CN106550584A - Heat radiation module - Google Patents
Heat radiation module Download PDFInfo
- Publication number
- CN106550584A CN106550584A CN201610291960.7A CN201610291960A CN106550584A CN 106550584 A CN106550584 A CN 106550584A CN 201610291960 A CN201610291960 A CN 201610291960A CN 106550584 A CN106550584 A CN 106550584A
- Authority
- CN
- China
- Prior art keywords
- evaporimeter
- pipe fitting
- chamber
- guiding face
- radiating module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005855 radiation Effects 0.000 title 1
- 239000012530 fluid Substances 0.000 claims abstract description 49
- 238000009434 installation Methods 0.000 claims description 18
- 238000007669 thermal treatment Methods 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 10
- 230000017525 heat dissipation Effects 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- LLPOLZWFYMWNKH-CMKMFDCUSA-N hydrocodone Chemical compound C([C@H]1[C@H](N(CC[C@@]112)C)C3)CC(=O)[C@@H]1OC1=C2C3=CC=C1OC LLPOLZWFYMWNKH-CMKMFDCUSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat dissipation module which is suitable for an electronic device. The electronic device has a heat source. The heat dissipation module comprises an evaporator, a pipe fitting and working fluid. The evaporator is in thermal contact with the heat source to absorb heat generated by the heat source. The evaporator has a chamber. The tubing connects the chambers and forms a circuit. The structure at the junction of the chamber and the pipe is of a tapered profile relative to the rest of the structure of the chamber. The working fluid is filled in the circuit. The technology of the invention can ensure that the working fluid can uniformly jet on each part in the chamber when flowing into the chamber through the tapered structure of the evaporator or the pipe fitting, and the working fluid can be collected and flow to the pipe fitting through the tapered structure after absorbing heat to generate phase change, thereby improving the heat transfer effect of the working fluid.
Description
Technical field
The invention relates to a kind of radiating module.
Background technology
The prosperity of communication science and technology, the mobile device such as mobile phone or panel computer be in modern life can not or
Scarce necessity, and with people for the degree of dependence of those mobile devices is gradually stepped up, use when
Between it is also increasingly longer；But the prolonged long-pending body electricity that the mobile device is often caused using mobile device
Machine is worked as on road because overheated, actually inconvenience.
Fan cannot be adopted as heat dissipation for mobile phone or panel computer etc. are limited to volume and weight
When, it is many at present to take the mode for attaching that radiating material or heat pipe radiate as which.Only, in mobile device
Under the operation of high-power electronic component, the heat dissipation that the radiating mode can be generated is imperfectly known.
The content of the invention
The present invention provides a kind of radiating module, and its local flow channel has tapered configuration, to improve working fluid
Flowing and hot transfer efficiency.
The radiating module of the present invention, it is adaptable to electronic installation.Electronic installation has thermal source.Radiating module bag
Include evaporimeter, pipe fitting and working fluid.Evaporimeter is thermally contacted in thermal source to absorb the heat produced by thermal source
Amount.Evaporimeter has chamber.Pipe fitting connection chamber simultaneously forms loop, its middle chamber and pipe fitting junction
Structure is presented towards the tapered profile of pipe fitting relative to remaining structure of chamber.Working fluid is filled in this time
Road.
The radiating module of the present invention, it is adaptable to electronic installation.Electronic installation has thermal source.Radiating module bag
Include evaporimeter, pipe fitting and working fluid.Evaporimeter is thermally contacted in thermal source.Pipe fitting has ends
Loop is formed to connect evaporimeter.The one end at least within of pipe fitting is towards evaporimeter in tapered.Work
Fluid filling is in loop.
Based on above-mentioned, in the above embodiment of the present invention, by evaporimeter or the tapered configuration of pipe fitting,
Because of caliber difference so as to improving outside fluid rate, the tapered configuration of evaporimeter internal chamber can also make for decapacitation
Working fluid flow into chamber when can equably jet flow in the various pieces of within the chamber, and working fluid absorb heat
After producing phase change, also can be collected by tapered configuration and flow to pipe fitting, and improve working fluid according to this
Heat transfer effects.
It is that the features described above and advantage of the present invention can be become apparent, special embodiment below, and coordinate
Accompanying drawing is described in detail below.
Description of the drawings
Fig. 1 is a kind of partial exploded view of the electronic installation according to one embodiment of the invention；
Fig. 2 is the partial schematic diagram of Fig. 1 radiating modules；
Fig. 3 is the partial top view of the radiating module of Fig. 1.
