copper post, second heat dissipation copper post and third heat dissipation copper post and can carry out the metal heat conduction to this structure, through being provided with the area of contact of the multiplicable this structure of first aluminium system heat radiation fins, second aluminium system heat radiation fins and third aluminium system heat radiation fins and mobile air, through the area of contact of increase and external mobile air, through being provided with first radiator and second radiator, let this structure can carry out the efficient heat dissipation.
Description
Technical Field
The utility model relates to a computer chip heat dissipation technical field specifically is a computer chip's multiple heat radiation structure.
Background
The computer chip is a thin sheet made of silicon, one chip is connected together by hundreds of electric microcircuits, the volume is small, only the size of the nail is about, and the computer, the automation device and other various devices needing to be operated can be controlled by transmitting current in the microcircuits.
Because the chip needs to transport and carry current when performing circuit operation, the process can cause the chip to generate heat, and the circuit is that a plurality of chips cooperate with each other, so the generated heat is easy to gather and difficult to dissipate.
Chip heat radiation structure, it is two kinds that generally mainly adopt forced air cooling and water-cooling, and the water-cooling is because the price is expensive, and in case the water-cooling exists and reveals, directly leads to the potential safety hazard of circuit damage, consequently is mostly the forced air cooling to the radiating mode of chip.
Current chip heat radiation structure is more single, is mostly simple heat conduction bar copper, heat dissipation aluminum plate and fan, and like this with the air area of contact of external flow limited, be difficult to carry out the efficient heat dissipation.
The existing chip heat dissipation efficiency is limited, but the overall heat dissipation efficiency is difficult to improve by metal heat conduction and air cooling heat dissipation, and a multiple heat dissipation structure of a computer chip is urgently needed to solve the problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a multiple heat radiation structure of computer chip to the heat radiation structure who proposes in solving above-mentioned background is single, and is limited with outside air area of contact, the problem that radiating efficiency has the limitation.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a multiple heat radiation structure of computer chip, includes first radiating seat, the below of first radiating seat is provided with first radiator, and the below of first radiator is provided with the second radiating seat, the below of second radiating seat is provided with the second radiator, and the below of second radiator is provided with the third radiating seat, the below of third radiating seat is provided with unable adjustment base, the left and right sides of first radiating seat and third radiating seat is inserted and is equipped with the heat pipe.
Preferably, the first heat dissipation seat comprises a first heat dissipation copper column and first aluminum heat dissipation fins, the first aluminum heat dissipation fins are arranged in a radial shape, and grooves are formed in the bottoms of the first aluminum heat dissipation fins.
Preferably, the first heat sink includes a first connecting fixing frame and a first heat dissipating fan, the first connecting fixing frame is adapted to a bottom groove of the first aluminum heat dissipating fin sleeved above the first connecting fixing frame, and the radius of the first heat dissipating fan is the same as that of the first heat dissipating seat.
Preferably, the second heat dissipation seat comprises a second heat dissipation copper column and second aluminum heat dissipation fins, the second aluminum heat dissipation fins are arranged in a radial shape, grooves are formed in the bottoms of the second aluminum heat dissipation fins, and the radius of the second aluminum heat dissipation fins is the same as that of the first heat dissipation seat.
Preferably, the second heat sink includes a second connecting fixing frame and a second heat dissipation fan, the second connecting fixing frame is matched with a groove at the bottom of a second aluminum heat dissipation fin sleeved above the second connecting fixing frame in size, and the radius of the second heat dissipation fan is the same as that of the first heat dissipation seat.
Preferably, the third heat dissipation seat comprises a third heat dissipation copper column and a third aluminum heat dissipation fin, the third heat dissipation copper column is arranged in a radial shape, and the radius of the third aluminum heat dissipation fin is the same as that of the first heat dissipation seat.
Preferably, the fixing base comprises a fixing base support, a chip radiating groove, a bolt sleeve, a bolt head and a bolt rod, the chip radiating groove is formed in the fixing base support, the outer end of the fixing base support is provided with the bolt sleeve, the bolt head is fixedly connected to the lower portion of the bolt sleeve, and the bolt rod is inserted into the upper portion of the bolt sleeve.
Preferably, the heat pipe includes first sleeve, second sleeve and second radiating seat, first telescopic upside transversely runs through in first radiating seat, first telescopic downside transversely runs through in the third radiating seat, the second sleeve sets up in first sleeve upside, the second radiating seat sets up in first telescopic downside, the surface of first heat dissipation copper post is located to the second sleeve cover, the surface of third heat dissipation copper post is located to the second sleeve cover.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a be provided with first heat dissipation copper post, second heat dissipation copper post and third heat dissipation copper post can carry out the metal heat conduction to this structure, through being provided with first aluminium system heat radiation fins, the area of contact of multiplicable this structure of second aluminium system heat radiation fins and third aluminium system heat radiation fins and mobile air, can dispel the heat to first aluminium system heat radiation fins through being provided with first radiator fan and second radiator fan, second aluminium system heat radiation fins and third aluminium system heat radiation fins, area of contact through increase and external mobile air, through being provided with first radiator and second radiator, let this structure can carry out the efficient heat dissipation.
