CN217116708U

CN217116708U - Heat dissipation device for vehicle-mounted electronic product and vehicle-mounted electronic product

Info

Publication number: CN217116708U
Application number: CN202121029249.7U
Authority: CN
Inventors: 杨清; 张舒雅; 李鹏飞; 向青宝
Original assignee: Ecarx Hubei Tech Co Ltd
Current assignee: Ecarx Hubei Tech Co Ltd
Priority date: 2021-05-13
Filing date: 2021-05-13
Publication date: 2022-08-02
Anticipated expiration: 2031-05-13

Abstract

The utility model relates to a heat abstractor and on-vehicle electronic product for on-vehicle electronic product. The heat dissipation device for the vehicle-mounted electronic product comprises a heat dissipation structure and a core board structure, wherein the heat dissipation structure comprises heat dissipation fins; the core board structure comprises a core board, wherein the inner side surface of the core board is used for fixing the electronic element of the vehicle-mounted electronic product and is fixed on the inner side surface of the radiating fin, and the heat emitted by the electronic element is conducted to the radiating fin. The utility model provides a heat abstractor for on-vehicle electronic product, through inciting somebody to action core plate snap-on is in on the medial surface of fin, have the function of panel beating support concurrently when the fin provides the heat dissipation function, reduce the use of panel beating support, be convenient for arrange the fin in the narrow and small inner space of on-vehicle electronic product.

Description

Heat dissipation device for vehicle-mounted electronic product and vehicle-mounted electronic product

Technical Field

The utility model relates to a vehicle-mounted electronic product heat dissipation technical field, in particular to heat abstractor and vehicle-mounted electronic product for vehicle-mounted electronic product.

Background

Along with the acceleration of the update of the existing intelligent vehicle-mounted electronic product, the demands for high-performance and high-integration core modules are increasing day by day, the size of a module assembly is smaller and smaller, the heat productivity is large during working, electronic components need to be radiated as soon as possible to ensure the normal work of the module, and therefore the radiating problem of intelligent equipment is more and more emphasized. Generally, a circuit board is provided with a heat sink, and a layer of heat-conducting silicone grease is coated on the contact surface of an electronic component and the heat sink, so that heat emitted by the component is more effectively conducted to the heat sink and then dissipated to the surrounding air through the heat sink.

The existing radiating fin mainly adopts an aluminum extrusion processing mode, and the main production method is to heat an aluminum ingot to a certain temperature and extrude a strip-shaped section with fins from a die. However, the heat sink has the obvious disadvantages that the heat sink cannot be directly processed into a complex shape, secondary processing, surface treatment and the like are required to be carried out on the cut aluminum profile, the process is complex, and the production cost is high. At present, the volume demand on the module assembly is smaller and smaller, and the requirement on the heat dissipation efficiency is higher and higher. The inner space of the product is narrow, so that the size design of parts is limited, and the problem to be solved at present is to realize the assembly of the product by using fewer parts as far as possible.

Please refer to fig. 1, which is an exploded view of a structure of an intelligent vehicle-mounted product according to a conventional scheme, including a first antenna bracket, a second antenna bracket, a core board, a heat sink, a metal plate bracket 61, a heat-conducting silica gel pad, a bottom cover, and screws. Wherein the first support of antenna and the lock of 3 screws for the second support of antenna attach on the panel beating support, electronic component welds on nuclear core plate, keeps apart with heat conduction silica gel pad at electronic component and fin contact surface, and nuclear core plate locks together on the panel beating support through 4 screws and fin again, 3 screws for the bottom lock on the panel beating support.

Disclosure of Invention

An embodiment of the utility model provides a heat abstractor for on-vehicle electronic product to solve among the prior art on-vehicle electronic product inner space narrow and small, and on-vehicle electronic product assembles the many technical problem of part with the fin.

In a first aspect, the utility model provides a heat abstractor for on-vehicle electronic product, include:

the heat dissipation structure comprises a heat dissipation fin;

the core board structure comprises a core board, wherein the inner side surface of the core board is used for fixing electronic elements of the vehicle-mounted electronic product;

the inner side surface of the core plate is fixed on the inner side surface of the radiating fin and used for conducting heat emitted by the electronic element to the radiating fin.

In some embodiments, the heat dissipation structure further includes a heat dissipation boss extending from the heat dissipation plate toward the core board and corresponding to the electronic component, and the heat dissipation boss is used for conducting heat in contact with the electronic component.

In some embodiments, the heat sink is provided with a support rib protruding from the edge of the core board.

