CN214840702U - High-power high heat dissipation lamp structure - Google Patents
High-power high heat dissipation lamp structure Download PDFInfo
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- CN214840702U CN214840702U CN202121378692.5U CN202121378692U CN214840702U CN 214840702 U CN214840702 U CN 214840702U CN 202121378692 U CN202121378692 U CN 202121378692U CN 214840702 U CN214840702 U CN 214840702U
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Abstract
A high-power high-heat-dissipation lamp structure comprises a lamp shell, a heat dissipation plate, a lamp panel and a control circuit board; the lamp shell is formed by aluminum alloy die casting or machining, and has the functions of a shell and a radiator; the heat dissipation plate is arranged in the center of the lamp shell, and the annular wall of the heat dissipation plate is connected with the inner wall of the lamp shell; the lamp panel is fixedly arranged on the upper surface of the heat dissipation plate, and the lamp panel and the heat dissipation plate are attached through heat conduction silicone grease; the control circuit board is fixedly arranged on the lower surface of the heat dissipation plate; the utility model discloses a two-sided assembly method of H type structure installs lamp plate and control circuit board respectively in the top and bottom of heating panel, has not only solved the problem that the high-power lamps and lanterns radiating efficiency of prior art is low, and the assembly production efficiency height of tearing open moreover, can not collide during the assembly, and the assembly yields is high.
Description
Technical Field
The utility model relates to a lamps and lanterns field, concretely relates to high-power high heat dissipation lamps and lanterns structure.
Background
In the prior art, the lamp with large and small power dissipates heat, the lamp panel, the radiator and the lamp shell are separated, and gaps among all parts are filled by using heat-conducting silicone grease in the heat dissipation process. The viscous liquid heat-conducting silicone grease is limited by low heat conductivity coefficient (1-5W/m.K), and becomes a bottleneck of heat conduction and heat dissipation, so that the overall heat dissipation efficiency of the high-power lamp is low.
In addition, in the prior art, the high-power lamp radiates heat, air is adopted for radiating heat in a mode of opening a hole in a multipurpose shell, the heat conduction coefficient of air is only 0.0267W/m.K, and the heat radiation efficiency is low.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned defect that exists among the prior art, the utility model aims to provide a high-power high heat dissipation lamps and lanterns structure adopts the two-sided assembly method of H type structure to install lamp plate and control circuit board respectively in the top and bottom of heating panel, has not only solved the problem that the high-power lamps and lanterns radiating efficiency of prior art is low, and the assembly production efficiency of taking apart moreover is high, can not collide during the assembly, assembles the yields height.
The utility model discloses a realize like this, the utility model relates to a technical scheme that high-power high heat dissipation lamp structure adopted is: a high power high heat dissipation lamp structure comprises
The lamp shell is formed by aluminum alloy die casting or machining, and has the functions of a shell and a radiator;
the heat dissipation plate is arranged in the center of the lamp shell, and the annular wall of the heat dissipation plate is connected with the inner wall of the lamp shell;
the lamp panel is fixedly arranged on the upper surface of the heat dissipation plate, and the lamp panel and the heat dissipation plate are attached through heat conduction silicone grease;
the control circuit board is fixedly arranged on the lower surface of the heat dissipation plate;
the lamp panel and the control circuit board are respectively arranged on the upper surface and the lower surface of the heat dissipation plate by adopting an H-shaped structure double-sided assembly method, the disassembly and assembly production efficiency is high, the lamp panel and the control circuit board cannot collide during assembly, and the assembly yield is high;
the connection between the lamp shell and the heat dissipation plate has no any break point, the heat conduction efficiency is high, and the high-power lamp is suitable for high-efficiency heat dissipation of high-power lamps.
Furthermore, the heat dissipation plate adopts a machining sweeping process and a high-precision horizontal plane integrated machining technology, the size of the heat dissipation plate is the same as that of the lamp plate, and the lamp plate is fixed by the heat dissipation plate through a first screw, a second screw and a third screw; the heat-conducting silicone grease is extruded on the binding surface between the lamp panel and the heat dissipation plate and is used as an auxiliary supplement for the defects of a machining sweeping process and a high-precision horizontal plane machining process.
