M277983 創作說明（1) 【新：：屬之技術領域』 利用心= : 散熱結構改良，尤指—種 『2行冷卻與散熱之水;：：至：冷式散熱裝置上後 【先别技術】 式放熱結構改良。 按，由於電腦產業 度之電子元件，這此子逮7升級，已發展出許多高精贫 僅運作之速度加快著技術水準的提昇，其； t電子元件可於其許可之、、θ=熱量的提昇，因此，為維持 現今研發人員最迫切急；；：：續運作，《問題已成為 β如目前在中央處理器（(；pm:。 題，由於其運作速度—再地 戶生之熱源散熱問 能提供之散熱效率 =，以往的鋁擠型散熱器所 體體積或改良其散熱二 加大散熱器之整 η吹散蕴藏於各散熱續片内d;積，同時藉助風扇 風；I之n ^ 4板係垂直贴靠於機殼側壁内，故若迟y +式 大散熱器之體積，只會使得 散埶，二阻礙。此外，目前的散熱器皆以熱傳導方式進行 於頭八tb礙於材質本身的熱傳導率，故其散熱速度遠不及 散熱理1運作時產生之熱量，以致目前散熱器之 不佳’難以符合需求。 匕現今亦有許多採用水冷方式提供熱滅進行冷卻M277983 Creation Instructions (1) [New :: The technical field of the use] Utilization = = Improved heat dissipation structure, especially-a kind of "2 lines of cooling and cooling water;": to: after the cooling device is installed [other technology first 】 Improved exothermic structure. According to the electronic components of the computer industry, these upgrades have been developed, and many high-precision and poor-working-only speeds have been developed to accelerate the improvement of technical standards. The electronic components can be used under their permission, θ = heat. Therefore, in order to maintain the most urgent needs of today's R & D personnel; :: Continuing operation, "The problem has become β as it is currently in the central processing unit ((; pm :.), due to its speed of operation-the hot source of household life The heat dissipation efficiency that the heat sink can provide =, the volume of the previous aluminum extruded heat sink or the improvement of its heat dissipation, and the increase of the heat dissipation of the heat sink is stored in each heat sink d; The n ^ 4 plate is vertically attached to the side wall of the chassis, so if the volume of the large y + type radiator is large, it will only disperse and hinder it. In addition, the current radiators are all conducted in the first eight by thermal conduction. Tb is affected by the thermal conductivity of the material itself, so its heat dissipation speed is far less than the heat generated during the operation of the heat sink 1, so that the current poor heat sink is difficult to meet the demand. There are also many water cooling methods to provide heat quenching for cooling.
|之體積C板的變形甚至損壞，且散熱器與風ί 卡等） 纟成為插設於機板上之各零組件（如顯示 M277983 3、創作說明（2) 之散熱裝置， 利用管路將該 ，藉由一泵浦 路傳遞 接觸， 適當之 惟 其重量 熱源表 I產生之 液茂漏 有 特潛心 有效改 【新型 本 改良， 管或熱 >，再透 熱。藉 不受其 並可避 為 結構改 至散熱 故可令 溫度環 ，由於 較重、 面處上 熱量仍 時，將 鏗於此 研究並 善上述 内容】 創作之 其係為 板將熱 過水冷 以使熱 周圍空 免冷卻 了達成 良，用 其主要 液體容 (Pump 板内， 冷卻液 境。 上述散 體積也 ，且冷 難以快 會造成 ’本創 配合學 缺失之 係於一液體容置箱内注入冷卻液，並 置箱與一中空之散熱板相連通，同時 )將該液體容置箱内之冷卻液經由管 而該散熱板則用以與熱源作面與面之 將熱源所產生之熱量帶走，藉此維持 熱板因利用冷卻液循環通過，故使得 較大，不易於裝配在如中央處理器等 部液的熱傳效率有限，對於熱源急驟 速帶離。同時，更重要的是，若冷卻 整個系統的損壞。 作人係為改善並解決上述之缺失，乃 理之運用，終於提出一種設計合理且 本創作。 主要目的，在於可提供一種水冷式散熱結構 提昇水冷式散熱裝置之熱傳效果，俾利用敎 :所產Ϊ之熱量傳導至水冷式散熱裝置上後 式散熱t置之冷卻液對熱管之冷卻端進行散 源與熱官接觸而減輕熱源的負擔，且配置上 = 更具有活用系統外；空間 液因洩漏而損壞系統。 上述之目的，本創作在 以裝配於一冷卻循s、α' '、一種水冷式散熱 卩循％迴路上’並將一熱源所| The volume of the C plate is deformed or even damaged, and the radiator and the wind card etc.) 纟 become the components inserted on the board (such as the display M277983 3, the creation instructions (2) heat dissipation device, using the pipeline to Therefore, through a pumping path to transfer the contact, the proper liquid leakage caused by the heat source table I is appropriate. The new type of improvement, tube or heat > In order to change the structure to heat dissipation, the temperature ring can be made. Due to the heavy weight and the heat on the surface, I will study this and make good use of the above content.] The creation is that the board is heated by water to cool it to avoid the surrounding air from being cooled. Daliang, using its main liquid