Accompanying drawing is described in detail：
10：Electronic installation；
100：Radiating module；
110：Evaporimeter；
111：Body；
113：Lid；
120：Pipe fitting；
130：Heat pipe；
112：Heat-conducting piece；
200：Thermal source；
310、320：Housing；
400：Retainer；
500：Plate body；
E1、E2：End；
E3、E4：Opening；
E5：This section；
F1：Working fluid；
R1：The thermal treatment zone；
R2：Flow region.
Specific embodiment
Fig. 1 is a kind of partial exploded view of the electronic installation according to one embodiment of the invention.Refer to Fig. 1,
In the present embodiment, electronic installation 10 is, for example, the portable electronic such as notebook computer or panel computer dress
Put, which possesses compact external appearance characteristic to meet the demand of convenient carrying.Only, with computing with it is aobvious
Show the increase of demand, electronic installation 10 need to arrange the correlation for possessing radiating effect in housing 310,320
Part, can correspond to the radiating requirements for being produced under aforementioned performance requirements therewith.Accordingly, electronic installation 10
Including thermal source 200 and radiating module 100, wherein thermal source 200 e.g. central processing unit or display chip,
The heat produced from thermal source 200 can be absorbed by radiating module 100, and and then heat be filled from electronics
Put 10 other positions to dissipate out.
In the present embodiment, radiating module 100 be, for example, hydrocone type radiating subassembly, it include evaporimeter 110,
Pipe fitting 120 and working fluid F1 (its flow direction is represented with arrow only in the accompanying drawings).Evaporimeter 110 is used
To thermally contact in thermal source 200, to absorb the heat for carrying out self-heat power 200.Pipe fitting 120 connects evaporimeter 110
And loop is formed, working fluid F1 is filled in loop, and working fluid F1 is when flowing through evaporimeter 110
Phase change can be produced because absorbing aforementioned heat, for example, make gaseous working fluid F1 be changed into steam state (vapor)
Working fluid F1, and heat is brought away from therewith as steam state working fluid F1 is moved away from evaporimeter 110,
And as pipe fitting 120 makes working fluid F1 again when the relatively low position of other temperature of electronic installation 10
It is secondary to carry out phase change condensation (liquid is returned by vapor state), and be able to for heat to dissipate out electronic installation 10.
Specifically, the radiating module 100 of the present embodiment also includes heat pipe 130, and which is thermally contacted in thermal source
Between 200 and evaporimeter 110, the heat produced by thermal source 200 is sent to into evaporimeter 110.Enter one
Step ground is said, as shown in figure 1, one end of heat pipe 130 is to be configured in electronic installation by retainer 400
On 10 plate body 500, and structure is connected on thermal source 200 according to this, and the other end of heat pipe 130 is then
With structure be connected to evaporimeter 110 at least local (here is not limiting as which and is connected on evaporimeter 110
Position, meanwhile, the present embodiment does not limit the assembling means of heat pipe 130 and dependency structure yet).So
One, heat pipe 130 just can be with the phase change of another working fluid in which by produced by thermal source 200
Heat is sent to evaporimeter 110.Separately it should be mentioned that configuration as shown in Figure 1, the electricity of the present embodiment
Sub-device 10 also can provide certain dissipation effect by plate body 500 to thermal source 200, and not show at other
In the embodiment for going out, plate body 500 may also be the part-structure or entire infrastructure of housing 310,320.Furthermore,
In the present embodiment, the plate body 500 is made of that, with metal material, which is covered in the configuration of thermal source 200
Mode can also provide thermal source 200 (such as premise central processor or display chip) or other electronic component electricity
Magnetic disturbance (EMI) shield effectiveness.
Fig. 2 is the partial schematic diagram of Fig. 1 radiating modules, and is disassembled by evaporimeter 110 is given part
And can smoothly recognize its internal structure.Fig. 3 is the partial top view of the radiating module of Fig. 1, and here simultaneously will
The internal structure of evaporimeter 110 is shown in broken lines.Fig. 2 and Fig. 3 is please also refer to, in the present embodiment,
Evaporimeter 110 is substantially and is mutually assembled with lid 113 and formed and allow working fluid F1 to flow by body 111
Dynamic internal chamber, wherein body 111 and allow workflow with opening E3, E4 with connecting pipe 120
Body F1 flow into or from (though accompanying drawing represents the flow direction of working fluid F1 with arrow, not therefore and
Limit, in another unshowned embodiment, working fluid can also reverse flow).
