TWI602497B - Thermal dissipation module - Google Patents

Description

Thermal module

The invention relates to a heat dissipation module.

The development of communication technology, mobile devices such as mobile phones or tablets have become an indispensable necessity in modern people's lives, and as people become more dependent on these mobile devices, the use time is getting longer and longer; The use of mobile devices in time often causes the integrated circuit of the mobile device to crash due to overheating, which is inconvenient.

When a mobile phone or a tablet computer is limited in size and weight and cannot use a fan as a heat dissipating means, a heat dissipating material or a heat pipe is often used as a heat dissipating method. However, under the operation of high-power electronic components in the mobile device, the heat dissipation performance of the heat dissipation method is still limited.

The invention provides a heat dissipation module, wherein a partial flow path has a tapered structure to improve the flow and heat transfer efficiency of the working fluid.

The heat dissipation module of the invention is suitable for an electronic device. The electronic device has a heat source. The heat dissipation module includes an evaporator, a tube, and a working fluid. The evaporator is in thermal contact with the heat source to absorb the heat generated by the heat source. The evaporator has a chamber. The tubular member joins the chamber and forms a circuit, wherein the structure at which the chamber is joined to the tubular member presents a contour that tapers toward the tubular member relative to the remaining structure of the tubular member. A working fluid is filled in the circuit.

The heat dissipation module of the invention is suitable for an electronic device. The electronic device has a heat source. The heat dissipation module includes an evaporator, a tube, and a working fluid. The evaporator is in thermal contact with the heat source. The tube has opposite ends to connect the evaporator to form a circuit. At least one of the ends of the tubular member tapers toward the evaporator. The working fluid is filled in the circuit.

Based on the above, in the above embodiment of the present invention, the tapered structure of the internal chamber of the evaporator can also make the working fluid, in addition to the tapered structure of the evaporator or the tube, in addition to increasing the fluid velocity due to the difference in the diameter of the tube. When flowing into the chamber, it can be uniformly sprayed to various parts in the chamber, and after the phase change of the heat absorption of the working fluid, it can also be collected by the tapered structure and flow to the pipe member, thereby improving the heat transfer effect of the working fluid.

The above described features and advantages of the invention will be apparent from the following description.

1 is a partial exploded view of an electronic device in accordance with an embodiment of the present invention. Referring to FIG. 1 , in the embodiment, the electronic device 10 is, for example, a portable electronic device such as a notebook computer or a tablet computer, which has a light and short appearance feature to meet the needs of convenient carrying. However, as the computing and display requirements increase, the electronic device 10 needs to provide related components having heat dissipation effects in the housings 310 and 320 in order to meet the heat dissipation requirements of the aforementioned performance requirements. Accordingly, the electronic device 10 includes a heat source 200 and a heat dissipation module 100 , wherein the heat source 200 is, for example, a central processing unit or a display chip, and the heat dissipation module 100 can absorb heat generated from the heat source 200 and further remove heat from the electronic device 10 . The other parts of the room escaped.

In the present embodiment, the heat dissipation module 100 is, for example, a siphon type heat dissipating assembly, which includes an evaporator 110, a tube member 120, and a working fluid F1 (in the drawings, only the arrows indicate its flow direction). The evaporator 110 is used to thermally contact the heat source 200 to absorb heat from the heat source 200. The pipe member 120 is connected to the evaporator 110 and forms a circuit. The working fluid F1 is filled in the circuit, and the working fluid F1 flows through the evaporator 110 to generate a phase change by absorbing the aforementioned heat, for example, converting the liquid working fluid F1 into a vapor state. The working fluid F1, and the heat is subsequently carried away as the vaporous working fluid F1 moves away from the evaporator 110, and the working fluid F1 is again performed as the tubular member 120 passes through other lower temperature portions of the electronic device 10. The phase change condenses (from the vapor state back to the liquid state), and the heat is dissipated out of the electronic device 10.