volume (in the Pump board, to cool the liquid environment. The above bulk volume is also cold, and it is difficult to get cold quickly. A hollow radiating plate is connected, and at the same time) the cooling liquid in the liquid containing box is passed through a tube, and the radiating plate is used as a face to face with the heat source to take away the heat generated by the heat source, thereby maintaining the hot plate Inli The coolant is circulated through, so it is relatively large, and it is not easy to assemble liquids such as central processors. The heat transfer efficiency of the liquid is limited, and the heat source is rapidly removed. At the same time, more importantly, if the entire system is cooled, it will be damaged. In order to improve and solve the above-mentioned shortcomings, the Department of Humans finally applied a rational design and this creation. The main purpose is to provide a water-cooled heat dissipation structure to improve the heat transfer effect of the water-cooled heat dissipation device. The heat of the 传导 is transmitted to the water-cooled heat sink. The cooling liquid placed on the rear of the heat pipe reduces the burden on the heat source by dispersing the cooling end of the heat pipe and contacting the heat officer, and the configuration = more outside the system; the space fluid is leaked due to leakage And the system is damaged. The purpose of the above is to assemble a cooling circuit s, α '', a water-cooled heat dissipation circuit, and a heat source.
M277983 习、創作說明（3) 產生之熱量 之循環座内 ，而熱傳構 伸至上述熱 【貫施方式 為了使 技術内容， 而所附圖式 限制者。 > 請參閱 立體分解示 創作係提供 熱板作為熱 之熱量傳導 該水冷式散 少一熱傳構 該冷卻 '散熱模組 ^盾環迴路， 浦的作動而 i述冷卻循 申請專利之 資迷。 该循壞 = ; = 至少-熱傳構件，其中 件之-端則與該循；：卻循環迴路串接而連通 衣座接觸，另一端則用以延 件之 源處 貴審 請參閱 僅提供 第一圖 意圖、 查委員&更進〜步暸解本創作之特徵及 :::關本創作之詳細說明與附®，然 >考一纟兄明用，並非用來對本創作加以 、第二 立體組 一種水冷式散 傳導， 至該水 熱裝置 件；其 循環迴 等構件 且於該 使冷卻 環迴路 範轉， 图及弟二圖，係分別為本創作之 合不意圖及組合剖面示意圖。本 、— 熱結構改良，其係利用熱管2或 以將一熱源3 (如第四圖所示）所產生 熱裝置上後再進行冷卻與散熱。 冷卻循環迴路、一循環座1及至 包含泵浦（pump)、液體容置箱 管路連通而串接成一所述之冷卻 環迴路内注入冷卻液，俾藉由粟 迴路内產生循環式的流動；由於 係與習知技術相同，益非本創作 其細部結構之配置，即不再予以 冷式散 包括一 中： 路大致，並以 冷卻循 液可於 之結構 故有關 座1可為導熱性良好之材質所製成，如銅等 M277983 3、創作說明（4) 在本創作 包含-座體10:舉之ί實施例中，該循環座1可更進 液體容室1〇0 熱傳座11所構成，該座體10内部形成^ 阻流結構101可於二體，室10。内設有阻流結構…成； ，可用以证^ 為禝數豆立設置之柱件或其它形狀m姓 於該循環座广」1入九環座4内部之冷卻液的停置時間ί 入 山t上 刀別汉有一入水接口 1 〇 3與一出水接D ] n 、甬，7妾口 1 0 3、1 0 4係分別與座體1 0之液體容室丨〇 n 4， ίΖ ^ 以與上述冷卻循環迴路相串接而連通，使Α欠相 :U浦的作動而由入水接口1 〇 3注入循環座1内了 ： ’夜 出水接口 104排出而形成一循環迴路。 内，再由 =傳座η係設於座體1〇下方，並與座體 熱傳構件可為熱管2或熱板，：Ϊ =ΪΓ* 俾使熱管2之一端與循環座1相接觸。 肚10與熱傳座11之間係可分別設有與熱管 =部m、110,以供熱管2之一端設置於座J與： 傳座11之凹弧部105、110内（如第三圖所示），而轨管，、2 端則用以延伸至上述熱源3 (如第四圖所示’）處， :S 2於另一端處亦可更進一步設有一貼附於熱源3上之 …傳基座20，該熱傳基座2〇亦可為如銅、鋁等導執性良好 之材質所製成'者。 是以 散熱結構改良 ’藉由上述之構造組成，即可得到本創作水冷式 夂良。 如第四圖所示，係為本創作應用於單一熱源2之使用M277983 Study and creation instructions (3) In the circulation seat of the heat generated, and the heat transfer structure extends to the above-mentioned heat [Performance method In order to make the technical content, the drawings are limited. > Please refer to the three-dimensional decomposition and creation system to provide a hot plate as the heat of heat conduction, the water-cooled heat dissipation, a heat transfer structure, the cooling module, a heat sink module, and a shield ring circuit. . The cycle is broken =; = At least-the heat transfer component, where the-end of the piece is connected to the cycle;: but the circulation loop is connected in series to contact the connecting seat, and the other end is used to extend the source of the piece. The intent of the first picture, the members & further understanding of the characteristics of this creation and ::: a