It should be noted that the structure of the internal chamber of evaporimeter 110 and 120 junction of pipe fitting relative to
Remaining structure of internal chamber is that the profile towards pipe fitting tapered 120 is presented.Further say, evaporimeter
110 internal chamber is separated as flow region R2 and thermal treatment zone R1, and the of internally positioned chamber periphery
One guiding face S1, the second guiding face S2 and the 3rd guiding face S3, wherein the first guiding face S1 and second
Guiding face S2 is and the 3rd guiding face in tapered from internal chamber towards pipe fitting 120 (that is, be open E4)
S3 is then and the tapered profile at described two in tapered from internal chamber towards pipe fitting 120 (opening E3)
Tapered direction is opposite each other.In other words, the first guiding face S1 and the second guiding face S2 are positions in opening
The opposite sides of E4, and incline towards opening E4, and the 3rd guiding face S3 is then adjacent to the E3 that is open
And incline towards opening E3.
Separately it should be mentioned that in the internal chamber of evaporimeter 110 shown in Fig. 2, heat pipe 130 is connected to
The recess of evaporimeter 110, and described depression causes the correspondence protuberance of internal chamber.Here, inner chamber
Bump pad described in room can be considered thermal treatment zone R1, and the place that pipe fitting 120 is connected with opening E3, E4
For flow region R2, and the second guiding face S2 and the 3rd guiding face S3 is located at thermal treatment zone R1, and the
One guiding face S1 is located at flow region R2, and pipe fitting 120 is substantially connected to flow region R2.In the present embodiment
In, radiating module 100 also includes the multiple heat-conducting pieces 112 for being configured in thermal treatment zone R1, these heat-conducting pieces 112
Profile be in the form of a column body and with array arrange, and heat-conducting piece 112 positioned at thermal treatment zone R1 the second guiding face
Between S2 and the 3rd guiding face S3, working fluid F1 is allowed to flow into evaporimeter 110 by opening E3 whereby
The thermal treatment zone R1 when, the contact area of working fluid F1 and evaporimeter 110 can be improved.
Based on above-mentioned, when working fluid F1 flows into the internal chamber of evaporimeter 110 by opening E3,
In its flow direction, jet flow effect can be produced because of the formed spaces for throwing open of the 3rd guiding face S3, such as
Shown in the dotted line arrow of Fig. 3.Then, working fluid F1 mainly absorbs heat by these heat-conducting pieces 112
And phase change (being changed into steam state working fluid F1 from gaseous working fluid F1) is produced, and pass through first
Guiding face S1 and tapered profile produced by the second guiding face S2 and after being able to conflux, then by opening E4
Flow into pipe fitting 120.
Though it should be mentioned that as shown in this embodiment, only have the 3rd guiding face S3 at opening E3,
And be located at opening E4 and then there is the first guiding face S1 and the second guiding face S2, right the present embodiment is not limited
Evaporimeter processed 110 is internally located at the quantity and its inclined degree of the guiding face of chamber both sides.That is, this area
The those skilled in the art that knows can be according to working-fluid characteristics and radiating requirements, and internally at two openings of chamber
The appropriate guiding face of configuration, to form the tapered configuration towards pipe fitting.
On the other hand, the pipe fitting 120 of the present embodiment substantially divide into this section of E5 and two end E1,
E2, wherein this section E5 are located between end E1, E2, and pipe fitting 120 be with its end E1, E2 with
Opening E3, E4 connection (end E1 connection opening E3, end E2 connection opening E4) of evaporimeter 110.
It is to be noted here that at least one of end E1, E2 of pipe fitting 120 has towards evaporation
The tapered structure of device 110.In other words, in the pipe fitting 120 and the inside of evaporimeter 110 of the present embodiment
The size relationship of chamber is that the caliber of this section of E5 is substantially greater than or equal to the chamber thickness of evaporimeter 110,
And the chamber thickness of evaporimeter 110 is more than the caliber of each end E1, E2.
Consequently, it is possible to as this section of E5 is with the caliber larger compared to each end E1, E2, workflow
Body F1 will keep larger flow and relatively low line loss at this section of E5, and from end E1 or
E2 flow into evaporimeter 110 when, by caliber it is tapered and while arrange in pairs or groups evaporimeter 110 internal chamber gradually
Shrinking structure (which is gradually to open profile for working fluid F1), and the effect of aforementioned jet flow can be improved, borrow
So that working fluid F1 is uniformly sprayed at the everywhere of internal chamber.As it was previously stated, here is not limiting as work
Make the flow direction of fluid, namely the radiating module 100 of the present embodiment can be in response to the use state of electronic installation 10
And make working fluid F1 produce different directions flowing, also by two end E1 of aforementioned pipe fitting 120,
The caliber tapered configuration feature of E2, and allow working fluid F1 no matter which kind of flow direction can maintain which in
Flow and flow velocity, and reach aforementioned jet flow effect.
