TW202137442A - Electronic device with a heat dissipation structure - Google Patents

Abstract

An electronic device with a heat dissipation structure is provided to solve the problem that the thickness of the conventional electronic device cannot be easily reduced due to the arrangement of a heat dissipation structure. The electronic device includes a housing, a circuit module mounted in the housing, a heat-conducting plate forming a sealed chamber together with the housing or a metal portion of the circuit module, and a working fluid filled in the chamber.

Description

Electronic device with heat dissipation structure

The present invention relates to an electronic device, especially an electronic device having a heat dissipation structure to help heat dissipation.

With the advancement of the technology industry, today’s electronic devices such as laptops or mobile phones are not only excellent in performance, but also have been moving towards a trend of thinner and lighter. However, when thin and high-performance electronic devices are operated, they are prone to generate a lot of waste heat, which leads to electronic devices. The increase in temperature increases the thermal failure rate and wear rate of electronic devices.

For this reason, in some electronic devices, structures such as heat pipes or heat dissipation fins have to be added to help remove the waste heat generated during the operation of the electronic device, but the volume of these heat dissipation structures is also limited, resulting in the electronic device The overall thickness is difficult to reduce; for electronic devices that require thinning, the thickness of the heat dissipation structure may cause insurmountable obstacles in the development of thinning, so it is necessary to improve it.

In order to solve the above-mentioned problems, the object of the present invention is to provide an electronic device with a heat dissipation structure, which can reduce the thickness of the overall electronic device by using an extremely thin heat dissipation structure.

The second objective of the present invention is to provide an electronic device with a heat dissipation structure, the heat dissipation structure of which can exchange heat with the external environment and is easy to maintain a low temperature.

Another object of the present invention is to provide an electronic device with a heat dissipation structure, the heat dissipation structure of which can be commonly used in existing electronic devices.

Another object of the present invention is to provide an electronic device with a heat dissipation structure, the heat dissipation structure of which can be embedded in the casing to further reduce the thickness of the overall electronic device.

The directionality described in the full text of the present invention or its similar terms, such as "front", "rear", "left", "right", "up (top)", "down (bottom)", "inner", "outer" , "Side", etc., mainly refer to the direction of the attached drawings. The terms of the directionality or similar terms are only used to assist in the description and understanding of the embodiments of the present invention, and are not used to limit the present invention.

The elements and components described in the full text of the present invention use the quantifiers "one" or "one" for convenience and to provide the general meaning of the scope of the present invention; in the present invention, it should be construed as including one or at least one, and single The concept of also includes the plural, unless it clearly implies other meanings.

Approximate terms such as "combination", "combination" or "assembly" mentioned in the full text of the present invention mainly include the types that can be separated without destroying the components after being connected, or the components cannot be separated after being connected, which are common knowledge in the field Those can be selected based on the materials of the components to be connected or assembly requirements.

The electronic device with a heat dissipation structure of the present invention includes: a casing; a circuit module located in the casing; a heat conducting sheet forming a closed chamber together with the casing or a metal part of the circuit module ; And a working fluid filled in the chamber.

Accordingly, the electronic device with a heat dissipation structure of the present invention can use the original metal part in the case or circuit module to form a cavity for filling the working fluid with the heat conductive sheet, thereby forming a heat dissipation structure with an extremely thin thickness. , And through the gas-liquid change cycle of the working fluid, the effect of helping the electronic device to dissipate heat is achieved; at the same time, the thickness of the overall electronic device can be further reduced, which can effectively solve the demand for thinner electronic devices It has always been the problem of restricting the development of thinner due to heat dissipation requirements.

Wherein, part or all of the casing can be made of metal, and the metal part of the casing is formed of a part of the metal material. The metal part can have a heat source alignment area. The heat conducting sheet can be combined with the casing. The aligning area with the heat source can jointly form the cavity. In this way, the outside of the metal part can also be exposed to the outside to exchange heat with the external environment, so that the metal part can easily maintain a low temperature relative to the heat source, and has the effects of improving heat dissipation efficiency and the like.

