TWI806099B - Thermal module - Google Patents

Abstract

A thermal module includes a base seat and multiple heat pipes. The base seat has a heat absorption side and a heat conduction side. Each heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end has a pair of long sides and a pair of short sides. The long sides and the short sides are connected with each other in the form of a loop to form the heat absorption end. The heat pipes are assembled with each other with the long sides attached to each other. The heat pipes are assembled with the base seat with the short sides attached to the heat conduction side of the base seat. By means of the aboye arrangement, the number of the heat pipes disposed in a limited area or space can be greatly increased to enhance the heat conduction efficiency.

Description

Cooling module

A heat dissipation module, especially a heat dissipation module capable of increasing the overall heat dissipation efficiency of the heat dissipation module.

Existing electronic equipment has at least one heat source and generates heat in the electronic equipment due to data calculation. Generally, the heat source is often installed near the center of the electronic equipment, and it is difficult to export the heat generated by the heat source to the outside. Therefore, some industry operators dissipate heat by setting heat conduction and heat dissipation elements above the heat source. Common heat conduction elements are heat pipes, vapor chambers, etc., and heat dissipation elements are radiators and heat dissipation fin groups. Through heat conduction elements and the heat source After contacting the heat generated by the adsorption heat source, the heat is conducted to the radiator and other heat dissipation elements for heat dissipation.

Please refer to Figures 5 and 6, which are conventional heat dissipation modules of the present invention. The heat pipe 8 used as a heat absorber in the conventional heat dissipation module must first be fixed with the heat source through the combination with the base 9; however, for example Generally speaking, the distance or width of the space or area where the base 9 is used to install the heat pipe is about 30-60 mm. If the diameter of the heat pipe 8 is selected to be 10 mm, only 3-5 heat pipes can be arranged on the base at most, and The joint between the two is only one point or line contact, and in order to increase the contact area between the heat pipe 8 and the base 9, some operators press the heat pipe 8 into a flat shape, and attach the flat heat pipe side to the base 9 In order to increase the contact area between the two, although the contact area between the two can be increased like this, but because the distance or width of the heat pipe that can be arranged on the base is fixed or limited, the number of heat pipes 8 that are arranged is more than that of the unsqueezed The number of round tubes before is less or insufficient, and the thermal efficiency obtained may be the same or worse. Therefore, how to increase the heat transfer efficiency of the heat dissipation module in a limited space while maintaining a good thermal contact area to prevent thermal resistance is the most important goal for those familiar with this technology.

Therefore, in order to effectively solve the above-mentioned problems, the main purpose of the present invention is to provide a heat dissipation module that can increase heat conduction efficiency.

To achieve the above-mentioned purpose, the present invention provides a heat dissipation module, which includes: a base, a plurality of heat pipes; the base has a heat-absorbing side and a heat-conducting side; the heat pipes have a heat-absorbing end and a heat-dissipating end, The heat-absorbing end is formed by connecting a pair of long sides and a pair of short sides. The inside of the heat pipe has a first chamber, the wall of which is provided with a first capillary structure, and the inside of the first chamber is filled with a working fluid. The heat pipes are pasted and combined with each other through the long sides, and the heat pipes are pasted and combined with the heat-conducting side of the base through the short sides. The invention can increase the number of heat pipes and further improve the heat conduction efficiency.

With the heat dissipation module of the present invention, it is possible to increase the number of heat pipes installed in the heat dissipation module within a limited unit distance, length (width), and volume, and to improve the overall heat conduction efficiency of the heat dissipation module through a greater number of heat pipes. Avoid heat sources that produce heat accumulation.

