CN109407797A - A kind of server heat-radiation framework - Google Patents
A kind of server heat-radiation framework Download PDFInfo
- Publication number
- CN109407797A CN109407797A CN201811203287.2A CN201811203287A CN109407797A CN 109407797 A CN109407797 A CN 109407797A CN 201811203287 A CN201811203287 A CN 201811203287A CN 109407797 A CN109407797 A CN 109407797A
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- China
- Prior art keywords
- cabinet
- wind scooper
- heat
- cpu
- shell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
The invention discloses a kind of server heat-radiation frameworks, it is related to server heat-radiation framework technical field, including power supply, FPGA card and CPU, FPGA card is set to left end in cabinet, the radiating end of FPGA card is opposite with cabinet air outlet, cabinet air outlet is set on cabinet right side wall, the right end of the FPGA card is equipped with wind scooper, wind scooper includes from left to right sequentially connected first wind scooper and the second wind scooper, the inner cavity of first wind scooper is small horn-like of the big right end in left end, second wind scooper is tubular structure, the left end of first wind scooper and the radiating end of FPGA card connect, the one end of second wind scooper far from the first wind scooper is opposite with cabinet air outlet, CPU is set to the front side or rear side of wind scooper.The present invention can efficiently use the confined space inside machine box for server, carry out water conservancy diversion to the hot wind that FPGA card generates, improve the heat dissipation effect of cabinet inside component, reduce the concentration of cabinet inside component, reduce cost.
Description
Technical field
The present invention relates to server heat-radiation framework technical fields, and in particular to a kind of server heat-radiation framework.
Background technique
With the development of the new techniques such as cloud computing, big data, machine box for server internal component is more and more closer, and
The arithmetic speed of processor and operand are also increasing, the quantity of heat production of the components such as memory, hard disk, CPU, FPGA card also with
Increase.
In the machine box for server for including power supply, FPGA card and CPU, FPGA card is set to left end in cabinet, and FPGA card dissipates
Hot end is opposite with cabinet air outlet, and cabinet air outlet is set on cabinet right side wall, and CPU is set to the right of the radiating end of FPGA card.
So the hot wind that FPGA card generates can flow through CPU, CPU heat dissipation is interfered, causes the problem of CPU heat dissipation effect difference, and then influence CPU
Normal operation.
The prior art is utilized in the mode for increasing the quantity of fan mould group at cabinet air outlet, air in Lai Zengqiang cabinet
Flowing promotes cabinet inside heat dissipation.But this mode cannot efficiently use the confined space inside machine box for server, increase machine
The concentration of case internal component, also improves cost.
Summary of the invention
The present invention In view of the above shortcomings of the prior art, proposes a kind of server heat-radiation framework, and the present invention can have
Effect carries out water conservancy diversion using the confined space inside machine box for server, to the hot wind that FPGA card generates, and improves cabinet inside component
Heat dissipation effect, reduce cabinet inside component concentration, reduce cost.
To achieve the goals above, the technical solution adopted by the present invention is that:
A kind of server heat-radiation framework, including power supply, FPGA card and CPU, FPGA card are set to left end in cabinet, FPGA card
Radiating end is opposite with cabinet air outlet, and cabinet air outlet is set on cabinet right side wall, and the right end of the FPGA card is equipped with wind scooper,
Wind scooper includes that from left to right sequentially connected first wind scooper and the second wind scooper, the inner cavity of the first wind scooper are the big right side in left end
Hold small horn-like, the second wind scooper is tubular structure, and the left end of the first wind scooper and the radiating end of FPGA card connect, and second leads
The one end of fan housing far from the first wind scooper is opposite with cabinet air outlet, and CPU is set to the front side or rear side of wind scooper.
Further, cpu heat is equipped with above the CPU, cpu heat includes thermal conductive shell and is set to thermally conductive
Heat conducting pipe on outer casing inner wall, heat conducting pipe are connect with thermal conductive shell, and thermal conductive shell includes from left to right sequentially connected shell one
With shell two, shell one and shell two are long barrel structure, and the length direction of shell one is vertical with the length direction of shell two, outside
The length direction of shell two is parallel close to the side of CPU with cabinet right side wall.