Wherein, the thermally conductive sheet may have a groove, and the thermally conductive sheet is combined with the casing and the cavity may be formed by the groove. In this way, the shape of the casing can be changed without changing the heat dissipation, it can be applied to the existing casing, and has the effect of improving versatility and the like.

Wherein, the thermally conductive sheet may have a cover plate, a ring wall may be connected to the cover plate and surround the groove to form the groove, and the ring wall may abut against the inner surface of the casing so that the groove forms the cavity. In this way, the structure of the thermally conductive sheet is simple and easy to form, and has the effects of reducing manufacturing costs and improving assembly convenience.

Wherein, the thermally conductive sheet may have a plurality of supporting columns located in the groove, and the plurality of supporting columns may abut against the inner surface of the casing. In this way, the plurality of support columns can assist the cover plate to maintain the volume of the chamber, and have the functions of preventing the cover plate from being deformed and affecting the heat dissipation effect.

Wherein, the inner surface of the casing may form a recess in the heat source alignment area, and after the thermal conductive sheet is combined with the casing, the cavity can be formed by the recess. In this way, the space occupied by the thermal conductive sheet and the cavity in the chamber can be reduced, and the overall thickness of the electronic device can be reduced.

Wherein, the casing may form an overlapping portion on the circumferential edge of the recessed portion, and the thermally conductive sheet may be combined with the overlapping portion by a first surface. In this way, the combination position of the thermal conductive sheet and the casing can be easily and accurately controlled, and the thermal conductive sheet cannot easily be displaced after contacting the overlapping portion, which has the effects of improving assembly convenience and combination stability.

Wherein, the thermally conductive sheet has a second surface opposite to the first surface, and the second surface may be flush with the inner surface of the casing where the recess is not formed. In this way, the thermal conductive sheet and the cavity can be embedded in the casing, which has the effect of further reducing the thickness of the overall electronic device.

Wherein, the thermally conductive sheet may have a groove, and the inner surface of the housing may form a depression in the heat source alignment area. After the thermally conductive sheet is combined with the housing, the groove and the depression may jointly form the Chamber. In this way, the cavity can be at least partially embedded in the casing, which has the effects of reducing the thickness of the overall electronic device or increasing the volume of the cavity to improve the heat dissipation effect.

Wherein, the thermally conductive sheet can be laser welded and combined with the casing. In this way, it has the effect of improving the stability of the combination.

Wherein, the circuit module can have a functional cover combined with a circuit board, and the functional cover is made of metal material and can form the metal part. In this way, by using the original metal part of the circuit module and the thermal conductive sheet to form a cavity for filling the working fluid, it has the effect of reducing the thickness of the overall electronic device.

Wherein, the thermally conductive sheet may have a groove, and the thermally conductive sheet is combined with the functional cover and the cavity may be formed by the groove. In this way, the original shape of the functional cover can not be changed, and the structure of the thermal conductive sheet is simple and easy to form, which has the effects of improving versatility, reducing manufacturing cost, and improving assembly convenience.

Wherein, the thermally conductive sheet may have a plurality of supporting pillars located in the groove, and the plurality of supporting pillars may abut against the functional cover. In this way, the plurality of support columns can assist the cover plate to maintain the volume of the chamber, and have the functions of preventing the cover plate from being deformed and affecting the heat dissipation effect.

Wherein, the thermal conductive sheet can be combined with the functional cover by laser welding. In this way, it has the effect of improving the stability of the combination.

Wherein, the functional cover can be an electromagnetic shielding cover. In this way, the functional cover can have electromagnetic shielding and heat conduction effects, and have the effects of improving component utilization and heat dissipation efficiency.

The electronic device with a heat dissipation structure may further include a capillary structure which is located in the chamber and contacts the working fluid. In this way, the working fluid can easily utilize the capillary phenomenon to circulate the gas-liquid phase change, and has the effects of improving heat dissipation efficiency and the like.

Among them, the casing can be a casing of a mobile phone, a tablet computer, a palmtop game console, a notebook computer, a desktop computer, a smart wearable device, AR/VR glasses, or electronic medical equipment. In this way, it has the effect of making these products easy to thin.

