JPH11237193A - Plate type heat pipe and mounting structure using it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a plate type heat pipe which can be assembled easily and has high dimensional accuracy by providing projecting sections on the plate-type member on one main surface side of a plate type heat pipe for positioning the plate-type member on the other main surface side and combining the members into one and, at the same time, to provide a mounting structure which can appropriately cool heat generating parts. SOLUTION: A plurality of projecting sections 13 are provided on a plate type member 10 so that another plate type member 11 may be positioned easily to the member 10. It is preferable to provide the projecting sections 13 so that the position of the member 11 may be decided and to provide two projecting sections 13 near the corner of the member 10. In addition, the projecting sections 13 can be formed in such a way that part of the member 10 is locally depressed (embossed) or masses are bonded to the member 10. When parts are cooled by using a heat pipe 1, such a projecting section that matches the position and height of the parts to be cooled is installed on the plate type member 11 or a heat-conductive pillar section is provided in the member 11. The heat pipe becomes more convenient to use, in addition, when projections for positioning a heat sink are provided on the external surface of the member 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plate-type heat pipe suitable for cooling a heat-generating component (a component to be cooled) such as a semiconductor element and a mounting structure using the same.

[0002]

2. Description of the Related Art In recent years, a cooling technique for preventing overheating of a heat-generating component such as a semiconductor element mounted on various devices such as a personal computer or a device such as a power facility has attracted attention. Electricity that needs cooling
As a method of cooling an electronic component (hereinafter, referred to as a cooled component), for example, a method of attaching a fan to the device to lower the temperature of air in the device housing, or a method of attaching a heat equalizing plate (cooling body) to the component to be cooled. Thus, a method of cooling the component to be cooled is known.

As a material of the heat equalizing plate to be attached to the component to be cooled, for example, a metal material having excellent thermal conductivity such as a copper material or an aluminum material, or a ceramic material such as a carbon material or aluminum nitride is applied. In recent years, a heat pipe is sometimes used as a soaking plate. When using a heat pipe, for example, a heat equalizing plate in which the heat pipe is embedded in a metal block may be used, but the heat pipe itself may be formed in a plate shape. The plate-type heat pipe has a large effect of rapidly spreading the heat of the component to be cooled (soaking effect), and is expected to achieve excellent cooling performance.

FIG. 8 is an explanatory view showing an example of a cooling structure using a soaking plate. In this figure, the heat equalizing plate 80 is a sectional view.
A heat equalizing plate 80 is connected to the component to be cooled 82 mounted on the substrate 83, and a heat sink 81 for heat dissipation is further attached to the heat equalizing plate 80. Component to be cooled (heating component) 8
The connection between the heat sink 2 and the heat equalizing plate 80 may be made by simply bringing them into contact with each other, or by making contact with heat conductive grease or the like. In some cases, the component to be cooled 82 may be joined to the heat equalizing plate 80 by soldering or the like. Reference numeral 8 in the figure
4 is a lead.

A heat sink 81 is provided to promote heat radiation from the heat equalizing plate 80 that has absorbed heat from the component to be cooled 82. The heat sink 81 may be formed integrally with the heat equalizing plate 80 in some cases. Further, a fan 85 may be further provided as shown in the figure to further promote heat radiation from the heat sink 81.

In some cases, a plate-type heat pipe is used as the above-mentioned soaking plate 80. Here, the heat pipe will be briefly described. The heat pipe has a cavity sealed inside, and the working fluid is contained in the cavity. The inside of the cavity is evacuated, and the working fluid is easily evaporated. As the working fluid, water, alcohol, CFC alternative, or the like is used.