Furthermore, the side wall of the lamp housing is provided with a first wire hole and a second wire hole, the position of the heat dissipation plate close to the first wire hole and the second wire hole is provided with a through wire hole, and an external wire is connected to the lamp panel and/or the control circuit board through the first wire hole, the second wire hole and the wire hole respectively.
Further, the heating panel is equipped with first screw hole, second screw hole, third screw hole, the lamp plate is equipped with first through-hole, second through-hole, third through-hole, first screw hole with the position of first through-hole is relative, the second screw hole with the position of second through-hole is relative, the third screw hole with the position of third through-hole is relative, first screw is through connecting first screw hole with first through-hole the second screw is through connecting the second screw hole with the second through-hole third screwed connection the third screw hole with the third through-hole, so that lamp plate fixed mounting in the upper surface of heating panel.
Furthermore, the lamp housing is provided with a first bolt column, a second bolt column and a third bolt column, and the first bolt column, the second bolt column and the third bolt column are close to the side wall of the lamp panel; the control circuit board is provided with a first bolt hole, a second bolt hole and a third bolt hole, the position of the first bolt hole is opposite to that of the first bolt column, the position of the second bolt hole is opposite to that of the second bolt column, the position of the third bolt hole is opposite to that of the third bolt column, and the first bolt column and the first bolt hole, the second bolt column and the second bolt hole, and the third bolt column and the third bolt hole are respectively connected through bolts, so that the control circuit board is fixedly installed on the lower surface of the heat dissipation plate.
Furthermore, the lamp housing is provided with a first heat dissipation port, a second heat dissipation port and a third heat dissipation port which are communicated at a position close to the heat dissipation plate, and the first heat dissipation port, the second heat dissipation port and the third heat dissipation port are used for dissipating heat of the control circuit board.
Furthermore, the lamp shell and the heat dissipation plate adopt an integrated processing technology.
Furthermore, the lamp panel is made of aluminum base, copper base or other metals with heat conduction efficiency.
Furthermore, be equipped with first lamp pearl, second lamp pearl, third lamp pearl and fourth lamp pearl above the lamp plate, the position of first lamp pearl with the position of second lamp pearl is adjacent, the position of third lamp pearl with the position of fourth lamp pearl is adjacent.
Compared with the prior art, the utility model has the advantages that the utility model provides a high-power high-heat-dissipation lamp structure, which comprises a lamp shell, a heat dissipation plate, a lamp plate and a control circuit board; the lamp shell is formed by aluminum alloy die casting or machining, and has the functions of a shell and a radiator; the heat dissipation plate is arranged in the center of the lamp shell, and the annular wall of the heat dissipation plate is connected with the inner wall of the lamp shell; the lamp panel is fixedly arranged on the upper surface of the heat dissipation plate, and the lamp panel and the heat dissipation plate are attached through heat conduction silicone grease; the control circuit board is fixedly arranged on the lower surface of the heat dissipation plate; the utility model discloses a two-sided assembly method of H type structure installs lamp plate and control circuit board respectively in the top and bottom of heating panel, has not only solved the problem that the high-power lamps and lanterns radiating efficiency of prior art is low, and the assembly production efficiency height of tearing open moreover, can not collide during the assembly, and the assembly yields is high.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic cross-sectional view of a high-power high-heat-dissipation lamp structure provided in an embodiment of the present invention.
Fig. 2 is an appearance schematic diagram of a high-power high-heat-dissipation lamp structure provided by an embodiment of the present invention.
Fig. 3 is an appearance schematic diagram of another direction of a high-power high-heat-dissipation lamp structure according to an embodiment of the present invention.
Fig. 4 is an exploded schematic view of a high power high heat dissipation lamp structure provided in an embodiment of the present invention.