In order to make the above and other objectives, features and advantages of the present invention more comprehensible, the following describes the preferred embodiments of the present invention in conjunction with the accompanying drawings in detail as follows:

Please refer to Figure 1, which is the first embodiment of an electronic device with a heat dissipation structure of the present invention. It includes a casing 1, a circuit module 2 and a thermal conductive sheet 3. The piece 3 is located in the casing 1. The electronic devices described in the present invention are, for example, but not limited to, mobile phones, tablet computers, handheld game consoles, notebook computers, desktop computers, smart wearable devices, AR/VR glasses, or electronic medical equipment.

The casing 1 has a chamber S inside, which can be used for assembling and positioning the circuit module 2 and the thermal conductive sheet 3. The present invention does not limit the type and type of the casing 1. Although this embodiment uses a mobile phone casing as an example, it is not intended to limit the present invention. Furthermore, the casing 1 disclosed in the drawings of the present invention is merely illustrative. It should not be used as a front cover or back cover of an electronic device. In addition, the casing 1 of this embodiment may have a metal part M, and the metal part M may be made of copper, aluminum or other metals with high thermal conductivity. Specifically, the casing 1 may only be partially made of a metal material, and the metal part M is formed by a part of the metal material; or the whole casing 1 is made of a metal material, so that the metal part M is formed by the whole casing 1. Wherein, the casing 1 has an inner surface 1a and an outer surface 1b opposite to each other. The inner surface 1a faces the chamber S, and the metal part M may have a heat source alignment zone 11, and the heat source alignment zone 11 may be located The inner surface 1a of the casing 1.

Please refer to Figures 1 and 2, the circuit module 2 has a circuit board 21, and several electronic components 22 are provided on the circuit board 21. The electronic components 22 (such as LCD modules, power Crystals, IC chips, camera modules, etc.) can form a heat source H of the circuit module 2. After the circuit module 2 is assembled in the casing 1, the heat source H can be positioned in the heat source alignment area 11. Among them, the electronic component 22 and the heat source H represented by a two-dot chain line in Figure 2 are only imaginary. With reference to Figures 1 and 3, it can be seen that in this embodiment, the electronic component 22 and the heat source H are located in the heat conduction Above slice 3.

Please refer to Figures 1 and 3, the thermally conductive sheet 3 can be made of copper, aluminum or other materials with high thermal conductivity for the heat source H of the circuit module 2 to be attached, and the thermally conductive sheet 3 absorbs the Heat energy at the heat source H. The thermal conductive sheet 3 can be combined with the casing 1, and the thermal conductive sheet 3 and the metal part M together form a closed cavity C, and the cavity C can cover part or all of the heat source alignment area 11. In this embodiment, the thermally conductive sheet 3 may have a cover plate 31, and a ring wall 32 is connected to the surface of the cover plate 31 facing the heat source alignment area 11 to form a groove 33 surrounded by the ring wall 32. After the thermal conductive sheet 3 is combined with the casing 1, the cavity C is formed by the groove 33. The thermal conductive sheet 3 can be abutted against the inner surface 1a of the casing 1 by the ring wall 32, and can be combined with the casing 1 by laser welding. In addition, a thermally conductive medium T, such as thermal pad or thermal grease, can be provided between the thermally conductive sheet 3 and the heat source H of the circuit module 2, so that the thermally conductive sheet 3 can use the The heat conducting medium T is indirectly attached to the heat source H of the circuit module 2 and ensures good thermal conductivity between the heat source H and the heat conducting sheet 3, so that the heat energy of the heat source H can be quickly transferred to the heat conducting sheet 3 .

The chamber C can be filled with a working fluid 4. The chamber C is preferably in a vacuum state. The working fluid 4 can be, for example, a non-conductive fluid or a low boiling point liquid. The working fluid 4 is not filled when it is in a liquid state. Fill the chamber C. In some embodiments, the cavity C may also have a capillary structure 5, the capillary structure 5 may be, for example, sintered on the inner wall of the thermal conductive sheet 3, or it may be preformed into a porous sheet and then placed in the cavity. Room C persons. The working fluid 4 can contact the capillary structure 5 located in the chamber C, so that the working fluid 4 can continuously circulate the gas-liquid phase change due to the capillary phenomenon.