Further, the material of the thermal conductive shell is copper.
Further, the thermal conductive shell is externally provided with the cooling fin that material is aluminium, cooling fin be equipped with it is multiple, and thermally conductive outer
Shell is uniformly distributed outside.
Further, the heat conducting pipe is sintered heat pipe.
Further, the power supply is set to right end in cabinet, and power supply is connect with cabinet rear wall, the radiating end and machine of power supply
Case air outlet is opposite, and power supply is equipped with wind deflector far from the side of cabinet rear wall, and the right end of wind deflector connects to power supply, wind deflector
Left end be located at the left end of cpu heat, wind deflector, chassis backplane, cabinet rear wall and cabinet top plate are logical around wind-guiding is formed
Road.
Further, the server is 2U type services device.
The invention has the benefit that
1, because FPGA card right end be equipped with wind scooper, wind scooper include from left to right sequentially connected first wind scooper and
Second wind scooper, the inner cavity of the first wind scooper are small horn-like of the big right end in left end, the left end of the first wind scooper and FPGA card
Radiating end connection, so the first wind scooper can collect the hot wind that FPGA card generates, because the second wind scooper is tubular knot
Structure, the one end of the second wind scooper far from the first wind scooper is opposite with cabinet air outlet, and CPU is set to the front side or rear side of wind scooper,
It is flowed at cabinet air outlet so directly passing through the second wind scooper by the hot wind that the first wind scooper collects, FPGA card is avoided to produce
Raw hot wind can flow through CPU, and obstruction CPU is avoided to radiate and cause the problem of CPU heat dissipation effect difference, and then avoid influencing CPU's
It operates normally；And the quantity without increasing the fan mould group in cabinet, the confined space of cabinet inside is made full use of, reasonably
Existing air quantity is distributed, heat dissipation effect is improved, the concentration for increasing cabinet inside component is avoided, reduces cost.
2, because the thermal conductive shell of cpu heat includes from left to right being sequentially connected shell one and shell two, one He of shell
Shell two is long barrel structure, and the length direction of shell one is vertical with the length direction of shell two, the length direction of shell two with
Cabinet right side wall is parallel close to the side of CPU.So cuboid cpu heat than in the prior art increases radiating surface
Product improves radiating efficiency, and the length direction of the shell two of long barrel structure is parallel close to the side of CPU with cabinet right side wall,
The distinguished and admirable contact area being capable of increasing at thermal conductive shell and cabinet air outlet, when the setting fan mould group at cabinet air outlet
When, increase the distinguished and admirable contact area with thermal conductive shell at fan mould group, improves the radiating efficiency of cpu heat, CPU is effectively reduced
Temperature.
3, by allowing the material of thermal conductive shell for copper.It is because aluminium and copper are to be known as being most suitable for being used to doing the material to radiate
Matter, copper are compared with aluminium, and copper has the more excellent capacity of heat transmission, and the material of thermal conductive shell is allowed to be copper, the heat that CPU can be made to distribute
It preferably passes to the cooling fin outside thermal conductive shell to radiate, improves heat transfer rate and radiating efficiency.
4, by being externally provided with the cooling fin that material is aluminium in thermal conductive shell, cooling fin be equipped with it is multiple, and outside thermal conductive shell
It is uniformly distributed.Save the cost and processing can be facilitated, this is because copper is compared with aluminium, the price of copper is more expensive than aluminium, difficulty of processing ratio
Aluminium is big；And combined with thermal conductive shell made of copper, on the one hand the heat for distributing CPU is directly passed to thermal conductive shell, another
Aspect passes to thermal conductive shell by heat conducting pipe, the two aspects carry out simultaneously, and raising heat-transfer rate, thermal conductive shell is by heat
Pass to cooling fin again, both save the cost, facilitate processing, also improve heat dissipation effect and radiating efficiency
5, because heat conducting pipe is in bending, the heating conduction of channel heat pipe is substantially reduced, or even can only achieve and lead originally
The half of hot property, and sintered heat pipe then has more excellent heating conduction, so heat conducting pipe is allowed to be sintered heat pipe, can make to lead
Heat pipe has more excellent heating conduction, so that cpu heat be made to have better heat-conducting effect, the working principle of sintered heat pipe
Are as follows: the evaporator section of sintered heat pipe is heated, and the heat-pipe working medium vaporization in sintered heat pipe, the heat-pipe working medium pressure of vaporization increases, vaporization
Heat-pipe working medium flowed under the effect of the pressure to condensation segment, the heat-pipe working medium of vaporization in condensation segment heat release and is condensed into liquid,
The heat-pipe working medium of liquid, which flows back to evaporator section under the action of the capillary force of the tube wall of sintered heat pipe, to be continued to be heated, and is so recycled past
It is multiple, the heat of CPU is taken away.