Fig. 5 is an exploded schematic view of another direction of a high power high heat dissipation lamp structure according to an embodiment of the present invention.
Fig. 6 is a lamp housing schematic diagram of a high-power high-heat-dissipation lamp structure provided in an embodiment of the present invention.
The reference symbols in the above figures are: 1. a lamp panel; 2. a heat dissipation plate; 3. a lamp housing; 41. a first wire guide hole; 42. a second wire guide; 43. a wire guide port; 6. a control circuit board; 211. a first bolt column; 212. a second bolt column; 213. a third bolt column; 201. a first heat dissipation port; 202. a second heat dissipation port; 203. a third heat dissipation port; 71. a first screw; 72. a second screw; 73. a third screw; 701. a first screw hole; 702. a second screw hole; 703. a third screw hole; 101. a first through hole; 102. a second through hole; 103. a third through hole; 601. a first bolt hole; 602. a second bolt hole; 603. a third bolt hole; 11. a first lamp bead; 12. a second lamp bead; 13. a third lamp bead; 14. and a fourth lamp bead.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it is noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present, it is to be understood that the terms "upper", "lower", "left", "right", and the like, if any, refer to an orientation or positional relationship based on that shown in the drawings, that is for convenience in describing the invention and to simplify the description, and that no indication or suggestion that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, is intended to be used as an illustration only, and not as a limitation of the patent, since the terms describing the positional relationship in the drawings will be understood by those skilled in the art as having the specific meaning of the terms set forth herein.
The technical solution of the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1 to 6, the preferred embodiment of the present invention is shown.
The utility model provides a high-power high heat dissipation lamps and lanterns structure, include
The lamp shell 3 is formed by aluminum alloy die casting or machining, and has the functions of a shell and a radiator;
the heat dissipation plate 2 is arranged in the center of the lamp shell 3, and the annular wall of the heat dissipation plate 2 is connected with the inner wall of the lamp shell 3;
the lamp panel 1 is fixedly arranged on the upper surface of the heat dissipation plate 2, and the lamp panel 1 and the heat dissipation plate 2 are attached through heat conduction silicone grease;
the control circuit board 6, the control circuit board 6 is fixedly mounted on the lower surface of the heating panel 2;
the lamp panel 1 and the control circuit board 6 are respectively arranged on the upper surface and the lower surface of the heat dissipation plate 2 by adopting an H-shaped structure double-sided assembly method, the disassembly and assembly production efficiency is high, no collision is caused during assembly, and the assembly yield is high;
the connection between the lamp housing 3 and the heat dissipation plate 2 has no any break point, the heat conduction efficiency is high, the lamp housing 3 and the heat dissipation plate 2 are made of die-cast aluminum, and the heat conductivity coefficient of the die-cast aluminum is 113-138W/m.K, so that the lamp housing is suitable for high-efficiency heat dissipation of a high-power lamp.
The high-power high-heat-dissipation lamp structure comprises a lamp shell 3, a heat dissipation plate 2, a lamp panel 1 and a control circuit board 6; the lamp shell 3 is formed by aluminum alloy die casting or machining, and has the functions of a shell and a radiator; the heat dissipation plate 2 is arranged in the center of the lamp shell 3, and the annular wall of the heat dissipation plate 2 is connected with the inner wall of the lamp shell 3; the lamp panel 1 is fixedly arranged on the upper surface of the heat dissipation plate 2, and the lamp panel 1 and the heat dissipation plate 2 are attached through heat conduction silicone grease; the control circuit board 6 is fixedly arranged on the lower surface of the heat dissipation plate 2; the utility model discloses a two-sided assembly method of H type structure installs lamp plate 1 and control circuit board 6 respectively below and above heating panel 2, has not only solved the problem that the high-power lamps and lanterns radiating efficiency of prior art is low, and the assembly production efficiency of tearing open moreover is high, can not collide during the assembly, and the assembly yields is high.
