TW201713201A - Thermal dissipation module - Google Patents

Thermal dissipation module

Info

Publication number
TW201713201A
TW201713201A TW105108930A TW105108930A TW201713201A TW 201713201 A TW201713201 A TW 201713201A TW 105108930 A TW105108930 A TW 105108930A TW 105108930 A TW105108930 A TW 105108930A TW 201713201 A TW201713201 A TW 201713201A
Authority
TW
Taiwan
Prior art keywords
dissipation module
pipe
chamber
evaporator
heat source
Prior art date
Application number
TW105108930A
Other languages
Chinese (zh)
Other versions
TWI602497B (en
Inventor
Yung-Chih Wang
Jau-Han Ke
Wen-Neng Liao
Cheng-Wen Hsieh
Original Assignee
Acer Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acer Inc filed Critical Acer Inc
Priority to US15/189,291 priority Critical patent/US9835382B2/en
Priority to US15/226,501 priority patent/US20170074596A1/en
Priority to EP16185982.2A priority patent/EP3144771B1/en
Priority to EP16186964.9A priority patent/EP3144772B1/en
Publication of TW201713201A publication Critical patent/TW201713201A/en
Application granted granted Critical
Publication of TWI602497B publication Critical patent/TWI602497B/en
Priority to US15/796,858 priority patent/US10634435B2/en
Priority to US16/792,195 priority patent/US11609048B2/en
Priority to US18/169,857 priority patent/US11852420B2/en
Priority to US18/505,136 priority patent/US20240068754A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20309—Evaporators
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps

Abstract

A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator is thermally contacted to the heat source and absorbs heat generated from the heat source. The evaporator has a chamber connected to the pipe to form a loop, and the working fluid is filled in the loop. A structure of the chamber located at a connection portion between the chamber and the pipe is convergent gradually toward the pipe relative to other structure of the chamber.
TW105108930A 2015-09-16 2016-03-23 Thermal dissipation module TWI602497B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
US15/189,291 US9835382B2 (en) 2015-09-16 2016-06-22 Thermal dissipation module
US15/226,501 US20170074596A1 (en) 2015-09-16 2016-08-02 Thermal dissipation module
EP16185982.2A EP3144771B1 (en) 2015-09-16 2016-08-26 Thermal dissipation module
EP16186964.9A EP3144772B1 (en) 2015-09-16 2016-09-02 Thermal dissipation module
US15/796,858 US10634435B2 (en) 2015-09-16 2017-10-30 Thermal dissipation module
US16/792,195 US11609048B2 (en) 2015-09-16 2020-02-15 Thermal dissipation module
US18/169,857 US11852420B2 (en) 2015-09-16 2023-02-15 Thermal dissipation module
US18/505,136 US20240068754A1 (en) 2015-09-16 2023-11-09 Thermal dissipation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104130535 2015-09-16

Publications (2)

Publication Number Publication Date
TW201713201A true TW201713201A (en) 2017-04-01
TWI602497B TWI602497B (en) 2017-10-11

Family

ID=57303084

Family Applications (2)

Application Number Title Priority Date Filing Date
TW105108930A TWI602497B (en) 2015-09-16 2016-03-23 Thermal dissipation module
TW105110817A TWI609163B (en) 2015-09-16 2016-04-06 Thermal dissipation module

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW105110817A TWI609163B (en) 2015-09-16 2016-04-06 Thermal dissipation module

Country Status (2)