In some embodiments, the electronic device further comprises a heat-conducting silicone pad, wherein the heat-conducting silicone pad is used for being arranged between the heat-radiating boss and the electronic element for conducting heat.

In some embodiments, further comprising:

the support structure comprises a first antenna support and a second antenna support, the first antenna support and the second antenna support are used for fixing antennas, and the first antenna support and the second antenna support are fixed on the top of the radiating fin;

and the bottom cover is fixed at the bottom of the radiating fin.

In some embodiments, the heat sink is a die cast aluminum heat sink.

In some embodiments of the present invention, the first and second,

the core plate is fixed on the inner side surface of the radiating fin in a threaded manner; and/or the presence of a gas in the gas,

the first antenna bracket and the second antenna are fixedly connected with the top of the radiating fin in a threaded manner; and/or the presence of a gas in the gas,

the bottom cover is fixed at the bottom of the radiating fin in a threaded manner.

In some embodiments of the present invention, the first and second,

a plurality of first positioning columns are arranged on the inner side surface of the radiating fin, and first positioning holes corresponding to the first positioning columns are arranged on the inner side surface of the core plate; and/or the presence of a gas in the gas,

a plurality of second positioning columns are arranged on the top end surface of the radiating fin, and second positioning holes corresponding to the second positioning columns are formed in the first antenna support and the second antenna support;

the bottom cover is provided with a plurality of third positioning columns, and the bottom cover is provided with a plurality of third positioning holes corresponding to the third positioning columns.

In some embodiments, the first positioning pillars, the second positioning pillars, and the third positioning pillars are integrally formed with the heat sink.

In a second aspect, the present invention further provides a vehicle-mounted electronic product, which is characterized by comprising the heat dissipation device for vehicle-mounted electronic product.

The utility model provides a beneficial effect that technical scheme brought includes:

the utility model provides a heat abstractor for on-vehicle electronic product, through inciting somebody to action core plate snap-on is in on the medial surface of fin, have the function of panel beating support concurrently when the fin provides the heat dissipation function, reduce the use of panel beating support, be convenient for effectively arrange the fin in the narrow and small inner space of on-vehicle electronic product.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 is an exploded schematic view of a heat dissipation device for a vehicle-mounted electronic product according to the prior art;

fig. 2 is an exploded schematic view of a heat dissipation device for a vehicle-mounted electronic product according to an embodiment of the present invention;

fig. 3 is a schematic diagram of an outer side surface structure of a heat dissipation structure according to an embodiment of the present invention;

fig. 4 is a schematic structural diagram of a core plate structure according to an embodiment of the present invention;

fig. 5 is a schematic view of an inner side surface structure of a heat dissipation structure according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a heat dissipation device for a vehicle-mounted electronic product according to an embodiment of the present invention;

FIG. 7 is a schematic cross-sectional view taken along the line A-A in FIG. 6;

fig. 8 is a schematic structural diagram of a support structure according to an embodiment of the present invention;

fig. 9 is a schematic top structure view of a heat dissipation structure according to an embodiment of the present invention;

fig. 10 is a schematic structural diagram of a bottom cover according to an embodiment of the present invention;

fig. 11 is a schematic bottom structure diagram of a heat dissipation structure according to an embodiment of the present invention.

In the figure:

11. a first antenna mount; 12. a second antenna mount; 13. a first screw; 21. a core plate; 23. a second screw; 31. a heat sink; 32. a heat dissipation boss; 33. a first positioning post; 34. a second positioning column; 35. a third positioning column; 36. supporting ribs; 41. a heat-conducting silica gel pad; 51. a bottom cover; 52. a third positioning hole; 53. a third screw; 61. a sheet metal bracket; 71. an electronic component.

Detailed Description

To make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and obviously, the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

An embodiment of the utility model provides a heat abstractor for on-vehicle electronic product to solve at present to the volume demand of module subassembly littleer and more, and also more and more high to the requirement of radiating efficiency. The inner space of the product is narrow, so that the size design of parts is limited, and the technical problem of realizing the assembly of the product by using fewer parts as far as possible is solved.

Referring to fig. 2, 3, 6 and 7, the present invention provides a heat dissipation device for a vehicle-mounted electronic product, including: the heat dissipation structure comprises a heat dissipation structure and a core board structure, wherein the heat dissipation structure comprises a heat dissipation fin 31, the core board structure comprises a core board 21, and the inner side surface of the core board 21 is used for fixing an electronic element 71 of a vehicle-mounted electronic product; the inner side surface of the core board 21 is fixed to the inner side surface of the heat sink 31, and is used for conducting heat generated by the electronic component 71 to the heat sink 31.