[0007] The operation of the heat pipe is briefly described as follows. That is, on the heat absorbing side of the heat pipe, the working fluid evaporates due to heat transmitted through the material of the container (container) constituting the heat pipe, and the vapor moves to the heat radiation side of the heat pipe. On the heat radiation side, the vapor of the working fluid is cooled and returns to the liquid state again. Then, the working fluid that has returned to the liquid phase moves (recirculates) to the heat absorbing side again. Heat is transferred by such phase transformation and movement of the working fluid. The recirculation of the working fluid is performed by gravity action or capillary action. In the case of a gravity-type heat pipe, the heat absorption side may be disposed below the heat radiation side.

[0008]

In order to manufacture a plate-type heat pipe, for example, as shown in FIG. 3, an upper plate-type member 20 and a lower plate-type member 21 are joined to each other to form two sheets. The method of assembling such that a cavity is formed between the plates is simple and practical.

One of the factors contributing to a reduction in the assembly cost is that the positioning of the plate member 20 and the plate member 21 can be performed easily and reliably when assembling the plate heat pipe as described above. . In addition, the plate-type heat pipe connected to the component to be cooled is usually housed in a housing of an electric device or the like, like the component to be cooled.
If the electrical device is a device having a severe internal space constraint, such as a small portable personal computer, the dimensional accuracy of the plate-type heat pipe used for the device must be strict. Therefore, in this sense, it is practically important that the positioning of the plate member 20 and the plate member 21 can be performed easily and reliably.

[0010]

SUMMARY OF THE INVENTION The present invention has been made to provide a plate-type heat pipe having excellent dimensional accuracy and excellent assembling workability. That is, the plate heat pipe of the present invention is provided with a projection a for positioning the plate member on the other main surface side on at least one main surface side plate member constituting the plate heat pipe container, The two plate members are united. Here, the term “projection a” is used to distinguish it from the projection b and the projection c described later. In this specification, the plate member on the other main surface is replaced with the plate member on the other main surface. The protrusion for positioning is referred to as a protrusion a.

[0011] Further, in particular, the plate-type heat pipe is provided to face a substrate on which a plurality of components to be cooled are mounted, and the plate-type member facing the substrate has the component to be cooled facing the substrate. Is proposed in the case of a plate-type heat pipe provided with a predetermined convex portion according to the distance.

The above-mentioned projections a are preferably provided by embossing or burring the plate-shaped member.

A heat transfer column may be provided inside the plate-type heat pipe of the present invention at a position corresponding to a component to be cooled. In this case, a protrusion b is provided inside the plate-type heat pipe, and the heat transfer column may be positioned by the protrusion b. The protrusion b is preferably provided by embossing or burring a plate-shaped member. Further, it is preferable that the wick disposed inside the plate-type heat pipe be fixed by the protrusion b.

The present invention also proposes a mounting structure in which the above-mentioned plate-type heat pipe is provided so as to be opposed to a substrate on which one or more components to be cooled are mounted. Also, a mounting structure is proposed in which one main surface of the plate-type heat pipe faces the substrate and a heat sink is attached to the other main surface.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS When joining a plate member 20 and a plate member 21 shown in FIG. 3, it is desired to position them quickly. Therefore, in the present invention, as shown in FIG. 1, the plate-shaped member 10 (corresponding to the plate-shaped member 20 in FIG. 3) is provided with a projection a13, and the plate-shaped member 11 (corresponding to the plate-shaped member 21 in FIG. 3). ) Can be easily positioned with respect to the plate member 10. FIG. 1 shows a plate-type heat pipe 1
Is a cross-sectional view depicting a part of the working fluid, and illustration of a working fluid in the hollow portion 12 and others is omitted.

A plurality of projections a are provided so that the position of the plate member 11 is determined. FIG. 2 is a plan view showing a part of the plate-shaped heat pipe 1. As shown in FIG. 2, two positions are set near the corner so that the position of the plate-shaped member 11 with respect to the plate-shaped member 10 is determined. Of the plate-shaped member 1
It is good to set to 0. Although not shown, the plate member 11
The projection a13 may be provided on the plate-shaped member 10 also at a part corresponding to the vicinity of some or all other corners.