In detail, the heat dissipation module 100 of the present embodiment further includes a heat pipe 130 that is in thermal contact with the heat source 200 and the evaporator 110 to transfer heat generated by the heat source 200 to the evaporator 110. Further, as shown in FIG. 1 , one end of the heat pipe 130 is disposed on the plate body 500 of the electronic device 10 by the holding member 400 , and is structurally abutted on the heat source 200 , and the other end of the heat pipe 130 . The structure is abutted at least in part of the evaporator 110 (the position of the abutment on the evaporator 110 is not limited herein, and the embodiment also does not limit the assembly means of the heat pipe 130 and the related structure). In this way, the heat pipe 130 can transfer the heat generated by the heat source 200 to the evaporator 110 with the phase change of another working fluid therein. It should be noted that, as shown in FIG. 1 , the electronic device 10 of the present embodiment can also provide a certain dissipation effect to the heat source 200 by the board 500. In other embodiments not shown, the board The body 500 can also be a partial or full structure of the housings 310, 320. Furthermore, in the embodiment, the plate body 500 is made of a metal material, and the arrangement of the heat source 200 can also provide electromagnetic interference of the heat source 200 (such as the aforementioned central processing unit or display chip) or other electronic components. (EMI) shielding effect.

2 is a partial schematic view of the heat dissipation module of FIG. 1, and the internal structure can be smoothly identified by partially disassembling the evaporator 110. 3 is a partial plan view of the heat dissipation module of FIG. 1 , and the internal structure of the evaporator 110 is shown in broken lines. Referring to FIG. 2 and FIG. 3 simultaneously, in the embodiment, the evaporator 110 is substantially assembled by the body 111 and the cover 113 to form an internal chamber for flowing the working fluid F1, wherein the body 111 has openings E3 and E4. In order to connect the pipe member 120, the working fluid F1 flows into or out (the figure indicates the flow direction of the working fluid F1 by arrows, but is not limited thereto. In another embodiment not shown, the working fluid can also Reverse flow).

It is noted that the structure at which the internal chamber of the evaporator 110 is joined to the tubular member 120 is contoured toward the tubular member 120 with respect to the remaining structure of the internal chamber. Further, the internal chamber of the evaporator 110 is divided into a flow area R2 and a heating area R1, and a first guiding surface S1, a second guiding surface S2 and a third guiding surface S3 located at the periphery of the internal chamber, Wherein the first guiding surface S1 and the second guiding surface S2 are tapered from the inner chamber toward the tubular member 120 (ie, the opening E4), and the third guiding surface S3 is from the inner chamber toward the tubular member 120 (opening) E3) is tapered, and the tapered directions of the two tapered profiles are opposite to each other. In other words, the first guiding surface S1 and the second guiding surface S2 are located on opposite sides of the opening E4 and are inclined toward the opening E4, and the third guiding surface S3 is adjacent to the opening E3 and facing the opening. E3 is tilted.

It should also be mentioned that in the internal chamber of the evaporator 110 shown in Fig. 2, the heat pipe 130 abuts against the depression of the evaporator 110, and the depression causes a corresponding bulge of the internal chamber. Here, the ridge in the inner chamber can be regarded as the heating zone R1, and the pipe member 120 is connected to the openings E3, E4 as the flow zone R2, and the second guiding surface S2 and the third guiding surface S3 is located in the heating zone R1, and the first guiding surface S1 is located in the flow zone R2, and the pipe member 120 is substantially connected to the flow zone R2. In this embodiment, the heat dissipation module 100 further includes a plurality of heat conducting members 112 disposed in the heating zone R1. The heat conducting members 112 are arranged in a columnar body and arranged in an array, and the heat conducting member 112 is located in the second portion of the heating zone R1. When the working fluid F1 flows into the heating zone R1 of the evaporator 110 via the opening E3 between the guiding surface S2 and the third guiding surface S3, the contact area between the working fluid F1 and the evaporator 110 can be increased.

