CN212809780U - Memory convenient to heat dissipation - Google Patents

Memory convenient to heat dissipation Download PDF

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Publication number
CN212809780U
CN212809780U CN202022021187.7U CN202022021187U CN212809780U CN 212809780 U CN212809780 U CN 212809780U CN 202022021187 U CN202022021187 U CN 202022021187U CN 212809780 U CN212809780 U CN 212809780U
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China
Prior art keywords
circuit board
heat
cover
heat dissipation
radiator
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Active
Application number
CN202022021187.7U
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Chinese (zh)
Inventor
赵万里
曹立冬
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Hefei Liwanxin Electronic Technology Co ltd
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Hefei Liwanxin Electronic Technology Co ltd
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Priority to CN202022021187.7U priority Critical patent/CN212809780U/en
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Abstract

The utility model discloses a memory convenient to heat dissipation, which comprises a circuit board, the circuit board openly is equipped with a plurality of chip units, a power and signal interface, the samming board is openly posted to the chip unit, the region between the positive samming board of circuit board is equipped with the radiator, the region outside positive chip unit of circuit board, a power and signal interface, samming board, radiator is covered by the heat-conducting plate, the copper sheet has been laid at the circuit board back, be connected with the arc on the radiator, the arc is connected with the copper sheet. The utility model provides a not good not enough of radiating effect that prior art exists.

