CN207133752U - The heat dissipation equipment that CPU caused by a kind of conflict for computer software is overheated - Google Patents
The heat dissipation equipment that CPU caused by a kind of conflict for computer software is overheated Download PDFInfo
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- CN207133752U CN207133752U CN201720773288.5U CN201720773288U CN207133752U CN 207133752 U CN207133752 U CN 207133752U CN 201720773288 U CN201720773288 U CN 201720773288U CN 207133752 U CN207133752 U CN 207133752U
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- fan
- cpu
- radiator
- heat dissipation
- conflict
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Abstract
The utility model discloses the heat dissipation equipment that CPU caused by a kind of conflict for computer software is overheated, including with the CPU radiators that contact of fitting and installed in fan of the radiator away from CPU one end；The radiator and fan are installed in mozzle；Also include being used for the temperature sensor for detecting CPU real time temperatures, the single-chip microcomputer being connected with temperature sensor, and crystal oscillating circuit, filter circuit, amplifying circuit and the motor drive circuit being connected with single-chip microcomputer.The utility model by being provided with mozzle outside the first fan in radiator and for radiating, the second fan, and mozzle and its end with being connected on the outside of the tank wall of mainframe box, it is ensured that the air for flowing through radiator is cold air, raising radiating efficiency.
Description
Technical field
Computer hardware field, more particularly to computer heat radiating device field are the utility model is related to, is one specifically
The heat dissipation equipment that CPU caused by kind is used for computer software conflict is overheated.
Background technology
In current Internet era, computer has been most basic live and work necessity, the popularization of computer
The with no paper process in work is advanced, greatly improves operating efficiency.However, it is handled during computer treatmenting information
Device（That is CPU）It is continual to carry out substantial amounts of computing, can produce substantial amounts of heat, the processor of current main-stream for CPU and
AMD, its normal working temperature is 50 °C -75 °C, generally may can not be just in more than more than 85 °C CPU when cpu temperature is too high
Often work, computer also deadlock, blue screen or the phenomenon restarted automatically can occur because of CPU high temperature, therefore, can cause the fortune of computer
Calculation unsuccessfully even results in loss of data etc..However, in reality, the reason for causing computer temperature too high, mainly has following several
Kind：One, computer operation large software, its amount of ram taken and data processing amount are very huge；Secondly, because software or
Temperature caused by person's system clashes drastically raises.Under normal circumstances, because software conflict causes what cpu temperature rose, continue
Second time 5-10 will produce deadlock phenomenon.
Existing processor heat abstractor is typically to install the radiator of an aluminium alloy additional at the CPU back side, and is being radiated
A radiator fan is equipped with device and ceaselessly dry and is radiated；Because existing radiator and radiator fan are directly to pacify
On CPU, the air inlet of fan and exhaust are in the same area, and all inside mainframe box, therefore, when one section of computer operation
Between after, in the heat caused by a large amount of CPU that can be deposited in mainframe box in the presence of fan, utilize hot-air to carry out circulation cooling
Effect is gradually reduced, and the air inlet of radiator fan in addition does not have any guiding device, and its air-flow is careless and sloppy turbulent flow, and flow velocity is slow, is dissipated
Thermal effect is poor, it is impossible to effectively temperature caused by software conflict or system crash is risen sharply and effectively radiated, in consideration of it, needing
A kind of efficient heat dissipation equipment is provided, to avoid above mentioned problem, avoids crashing because software conflict causes cpu temperature too high.
Utility model content
The purpose of this utility model is that providing a kind of radiating for being used for CPU overheats caused by computer software conflict sets
It is standby, for solve the indeterminable cpu temperature caused by software conflict of existing heat dissipation equipment steeply rise cause radiating not
The problem of crashing in time.
The utility model is achieved through the following technical solutions：
The heat dissipation equipment that CPU caused by a kind of conflict for computer software is overheated, including the radiating contacted with CPU fittings
Device and installed in fan of the radiator away from CPU one end；The radiator and fan are installed in mozzle.
In order to further realize the utility model, strengthen speed air flow, improve radiating efficiency, it is preferable that institute
Stating fan includes the first fan and the second fan, and second fan is installed close to radiator.