Additionally, the partial enlarged drawing of the structure configuration and Fig. 2 or Fig. 3 shown in control Fig. 1, pipe fitting 120
The periphery of plate body 500 is configured in substantially, wherein this section E5 is substantially thermally contacted in plate body 500, therefore
Possess the characteristics such as larger area and metal material by plate body 500, and be able to provide preferably heat transfer effects,
Allow steam state working fluid F1 reach when flowing through this section of E5 of pipe fitting 120 from end E2 or E1 according to this cold
Solidifying effect, and make steam state working fluid F1 transform back into gaseous working fluid F1 and again by end E1 or
E2 is flowed back in evaporimeter 110.
In sum, in the above embodiment of the present invention, radiating module passes through evaporimeter or pipe fitting gradually
Shrinking structure, and allow working fluid decapacitation to improve outside flow velocity because of caliber difference, evaporimeter internal chamber is gradually
Shrinking structure can also be arranged in pairs or groups with caliber, and allow working fluid and enter evaporimeter with eruption mode, with can be equably
It is sprayed at flow region and the thermal treatment zone of internal chamber.Furthermore, by internal chamber opposite side exit gradually
Shrinking structure, moreover it is possible to the effect confluxed by the working fluid after phase change is provided, and is able to work successfully
This flows out evaporimeter to make fluid Jing.In other words, pipe fitting passes through the caliber difference of this section and end, and allows
Working fluid can maintain its flow at this larger section of caliber, and then lead to when flowing into evaporimeter by end
Cross the tapered end of caliber and be improved flow velocity, while the tapered knot of forgoing evaporators internal chamber of arranging in pairs or groups
Structure, has the efficiency that preferably flows to allow working fluid.
Finally it should be noted that：Various embodiments above is only illustrating technical scheme rather than right
Its restriction；Although being described in detail to the present invention with reference to foregoing embodiments, this area it is common
Technical staff should be understood：Which still can be modified to the technical scheme described in foregoing embodiments,
Or equivalent is carried out to which part or all technical characteristic；And these modifications or replacement, and
The scope of the essence disengaging various embodiments of the present invention technical scheme of appropriate technical solution is not made.
Claims (10)
1. a kind of radiating module, it is characterised in that suitable for electronic installation, the electronic installation have heat
Source, the radiating module include：
Evaporimeter, thermally contacts in the thermal source to absorb the heat produced by the thermal source, the evaporimeter
With chamber；
Pipe fitting, connects the chamber and simultaneously forms loop, wherein the knot of the chamber and the pipe fitting junction
Structure is presented towards the tapered profile of the pipe fitting relative to remaining structure of the chamber；And
Working fluid, is filled in the loop.
2. radiating module according to claim 1, it is characterised in that the evaporimeter has and is located at
A pair of openings of the opposite sides of the chamber, the opposite end of the pipe fitting connect the pair of opening respectively
Mouthful and form the loop, the tapered profile include by the chamber towards it is described be respectively open it is inclined extremely
A few guiding face.
3. radiating module according to claim 2, it is characterised in that the evaporimeter has first
With the second opening, an at least guiding face, opening includes that the first guiding face, the second guiding face are led with the 3rd
Draw face, and first guiding face be located at the opposite sides of the described second opening with second guiding face,
3rd guiding face is adjacent to the described first opening.
4. radiating module according to claim 3, it is characterised in that the chamber zone is divided into heating
Area and flow region, second guiding face and the 3rd guiding face are located at the thermal treatment zone, and described first
Guiding face is located at the flow region, and the pipe fitting is connected to the flow region.
5. radiating module according to claim 4, it is characterised in that the evaporimeter also includes：
Multiple heat-conducting pieces, are configured in the thermal treatment zone and are located at second guiding face and the 3rd guiding face
Between.
6. radiating module according to claim 1, it is characterised in that also include：
Heat pipe, thermally contacts between the thermal source and the evaporimeter, by the heat produced by the thermal source
Amount is sent to the evaporimeter.