Based on the above, when the working fluid F1 flows into the internal chamber of the evaporator 110 via the opening E3, in the flow direction thereof, a jet flow effect is generated due to the sudden opening space formed by the third guiding surface S3, as shown by the dotted arrow in FIG. No. Then, the working fluid F1 mainly absorbs heat through the heat conducting members 112 and generates a phase change (transition from the liquid working fluid F1 to the vapor working working fluid F1), and is generated by the first guiding surface S1 and the second guiding surface S2. After the tapered profile is merged, it flows into the tubular member 120 through the opening E4.

It should be mentioned that, as shown in this embodiment, only the third guiding surface S3 is located at the opening E3, and the first guiding surface S1 and the second guiding surface s2 are located at the opening E4. The embodiment does not limit the number of guide faces on the sides of the chamber inside the evaporator 110 and the degree of inclination thereof. That is, those skilled in the art can configure appropriate guide faces at the two openings of the internal chamber to form a tapered structure toward the tubular member, depending on the characteristics of the working fluid and the need for heat dissipation.

On the other hand, the pipe member 120 of the present embodiment is substantially divided into the segment E5 and the two end portions E1, E2, wherein the segment E5 is located between the ends E1, E2, and the pipe member 120 is at its end E1, E2 It is connected to the openings E3 and E4 of the evaporator 110 (the end E1 is connected to the opening E3, and the end E2 is connected to the opening E4). It is worth noting here that at least one of the ends E1, E2 of the tubular member 120 has a structure that tapers towards the evaporator 110. In other words, the dimensional relationship between the tubular member 120 of the present embodiment and the internal chamber of the evaporator 110 is such that the diameter of the section E5 is substantially greater than or equal to the thickness of the chamber of the evaporator 110, and the chamber of the evaporator 110 The thickness is larger than the diameter of each end portion E1, E2.

In this way, since the E5 of this section has a larger diameter than the ends E1 and E2, the working fluid F1 will maintain a larger flow rate and a lower pipeline loss at the E5 section, and at the secondary end. When the portion E1 or E2 flows into the evaporator 110, the tapered flow can be improved by the tube diameter being tapered and simultaneously with the tapered structure of the internal chamber of the evaporator 110 (which is an involute profile for the working fluid F1). The effect is to evenly spray the working fluid F1 to each of the internal chambers. As described above, the flow direction of the working fluid is not limited herein, that is, the heat dissipation module 100 of the present embodiment can cause the working fluid F1 to flow in different directions according to the state of use of the electronic device 10, and also by the tube member 120. The diameter of the two ends E1 and E2 is tapered, and the working fluid F1 can maintain its flow rate and flow rate regardless of the flow direction, and achieve the aforementioned jet flow effect.

In addition, with reference to the structural arrangement shown in FIG. 1 and the partial enlarged view of FIG. 2 or FIG. 3, the tube member 120 is substantially disposed on the periphery of the plate body 500, wherein the segment E5 is substantially in thermal contact with the plate body 500, and thus the plate is used. The body 500 has characteristics such as a large area and a metal material, and provides a better heat transfer effect, so that the vapor working fluid F1 can flow through the end portion E2 or E1 through the E5 of the pipe member 120 to achieve a condensation effect. The vaporous working fluid F1 is converted back to the liquid working fluid F1 and again flows back into the evaporator 110 from the end E1 or E2.

In summary, in the above embodiment of the present invention, the heat dissipation module is configured to reduce the flow rate of the working fluid by the tapered structure of the evaporator or the tube, and the internal chamber of the evaporator is gradually increased. The reduced structure can also be matched with the pipe diameter, and the working fluid can be sprayed into the evaporator to be uniformly sprayed on the flow zone and the heating zone of the internal chamber. Moreover, by the tapered structure at the outlet of the other side of the internal chamber, it is also possible to provide the effect of the flow of the phase-changing working fluid to smoothly flow the working fluid out of the evaporator. In other words, the pipe member can maintain the flow rate of the working fluid at the section where the pipe diameter is larger by the difference in the pipe diameter between the section and the end portion, and the end portion which is tapered by the pipe diameter when flowing into the evaporator through the end portion. The flow rate is increased while matching the tapered structure of the internal chamber of the evaporator to provide better flow performance of the working fluid.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art can make some changes and refinements without departing from the spirit and scope of the present invention. The scope of the invention is defined by the scope of the appended claims.