In order to further realize the utility model, strengthen speed air flow, improve radiating efficiency, it is preferable that institute
State the second fan to be driven by the second motor, the first fan is driven by the first motor, and the maximum (top) speed of the second motor is more than first
The maximum (top) speed of fan；The length of blade of second fan is equal to 2/3rds of the length of blade of the first fan.
In order to further realize the utility model, increase effective air circulation cross-section in mozzle, improve radiating
Efficiency, it is preferable that first motor and the second motor are carried out by the fixed support being fixedly connected with the water conservancy diversion inside pipe wall
It is fixed.
In order to further realize the utility model, reduce heat alluvial, improve effectively distributing for heat, it is preferable that
The radiator is integrated design, and middle part is provided with solid heat carrier, is set around heat carrier due to multiple forniciform scattered
Backing, the heat dissipation channel of bending is formed between adjacent two pieces of fin and runs through whole radiator.
In order to further realize the utility model, the thermal heat transfer capability of CPU and radiator is improved, improves radiating effect
Rate, it is preferable that the material of described radiator is fine copper.
In order to further realize the utility model, intellectuality is improved, strengthens the specific aim and validity of radiating, preferably
Ground, in addition to for detecting the temperature sensor of CPU real time temperatures, the single-chip microcomputer being connected with temperature sensor, and and monolithic
Crystal oscillating circuit, filter circuit, amplifying circuit and the motor drive circuit of machine connection.
The utility model compared with prior art, has advantages below and beneficial effect：
（1）The utility model by being provided with mozzle outside the first fan in radiator and for radiating, the second fan,
And mozzle and its end with being connected on the outside of the tank wall of mainframe box, it is ensured that the air for flowing through radiator is cold air, raising
Radiating efficiency.
（2）The material of radiator of the present utility model manufactures for fine copper, and its heat conductivility is more preferable than existing aluminium alloy, more
Beneficial to distributing for heat, highly efficient CPU radiatings are realized；Further, the fin on radiator is curved surface, to cold air
Outflow and by producing certain stop, increase the time of contact of cold air and fin, to take away more heats.
（3）Radiator fan is laid out using two-stage, and is more than by the blade of the first fan of the side of air inlet section close to radiating
Second fan blade of device, air communication channel become narrow, further increase air pressure, increase flow velocity, take away more heat
Amount, improve radiating efficiency.
Brief description of the drawings
Fig. 1 is topology view of the utility model along airintake direction；
Fig. 2 is along the profile of A-A hatchings in Fig. 1；
Fig. 3 is circuit theory diagrams of the present utility model；
Wherein 1- mozzles；2- radiators；21- heat carriers；22- fin；The fans of 3- first；The motors of 31- first；4-
Two fans；The motors of 41- second；5- fixed supports；6- kuppes.
Embodiment
The utility model is described in further detail with reference to embodiment, but embodiment of the present utility model is not
It is limited to this.
Embodiment 1：
With reference to shown in accompanying drawing 1-2, the heat dissipation equipment of CPU overheats caused by a kind of conflict for computer software, including with
CPU is bonded the radiator 2 of contact and installed in fan of the radiator 2 away from CPU one end；The radiator 2 and fan are respectively mounted
In mozzle 1.
Operation principle：
Because radiator 2 and fan are arranged in mozzle 1, in the presence of fan rotates at a high speed, air can only be from
One end of mozzle 1 flows to the other end, avoids the problem of air-flow existing for existing radiator fan is careless and sloppy turbulent, meanwhile,
In order to prevent the cold and hot sky with heat to be again introduced into cooling circulation, radiating efficiency is reduced, further, by the mozzle 1
Inlet end be directly connected with computer chassis shell, and utilize multiple small spaces for being arranged on computer case to carry out
Contaminant filter, prevent larger volume or graininess solid impurity from entering in mozzle 1, influence radiating efficiency.
Embodiment 2：
In order to further realize the utility model, strengthen speed air flow, radiating efficiency is improved, in embodiment 1
On the basis of, with reference to shown in accompanying drawing 1-2, further, the fan includes the first fan 3 and the second fan 4, and described second
Fan 4 is installed close to radiator 2.