2. The utility model discloses a be provided with the cover and locate the first sleeve on third heat dissipation copper post and first heat dissipation copper post surface, can increase the device's radiating efficiency, when letting this structure possess traditional metal heat-conduction and air-cooled heat dissipation, also have the quick heat-conduction heat radiation structure of phase change medium, radiating efficiency far surpasss the heat-conduction heat dissipation of metal, increases substantially and changes the overall radiating efficiency of structure.
Description of the drawings:
in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a front perspective view of the present invention;
FIG. 2 is a front perspective exploded view of the present invention;
FIG. 3 is a front perspective view of the fixing base of the present invention;
fig. 4 is a front perspective view of the heat pipe of the present invention.
In the figure: 1. a first heat sink; 101. a first heat-dissipating copper pillar; 102. a first aluminum heat dissipation fin; 2. a first heat sink; 201. a first connecting fixing frame; 202. a first heat dissipation fan; 3. a second heat sink; 301. a second heat-dissipating copper pillar; 302. a second aluminum heat dissipation fin; 4. A second heat sink; 401. the second connecting fixing frame; 402. a second heat dissipation fan; 5. a third heat sink; 501. a third heat dissipation copper column; 502. a third aluminum heat dissipation fin; 6. a fixed base; 601. fixing a base bracket; 602. a chip heat sink; 603. a bolt bushing; 604. A bolt head; 605. a bolt shank; 7. a heat pipe; 701. a first sleeve; 702. a second sleeve.
The specific implementation mode is as follows:
the technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides an embodiment: the utility model provides a multiple heat radiation structure of computer chip, includes first heat dissipation seat 1, first heat dissipation seat 1 includes first heat dissipation copper post 101 and first aluminium system heat radiation fins 102, first aluminium system heat radiation fins 102 set up to radially, first aluminium system heat radiation fins 102 bottom is seted up flutedly, through being provided with first heat dissipation copper post 101, can carry out metal heat conduction to the heat that the chip produced when moving, through being provided with first aluminium system heat radiation fins 102, can increase the area of contact of first heat dissipation copper post 101 with the external air that flows, improve the radiating efficiency of first heat dissipation copper post 101.
The first radiator 2 is arranged below the first radiating seat 1, the first radiator 2 comprises a first connecting fixing frame 201 and a first radiating fan 202, the size of the first connecting fixing frame 201 is matched with a groove in the bottom of the first aluminum radiating fin 102 sleeved above the first connecting fixing frame, the radius of the first radiating fan 202 is the same as that of the first radiating seat 1, the first connecting fixing frame 201 is arranged to support the operation of the first radiating fan 202, the first connecting fixing frame can be clamped with the groove arranged below the first aluminum radiating fin 102 at the top of the first radiating fan 202, and the first radiating fan 202 is arranged to manufacture flowing air flow to assist the first aluminum radiating fin 102 to carry out air cooling radiation.
The second heat dissipation seat 3 is arranged below the first heat sink 2, the second heat dissipation seat 3 comprises a second heat dissipation copper column 301 and a second aluminum heat dissipation fin 302, the second aluminum heat dissipation fin 302 is arranged in a radial shape, a groove is formed in the bottom of the second aluminum heat dissipation fin 302, the radius of the second aluminum heat dissipation fin 302 is the same as that of the first heat dissipation seat 1, the second heat dissipation copper column 301 is arranged, heat generated during chip operation can be conducted through metal heat conduction, the contact area between the second heat dissipation copper column 301 and external flowing air can be increased through the arrangement of the second aluminum heat dissipation fin 302, and the heat dissipation efficiency of the second heat dissipation copper column 301 is improved.
The second radiator 4 is arranged below the second radiating seat 3, the second radiator 4 comprises a second connecting fixing frame 401 and a second radiating fan 402, the size of the second connecting fixing frame 401 is matched with the groove at the bottom of the second aluminum radiating fin 302 sleeved above the second connecting fixing frame, the radius of the second radiating fan 402 is the same as that of the first radiating seat 1, the second connecting fixing frame 401 is arranged to support the operation of the second radiating fan 402, the second connecting fixing frame can be clamped with the groove arranged below the second aluminum radiating fin 302 at the top of the second connecting fixing frame, and the second radiating fan 402 is arranged to produce flowing air flow to assist the second aluminum radiating fin 302 to perform air cooling and radiating.