10‧‧‧Electronic devices
100‧‧‧ Thermal Module
110‧‧‧Evaporator
111‧‧‧Ontology
113‧‧‧ cover
120‧‧‧ pipe fittings
130‧‧‧heat pipe
112‧‧‧Heat-conducting parts
200‧‧‧heat source
310, 320‧‧‧ shell
400‧‧‧Holding parts
500‧‧‧ board
E1, E2‧‧‧ end
E3, E4‧‧‧ openings
E5‧‧‧This paragraph
F1‧‧‧ working fluid
R1‧‧‧heating area
R2‧‧‧ mobile area

1 is a partial exploded view of an electronic device in accordance with an embodiment of the present invention. 2 is a partial schematic view of the heat dissipation module of FIG. 1. 3 is a partial plan view of the heat dissipation module of FIG. 1.

10‧‧‧Electronic devices

100‧‧‧ Thermal Module

110‧‧‧Evaporator

120‧‧‧ pipe fittings

130‧‧‧heat pipe

200‧‧‧heat source

310, 320‧‧‧ shell

400‧‧‧Holding parts

500‧‧‧ board

F1‧‧‧ working fluid

Claims (10)

A heat dissipation module is applicable to an electronic device having a heat source, the heat dissipation module comprising: an evaporator that is in thermal contact with the heat source to absorb heat generated by the heat source, the evaporator having a chamber; A tubular member is coupled to the chamber and forms a circuit, wherein the structure at which the chamber is coupled to the tubular member exhibits a contour that tapers toward the tubular member relative to the remaining structure of the tubular member; and a working fluid is filled in the circuit. The heat dissipation module of claim 1, wherein the evaporator has a pair of openings on opposite sides of the chamber, and opposite ends of the tube are respectively connected to the pair of openings to form the circuit, The tapered profile includes at least one guiding surface that is inclined by the chamber toward each of the openings. The heat dissipation module of claim 2, wherein the evaporator has a first opening and a second opening, and the at least one guiding surface comprises a first guiding surface, a second guiding surface and a a third guiding surface, wherein the first guiding surface and the second guiding surface are located on opposite sides of the second opening, and the third guiding surface is adjacent to the first opening. The heat dissipation module of claim 3, wherein the chamber is divided into a heating zone and a flow zone, and the second guiding surface and the third guiding surface are located in the heating zone, the first The guiding surface is located in the flow area, and the tube is connected to the flow area. The heat dissipation module of claim 4, wherein the evaporator further comprises: a plurality of heat conducting members disposed in the heating zone and located between the second guiding surface and the third guiding surface. The heat dissipation module of claim 1, further comprising: a heat pipe that is in thermal contact with the heat source and the evaporator to transfer heat generated by the heat source to the evaporator. A heat dissipation module is applicable to an electronic device having a heat source. The heat dissipation module includes: an evaporator that is in thermal contact with the heat source; and a tube member having opposite ends for connecting the evaporator to form a heat sink a circuit, at least one of the ends of the tubular member tapers toward the evaporator; and a working fluid is filled in the circuit. The heat dissipation module of claim 7, wherein the pipe member comprises a pair of the two ends connected to each other, the pipe diameter of the segment is greater than or equal to the thickness of the chamber of the evaporator, and is greater than each The diameter of the end. The heat dissipation module of claim 8, further comprising: a plate covering the heat source, wherein the segment of the pipe is in thermal contact with the plate The heat dissipation module of claim 9, further comprising: a heat pipe electrically contacting the heat source and the evaporator to transfer heat generated by the heat source to the evaporator, the heat pipe portion Thermal contact with the plate.