The utility model provides a heat abstractor for vehicle-mounted electronic product, through directly fixing the core plate 21 on the medial surface of the radiating fin 31, the radiating fin 31 has the function of a sheet metal bracket while providing the heat dissipation function, reduces the use of the sheet metal bracket, simplifies the assembly process, and avoids the sheet metal bracket from generating deformation and other adverse effects on the product assembly stability in the production and manufacturing process; while facilitating efficient arrangement of the heat sink 31 in a narrow internal space of the in-vehicle electronic product.

In an embodiment, referring to fig. 3, the size of the heat sink 31 is the same as the size of the core board, and the outer side surface of the heat sink 31 is provided with fins, so as to increase the contact area between the heat sink 31 and the air, and improve the fluidity of the air inside the heat sink 31, thereby increasing the heat dissipation effect of the heat sink 31.

In an embodiment, referring to fig. 5, the heat dissipation structure further includes a heat dissipation boss 32 extending from the heat dissipation plate 31 toward the core board 21 and corresponding to the electronic component 71, and the heat dissipation boss 32 is used for contacting the electronic component 71 to conduct heat, so as to improve the heat conduction effect.

In an embodiment, the heat sink 31 is convexly provided with a support structure at the edge of the core board 21, and the support structure is used for stably supporting the core board 21 and preventing the core board 21 from deforming after fastening and assembling so as to affect the assembling stability.

In a more specific embodiment, the supporting structure is a protruding supporting rib 36 located at the edge of the core board 21, and the supporting rib 36 is used for deformation of the core board 21 after the core board 21 is fixed on the heat sink 31, which causes damage to the product and increases the assembly stability of the heat dissipation device for the vehicle-mounted electronic product.

In an embodiment, the heat dissipation device for the vehicle-mounted electronic product further includes a soft thermal pad layer, which is disposed between the heat dissipation boss 32 and the electronic component 71 and is used for enhancing the contact thermal conduction effect between the electronic component 71 and the heat dissipation fin 31.

In a more specific embodiment, the soft heat conducting cushion layer is a heat conducting silica gel pad 41, the heat conducting silica gel pad 41 is used for being arranged between the heat dissipation boss 32 and the electronic component 71 for conducting heat, and the heat emitted by the electronic component 71 is effectively conducted to the heat dissipation sheet 31 through the heat conducting silica gel pad 41 and then dissipated to the surrounding air.

In one embodiment, the electronic components 71 are soldered and fixed to the inner side of the core board 21

In some embodiments, referring to fig. 8, the heat dissipation device for the vehicle-mounted electronic product further includes a support structure and a bottom cover 51, the support structure includes a first antenna support 11 and a second antenna support 12, the first antenna support 11 and the second antenna support 12 are both used for fixing an antenna, and the first antenna support 11 and the second antenna support 12 are both fixed on the top of the heat dissipation plate 31; the heat sink is fixed on the bottom of the heat sink 31 for presenting the appearance of the bottom of the product.

In some embodiments, the heat sink 31 is a die-cast aluminum heat sink 31, and the heat sink 31 is die-cast in a die-cast aluminum manner, so that sawing is not required, the heat sink 31 can be compatible with the function of a bracket for fixing and supporting, and the heat conduction effect is good and the heat dissipation is fast. Compared with the method that an aluminum ingot is heated to a certain temperature, the long-strip section with the fins is extruded from the die and cannot be directly heated into a section with a complex shape, the long-strip section with the fins needs to be cut, and the cut section needs to be subjected to secondary processing, surface treatment and the like, so that the method is complex in process and high in production cost. The die-casting formed radiating fin 31 can be directly processed into a complex shape, so that the radiating structure has the function of a metal plate support, cutting, secondary processing and surface treatment are not needed, the process is simple, and the production cost is low.

In some embodiments, referring to fig. 2, 4, 8 and 10, the core plate 21 is screwed on the inner side of the heat sink 31; and/or the presence of a gas in the gas,

the first antenna bracket 11 and the second antenna are screwed and fixed on the top of the heat sink 31; and/or the presence of a gas in the gas,

the bottom cover 51 is screwed to the bottom of the heat sink 31.

In a more specific embodiment, the mounting structure is locked to the top of the heat sink 31 by three first screws 13.

In a more specific embodiment, the core board 21 is locked to the inner side of the heat sink 31 by four second screws 23, so as to effectively improve the adhesion between the electronic component 71 on the core board 21 and the heat sink 31 and increase the stability of the product structure.