The third heat dissipation seat 5 is arranged below the second heat sink 4, the third heat dissipation seat 5 comprises a third heat dissipation copper column 501 and a third aluminum heat dissipation fin 502, the third heat dissipation copper column 501 is arranged in a radial shape, the radius of the third aluminum heat dissipation fin 502 is the same as that of the first heat dissipation seat 1, through the third heat dissipation copper column 501, heat generated during chip operation can be conducted through metal heat conduction, through the third aluminum heat dissipation fin 502, the contact area of the third heat dissipation copper column 501 and external flowing air can be increased, the heat dissipation efficiency of the third heat dissipation copper column 501 is improved, and efficient heat dissipation can be achieved through the structure.
The fixing base 6 is arranged below the third heat sink 5, the fixing base 6 comprises a fixing base support 601, a chip heat sink 602, a bolt sleeve 603, a bolt head 604 and a bolt rod 605, the chip heat sink 602 is arranged in the fixing base support 601, the outer ends of the fixing base support 601 are all provided with the bolt sleeve 603, the bolt head 604 is fixedly connected below the bolt sleeve 603, the bolt rod 605 is inserted in the upper part of the bolt sleeve 603, the fixing base support 601 is arranged to support and fix the structure above the fixing base support, the chip heat sink 602 is arranged to conduct the heat generated during the operation of the chip to the third heat sink copper column 501, the bolt sleeve 603 is arranged to support the rotation of the bolt rod 605, the device can be fixed on the surface of the chip mainboard by the bolt head 604, and the bolt rod 605 is arranged, the bolt head 604 can be driven to rotate to fix the device.
The heat pipes 7 are inserted into the left and right sides of the first heat sink 1 and the third heat sink 5, each heat pipe 7 comprises a first sleeve 701, a second sleeve 702 and a second heat sink 3, the upper side of the first sleeve 701 transversely penetrates through the first heat sink 1, the lower side of the first sleeve 701 transversely penetrates through the third heat sink 5, the second sleeve 702 is arranged on the upper side of the first sleeve 701, the second heat sink 3 is arranged on the lower side of the first sleeve 701, the second sleeve 702 is sleeved on the surface of the first heat-dissipating copper column 101, the second sleeve 702 is sleeved on the surface of the third heat-dissipating copper column 501, the first sleeve 701 is arranged to efficiently dissipate heat of the device, the top end of the first sleeve 701 is transversely inserted into the first heat sink 1, the bottom end of the first sleeve 701 is transversely inserted into the third heat sink 5 to fix and connect the whole structure, and the first sleeve 701 is arranged, can establish third heat dissipation copper post 501 with the cover, let the inside coolant liquid that sets up of heat pipe 7 absorb the heat, through being provided with second sleeve 702, can establish first heat dissipation copper post 101 with the cover, let the coolant liquid of the inside setting of heat pipe 7 absorb the heat, when this structure has traditional metal heat conduction heat dissipation and air-cooled heat dissipation, increased the quick heat-conduction heat radiation structure of phase change medium, the radiating efficiency of totality promotes by a wide margin.
The working principle is as follows: before use, the chip heat dissipation groove 602 of the structure is firstly placed above the chip, the bolt rod 605 supported by the bolt sleeve 603 is rotated to drive the bolt head 604 to rotate, so that the bolt head 604 is in threaded connection with the chip main board, and at this moment, the structure for bearing and fixing above the fixed base support 601 is installed.
When the heat dissipation structure is used, heat is generated along with the operation of a chip, the generated heat is conducted through the third heat dissipation copper column 501 arranged above the chip, in the conduction process, the contact area with the outside air is enlarged through the third aluminum heat dissipation fins 502, the heat dissipation efficiency of the third heat dissipation copper column 501 is increased, the second heat dissipation fan 402 arranged above the third heat dissipation copper column 501 increases the air flow speed of the third aluminum heat dissipation fins 502 in the air contact process, so that the third aluminum heat dissipation fins 502 can be heated by air flow in the heat dissipation process, the heat conduction and heat dissipation efficiency of metal is increased, the second connection fixing frame 401 arranged above the second heat dissipation fan 402 can provide support for the second heat dissipation fan 402 to operate, the second heat dissipation fan 402 is arranged to be mutually matched with the grooves arranged at the bottom of the second aluminum heat dissipation fins 302, and the second heat dissipation fan 402 can be connected with the second aluminum heat dissipation fins 302, the structure can be subjected to metal heat conduction and radiation by being provided with the second radiating copper columns 301, the contact area of the second radiating copper columns 301 with the flowing air outside can be increased by being provided with the second aluminum radiating fins 302, the radiating efficiency of the structure can be increased, the flowing air flow can be made above the second aluminum radiating fins 302 by being provided with the first radiating fans 202, the radiating efficiency of the structure can be increased, the first connecting fixing frames 201 can provide support for the operation of the first radiating fans 202 arranged below the first connecting fixing frames 201, the first aluminum radiating fins 102 arranged above the first connecting fixing frames 201 can be clamped and connected by being provided with the first radiating copper columns 101, the metal heat conduction and radiation can be performed by being provided with the first aluminum radiating fins 102, the contact area of the first radiating copper columns 101 with the flowing air outside can be increased, and the radiating efficiency of the structure can be increased, through being provided with transversely insert the first sleeve 701 of locating first radiating seat 1 and the 5 both sides of third radiating seat, can provide the quick heat-conduction heat dissipation of phase change medium for the device, let the device's radiating efficiency improve, locate first radiating copper post 101 outward appearance first sleeve 701 through being provided with the cover, can increase the efficiency of metal heat conduction, locate third radiating copper post 501 outward appearance second radiating seat 3 through being provided with the cover, can increase the efficiency of metal heat conduction, let the device's radiating efficiency higher.