1: Base

11: Heat-absorbing side

12: Heat conduction side

121: Groove

13: The second chamber

14: Second capillary structure

2: heat pipe

2a: Heat-absorbing end

2b: Heat sink

21: long side

22: short side

23: The first capillary structure

24: First chamber

3: heat source

4: Working fluid

5: vapor chamber

6: screw lock element

7: Radiator

8: heat pipe

9: Base

Figure 1 is a perspective view of the first embodiment of the heat dissipation module of the present invention; Figure 2 is a combined cross-sectional view of the first embodiment of the heat dissipation module of the present invention; Figure 3 is the second embodiment of the heat dissipation module of the present invention Combined cross-sectional view; Figure 4 is a schematic diagram of the third embodiment of the heat dissipation module of the present invention; Figure 5 is a perspective view of a conventional heat dissipation module; Figure 6 is a perspective view of a conventional heat dissipation module.

The above-mentioned purpose of the present invention and its structural and functional characteristics will be described based on the preferred embodiments of the accompanying drawings.

Please refer to Figures 1 and 2, which are three-dimensional exploded and combined sectional views of the first embodiment of the heat dissipation module of the present invention. As shown in the figure, the heat dissipation module of the present invention includes: a base 1, a plurality of heat pipes 2; The base 1 has a heat-absorbing side 11 and a heat-conducting side 12, the heat-absorbing side 11 and the heat-conducting side 12 are respectively arranged on the lower and upper sides of the base 1, and the heat-absorbing side 11 is correspondingly in contact with at least one heat source 3 And absorb the heat generated by the heat source 3, the heat conduction side 12 can be combined with a heat conduction element or a heat dissipation element to conduct heat. Heat Conduction Element This case uses the heat pipe 2 as an illustration.

The heat pipes 2 have a heat-absorbing end 2a and a heat-dissipating end 2b. The heat-absorbing end 2a has a pair of long sides 21 and a pair of short sides 22. The long and short sides 21, 22 surround the heat pipe 2 radially. The connection is formed, and the inside of the heat pipe 2 has a first chamber 24, the wall surface of which is provided with at least one first capillary structure 23, and the inside of the first chamber 24 is filled with a working fluid 4, and the long sides 21 of the heat pipes 2 are It is a flat surface, and the short side 22 can be selected as an arc surface or a flat surface, and the heat pipes 2 are attached to each other through the long side 21 to provide rapid heat transfer between the heat pipes 2, and the heat pipes 2 pass through The short side 22 is attached and combined with the heat conduction side 12 of the base 1 .

The first capillary structure 23 is any one of sintered powder, groove, grid body or a combination of any two of the above, and the heat pipe 2 and the base 1 are made of copper, aluminum, stainless steel, titanium, titanium alloy, aluminum Any material of the alloy, and the heat pipe 2 and the base 1 can be any of the same or different materials, and the working fluid 4 can be any of refrigerant, acetone, pure water, and alcohol.

The heat-conducting side 12 of the aforementioned base 1 may have a plurality of grooves 121, the shapes of the short sides 22 of the heat pipes 2 correspond to the grooves 121, and the heat pipes 2 are accommodated in the grooves 121 through the short sides 22 Combined with this base 1.

The contact portion between the heat pipe 2 and the heat-conducting side 12 of the base 1 is not limited to the head and end of the heat pipe 2, but can also be the middle section of the heat pipe 2. The present invention uses the head and the end of the heat pipe 2 as an illustrative example. But it is not limited thereto, and the heat transfer efficiency can be improved by increasing the number of heat pipes 2 arranged in this way, and the heat-absorbing end 2 a of the heat pipe 2 is the same or different from the radial shape of other parts of the heat pipe 2 .

Please refer to Figure 3, which is a cross-sectional view of the second embodiment of the heat dissipation module of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here, but this embodiment The difference from the aforementioned first embodiment is that there is a second chamber 13 inside the base 1, and there is at least one second capillary structure 14 inside the second chamber 13, and the second capillary structure 14 is sintered powder, Any one of grooves and mesh bodies or a combination of any two of the foregoing.