detailed explanation of the creation of this book with the attached ®, but > the test is not intended to add to the creation, The two-dimensional group is a kind of water-cooled dissipative conduction to the water-heating device; its circulation returns to the equal parts and the cooling ring circuit is transformed. The figure and the second figure are schematic diagrams of the intention and combination of the creation respectively. . The improvement of the heat structure is to use a heat pipe 2 or a heat device generated by a heat source 3 (as shown in the fourth figure), and then perform cooling and heat dissipation. The cooling circulation circuit, a circulation seat 1 and the pipeline containing the pump and the liquid containing tank are communicated and connected in series to form a cooling ring circuit for injecting cooling liquid, so as to generate a circulating flow in the millet circuit; Because it is the same as the known technology, it is not the configuration of the detailed structure of this creation, that is, it will no longer be cold-dispersed. It includes one middle: The road is roughly, and the structure can be cooled by liquid, so the seat 1 can have good thermal conductivity. Made of materials such as copper, etc. M277983 3. Creation instructions (4) In this creation contains-seat 10: For example, the circulation seat 1 can be inserted into the liquid container 100 heat transfer seat 11 As a result, a blocking structure 101 can be formed inside the base body 10 and can be formed in the two bodies and the chamber 10. There is a flow-blocking structure inside. It can be used to prove that the number of columns or other shapes are set up. The surname is in the circulation seat. "1 into the ninth ring seat 4 cooling time of the coolant. On the top, the sword has a water inlet 1 〇3 and a water outlet D] n, 甬, 7 妾 口 1 0 3, 1 0 4 and the liquid storage chamber of the base 10, respectively 〇〇4, ίZ ^ to It is connected in series with the above-mentioned cooling circulation circuit, so that the phase of A is insufficient: the operation of Upu is injected into the circulation seat 1 from the water inlet port 103: 'The night water outlet port 104 is discharged to form a circulation loop. The heat transfer member may be a heat pipe 2 or a hot plate, and Ϊ = 与 Γ * 俾 makes one end of the heat pipe 2 contact the circulation seat 1. Between the belly 10 and the heat transfer seat 11, heat pipes = sections m and 110 may be respectively provided, and one end of the heat supply pipe 2 is provided in the seat J and: the concave arc portions 105 and 110 of the transfer seat 11 (as shown in the third figure) (Shown), and the end of the rail tube, 2 is used to extend to the above heat source 3 (as shown in the fourth figure): S 2 can be further provided at the other end with a sticker attached to the heat source 3 ... the heat transfer base 20, the heat transfer base 20 may also be made of a material with good conductivity such as copper, aluminum, or the like. It is based on the improvement of the heat dissipation structure. 'With the above structure, you can get the water-cooled goodness of this creation. As shown in the fourth figure, it is the application of this creative application to a single heat source 2