6, because power supply is set to right end in cabinet, power supply is connect with cabinet rear wall, the radiating end of power supply and cabinet outlet air
Mouth is opposite, and power supply is equipped with wind deflector far from the side of cabinet rear wall, and the right end of wind deflector connects to power supply, the left end of wind deflector
Positioned at the left end of cpu heat, wind deflector, chassis backplane, cabinet rear wall and cabinet top plate surround and form air-guiding aisle.So
Temperature lower wind in front can radiate to power supply by air-guiding aisle in cabinet, and wind deflector has blocked the height of CPU generation
Temperature is distinguished and admirable, and the distinguished and admirable influence of the high temperature for avoiding power supply from being generated by CPU can be effectively reduced the temperature of power supply air inlet；And
Power supply hot air reflux problem caused by the higher-pressure region at cabinet right end air outlet fan mould group is avoided, the heat dissipation effect of power supply is improved
Fruit.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of server heat-radiation framework；
Fig. 2 is the structural schematic diagram of wind scooper；
Fig. 3 is the structural schematic diagram of cpu heat；
Fig. 4 is the structural schematic diagram of the thermal conductive shell of cpu heat；
Fig. 5 is the structural schematic diagram of wind deflector.
Description of symbols: 1- cabinet, 101- cabinet right side wall, 102- cabinet rear wall, the first FPGA card of 2-, 3- second
FPGA card, 4- the 2nd CPU of the first CPU, 5-, 6- wind scooper, the first wind scooper of 601-, the second wind scooper of 602-, 7-CPU heat dissipation
Device, 701- thermal conductive shell, 702- shell one, 703- shell two, 704- cooling fin, 8- power supply, 9- wind deflector, 901- plate one,
902- plate two, 903- plate three, 10- fan mould group.
It is worth noting that, in the description of the present invention, term " center ", "upper", "lower", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to
Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation,
It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.
Specific embodiment
For a better understanding of the present invention, the present invention will be further elaborated with reference to the accompanying drawing.
Embodiment:
In the cabinet of 2U type services device, as shown in Figure 1, including 8, two FPGA cards of power supply and two CPU, power supply 8,
Two FPGA cards and two CPU are connect with chassis backplane, and two FPGA cards are respectively the first FPGA card 2 and the second FPGA card 3,
First FPGA card 2 and the second FPGA card 3 are set to the left end of cabinet 1, the radiating end of the first FPGA card 2 and the second FPGA card 3
Radiating end is opposite with cabinet air outlet, and cabinet air outlet is set on cabinet right side wall 101, and two CPU are respectively the first CPU4
It is set to the right of the radiating end of the first FPGA card 2 with the 2nd CPU5, the first CPU4, the 2nd CPU5 is set to dissipating for the second FPGA card 3
The right in hot end, in cabinet 1 also side by side the air outlet equipped with 4 fan mould groups, 10,4 fan mould groups 10 with cabinet right side wall
Cabinet air outlet connection on 101.
The right end of first FPGA card 2 and the second FPGA card 3 is equipped with wind scooper 6, and 6 structure of wind scooper is as shown in Fig. 2, lead
Fan housing 6 includes that from left to right sequentially connected first wind scooper 601 and the second wind scooper 602, the inner cavity of the first wind scooper 601 are
Small horn-like of the big right end in left end, the second wind scooper 602 are tubular structure, the left end of the first wind scooper 601 and the first FPGA card 2
Radiating end and the second FPGA card 3 radiating end connection, the second wind scooper 602 one end and cabinet far from the first wind scooper 601
Air outlet is opposite, and the first CPU4 and the 2nd CPU5 are respectively arranged on the front and rear sides of the second wind scooper 602.