In the example shown in FIG. 1, the projection a13 is
0 is partially recessed and formed (embossed). In addition, in some cases, a lump that becomes the protrusion a may be separately prepared and joined to the plate member 10.

When a semiconductor element or the like mounted on a substrate is to be cooled using a plate-type heat pipe, the number of components (semiconductor element or the like) to be cooled mounted on the substrate is not limited to one. Their size (height) is not always constant either. Therefore, the present inventors have invented a plate-type heat pipe that can be suitably applied in such a case, and have applied for a patent. FIG. 4 is a diagram illustrating such a plate-type heat pipe. FIG. 4A shows the upper plate-shaped member 30.
And a state in which a plate-shaped heat pipe is assembled by joining the lower plate-shaped member 31 having the convex portions 301 to 303,
FIG. 4A illustrates an example of a cooling structure using the plate-type heat pipe 3.

As shown in FIG. 4A, the plate-type heat pipe 3 is disposed so as to face a substrate 35 on which components to be cooled 311 to 313 such as semiconductor elements are mounted. Each cooled part 3
The plate-shaped heat pipe 3 is provided with convex portions 301 to 303 corresponding to the heights of 11 to 313, and can cool the plurality of cooled parts 311 to 313 suitably. In the case of such a plate-type heat pipe 3, since the positional accuracy of the protrusions 301 to 303 is important, the positioning of the plate-shaped members 30, 31 becomes even more important. Therefore, the configuration of the present invention is particularly effective in the case of the plate type heat pipe 3 or the like. Reference numerals 32, 33, and 34 in the figure indicate a cavity, a heat sink, and a lead, respectively.

In the plate type heat pipe of the present invention, a heat transfer column may be provided therein. FIG. 5 is an explanatory diagram showing a main part of such an example. In this example, a form in which the heat transfer column 44 is provided in the hollow portion 42 of the convex portion 410 corresponding to the convex portions 301 to 303 in FIG. As shown, the heat transfer column 44 is positioned by a projection b43 provided on the plate member 40 and the plate member 41. In this example, a projection b4 provided on the plate member 41 is further provided.
Reference numeral 3 designates a wick 45 (metal mesh or the like).

The mounting structure using the plate type heat pipe of the present invention will be described. FIG. 4A shows an example of a mounting structure using the plate-type heat pipe 3. In this mounting structure, one main surface side of the plate-type heat pipe 3 (the lower side in the figure). The heat sink 33 is attached to the other main surface side (upper side in the figure) of the substrate 35 so as to face the substrate 35 on which the components to be cooled 311 to 313 are mounted. In the case of the present invention, the protrusions c for positioning the heat sink (the above-described protrusions a and b) are provided on the outer surface of the plate-type heat pipe.
It is convenient to provide a projection c for distinguishing from the above. It is convenient if the projection c is also provided by embossing or burring the plate-shaped member.

By the way, there are various mounting methods (fixing methods) between the plate type heat pipe and the heat sink. FIG. 6 shows an example of the attachment form. In this example,
A screw hole is provided in the heat sink 54, and the plate member 50
The heat sink 54 is fixed to the plate-type heat pipe 5 with screws 56 passed through holes formed by performing burring on the heat sink 54. Also, the protrusion c formed during the burring process
Conveniently, a recess into which the 55 is inserted is provided in the heat sink 54 in advance so that the plate-shaped member 50 and the heat sink 54 are positioned before being fixed by the screw 56. Reference numeral 53 in the drawing denotes a projection a for positioning the plate member 51. Illustration of the inside of the cavity 52 is omitted.

FIG. 7 shows a plate-type heat pipe 6 and a part 6 to be cooled.
3 shows an example of an attachment form with a substrate 65 on which a circuit board 3 is mounted. In this example, the board 65 and the plate member 60 are fixed with screws 66. In the figure, reference numeral 61 denotes a plate member, 62 denotes a hollow portion, and 64 denotes a lead. Reference numeral 67 denotes a nut, and reference numeral 68 denotes a hole provided in the plate-shaped member 60 by burring.