Description

Memory convenient to heat dissipation
Technical Field
The utility model relates to an electronic product heat dissipation technical field specifically is a memory convenient to heat dissipation.
Background
The memory is a main carrier of data storage, and plays a very important role in storing and backing up data in computers and electronic products, and the current memory is matched with a processor for high-speed operation, and tends to develop at high speed and high frequency no matter working frequency or transmission bandwidth, so that the working temperature of a memory module is higher and higher, the generated heat is higher and higher, and the requirement on heat dissipation performance is higher and higher.
The existing heat dissipation structure usually adopts laying radiating fins or installing a radiating fan to radiate heat of a memory, but has the following defects: because the heating degrees of all parts in the memory are inconsistent, the direct laying of the radiating fins is difficult to avoid that the heat of partial areas is difficult to conduct to cause local high heat, and the blowing range of the radiating fan is limited, so that the problem of uneven heat radiation also exists. The defects easily cause poor heat dissipation effect and damage to the memory.
SUMMERY OF THE UTILITY MODEL
For overcoming the not enough of prior art, the utility model provides a be convenient for radiating memory solves the not good not enough of radiating effect that prior art exists.
The utility model provides a technical scheme that above-mentioned problem adopted is:
the utility model provides a memory convenient to heat dissipation, includes the circuit board, the circuit board openly is equipped with a plurality of chip units, a power and signal interface, the samming board is openly posted to the chip unit, the region between the positive samming board of circuit board is equipped with the radiator, the region outside positive chip unit of circuit board, a power and signal interface, samming board, radiator is covered by the heat-conducting plate, the copper sheet has been laid at the circuit board back, be connected with the arc on the radiator, the arc is connected with the copper sheet.
In the technical scheme, the chip unit is used as a heat source, the chip unit is an area with the largest heat productivity, and the temperature equalizing plate dissipates heat to the area; part of heat generated by the chip unit is conducted to an area between the temperature equalizing plates on the front surface of the circuit board, and the heat radiator radiates the area; other regions on the front side of the circuit board are radiated by the heat conducting plate, the back side of the circuit board is radiated by the copper sheet layer, heat on the radiator and the copper sheet layer can be dissipated through the arc plate, the arc plate is favorable for increasing the radiating area and the heat conduction distance, and meanwhile, air in the space below the arc plate is also favorable for conducting heat to the outside. Therefore, the whole memory is divided into a plurality of heat dissipation areas with different gradients, so that heat dissipation is respectively facilitated according to different heating degrees and heating reasons, the heat dissipation uniformity is greatly improved, local high heat is prevented, and the heat dissipation effect is improved.
Preferably, the circuit board is externally provided with a first cover body and a second cover body which are detachably connected, the first cover body is externally provided with a condenser, the first cover body and the second cover body are matched to form an accommodating space, the surface of the copper sheet layer is connected with a connecting column, and the other end of the connecting column penetrates through the first cover body to be connected with the condenser.
The heat at the back of the circuit board is further conducted to the condenser outside the first cover body through the connecting column after being radiated by the copper skin layer, so that the radiating effect is further improved, the radiating speed is favorably improved, the space formed by the first cover body and the second cover body provides a containing space for the storage, and impurities such as dust in the external environment are favorably prevented from entering the circuit board, so that the poor radiating effect caused by the dust covering is avoided.
Preferably, the edge of the heat sink is flush with the side edge of the circuit board, and the edge of the heat conducting plate is flush with the side edge of the circuit board.
The structure enables the edges of the radiator and the heat conducting plate to be flush with the side edge of the circuit board and to be in direct contact with relevant areas on the circuit board, and therefore radiating uniformity and radiating efficiency are further improved.
Preferably, the fins of the heat sink are cylindrical.
When air flows among the dense columnar fins, a turbulent flow is formed around each columnar fin, so that the whole side surface of each columnar fin becomes an effective heat dissipation surface, the radiator has larger surface area and better heat conduction capability, and the heat dissipation effect is improved.
Preferably, the arc-shaped plate is provided with a through hole.
The through holes are beneficial to increasing the convection of heated hot air and cold air near the arc-shaped plate, and are also beneficial to increasing the contact area of the cold air and the arc-shaped plate, thereby improving the contact area of heat exchange and increasing the heat dissipation speed.
Preferably, a heat-conducting double-sided adhesive layer is arranged between the circuit board and the copper sheet layer.
The heat conduction double-sided adhesive layer plays a role in bonding the circuit board and the copper sheet layer, so that the circuit board is more fully contacted with the copper sheet layer, the surface area of heat conduction is increased, and the good heat conduction capability of the heat conduction double-sided adhesive layer is favorable for efficiently and quickly conducting heat on the back of the circuit board to the copper sheet layer.
Preferably, the first cover body and the second cover body are connected in a snap-in manner.
The buckle type connection is convenient to mount, dismount and mount, tool-free dismounting can be achieved, and maintenance of the storage are facilitated.
Compared with the prior art, the utility model, following beneficial effect has:
(1) the whole memory is divided into a plurality of heat dissipation areas with different gradients, so that heat dissipation is respectively facilitated according to different heating degrees and heating reasons, the heat dissipation uniformity is greatly improved, local high heat is prevented, and the heat dissipation effect is improved;
(2) the utility model is beneficial to improving the heat dissipation speed and the impurities such as dust in the external environment entering the circuit board, thereby avoiding the poor heat dissipation caused by the dust covering;
(3) the utility model has the advantages that the radiator has larger surface area and better heat conduction capability, and the heat radiation effect is further improved;
(4) the utility model is beneficial to the high-efficiency and rapid conduction of the heat on the back of the circuit board to the copper layer;
(5) the utility model discloses the installation is dismantled conveniently, can accomplish the instrument of exempting from to dismantle, and the maintenance of the memory of being convenient for is safeguarded.
Drawings
Fig. 1 is a schematic diagram of the position relationship among the circuit board, the chip unit, the power supply and the signal interface of the present invention;
FIG. 2 is a schematic structural view of the present invention;
FIG. 3 is a cross-sectional view taken along plane A-A of FIG. 2;
fig. 4 is a schematic structural view of the arc plate of the present invention.
Reference numbers and corresponding part names in the drawings: 1. the circuit board, 2, chip unit, 3, power and signal interface, 4, samming board, 5, radiator, 6, heat-conducting plate, 7, arc, 8, spliced pole, 9, condenser, 10, through-hole, 11, first lid, 12, second lid, 13, copper sheet.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
Example 1
As shown in fig. 1 to 4, a memory convenient to heat dissipation, includes circuit board 1, circuit board 1 openly is equipped with a plurality of chip unit 2, a power and signal interface 3, chip unit 2 openly posts temperature-uniforming plate 4, the region between the positive temperature-uniforming plate 4 of circuit board 1 is equipped with radiator 5, the region outside the positive chip unit 2 of circuit board 1, a power and signal interface 3, temperature-uniforming plate 4, radiator 5 is covered by heat-conducting plate 6, copper sheet 13 has been laid at the 1 back of circuit board, be connected with arc 7 on the radiator 5, arc 7 is connected with copper sheet 13.
When the temperature-equalizing device works, the power supply and signal interface 3 is connected with electricity, the chip unit 2 is used as a heat source, the chip unit 2 is an area with the largest heat productivity, and the temperature-equalizing plate 4 dissipates heat to the area; a part of heat generated by the chip unit 2 is conducted to the area between the temperature equalizing plates 4 on the front surface of the circuit board 1, and the heat radiator 5 radiates the area; other positive regions of circuit board 1 rely on heat-conducting plate 6 to dispel the heat, and the heat dissipation of circuit board 1 back dependence copper sheet layer 13, and the heat on radiator 5, the copper sheet layer 13 still can be lost and lost through arc 7, and arc 7 is favorable to increasing heat-radiating area and heat-conduction distance, and simultaneously, the air in arc 7 lower part space also is favorable to the heat to external conduction. Therefore, the whole memory is divided into a plurality of heat dissipation areas with different gradients, so that heat dissipation is respectively facilitated according to different heating degrees and heating reasons, the heat dissipation uniformity is greatly improved, local high heat is prevented, and the heat dissipation effect is improved.
Preferably, circuit board 1 is equipped with first lid 11, the second lid 12 of detachable connection outward, first lid 11 is equipped with condenser 9 outward, accommodation space is constituteed in the cooperation of first lid 11, the second lid 12, copper sheet 13 surface connection has spliced pole 8, and the other end of spliced pole 8 passes first lid 11 and is connected with condenser 9.
The heat at the back of circuit board 1 is through the heat dissipation back of copper sheet 13, further conducts to the outer condenser 9 of first lid 11 through spliced pole 8, has further improved the radiating effect, and is favorable to improving the radiating rate, and the space that first lid 11, second lid 12 are constituteed provides accommodation space for the memory, and this is favorable to impurity such as dust among the external environment to get into on circuit board 1 to avoid the heat dissipation that the dust cover leads to bad.
Preferably, the edge of the heat sink 5 is flush with the edge of the side of the circuit board 1, and the edge of the heat conducting plate 6 is flush with the edge of the side of the circuit board 1.
The structure enables the edges of the radiator 5 and the heat conducting plate 6 to be flush with the side edge of the circuit board 1 and directly contact with the relevant area on the circuit board 1, and therefore the radiating uniformity and the radiating efficiency are further improved.
Example 2
As shown in fig. 1 to 4, in order to better explain the present invention, as a further optimization of embodiment 1, embodiment 2 includes all the technical features of embodiment 1, and in addition, embodiment 2 includes the following technical features:
preferably, the fins of the heat sink 5 are cylindrical.
The columnar fins are taken as the existing mature technology, when air flows among the dense columnar fins, a turbulent flow is formed around each columnar fin, so that the whole side surface of each columnar fin becomes an effective heat dissipation surface, the heat sink 5 has larger surface area and better heat conduction capability, and the heat dissipation effect is improved.
Preferably, the arc plate 7 is provided with a through hole 10.
The through holes 10 are beneficial to increasing the convection of heated hot air and cold air near the arc-shaped plate 7 and the contact area of the cold air and the arc-shaped plate 7, so that the heat exchange contact area is increased, and the heat radiation speed is increased.
Preferably, a heat-conducting double-sided adhesive layer is arranged between the circuit board 1 and the copper sheet layer 13.
The heat-conducting double-sided adhesive layer plays a role in bonding the circuit board 1 and the copper layer 13, so that the circuit board 1 is more fully contacted with the copper layer 13, the surface area of heat conduction is increased, and the good heat-conducting capacity of the heat-conducting double-sided adhesive layer is favorable for efficiently and quickly conducting heat on the back surface of the circuit board 1 to the copper layer 13.
Preferably, the first cover 11 and the second cover 12 are connected in a snap-fit manner.
The buckle type connection is convenient to mount, dismount and mount, tool-free dismounting can be achieved, and maintenance of the storage are facilitated.
As described above, the present invention can be preferably realized.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way, and the technical essence of the present invention is that within the spirit and principle of the present invention, any simple modification, equivalent replacement, and improvement made to the above embodiments are all within the protection scope of the technical solution of the present invention.