Please refer to Figure 4, which is a schematic diagram of the third embodiment of the heat dissipation module of the present invention. As shown in the figure, part of the structure of this embodiment is the same as that of the first embodiment, so it will not be repeated here, but this embodiment The difference from the aforementioned first embodiment is that the heat-absorbing side 11 of the base 1 is attached to one side of a vapor chamber 5, and the other side of the vapor chamber 5 is in contact with a heat source 3 to absorb the heat source 3 the generated heat, the base 1 in this embodiment is mainly used as a carrier to fix the heat pipe 2 and the chamber 5 to form a heat dissipation module, and another function of the base 1 is to integrate the whole heat dissipation module ( Base 1, heat pipe 2, vapor chamber 5) are fixedly combined with the heat source 3, and the base 1 can lock the base 1 and the heat source 3 through the screw lock element 6, or through the fastener (Fig. (not shown in the figure) to clamp the base 1 or fasten the base 1, and fix the base 1 to the side of the heat source 3 (not shown in the figure).

One end of the heat pipe 2 (i.e. the heat dissipation end) in the first, second, and third embodiments above can be combined with at least one radiator 7 or heat dissipation fin group or water cooling module for cooling. When the contact portion 2a of the heat pipe absorbs the heat source The heat emitted by 3 is conducted by the heat pipe 2 to the distal end of the axial direction, and then the radiator or the cooling fin set or the water-cooling module is used to exchange heat with the surrounding air.

In the present invention, the heat pipes are pasted and combined with each other through the long sides, and the heat pipes are combined with the heat-conducting side of the base through the short sides, so that this design can greatly increase the number of heat pipes in a limited area or space. Set the number to improve the heat conduction efficiency and improve the overall heat dissipation performance, so as to improve the conventional heat dissipation module. Because the distance or width of the heat pipes on the base is fixed or limited, the heat conduction efficiency is not good due to the insufficient number of heat pipes.

1: Base

11: Heat-absorbing side

12: Heat conduction side

121: Groove

2: heat pipe

2a: Heat-absorbing end

2b: Heat sink

21: long side

22: short side

3: heat source

Claims (9)

A heat dissipation module includes: a base with a heat-absorbing side and a heat-conducting side; a plurality of heat pipes, the heat pipes have a heat-absorbing end and a heat-dissipating end, and the heat-absorbing end has a pair of long sides and a pair of short sides , the equal long and short sides are formed by connecting radially around the heat pipe, and the inside of the heat pipe has a first chamber, the wall surface of which is provided with at least one first capillary structure, and the inside of the first chamber is filled with a working fluid, The heat pipes are bonded and combined with each other through the long sides, and the heat pipes are bonded and combined with the heat-conducting side of the base through the short sides. The heat dissipation module as described in Item 1 of the scope of the patent application, wherein the heat conduction side has a plurality of grooves, the shape of the short sides of the heat pipes corresponds to the grooves, and the heat pipes are accommodated in the grooves through the short sides The groove is combined with the base. The heat dissipation module as described in item 1 of the scope of the patent application, wherein the first capillary structure is any one of sintered powder, groove, and mesh body. The heat dissipation module described in item 1 of the scope of the patent application, wherein the heat pipe and the base are made of any one of copper, aluminum, stainless steel, titanium, titanium alloy, and aluminum alloy, and the heat pipe and the base are It can be any of the same or different materials. The heat dissipation module described in item 1 of the scope of the patent application, wherein the working fluid system is any one of refrigerant, acetone, pure water, and alcohol. According to the heat dissipation module described in item 1 of the scope of the patent application, there is a second chamber inside the base, and a second capillary structure inside the second chamber. The heat dissipation module described in item 1 of the scope of the patent application, wherein the heat-absorbing ends of the heat pipes and other parts of the heat pipes have the same or different radial shapes. As the heat dissipation module described in item 1 of the scope of the patent application, one side of a temperature chamber is attached to the heat absorbing side of the base, and the other side of the temperature chamber is attached to a heat source. The heat dissipation module described in item 1 of the scope of the patent application, wherein the heat dissipation end of the heat pipe is combined with at least one heat sink or heat dissipation fin set or water cooling module for cooling.

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