In order to further realize the utility model, strengthen speed air flow, improve radiating efficiency, it is preferable that institute
State the second fan 4 to be driven by the second motor 41, the first fan 3 is driven by the first motor 31, and the maximum (top) speed of the second motor 41
More than the maximum (top) speed of the first fan 3；The length of blade of second fan 4 is equal to three points of the length of blade of the first fan 3
Two.
Operation principle：
The purpose that first fan 3 and the second fan 4 are installed and independently driven side by side is to enter the air in mozzle 1
Row two level accelerates, and improves the initial velocity that cold air enters radiator 2, improves the cold air stream that radiator 2 is flowed through in the unit interval
Amount, more heats are taken away, improve radiating efficiency.The length of blade of second fan 4 is arranged to the length of blade of the first fan 3
2/3rds purpose is the cross-sectional area for reducing air circulation, increases atmospheric pressure and flow velocity, makes the inlet end of radiator 2
Pressure difference is formed with exhaust end, so that both taking away more heats beneficial to cold air, can prevent small foreign body from dissipating again
The air inlet port alluvial of hot device 2, forms the air inlet that obstacle blocks radiator 2.
Embodiment 3：
In order to further realize the utility model, increase effective air circulation cross-section in mozzle 1, improve radiating
Efficiency, on the basis of embodiment 2, with reference to shown in accompanying drawing 1-2, the motor 41 of the first motor 31 and second with described by leading
The fixed support 5 that the inwall of flow tube 1 is fixedly connected is fixed.
In order to further realize the utility model, reduce heat alluvial, improve effectively distributing for heat, it is preferable that
The radiator 2 is integrated design, and middle part is provided with solid heat carrier 21, and the surrounding of heat carrier 21 is set due to multiple bendings
Fin 22, form the heat dissipation channel of bending between adjacent two pieces of fin 22 and run through whole radiator 2.
In order to further realize the utility model, the thermal heat transfer capability of CPU and radiator 2 is improved, improves radiating effect
Rate, it is preferable that the material of described radiator 2 is fine copper.
The coefficient of heat conduction of fine copper is 401w/mk, and existing radiator is using aluminum alloy material, aluminium alloy
The coefficient of heat conduction is 226w/mk, and for aluminium alloy, the radiator 2 of same shape is under the effect of identical fan, device
Heat dispersion improves 77.43%.
Experiment proves：Using existing fansink designs, cold air is flowed into above radiator blade, side stream
Go out, it is impossible to flow completely through whole radiator, therefore, radiating efficiency is low；Meanwhile existing radiator uses discrete type blade, gas
In sector, the stop for being unfavorable for cold air carries out heat exchange, effectively can not taken away heat circulation road.Phase in the present embodiment
The heat dissipation channel of bending is formed between adjacent two pieces of fin 22 and runs through whole radiator 2, and cold air is effectively formed into one kind
Circulation retardance, increases heat exchanger time, makes in the unit interval, cold air and the heat exchange that radiator 2 is carried out are more abundant, can
It is significantly more efficient that radiator 2 is cooled, avoid because software conflict etc. causes cpu temperature to raise suddenly, it is impossible to enter in time
Row radiating causes continuous high temperature, CPU is departed from normal working temperature and is crashed or occur the problems such as burning.
Embodiment 4：
In order to further realize the utility model, intellectuality is improved, strengthens the specific aim and validity of radiating, upper
On the basis of stating any one embodiment, the utility model also includes being used for the temperature sensor for detecting CPU real time temperatures, with temperature
The single-chip microcomputer of sensor connection is spent, and crystal oscillating circuit, filter circuit, amplifying circuit and the motor driving electricity being connected with single-chip microcomputer
Road.Wherein single-chip microcomputer model MSP430F149, the mode of its circuit connection is as shown in figure 3, motor-drive circuit passes through monolithic
Machine MSP430F149 P1.2 pins send drive signal, trigger triode Q, turn it on, and then electromagnetic relay K is powered
Closure, makes the motor energization work of the first fan 3 and/or the second fan 4, motor here refers to the first motor
31 or second motor 41.What deserves to be explained is：Motor-drive circuit is multiple independent circuits parallel with one another, drive signal by
Output pins different single-chip microcomputer MSP430F149 provides drive signal.The temperature sensor is used for the real-time temperature for detecting CPU
Degree, and Real-time Feedback is handled into single-chip microcomputer.Realize the real-time control of temperature.The logical operation foundation of single-chip microcomputer, and
The setting of temperature value is set according to the operating ambient temperature of computer, can inject single-chip microcomputer logic journey according to the demand of user
Sequence, the contents of the section belong to prior art, the logical operation process for the single-chip microcomputer that will not be described in detail herein.