Please refer to Figures 2 and 3, according to the foregoing structure, when the electronic device with a heat dissipation structure of this embodiment operates, the thermal conductive sheet directly or indirectly attached to the heat source H can be used when the temperature of the heat source H rises. 3 Absorb thermal energy, and the liquid working fluid 4 in the chamber C is heated by the thermal energy, so that the liquid working fluid 4 absorbs thermal energy to evaporate into a gaseous state, and the gaseous working fluid 4 can contact the relatively low-temperature housing 1 The metal part M can be condensed back to the liquid state again; in this way, the working fluid 4 continues to cycle through the gas-liquid phase change, thereby taking away the heat energy of the heat source H, and achieving the effect of effectively dissipating heat from the heat source H. Among them, since the metal part M of the casing 1 is directly used as the part where the cavity C is formed together with the heat conducting sheet 3 in this embodiment, a heat dissipation structure with extremely thin thickness can be formed, which helps reduce the thickness of the overall electronic device. In addition, the outside of the metal part M of the casing 1 can also be exposed to the outside for heat exchange with the external environment, so that the metal part M can easily maintain a low temperature relative to the heat source H, which helps to improve the heat dissipation efficiency.

Please refer to Figure 4, which is the second embodiment of the electronic device with a heat dissipation structure of the present invention. The thermal conductive sheet 3 of this embodiment can be selected to be a thin flat plate with a first surface 3a and a second surface opposite to each other. On the surface 3b, the inner surface 1a of the casing 1 can form a recess G in the heat source alignment area 11. In this way, after the thermal conductive sheet 3 is combined with the casing 1, the cavity C can be formed by the recess G, so as to reduce the space occupied by the thermal conductive sheet 3 and the cavity C in the chamber S, so that the electronic The configuration of the other components of the device in the chamber S can be more flexible and unrestricted, or the thermal conductive sheet 3 or the chamber C can be at least partially embedded in the casing 1, so as to reduce the electronic components. The effect of the overall thickness of the device. Wherein, the casing 1 may form an overlapping portion 12 on the circumferential edge of the recess G, and the thermally conductive sheet 3 may be combined with the overlapping portion 12 by the first surface 3a, so that it is easy to accurately control the thermally conductive sheet 3 and the overlapping portion 12 The joint position of the casing 1 and the thermal conductive sheet 3 after contacting the overlapping portion 12 are less likely to be displaced. Preferably, the second surface 3b of the thermally conductive sheet 3 can be flush with the inner surface 1a of the casing 1 where the recess G is not formed, so that the thermally conductive sheet 3 and the cavity C can appear to be completely embedded in the The shape of the casing 1 can further reduce the thickness of the overall electronic device.

Please refer to FIG. 5, which is the third embodiment of the electronic device with heat dissipation structure of the present invention. The thermal conductive sheet 3 of this embodiment may be similar to the aforementioned first embodiment but has a groove 33, and the casing The inner surface 1a of 1 can be similar to the aforementioned second embodiment to form the recess G in the heat source positioning area 11; The recesses G together form the cavity C, and make the cavity C appear at least partially embedded in the casing 1, thereby reducing the overall thickness of the electronic device, or without increasing the overall thickness, making the cavity C The chamber C has a larger volume to contain a larger amount of working fluid 4 to help improve the heat dissipation effect. In an embodiment where the cover plate 31 has a larger area, the thermally conductive sheet 3 may also have a plurality of supporting pillars 34, the plurality of supporting pillars 34 are located in the groove 33, and the thermally conductive sheet 3 is combined with the metal of the casing 1. When the part M is formed, the support columns 34 can abut against the recessed part G of the inner surface 1a of the casing 1 to provide an auxiliary support for the cover plate 31 to maintain the volume of the chamber C. Similarly, in the embodiment with the capillary structure 5 (indicated in Figure 3) in the chamber C, the plurality of support posts 34 can abut the capillary structure 5 or penetrate the capillary structure 5 to resist Connecting to the inner surface 1a of the casing 1 enables the support columns 34 to also have the function of assisting the positioning of the capillary structure 5.