Country Link
CN (4) CN106550583B (en)
TW (2) TWI602497B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI602497B (en) * 2015-09-16 2017-10-11 宏碁股份有限公司 Thermal dissipation module
US9835382B2 (en) 2015-09-16 2017-12-05 Acer Incorporated Thermal dissipation module
TWI658776B (en) * 2017-11-27 2019-05-01 宏碁股份有限公司 Heat dissipation system of electronic device
CN109841583A (en) * 2017-11-29 2019-06-04 中电普瑞电力工程有限公司 A kind of Natural Circulation evaporative cooling system of thyristor
CN108106473B (en) * 2018-01-12 2019-07-05 奇鋐科技股份有限公司 The hot transmission module of phase stream
CN110062554A (en) * 2018-01-18 2019-07-26 宏碁股份有限公司 The cooling system of electronic device
TWI725422B (en) * 2018-05-31 2021-04-21 技嘉科技股份有限公司 Liquid cooling device, coolant circulation system , and liquid leaking detection method
CN108617083B (en) * 2018-06-11 2020-01-17 Oppo广东移动通信有限公司 Electronic device
CN109099744A (en) * 2018-09-27 2018-12-28 朱钢 Heat exchanger and the new energy vehicles
TWI705540B (en) * 2020-03-25 2020-09-21 建準電機工業股份有限公司 Electronic device with a heat dissipation structure

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Publication number Priority date Publication date Assignee Title
US4931905A (en) * 1989-01-17 1990-06-05 Grumman Aerospace Corporation Heat pipe cooled electronic circuit card
TWM277983U (en) * 2005-05-26 2005-10-11 Rung-Hua Wang Improved water-cooling heat dissipating structure
KR100772381B1 (en) * 2005-09-29 2007-11-01 삼성전자주식회사 Heat sink
CN201039637Y (en) * 2007-01-10 2008-03-19 讯凯国际股份有限公司 Composite heat exchange device
CN101351109A (en) * 2007-07-20 2009-01-21 富准精密工业(深圳)有限公司 Radiating device
CN201153360Y (en) * 2008-01-17 2008-11-19 中兴通讯股份有限公司 Heat radiating device of communication system
DE102009000914A1 (en) * 2009-02-17 2010-08-19 Stemke, Gudrun Evaporator and cooler using such evaporator
EP2433480B1 (en) * 2009-05-18 2013-05-01 Huawei Technologies Co., Ltd. Heat spreading device and method therefore
CN102157468B (en) * 2011-03-17 2013-01-16 北京芯铠电子散热技术有限责任公司 High-power loop heat pipe radiator and manufacturing method thereof
KR101457585B1 (en) * 2012-05-22 2014-11-03 한라비스테온공조 주식회사 Evaporator
CN202979539U (en) * 2012-08-23 2013-06-05 保锐科技股份有限公司 Liquid-cooled heat exchange module with uniform flow channels
CN202799548U (en) * 2012-09-25 2013-03-13 陈羽萱 Heat conducting structure
TWM452329U (en) * 2013-01-11 2013-05-01 Asia Vital Components Co Ltd Improved structure of isothermal board
TWM454707U (en) * 2013-02-01 2013-06-01 Asia Vital Components Co Ltd Heat dissipative structure
CN203722976U (en) * 2013-11-27 2014-07-16 阳光电源股份有限公司 Heat-dissipation device and electronic equipment therewith
CN203761742U (en) * 2014-02-28 2014-08-06 双鸿科技股份有限公司 Liquid-gas divided-flow type heat exchange cavity
TWM487609U (en) * 2014-06-17 2014-10-01 Asia Vital Components Co Ltd Heat dissipation structure of handheld electronic device
CN203980977U (en) * 2014-07-07 2014-12-03 双鸿科技股份有限公司 Interior tubular type temperature-uniforming plate
CN104880107B (en) * 2015-05-18 2017-10-20 华南理工大学 A kind of follow-on ultra-thin loop circuit heat pipe
TWI602497B (en) * 2015-09-16 2017-10-11 宏碁股份有限公司 Thermal dissipation module

Also Published As

Publication number Publication date
CN106550583A (en) 2017-03-29
CN106550583B (en) 2020-04-07
TW201712287A (en) 2017-04-01
TWI609163B (en) 2017-12-21
CN106550584A (en) 2017-03-29
TWI602497B (en) 2017-10-11
CN205726842U (en) 2016-11-23
CN205726840U (en) 2016-11-23

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