In a more specific embodiment, referring to fig. 10, the bottom cover 51 is correspondingly locked in the bottom of the heat sink 31 by two third screws 53.

As described above, through with core plate 21, supporting structure and bottom 51 spiro union are fixed in on the fin 31, make fin 31 has the function of panel beating support concurrently, thereby realizes the utility model discloses reduce the structural design scheme who arranges the on-vehicle heat abstractor for the electronic product of panel beating support.

In some embodiments, referring to fig. 5, a plurality of first positioning pillars 33 are disposed on an inner side surface of the heat sink 31, and first positioning holes corresponding to the plurality of first positioning pillars 33 are disposed on the inner side surface of the core plate 21; and/or the presence of a gas in the gas,

referring to fig. 5 and 9, a plurality of second positioning posts 34 are disposed on the top end surface of the heat sink 31, and second positioning holes corresponding to the second positioning posts 34 are disposed on both the first antenna support 11 and the second antenna support 12; and/or the presence of a gas in the gas,

referring to fig. 11, a plurality of third positioning pillars 35 are disposed on the bottom surface of the heat sink 31, and a plurality of third positioning holes 52 corresponding to the third positioning pillars 35 are disposed on the bottom cover 51.

As described above, according to the present application, by providing the plurality of first positioning pillars 33, the plurality of second positioning pillars 34, and the plurality of third positioning pillars 35, the heat dissipation structure provided by the present application not only can perform a heat dissipation function for the electronic component 71 of the core board 21, but also can perform a structural support function for other parts of the heat dissipation device for the entire vehicle-mounted electronic product, such as the support structure, the core board 21, and the bottom cover 51, instead of the support function of the conventional sheet metal support.

In some embodiments, the first positioning pillars 33, the second positioning pillars 34, and the third positioning pillars 35 are integrally formed with the heat sink 31.

In a second aspect, the present invention further provides a vehicle-mounted electronic product, including the heat dissipation device for vehicle-mounted electronic product as described above.

The utility model discloses an adopt die-casting aluminium fin 31, heat radiation structure has the function of panel beating support concurrently to reduce the use of panel beating support, reduce cost simplifies the assembly flow, is convenient for arrange fin 31 at narrow and small product inner space simultaneously, does not influence the radiating effect of product.

In the description of the present invention, it should be noted that the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are intended to be inclusive and mean, for example, that they may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

It is noted that, in the present invention, relational terms such as "first" and "second", and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The above description is only exemplary of the invention, and is intended to enable those skilled in the art to understand and implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a heat abstractor for on-vehicle electronic product which characterized in that includes:

the heat dissipation structure comprises a heat dissipation fin;

2. The heat dissipating device for an in-vehicle electronic product as claimed in claim 1, wherein the heat dissipating structure further includes a heat dissipating protrusion extending from the heat dissipating fin toward the core board and disposed corresponding to the electronic component, the heat dissipating protrusion being configured to contact the electronic component to conduct heat.

3. The heat sink for vehicular electronic products according to claim 2, wherein the heat sink has a support rib protruding therefrom at an edge of the core board.

4. The heat dissipating device for vehicle-mounted electronic products according to claim 2, further comprising a heat conductive silicone pad disposed between the heat dissipating protrusion and the electronic component for transferring heat.

5. The heat dissipating device for an in-vehicle electronic product according to claim 1, further comprising:

and the bottom cover is fixed at the bottom of the radiating fin.

6. The heat sink for vehicle-mounted electronic products according to claim 1, wherein the heat sink is a die-cast aluminum heat sink.

7. The heat dissipating device for an in-vehicle electronic product according to claim 5,

8. The heat dissipating device for an in-vehicle electronic product according to claim 7,

a plurality of first positioning columns are arranged on the inner side surface of the radiating fin, and first positioning holes corresponding to the first positioning columns are formed in the inner side surface of the core plate; and/or the presence of a gas in the gas,

a plurality of second positioning columns are arranged on the top end face of the radiating fin, and second positioning holes corresponding to the second positioning columns are formed in the first antenna support and the second antenna support;

9. The heat dissipating device for vehicle-mounted electronic products as claimed in claim 8, wherein the plurality of first positioning posts, the plurality of second positioning posts, and the plurality of third positioning posts are integrally formed with the heat dissipating fin.

10. A vehicle-mounted electronic product, characterized by comprising the heat dissipating device for a vehicle-mounted electronic product according to any one of claims 1 to 9.