Claims (7)

1. The utility model provides a memory convenient to it is radiating, includes circuit board (1), circuit board (1) openly is equipped with a plurality of chip units (2), a power and signal interface (3), a serial communication port, chip unit (2) openly posts temperature-uniforming plate (4), the region between circuit board (1) openly temperature-uniforming plate (4) is equipped with radiator (5), the region outside circuit board (1) openly chip unit (2), a power and signal interface (3), temperature-uniforming plate (4), radiator (5) is covered by heat-conducting plate (6), copper sheet layer (13) have been laid at the circuit board (1) back, be connected with arc (7) on radiator (5), arc (7) are connected with copper sheet layer (13).
2. The memory convenient to dissipate heat according to claim 1, wherein the circuit board (1) is externally provided with a first cover body (11) and a second cover body (12) which are detachably connected, the first cover body (11) is externally provided with a condenser (9), the first cover body (11) and the second cover body (12) are matched to form an accommodating space, the surface of the copper sheet layer (13) is connected with the connecting column (8), and the other end of the connecting column (8) penetrates through the first cover body (11) to be connected with the condenser (9).
3. A memory facilitating heat dissipation according to claim 1, wherein the edge of the heat sink (5) is flush with the side edge of the circuit board (1), and the edge of the heat conductive plate (6) is flush with the side edge of the circuit board (1).
4. A reservoir facilitating heat dissipation according to claim 1, wherein the fins of the heat sink (5) are cylindrical.
5. A reservoir facilitating heat dissipation according to claim 1, wherein the arc-shaped plate (7) is provided with through holes (10).
6. The memory convenient for heat dissipation according to claim 1, wherein a heat-conducting double-sided adhesive layer is arranged between the circuit board (1) and the copper layer (13).
7. The memory convenient for heat dissipation according to claim 2, wherein the first cover body (11) and the second cover body (12) are connected in a snap-in manner.
CN202022021187.7U 2020-09-16 2020-09-16 Memory convenient to heat dissipation Active CN212809780U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022021187.7U CN212809780U (en) 2020-09-16 2020-09-16 Memory convenient to heat dissipation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022021187.7U CN212809780U (en) 2020-09-16 2020-09-16 Memory convenient to heat dissipation

Publications (1)

Publication Number Publication Date
CN212809780U true CN212809780U (en) 2021-03-26

Family

ID=75089502

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022021187.7U Active CN212809780U (en) 2020-09-16 2020-09-16 Memory convenient to heat dissipation

Country Status (1)

Country Link
CN (1) CN212809780U (en)

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