The above is the whole working principle of the utility model.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a multiple heat radiation structure of computer chip, includes first radiating seat (1), its characterized in that: the heat pipe is characterized in that a first radiator (2) is arranged below the first radiator (1), a second radiator (3) is arranged below the first radiator (2), a second radiator (4) is arranged below the second radiator (3), a third radiator (5) is arranged below the second radiator (4), a fixing base (6) is arranged below the third radiator (5), and heat pipes (7) are inserted into the left side and the right side of the first radiator (1) and the left side and the right side of the third radiator (5).
2. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the first heat dissipation seat (1) comprises a first heat dissipation copper column (101) and first aluminum heat dissipation fins (102), the first aluminum heat dissipation fins (102) are arranged in a radial shape, and grooves are formed in the bottoms of the first aluminum heat dissipation fins (102).
3. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the first radiator (2) comprises a first connecting fixing frame (201) and a first radiating fan (202), the size of the first connecting fixing frame (201) is matched with a groove at the bottom of a first aluminum radiating fin (102) sleeved on the first connecting fixing frame, and the radius of the first radiating fan (202) is the same as that of the first radiating seat (1).
4. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the second heat dissipation seat (3) comprises a second heat dissipation copper column (301) and second aluminum heat dissipation fins (302), the second aluminum heat dissipation fins (302) are arranged in a radial shape, grooves are formed in the bottoms of the second aluminum heat dissipation fins (302), and the radius of the second aluminum heat dissipation fins (302) is the same as that of the first heat dissipation seat (1).
5. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the second radiator (4) comprises a second connecting fixing frame (401) and a second radiating fan (402), the size of the second connecting fixing frame (401) is matched with a groove at the bottom of a second aluminum radiating fin (302) sleeved above the second connecting fixing frame, and the radius of the second radiating fan (402) is the same as that of the first radiating seat (1).
6. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the third heat dissipation seat (5) comprises third heat dissipation copper columns (501) and third aluminum heat dissipation fins (502), the third heat dissipation copper columns (501) are arranged in a radial shape, and the radius of the third aluminum heat dissipation fins (502) is the same as that of the first heat dissipation seat (1).
7. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the fixing base (6) comprises a fixing base support (601), a chip heat dissipation groove (602), a bolt sleeve (603), a bolt head (604) and a bolt rod (605), the chip heat dissipation groove (602) is formed in the fixing base support (601), the outer end of the fixing base support (601) is provided with the bolt sleeve (603), the bolt head (604) is fixedly connected to the lower portion of the bolt sleeve (603), and the bolt rod (605) is inserted into the upper portion of the bolt sleeve (603).
8. The multiple heat dissipation structure of a computer chip according to claim 1, wherein: the heat pipe (7) comprises a first sleeve (701), a second sleeve (702) and a second heat dissipation seat (3), wherein the upper side of the first sleeve (701) transversely penetrates through the first heat dissipation seat (1), the lower side of the first sleeve (701) transversely penetrates through the third heat dissipation seat (5), the second sleeve (702) is arranged on the upper side of the first sleeve (701), the second heat dissipation seat (3) is arranged on the lower side of the first sleeve (701), the surface of the first heat dissipation copper column (101) is sleeved with the second sleeve (702), and the surface of the third heat dissipation copper column (501) is sleeved with the second sleeve (702).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021604137.5U CN212781915U (en) | 2020-08-05 | 2020-08-05 | Multiple heat radiation structure of computer chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021604137.5U CN212781915U (en) | 2020-08-05 | 2020-08-05 | Multiple heat radiation structure of computer chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212781915U true CN212781915U (en) | 2021-03-23 |
Family
ID=75050213
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021604137.5U Expired - Fee Related CN212781915U (en) | 2020-08-05 | 2020-08-05 | Multiple heat radiation structure of computer chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212781915U (en) |
-
2020
- 2020-08-05 CN CN202021604137.5U patent/CN212781915U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210323 Termination date: 20210805 |