Please refer to Figures 6 and 7, which are the fourth embodiment of the electronic device with a heat dissipation structure of the present invention. The material of the casing 1 of this embodiment is not limited, and it is preferably made of metal with high thermal conductivity. The module 2 may include a functional cover 23 with electromagnetic shielding, heat conduction, or supporting functions. The functional cover 23 is made of metal and can form the metal portion M. For example, the functional cover 23 of this embodiment may be an electromagnetic shielding cover. The functional cover 23 is combined with the circuit board 21, and part of the electronic components 22 are covered in the functional cover 23, so that the functional cover made of iron 23 can have the functions of electromagnetic shielding and heat conduction. In other embodiments, the functional cover 23 can also be a thermally conductive plate made of a material with high thermal conductivity such as copper or aluminum. The functional cover 23 can also be combined with the circuit board 21 and attached to the electronics forming the heat source H. Component 22 on. Therefore, the metal part M of the circuit module 2 can be made of iron, copper or aluminum, and the present invention is not limited.

Referring to FIGS. 6 and 8, the thermal conductive sheet 3 may have a cover plate 31 and a ring wall 32, and the ring wall 32 is connected to the cover plate 31 and encloses a groove 33. The thermal conductive sheet 3 can be laser welded to combine with the functional cover 23, and the cavity C for filling the working fluid 4 is formed by the groove 33. In addition, in an embodiment where the cover plate 31 has a larger area, the thermally conductive sheet 3 may also have a plurality of supporting pillars 34, the plurality of supporting pillars 34 are located in the groove 33, and the thermally conductive sheet 3 is combined with the functional cover 23. At this time, the support columns 34 can abut against the functional cover 23 to provide auxiliary support for the cover plate 31 to maintain the volume of the chamber C.

Please refer to Figures 7 and 8, because this embodiment directly uses the metal part M of the circuit module 2 as the part that forms the cavity C together with the heat conducting sheet 3, it is similar to the first and second embodiments described above. In the same example, a very thin heat dissipation structure can be formed, thereby reducing the thickness of the overall electronic device. In addition, a heat-conducting medium T may be provided between the functional cover 23 and the heat source H of the circuit module 2, so that the functional cover 23 can be indirectly attached to the heat source H of the circuit module 2 through the heat-conducting medium T, And it is ensured that there is good thermal conductivity between the heat source H and the functional cover 23, so that the heat energy of the heat source H can be quickly transferred to the functional cover 23, and then to the thermal conductive sheet 3.

In summary, the electronic device with a heat dissipation structure of the present invention can use the original metal part in the casing or circuit module to form a cavity for filling the working fluid together with the thermal conductive sheet, thereby forming a very thin thickness The heat dissipation structure can help the electronic device to dissipate heat by circulating the gas and liquid phases of the working fluid. At the same time, it can further reduce the thickness of the overall electronic device. Effectively solve the problems that have been restricted by the heat dissipation requirements for the development of thinner.

Although the present invention has been disclosed using the above-mentioned preferred embodiments, it is not intended to limit the present invention. Anyone who is familiar with the art without departing from the spirit and scope of the present invention may make various changes and modifications relative to the above-mentioned embodiments. The technical scope of the invention is protected. Therefore, the scope of protection of the invention shall be subject to the scope of the attached patent application.

1: chassis 1a: inner surface 1b: Outer surface 11: Heat source counterpoint area 12: Lap joint 2: Circuit module 21: circuit board 22: Electronic components 23: Function cover 3: Thermal conductive sheet 3a: First side 3b: second side 31: Cover 32: Ring Wall 33: Groove 34: Support column 4: Working fluid 5: Capillary structure C: Chamber G: Depressed part H: heat source M: Metal Department S: Room T: Thermally conductive medium

[Figure 1] An exploded perspective view of the first embodiment of the present invention. [Figure 2] A schematic diagram of the combination of the casing and the thermal conductive sheet according to the first embodiment of the present invention. [Figure 3] A partial cross-sectional view along the line A-A in Figure 2. [Figure 4] A partial cross-sectional view of the second embodiment of the present invention. [Figure 5] A partial cross-sectional view of the third embodiment of the present invention. [Figure 6] An exploded perspective view of the thermal conductive sheet and the metal part of the circuit module of the fourth embodiment of the present invention. [Figure 7] A combined perspective view of the fourth embodiment of the present invention. [Figure 8] A partial cross-sectional view along the line B-B in Figure 7.