Further, cpu heat 7, the knot of cpu heat 7 are equipped with above the first CPU4 and the 2nd CPU5
Structure is as shown in Figure 3 and Figure 4, and cpu heat 7 includes thermal conductive shell 701 and the heat conducting pipe on 701 inner wall of thermal conductive shell, leads
Heat pipe is connect with thermal conductive shell 701, and thermal conductive shell 701 includes left-to-right sequentially connected shell 1 and shell 2 703, tool
Body, it is connect in the middle part of the right end and 2 703 side wall of shell of shell 1, shell 1 and shell 2 703 are long barrel structure,
The length direction ab of shell 1 and the length direction cd of shell 2 703 are vertical, the length direction cd and cabinet of shell 2 703
Right side wall 101 is parallel close to the side of CPU, overlooks in cabinet 1, thermal conductive shell is " T " shape.
Further, the material of the thermal conductive shell 701 is copper.
Further, the thermal conductive shell 701 be externally provided with material be aluminium cooling fin 704, cooling fin 704 be equipped with it is multiple,
And it is uniformly distributed outside thermal conductive shell 701.
Further, the heat conducting pipe is sintered heat pipe.
Further, the power supply 8 is set to right end in cabinet 1, and power supply 8 is connect with cabinet rear wall 102, and power supply 8 dissipates
Hot end is opposite with cabinet air outlet, and power supply 8 is equipped with wind deflector 9,9 structure of wind deflector such as Fig. 5 far from the side of cabinet rear wall 102
Shown, wind deflector 9 includes sequentially connected plate 1, plate 2 902 and plate 3 903 from right to left, the right end and electricity of plate 1
The left end in source 8 connects, and plate 3 903 is set to cpu heat 7 close to the side of cabinet rear wall 102, and the left end of plate 3 903 is in CPU
The left end of radiator 7, wind deflector 9, chassis backplane, cabinet rear wall 102 and cabinet top plate surround and form air-guiding aisle.
In use, the first wind scooper 601 collects the hot wind that the first FPGA card 2 and the second FPGA card 3 generate, by
The hot wind that one wind scooper 601 collects directly passes through the second wind scooper 602 and flows at the air outlet of cabinet 1, and is located at machine
Hot wind is dispersed into outside cabinet 1 by the fan mould group 10 at 1 air outlet of case, realizes wind scooper 6 to the first FPGA card 2 and second
The water conservancy diversion of the generation hot wind of FPGA card 3；The heat that first CPU4 and the 2nd CPU5 are distributed passes through the bottom surface of thermal conductive shell 701, will be hot
Amount passes to the heat conducting pipe in thermal conductive shell 701, and heat conducting pipe distributes heat on thermal conductive shell 701, and thermal conductive shell 701 will be warm
Amount passes to cooling fin 704, to realize heat dissipation of the cpu heat 7 to the first CPU4 and the 2nd CPU5；Front temperature in cabinet 1
Spending lower wind can radiate to power supply 8 by air-guiding aisle, and the height generated by the first CPU4 and the 2nd CPU5 is avoided
The distinguished and admirable influence of temperature, can be effectively reduced the temperature of 8 air inlet of power supply.The present invention is suitable for two CPU layouts, system power dissipation
Height, the type of PSU postposition can make full use of existing air quantity to accomplish system temperature most bottom using the present invention.
Claims (7)
1. a kind of server heat-radiation framework, including power supply, FPGA card and CPU, FPGA card is set to left end in cabinet, and FPGA card dissipates
Hot end is opposite with cabinet air outlet, and cabinet air outlet is set on cabinet right side wall, which is characterized in that the right end of the FPGA card is set
There is wind scooper, wind scooper includes from left to right sequentially connected first wind scooper and the second wind scooper, the inner cavity of the first wind scooper
For small horn-like of the big right end in left end, the second wind scooper is tubular structure, the left end of the first wind scooper and the radiating end of FPGA card
Connection, the one end of the second wind scooper far from the first wind scooper is opposite with cabinet air outlet, CPU set on wind scooper front side or after
Side.