7. a kind of radiating module, it is characterised in that suitable for electronic installation, the electronic installation have heat
Source, the radiating module include：
Evaporimeter, thermally contacts in the thermal source；
Pipe fitting, forms loop to connect the evaporimeter with ends, and the pipe fitting is at least
Wherein one end is in tapered towards the evaporimeter；And
Working fluid, is filled in the loop.
8. radiating module according to claim 7, it is characterised in that the pipe fitting includes described two
End is more than or equal to the chamber thickness of the evaporimeter with this section therebetween, the caliber of described section is connected,
And more than the caliber of each end.
9. radiating module according to claim 8, it is characterised in that also include：
Plate body, is covered in the thermal source, and this section of the pipe fitting is thermally contacted in the plate body.
10. radiating module according to claim 9, it is characterised in that also include：
Heat pipe, thermally contacts between the thermal source and the evaporimeter, by the heat produced by the thermal source
Amount is sent to the evaporimeter, and the localized heat of the pipe is contacted with the plate body.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW104130535 | 2015-09-16 | ||
| TW104130535 | 2015-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106550584A true CN106550584A (en) | 2017-03-29 |
Family
ID=57303084
Family Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610291960.7A Pending CN106550584A (en) | 2015-09-16 | 2016-05-05 | Heat radiation module |
| CN201610289435.1A Active CN106550583B (en) | 2015-09-16 | 2016-05-05 | Heat radiation module |
| CN201620398460.9U Withdrawn - After Issue CN205726842U (en) | 2015-09-16 | 2016-05-05 | Heat radiation module |
| CN201620395347.5U Active CN205726840U (en) | 2015-09-16 | 2016-05-05 | Heat radiation module |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610289435.1A Active CN106550583B (en) | 2015-09-16 | 2016-05-05 | Heat radiation module |
| CN201620398460.9U Withdrawn - After Issue CN205726842U (en) | 2015-09-16 | 2016-05-05 | Heat radiation module |
| CN201620395347.5U Active CN205726840U (en) | 2015-09-16 | 2016-05-05 | Heat radiation module |
Country Status (2)
| Country | Link |
|---|---|
| CN (4) | CN106550584A (en) |
| TW (2) | TWI602497B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9835382B2 (en) | 2015-09-16 | 2017-12-05 | Acer Incorporated | Thermal dissipation module |
| TWI602497B (en) * | 2015-09-16 | 2017-10-11 | 宏碁股份有限公司 | Thermal dissipation module |
| TWI658776B (en) * | 2017-11-27 | 2019-05-01 | 宏碁股份有限公司 | Heat dissipation system of electronic device |
| CN109841583A (en) * | 2017-11-29 | 2019-06-04 | 中电普瑞电力工程有限公司 | A kind of Natural Circulation evaporative cooling system of thyristor |
| CN108106473B (en) * | 2018-01-12 | 2019-07-05 | 奇鋐科技股份有限公司 | The hot transmission module of phase stream |
| CN110062554A (en) * | 2018-01-18 | 2019-07-26 | 宏碁股份有限公司 | The cooling system of electronic device |
| TWI725422B (en) * | 2018-05-31 | 2021-04-21 | 技嘉科技股份有限公司 | Liquid cooling device, coolant circulation system , and liquid leaking detection method |
| CN108617083B (en) * | 2018-06-11 | 2020-01-17 | Oppo广东移动通信有限公司 | Electronic device |
| CN109099744A (en) * | 2018-09-27 | 2018-12-28 | 朱钢 | Heat exchanger and the new energy vehicles |
| TWI705540B (en) * | 2020-03-25 | 2020-09-21 | 建準電機工業股份有限公司 | Electronic device with a heat dissipation structure |
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- 2016-03-23 TW TW105108930A patent/TWI602497B/en active
- 2016-04-06 TW TW105110817A patent/TWI609163B/en active
- 2016-05-05 CN CN201610291960.7A patent/CN106550584A/en active Pending
- 2016-05-05 CN CN201610289435.1A patent/CN106550583B/en active Active
- 2016-05-05 CN CN201620398460.9U patent/CN205726842U/en not_active Withdrawn - After Issue
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201712287A (en) | 2017-04-01 |
| CN106550583B (en) | 2020-04-07 |
| TWI609163B (en) | 2017-12-21 |
| CN205726840U (en) | 2016-11-23 |
| TWI602497B (en) | 2017-10-11 |
| CN205726842U (en) | 2016-11-23 |
| TW201713201A (en) | 2017-04-01 |
| CN106550583A (en) | 2017-03-29 |
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