[0024]

As described above, the plate-type heat pipe of the present invention is easy to assemble and excellent in dimensional accuracy, and the mounting structure using the same is suitable for cooling heat-generating components such as semiconductor elements to be cooled. It is suitable.

[Brief description of the drawings]

FIG. 1 is a side sectional view illustrating a main part of a plate-type heat pipe according to the present invention.

FIG. 2 is a plan view illustrating a main part of the plate-type heat pipe of FIG.

FIG. 3 is an explanatory view showing an example of assembling a plate-type heat pipe.

FIG. 4 is an explanatory diagram showing an assembling state of a plate-type heat pipe and a mounting structure thereof.

FIG. 5 is a cross-sectional view illustrating a main part of a plate-type heat pipe according to the present invention.

FIG. 6 is an explanatory diagram showing an example of a fixed form of a plate-type heat pipe and a heat sink.

FIG. 7 is an explanatory view showing an example of a fixed form of a plate-type heat pipe and a substrate.

FIG. 8 is an explanatory diagram showing an example of a mounting structure using a plate-type heat pipe.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Plate heat pipe 10 Plate member 11 Plate member 12 Cavity part 13 Projection part a 20 Plate member 21 Plate member 3 Plate heat pipe 30 Plate member 31 Plate member 301 Projection 302 Projection 303 Projection 32 Cavity part 301 Convex part 302 Convex part 303 Convex part 311 Component to be cooled 312 Component to be cooled 313 Component to be cooled 33 Heat sink 34 Lead 35 Board 40 Plate member 41 Plate member 410 Convex portion 42 Cavity 43 Projection b 44 Transmission Heat column part 45 Wick 5 Plate heat pipe 50 Plate member 51 Plate member 52 Cavity 53 Projection a 54 Heat sink 55 Projection c 56 Screw 6 Plate heat pipe 60 Plate member 61 Plate member 62 Cavity 63 Component to be cooled 64 Lead 65 Board 66 Screw 67 Nut 68 Hole 80 Heat equalizing plate 81 Heat sink 82 Component to be cooled 83 Board 84 Lead 65 Fan

Claims (9)

[Claims] 1. A plate-shaped heat pipe container comprising at least one main surface-side plate-shaped member provided with a projection a for positioning the other main surface-side plate-shaped member, wherein said two plates are provided. A plate-type heat pipe formed by combining mold members. 2. The plate-type heat pipe is a plate-type heat pipe provided to face a substrate on which a plurality of components to be cooled are mounted, wherein the plate-type heat pipe faces the substrate. The plate-shaped heat pipe according to claim 1, wherein a predetermined convex portion is provided according to a distance from the component to be cooled. 3. The plate-type heat pipe according to claim 1, wherein the protrusion a is provided by embossing or burring the plate-shaped member. 4. The plate type heat pipe according to claim 1, wherein a heat transfer column portion is provided inside the plate type heat pipe at a position corresponding to a component to be cooled. pipe. 5. The plate heat pipe according to claim 4, wherein a protrusion b is provided inside the plate heat pipe, and the heat transfer column is positioned and fixed by the protrusion b. 6. The plate type heat pipe according to claim 5, wherein a wick is provided inside the plate type heat pipe, and the wick is fixed by the protrusion b. 7. The plate-type heat pipe according to claim 5, wherein the protrusion b is provided by embossing or burring the plate-shaped member. 8. The heat pipe according to claim 1, wherein the heat pipe according to any one of claims 1 to 7 is provided opposite to a substrate on which one or more components to be cooled are mounted. Mounting structure using a plate-type heat pipe. 9. The mounting structure according to claim 8, wherein one main surface of the plate-type heat pipe faces the substrate, and a heat sink is attached to the other main surface.