2. a kind of server heat-radiation framework according to claim 1, which is characterized in that be equipped with CPU above the CPU
Radiator, cpu heat include thermal conductive shell and the heat conducting pipe on thermal conductive shell inner wall, and heat conducting pipe and thermal conductive shell connect
It connects, thermal conductive shell includes from left to right sequentially connected shell one and shell two, and shell one and shell two are long barrel structure, outside
The length direction of shell one is vertical with the length direction of shell two, and the length direction and cabinet right side wall of shell two are close to the one of CPU
Side is parallel.
3. a kind of server heat-radiation framework according to claim 2, which is characterized in that the material of the thermal conductive shell is
Copper.
4. a kind of server heat-radiation framework according to claim 3, which is characterized in that the thermal conductive shell is externally provided with material
For the cooling fin of aluminium, cooling fin is equipped with multiple, and is uniformly distributed outside thermal conductive shell.
5. a kind of server heat-radiation framework according to claim 4, which is characterized in that the heat conducting pipe is sintered heat pipe.
6. a kind of server heat-radiation framework according to claim 2, which is characterized in that the power supply is set to right in cabinet
End, power supply are connect with cabinet rear wall, and the radiating end of power supply is opposite with cabinet air outlet, side of the power supply far from cabinet rear wall
Equipped with wind deflector, the right end of wind deflector is connected to power supply, and the left end of wind deflector is located at the left end of cpu heat, wind deflector, cabinet
Bottom plate, cabinet rear wall and cabinet top plate surround and form air-guiding aisle.
7. a kind of server heat-radiation framework according to claim 1, which is characterized in that the server is 2U type services
Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811203287.2A CN109407797A (en) | 2018-10-16 | 2018-10-16 | A kind of server heat-radiation framework |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811203287.2A CN109407797A (en) | 2018-10-16 | 2018-10-16 | A kind of server heat-radiation framework |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109407797A true CN109407797A (en) | 2019-03-01 |
Family
ID=65468159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811203287.2A Pending CN109407797A (en) | 2018-10-16 | 2018-10-16 | A kind of server heat-radiation framework |
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| Country | Link |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112270086A (en) * | 2020-10-26 | 2021-01-26 | 济南浪潮高新科技投资发展有限公司 | System and method for preventing FPGA (field programmable Gate array) from heat dissipation failure |
| TWI816551B (en) * | 2022-09-16 | 2023-09-21 | 英業達股份有限公司 | Server |
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| CN1707395A (en) * | 2004-06-09 | 2005-12-14 | 中国科学院计算技术研究所 | Radiating system for four-path frame server |
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| CN203761703U (en) * | 2013-12-30 | 2014-08-06 | 杭州华三通信技术有限公司 | Electronic equipment cabinet |
| CN104898814A (en) * | 2015-06-29 | 2015-09-09 | 北京百度网讯科技有限公司 | Ventilation device for ventilation source cluster and server |
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2672342Y (en) * | 2003-08-22 | 2005-01-19 | 鸿富锦精密工业（深圳）有限公司 | Wind guide tube and radiator using siad wind guide tube |
| CN1707395A (en) * | 2004-06-09 | 2005-12-14 | 中国科学院计算技术研究所 | Radiating system for four-path frame server |
| CN101730445A (en) * | 2008-10-20 | 2010-06-09 | 富准精密工业(深圳)有限公司 | Heat radiation device |
| CN203761703U (en) * | 2013-12-30 | 2014-08-06 | 杭州华三通信技术有限公司 | Electronic equipment cabinet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112270086A (en) * | 2020-10-26 | 2021-01-26 | 济南浪潮高新科技投资发展有限公司 | System and method for preventing FPGA (field programmable Gate array) from heat dissipation failure |
| TWI816551B (en) * | 2022-09-16 | 2023-09-21 | 英業達股份有限公司 | Server |
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Application publication date: 20190301 |
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| RJ01 | Rejection of invention patent application after publication |