Specifically, the heat dissipation plate 2 adopts a machining sweeping process and a high-precision horizontal plane integrated machining technology, the size of the heat dissipation plate 2 is the same as that of the lamp panel 1, and the heat dissipation plate 2 fixes the lamp panel 1 through first screws 71, second screws 72 and third screws 73; the heat-conducting silicone grease is used for extruding the binding surface between the lamp panel 1 and the heat dissipation plate 2 and is used as auxiliary supplement for the defects of a mechanical processing sweeping process and a high-precision horizontal plane processing process.
As an embodiment of the present invention, the side wall of the lamp housing 3 is provided with a first wire guide 41 and a second wire guide 42, the position of the heat dissipation plate 2 near the first wire guide 41 and the second wire guide 42 is provided with a wire guide 43 having a through hole, and the external wire is respectively connected to the lamp panel 1 and/or the control circuit board 6 through the first wire guide 41, the second wire guide 42 and the wire guide 43.
As an embodiment of the present invention, the heat dissipation plate 2 is provided with a first screw hole 701, a second screw hole 702, and a third screw hole 703, the lamp panel 1 is provided with a first through hole 101, a second through hole 102, and a third through hole 103, the first screw hole 701 is relative to the position of the first through hole 101, the second screw hole 702 is relative to the position of the second through hole 102, the third screw hole 703 is relative to the position of the third through hole 103, the first screw 71 is connected to the first screw hole 701 and the first through hole 101, the second screw 72 is connected to the second screw hole 702 and the second through hole 102, and the third screw hole 703 and the third through hole 103 are connected to the third screw 73, so that the lamp panel 1 is fixedly mounted on the upper surface of the heat dissipation plate 2.
As an embodiment of the present invention, the lamp housing 3 is provided with a first bolt column 211, a second bolt column 212, and a third bolt column 213, and the first bolt column 211, the second bolt column 212, and the third bolt column 213 are close to the side wall of the lamp panel 1; the control circuit board 6 is provided with a first bolt hole 601, a second bolt hole 602, and a third bolt hole 603, the position of the first bolt hole 601 is opposite to the position of the first bolt column 211, the position of the second bolt hole 602 is opposite to the position of the second bolt column 212, and the position of the third bolt hole 603 is opposite to the position of the third bolt column 213, and the first bolt column 211 and the first bolt hole 601, the second bolt column 212 and the second bolt hole 602, and the third bolt column 213 and the third bolt hole 603 are respectively connected by bolts, so that the control circuit board 6 is fixedly mounted on the lower surface of the heat dissipation plate 2.
As an embodiment of the present invention, the position of the lamp housing 3 near the heat dissipation plate 2 is further provided with a first heat dissipation opening 201, a second heat dissipation opening 202, and a third heat dissipation opening 203, and the first heat dissipation opening 201, the second heat dissipation opening 202, and the third heat dissipation opening 203 are used for dissipating heat of the control circuit board 6.
As an embodiment of the present invention, the lamp housing 3 and the heat dissipation plate 2 adopt an integrated processing technology.
Preferably, the lamp panel 1 is made of aluminum, copper or other metals with heat conduction efficiency.
As an embodiment of the present invention, the lamp panel 1 is provided with a first lamp bead 11, a second lamp bead 12, a third lamp bead 13 and a fourth lamp bead 14, the position of the first lamp bead 11 is adjacent to the position of the second lamp bead 12, and the position of the third lamp bead 13 is adjacent to the position of the fourth lamp bead 14.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. A high-power high-heat-dissipation lamp structure is characterized by comprising
The lamp shell is formed by aluminum alloy die casting or machining, and has the functions of a shell and a radiator;
the heat dissipation plate is arranged in the center of the lamp shell, and the annular wall of the heat dissipation plate is connected with the inner wall of the lamp shell;
the lamp panel is fixedly arranged on the upper surface of the heat dissipation plate, and the lamp panel and the heat dissipation plate are attached through heat conduction silicone grease;
the control circuit board is fixedly arranged on the lower surface of the heat dissipation plate;
the lamp panel and the control circuit board are respectively arranged on the upper surface and the lower surface of the heat dissipation plate by adopting an H-shaped structure double-sided assembly method;
the connection between the lamp shell and the heat dissipation plate has no any break point, the heat conduction efficiency is high, and the high-power lamp is suitable for high-efficiency heat dissipation of high-power lamps.