M277983 四、創作說明（5) 狀態示意圖。該循環座1係可設置於詎熱源3之遠離位置處 上，而僅需藉由熱管2之延伸，令熱管2於另一端處所設置 之熱傳基座2 0貼附於熱源3表面上；如此，透過熱管2高熱 傳量可使熱源3所產生之熱量得以快速被傳導至循環座1， 且無需將循環座1設置在熱源3上方，可避免熱源3承受循 環座1之重量，亦可不受熱源3周圍之環境侷限，同時更可 有效運用系統外部之空間來配置冷卻循環迴路及循環座1 等構件，且將熱量導引之系統外部後，還能避免系統内部 I之溫室效應的產生，亦可避免冷卻液因洩漏而損壞系統。 如第五圖所示，係為本創作應用於複數熱源3、3，之 使用狀態示意圖。當本創作配置複數熱管2、2，時，亦可 分別對不同之熱源3、3，進行熱傳導，以將該等熱源3、 3’所產生之熱量一併傳導至該循環座丨上；如此，僅需藉 由單一組水冷式散熱裝置即可同時對多數的熱源3、3，進 仃散熱，可平衡系統整體所產生之熱量，而可便於進一步 控制與衡溫。 綜上所述’本創作實為不可多得之新型創作產品，其 達到預期之使用目的，而解決習知之缺失，又因極具 生及進步性’完全符合新型專利中請要件，爱依專利 出申請’敬請詳查並賜准本案專#lj，以保障創作人之 ，以上所，僅為本創作之較佳可行實施例此 ^ ^ ^ ^ 牛凡運用本創作說明書及圖式 内谷所為之荨效結構變化，均同揮 J Μ理皆包含於本創作之範圍M277983 IV. Creative Instructions (5) State diagram. The circulation seat 1 can be arranged at a distance from the heat source 3, and only by the extension of the heat pipe 2, the heat transfer base 20 provided at the other end of the heat pipe 2 can be attached to the surface of the heat source 3; In this way, through the high heat transfer of the heat pipe 2, the heat generated by the heat source 3 can be quickly transferred to the circulation seat 1, and the circulation seat 1 does not need to be arranged above the heat source 3, and the heat source 3 can be prevented from bearing the weight of the circulation seat 1. Limited by the environment around heat source 3, it is also possible to effectively use the space outside the system to configure components such as the cooling loop circuit and the circulation seat 1, and to guide the heat to the outside of the system can also avoid the greenhouse effect of the internal I It can also prevent the coolant from damaging the system due to leakage. As shown in the fifth figure, it is a schematic diagram of the use state of this creative application to multiple heat sources 3, 3. When a plurality of heat pipes 2 and 2 are configured in this creation, different heat sources 3 and 3 may be respectively heat-conducted to conduct the heat generated by the heat sources 3 and 3 ′ to the circulation seat together. Only a single group of water-cooled heat sink can be used to dissipate heat from most of the heat sources 3 and 3 at the same time, which can balance the heat generated by the entire system and facilitate further control and temperature control. In summary, 'This creation is a rare new creation product, which achieves the intended use purpose, and solves the lack of knowledge, because it is very innovative and progressive.' It fully meets the requirements of the new patent, Aiyi Patent Please apply for a detailed inspection and grant the permission #lj of this case to protect the creator. The above is only a good and feasible embodiment of this creation. ^ ^ ^ ^ Niu Fan uses this creation manual and schematic inner valley The changes in the structure of the net effect are all included in the scope of this creation.
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第ίο頁 M277983 圖式簡單說明 【圖式簡單說明】 第一圖 係本創作之立體分解示意圖。 第二圖 係本創作之立體組合示意圖。 第三圖 係本創作之組合剖面示意圖。 第四圖 係本創作第一使用狀態之示意圖。 第五圖 係本創作第二使用狀態之示意圖。 〔元件代表符號〕 i <本創作> 循環座 1 座體 10 液體容室 100 阻流結構 101 蓋板 102 入水接口 103 出水接口 104 凹弧部 105 熱傳座 11 凹弧部 110 熱管 1、r 熱傳基座 20 、 20， 熱源 3 、 3’Page 277: Simple illustration of the drawing [Simple illustration of the drawing] The first drawing is a three-dimensional exploded view of the creation. The second picture is a three-dimensional combination diagram of this creation. The third figure is a schematic sectional view of the composition of this creation. The fourth picture is a diagram of the first use state of this creation. The fifth picture is a diagram of the second use state of this creation. [Representative Symbols of Components] i < This Creation > Circulation Block 1 Base Body 10 Liquid Reservoir 100 Flow Blocking Structure 101 Cover 102 Water Inlet Port 103 Water Outlet Port 104 Concave Arc Section 105 Heat Transfer Block 11 Concave Arc Section 110 Heat Pipe 1, r Heat transfer base 20, 20, heat source 3, 3 '