It is described above, only it is preferred embodiment of the present utility model, any formal limit is not done to the utility model
System, every any simple modification made according to the technical essence of the utility model to above example, equivalent variations, each falls within
Within the scope of protection of the utility model.
Claims (7)
1. the heat dissipation equipment that CPU caused by a kind of conflict for computer software is overheated, including the radiator contacted with CPU fittings
(2) and installed in fan of the radiator (2) away from CPU one end；It is characterized in that：The radiator (2) and fan are installed in
In mozzle (1).
2. the heat dissipation equipment that CPU caused by a kind of conflict for computer software according to claim 1 is overheated, its feature
It is, the fan includes the first fan (3) and the second fan (4), and second fan (4) is installed close to radiator (2).
3. the heat dissipation equipment that CPU caused by a kind of conflict for computer software according to claim 2 is overheated, its feature
It is, second fan (4) is driven by the second motor (41), and the first fan (3) is driven by the first motor (31), and the second electricity
The maximum (top) speed of machine (41) is more than the maximum (top) speed of the first fan (3)；The length of blade of second fan (4) is equal to the first wind
Fan 2/3rds of the length of blade of (3).
4. the heat dissipation equipment that CPU caused by a kind of conflict for computer software according to claim 3 is overheated, its feature
It is, first motor (31) and the second motor (41) pass through the fixed support that is fixedly connected with the mozzle (1) inwall
(5) it is fixed.
5. the heat dissipation equipment that CPU caused by a kind of conflict for computer software according to claim 1 is overheated, its feature
Be, the radiator (2) is integrated design, and middle part is provided with solid heat carrier (21), set around heat carrier (21) by
The heat dissipation channel of bending is formed between multiple forniciform fin (22), adjacent two pieces of fin (22) and is dissipated through whole
Hot device (2).
6. the heat dissipation equipment that CPU caused by a kind of conflict for computer software according to claim 5 is overheated, its feature
It is, the material of described radiator (2) is fine copper.
7. the heat dissipation equipment that CPU caused by a kind of conflict for computer software according to claim 1 is overheated, its feature
Be, in addition to for detecting the temperature sensors of CPU real time temperatures, the single-chip microcomputer being connected with temperature sensor, and with list
Crystal oscillating circuit, filter circuit, amplifying circuit and the motor drive circuit of piece machine connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720773288.5U CN207133752U (en) | 2017-06-29 | 2017-06-29 | The heat dissipation equipment that CPU caused by a kind of conflict for computer software is overheated |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720773288.5U CN207133752U (en) | 2017-06-29 | 2017-06-29 | The heat dissipation equipment that CPU caused by a kind of conflict for computer software is overheated |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207133752U true CN207133752U (en) | 2018-03-23 |
Family
ID=61632332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720773288.5U Expired - Fee Related CN207133752U (en) | 2017-06-29 | 2017-06-29 | The heat dissipation equipment that CPU caused by a kind of conflict for computer software is overheated |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207133752U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114334374A (en) * | 2022-01-13 | 2022-04-12 | 博罗县嘉治电子有限公司 | Novel three-phase transformer with heat dissipation mechanism |
| CN115404428A (en) * | 2022-11-02 | 2022-11-29 | 华北理工大学 | Observation window of closed galvanized heating furnace |
-
2017
- 2017-06-29 CN CN201720773288.5U patent/CN207133752U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114334374A (en) * | 2022-01-13 | 2022-04-12 | 博罗县嘉治电子有限公司 | Novel three-phase transformer with heat dissipation mechanism |
| CN114334374B (en) * | 2022-01-13 | 2022-09-20 | 博罗县嘉治电子有限公司 | Novel three-phase transformer with heat dissipation mechanism |
| CN115404428A (en) * | 2022-11-02 | 2022-11-29 | 华北理工大学 | Observation window of closed galvanized heating furnace |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180323 Termination date: 20190629 |