2. The structure of claim 1, wherein the heat dissipation plate is machined by a sweeping process and a high-precision horizontal plane integrated machining process, the size of the heat dissipation plate is the same as that of the lamp panel, and the heat dissipation plate fixes the lamp panel through a first screw, a second screw and a third screw; the heat-conducting silicone grease is extruded on the binding surface between the lamp panel and the heat dissipation plate and is used as an auxiliary supplement for the defects of a machining sweeping process and a high-precision horizontal plane machining process.
3. The structure of a high-power high-heat-dissipation lamp according to claim 1, wherein a first wire guide hole and a second wire guide hole are formed in a side wall of the lamp housing, a through wire guide port is formed in a position, close to the first wire guide hole and the second wire guide hole, of the heat dissipation plate, and an external wire is respectively connected to the lamp panel and/or the control circuit board through the first wire guide hole, the second wire guide hole and the wire guide port.
4. The high-power high-heat-dissipation lamp structure according to claim 2, wherein the heat dissipation plate is provided with a first screw hole, a second screw hole and a third screw hole, the lamp panel is provided with a first through hole, a second through hole and a third through hole, the first screw hole is opposite to the first through hole in position, the second screw hole is opposite to the second through hole in position, the third screw hole is opposite to the third through hole in position, the first screw is connected with the first screw hole and the second through hole, and the second screw is connected with the second screw hole and the third through hole, so that the lamp panel is fixedly mounted on the upper surface of the heat dissipation plate.
5. The structure of claim 1, wherein the lamp housing is provided with a first bolt column, a second bolt column, and a third bolt column, and the first bolt column, the second bolt column, and the third bolt column are close to the side wall of the lamp panel; the control circuit board is provided with a first bolt hole, a second bolt hole and a third bolt hole, the position of the first bolt hole is opposite to that of the first bolt column, the position of the second bolt hole is opposite to that of the second bolt column, the position of the third bolt hole is opposite to that of the third bolt column, and the first bolt column and the first bolt hole, the second bolt column and the second bolt hole, and the third bolt column and the third bolt hole are respectively connected through bolts, so that the control circuit board is fixedly installed on the lower surface of the heat dissipation plate.
6. The structure of claim 4, wherein the lamp housing is further provided with a first heat dissipation opening, a second heat dissipation opening, and a third heat dissipation opening at a position close to the heat dissipation plate, and the first heat dissipation opening, the second heat dissipation opening, and the third heat dissipation opening are used for dissipating heat of the control circuit board.
7. The structure of claim 1, wherein the lamp housing and the heat sink are integrally formed.
8. The high-power high-heat-dissipation lamp structure according to claim 1, wherein the lamp panel is made of aluminum-based or copper-based materials.
9. The high-power high-heat-dissipation lamp structure according to claim 8, wherein the lamp panel is provided with a first lamp bead, a second lamp bead, a third lamp bead and a fourth lamp bead, the first lamp bead is adjacent to the second lamp bead, and the third lamp bead is adjacent to the fourth lamp bead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121378692.5U CN214840702U (en) | 2021-06-21 | 2021-06-21 | High-power high heat dissipation lamp structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121378692.5U CN214840702U (en) | 2021-06-21 | 2021-06-21 | High-power high heat dissipation lamp structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214840702U true CN214840702U (en) | 2021-11-23 |
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ID=78808698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121378692.5U Active CN214840702U (en) | 2021-06-21 | 2021-06-21 | High-power high heat dissipation lamp structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214840702U (en) |
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2021
- 2021-06-21 CN CN202121378692.5U patent/CN214840702U/en active Active
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