1: chassis

1a: inner surface

1b: Outer surface

11: Heat source counterpoint area

22: Electronic components

3: Thermal conductive sheet

31: Cover

32: Ring Wall

33: Groove

4: Working fluid

5: Capillary structure

C: Chamber

H: heat source

M: Metal Department

T: Thermally conductive medium

Claims (17)

An electronic device with a heat dissipation structure, including: A housing A circuit module located in the casing; A thermal conductive sheet, which forms a closed chamber together with a metal part of the casing or the circuit module; and A working fluid is filled in the chamber. For example, the electronic device with a heat dissipation structure of claim 1, wherein part or all of the casing is made of metal, and the portion of the casing made of metal forms the metal portion, the metal portion has a heat source alignment area, and the heat conduction The sheet is combined with the casing, and the heat-conducting sheet and the heat source alignment area jointly form the cavity. According to claim 2, the electronic device with a heat dissipation structure, wherein the thermally conductive sheet has a groove, and the thermally conductive sheet is combined with the casing and the cavity is formed by the groove. For example, the electronic device with a heat dissipation structure of claim 3, wherein the thermally conductive sheet has a cover plate, a ring wall is connected to the cover plate and surrounds the groove to form the groove, and the ring wall abuts against the inner surface of the casing so that the The groove forms the cavity. For example, the electronic device with a heat dissipation structure of claim 3, wherein the thermally conductive sheet has a plurality of supporting pillars located in the groove, and the plurality of supporting pillars abut the inner surface of the casing. For example, the electronic device with a heat dissipation structure of claim 2, wherein the inner surface of the casing forms a recess in the heat source aligning area, and the cavity is formed by the recess after the thermal conductive sheet is combined with the casing. For example, the electronic device with a heat dissipation structure of claim 6, wherein the casing forms an overlapping portion at the circumferential edge of the recessed portion, and the thermally conductive sheet is joined to the overlapping portion by a first surface. For example, the electronic device with a heat dissipation structure of claim 7, wherein the thermally conductive sheet has a second surface opposite to the first surface, and the second surface is flush with the inner surface of the casing where the recess is not formed. For example, the electronic device with a heat dissipation structure of claim 2, wherein the thermally conductive sheet has a groove, the inner surface of the casing forms a depression in the heat source alignment area, and the thermally conductive sheet is combined with the casing to be The groove and the recess together form the cavity. For example, the electronic device with a heat dissipation structure of claim 2, wherein the thermal conductive sheet is laser-welded and combined with the casing. For example, the electronic device with a heat dissipation structure of claim 1, wherein the circuit module has a functional cover combined with a circuit board, and the functional cover is made of a metal material and forms the metal part. According to claim 11, the electronic device with a heat dissipation structure, wherein the thermally conductive sheet has a groove, and the thermally conductive sheet is combined with the functional cover and the cavity is formed by the groove. For example, the electronic device with a heat dissipation structure of claim 12, wherein the thermally conductive sheet has a plurality of supporting pillars located in the groove, and the plurality of supporting pillars abut the functional cover. For example, the electronic device with a heat dissipation structure of claim 11, wherein the thermal conductive sheet is laser welded and combined with the functional cover. For example, the electronic device with a heat dissipation structure of claim 11, wherein the functional cover is an electromagnetic shielding cover. For example, the electronic device with a heat dissipation structure according to any one of claims 1 to 15, further comprising a capillary structure, the capillary structure being located in the chamber and contacting the working fluid. For example, the electronic device with a heat dissipation structure according to any one of claim 1 to 15, wherein the casing is a mobile phone, a tablet computer, a handheld game console, a notebook computer, a desktop computer, a smart wearable device, AR/VR The case of glasses or electronic medical equipment.

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