CN212910525U

CN212910525U - Heat radiation structure of power module and power module

Info

Publication number: CN212910525U
Application number: CN202021593912.1U
Authority: CN
Inventors: 钟华生; 余勇
Original assignee: Guowei Group Shenzhen Co ltd
Current assignee: Shenzhen Guoweijingrui Technology Co ltd
Priority date: 2020-08-04
Filing date: 2020-08-04
Publication date: 2021-04-06
Anticipated expiration: 2030-08-04

Abstract

The utility model discloses a power module's heat radiation structure and power module, power module install the bottom surface at the PCB board, heat radiation structure includes: the PCB is arranged on the heat dissipation plate, a boss or a groove is respectively arranged at the position, corresponding to each heating element of the power module, on the heat dissipation plate, and a heat conduction sheet is arranged between the boss or the groove and the heating element. The utility model discloses a position that corresponds heating element on the heating panel sets up recess or boss and comes with heating element's high phase-match, makes every heating element unanimous with the top surface of the boss that corresponds it or the distance of the bottom surface of recess, can guarantee heating panel, heat conduction silica gel piece and heating element and fully contact, guarantees that the heat derives rapidly. And the structure is compact, and the limitation of the space size of the product is obviously reduced.

Description

Heat radiation structure of power module and power module

Technical Field

The utility model relates to a semiconductor field especially relates to a power module's heat radiation structure and power module.

Background

The conventional heat dissipation structure of the power module generally discharges heat through a practical fin radiator, and the fin radiator generally needs practical screws or heat-conducting double-sided adhesive tapes to fix the fin radiator on the surface of a heating element, so that the temperature of the element is reduced and the normal operation of the heat dissipation module is ensured. The heat dissipation mode needs to buy parts such as a heat radiator, a screw, a heat conduction double-sided adhesive tape and the like separately, so that the cost is increased and the installation is more complicated.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a solve the technical problem among the above-mentioned prior art, provide a power module's heat radiation structure and power module.

The utility model adopts the technical proposal that:

the utility model provides a power module's heat radiation structure and power module, power module installs the bottom surface at the PCB board, heat radiation structure includes: the PCB is arranged on the heat dissipation plate, a boss or a groove is respectively arranged at the position, corresponding to each heating element of the power module, on the heat dissipation plate, and a heat conduction sheet is arranged between the boss or the groove and the heating element.

Preferably, the material of the heat conducting sheet is silica gel.

Preferably, the distance between each of the heat generating elements and the boss or the groove is between 0.50mm and 0.60 mm.

Furthermore, the heat dissipation plate is provided with a plurality of threaded columns with threaded holes, and the PCB is fixed on the threaded columns through screws. The middle part of heat dissipation frame is equipped with the mounting groove, the heating panel is installed in the mounting groove. The heat dissipation plate is fixed on the heat dissipation rack through screws.

Preferably, the heat dissipation frame is made of aluminum. The heating panel is aluminum plate. The thickness of heat conduction silica gel piece is 0.7 mm.

The utility model also provides a power module uses above-mentioned heat radiation structure.

Compared with the prior art, the utility model discloses a position that corresponds heating element on the heating panel sets up the recess or sets up the boss and come with heating element's high phase-match, makes every heating element unanimous with the top surface of the boss that corresponds it or the distance of the bottom surface of recess, can guarantee heating panel, heat conduction silica gel piece and heating element fully contact, guarantees that the heat derives rapidly.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.

Fig. 1 is an exploded view of an embodiment of the present invention;

fig. 2 is a schematic structural diagram of an embodiment of the present invention.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

In the description of the present invention, it is to be understood that the terms "center", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.

The principles and structure of the present invention will be described in detail below with reference to the accompanying drawings and examples.

As shown in fig. 1 and fig. 2, the utility model provides a power module's heat radiation structure and power module, power module install in the bottom surface of PCB board 4, and power module includes a plurality of different heating element of height, and heat radiation structure includes: the heat dissipation device comprises a heat dissipation frame 2 and a heat dissipation plate 1, wherein the heat dissipation plate 1 is installed on the heat dissipation frame 2, a groove 12 or a boss 11 is arranged on the heat dissipation plate 1 corresponding to each heating element to be matched with the height of the heating element, and the distance between each heating element and the top surface of the boss 11 corresponding to the heating element or the bottom surface of the groove 12 is consistent. Be equipped with conducting strip 3 between boss 11 or recess 12 and the heating element, conducting strip 3 is the silica gel conducting strip, sets up boss and recess through the height that corresponds heat radiating element, can guarantee heating panel, heat conduction silica gel piece and heating element full contact, guarantees that the heat is derived rapidly.

In a specific embodiment, the distance between each heating element and the boss 11 or the groove 12 is between 0.50mm and 0.60mm, and the optimal distance is kept at 0.55 mm. The size of the heat conducting silicon sheet is 30mm 0.7mm, namely the thickness is 0.7mm, the heat conducting silicon sheet is adhered on the boss 11 and the groove 12 of the heat dissipation plate 1 and is in interference fit with the heating element, and the heat conducting silicon sheet has elasticity and cannot damage the element.

The utility model discloses in, be equipped with the screw thread post of a plurality of threaded holes on the heating panel 1, PCB board 4 passes through the fix with screw on the screw thread post, and the middle part of heat dissipation frame 2 is equipped with the mounting groove, and the heating panel passes through the mounting groove position of mounting screw in the heat dissipation frame, is convenient for confirm the position, improves the installation effectiveness.

In a specific embodiment, the heat sink frame 2 and the heat sink plate 1 are made of aluminum, which has good heat conductivity and can rapidly conduct heat of the heating element.

The utility model also provides a power module, including above-mentioned heat radiation structure.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. The utility model provides a power module's heat radiation structure, power module installs the bottom surface at the PCB board, its characterized in that, heat radiation structure includes: the PCB is arranged on the heat dissipation plate, a boss or a groove is respectively arranged at the position, corresponding to each heating element of the power module, on the heat dissipation plate, and a heat conduction sheet is arranged between the boss or the groove and the heating element.

2. The heat dissipating structure of a power module as claimed in claim 1, wherein the heat conducting sheet is made of silicon.

3. The heat dissipation structure of a power module as set forth in claim 1, wherein a distance between each of the heat generating elements and the boss or the groove is between 0.50mm and 0.60 mm.

4. The heat dissipating structure of a power module as claimed in claim 1, wherein the heat dissipating plate is provided with a plurality of screw posts having screw holes, and the PCB is fixed to the screw posts by screws.

5. The heat dissipation structure of a power module as claimed in claim 1, wherein a mounting groove is formed at a middle portion of the heat dissipation frame, and the heat dissipation plate is mounted in the mounting groove.

6. The heat dissipation structure of a power module as claimed in claim 1, wherein the heat dissipation frame is made of aluminum.

7. The heat dissipation structure of a power module as set forth in claim 1, wherein the heat dissipation plate is an aluminum plate.

8. The heat dissipation structure of a power module as set forth in claim 1, wherein the heat dissipation plate is fixed to the heat dissipation frame by screws.

9. The heat dissipation structure of a power module as set forth in claim 2, wherein the heat conductive sheet has a thickness of 0.7 mm.

10. A power module characterized by comprising the heat dissipation structure of any one of claims 1 to 9.