WO2013076853A1

WO2013076853A1 - Cooling device and electronic apparatus

Info

Publication number: WO2013076853A1
Application number: PCT/JP2011/077089
Authority: WO
Inventors: 吉野幸雄; 島森浩
Original assignee: 富士通株式会社
Priority date: 2011-11-24
Filing date: 2011-11-24
Publication date: 2013-05-30

Abstract

In the present invention, a cooling device is provided with the following: a flow path which is disposed so as to pass through the inside and the outside of an enclosed space and in which a refrigerant flows; a heat exchanger disposed in the enclosed space so as to enable thermal conduction with the refrigerant; and a fan which by causing gas inside the enclosed space to flow, causes the heat of the gas to thermally conduct from the heat exchanger to the refrigerant.

Description

Cooling device and electronic device

Embodiments discussed herein relate to a cooling device and an electronic device that includes the cooling device and a heat generating component.

Conventionally, for example, an air cooling method or a water cooling method is used for a cooling device arranged in an electronic device or the like.

As such a cooling device, for example, a cooling device including both an air cooling device and a liquid cooling device is known.

Also, a cooling device is known that includes a heat dissipating fin that radiates heat inside the sealed casing to the outside, and a cooling fan arranged in the sealed casing.

JP 2005-317033 A Japanese Utility Model Publication No. 02-04493

By the way, the conventional cooling device raises the temperature outside the device by exhausting the high-temperature air outside the device or radiating the air inside the device to the air outside the device with fins. To rise.

If the environmental temperature is lowered by using air conditioning equipment to lower the environmental temperature, investment in the air conditioning equipment and increase in power consumption of the air conditioning equipment occur. As an example, in a data center, reducing power consumption used for air conditioning is an issue.

In one aspect, a cooling device and an electronic device disclosed in this specification are intended to suppress an increase in environmental temperature.

The cooling device disclosed in this specification includes a flow path, a heat exchanger, and a fan. The flow path is arranged to pass through the inside and the outside of the sealed space, and the refrigerant flows. The heat exchanger is disposed in the sealed space so as to be able to conduct heat with the refrigerant. The fan controls the gas flow so that the gas flow in the sealed space is directed to the heat exchanger.

The electronic device disclosed in this specification includes a housing, a heat generating component, a flow path, a heat exchanger, and a fan. The casing has a sealed space inside. The heat generating component is disposed in the sealed space. The flow path is arranged to pass through the inside and the outside of the sealed space, and the refrigerant flows. The heat exchanger is disposed in the sealed space so as to be able to conduct heat with the refrigerant. The fan controls the gas flow so that the gas flow in the sealed space is directed to the heat exchanger.

According to the cooling device and the electronic device according to one embodiment, an increase in environmental temperature can be suppressed.

It is a top view which shows an electronic device provided with a cooling device. It is a schematic side view which shows the internal structure of an electronic device provided with a cooling device. It is a schematic front view which shows the internal structure of an electronic device provided with a cooling device. It is a graph which shows the relationship between a wind speed and the temperature of a memory case. It is a front view which shows a fan and a flow-path throttle part. It is a front view which shows a fan and a spacer.

FIG. 1 is a plan view showing an electronic device 100 including the cooling device 1.
2 and 3 are a schematic side view and a schematic front view showing the internal structure of the electronic device 100.

The cooling device 1 includes a liquid flow path (an example of a flow path) 2, a heat exchanger 3, a fan 4, a partition member 5, and a wind deflection member 6.

The electronic device 100 includes a cooling device 1, a housing 101, a substrate 102, a first heat generating component 103, and a second heat generating component 104. The electronic device 100 is used for a server device, for example.

The liquid flow path 2 is arranged so as to circulate a liquid refrigerant (an example of a refrigerant) L which is water, for example, inside and outside a sealed space S formed inside the housing 101. A liquid refrigerant L circulates in the liquid flow path 2 by a pump disposed outside the sealed space S. When the electronic device 100 is arranged in a system such as a server device, the pump may be arranged outside the system. For example, the liquid refrigerant L is forcibly cooled by the cooling device and maintained at a constant temperature outside the sealed space S, but may be naturally cooled if it can be maintained at a constant temperature. The refrigerant is not limited to the liquid refrigerant L. Therefore, the flow path is not limited to the liquid flow path 2.

The liquid flow path 2 has a U shape with both ends positioned on the left side in the plan view of FIG. As shown in FIGS. 2 and 3, the liquid flow path 2 includes, for example, a cooling plate 2a having a microchannel formed therein and a pipe 2b.

The cooling plate 2 a is disposed so as to be in surface contact with the upper surface of the first heat generating component (for example, CPU) 103 mounted on the substrate 102. In this way, the liquid flow path 2 is arranged so that the heat of the first heat generating component 103 is conducted to the liquid refrigerant L.

In this embodiment, four cooling plates 2a are arranged in the same number as the first heat generating component 103. The pipe 2b connects the four cooling plates 2a to each other and extends inside and outside the sealed space S.

The heat exchanger 3 is disposed in the sealed space S so as to be able to conduct heat with the liquid refrigerant L. In the present embodiment, the heat exchanger 3 is arranged so as to be in surface contact with the upper surface of the cooling plate 2a, so that heat conduction with the liquid refrigerant L is possible. Thus, the heat exchanger 3 faces the first heat generating component 103 with the cooling plate 2a interposed therebetween.

The heat exchanger 3 can be a heat sink, for example. The heat exchanger 3 shown in FIGS. 1 and 2 has a plurality of plate-like fins 3a arranged in parallel to each other, and the plurality of plate-like fins 3a are arranged in parallel with the flow of a gas G described later. Yes. This can prevent the heat exchanger 3 from obstructing the flow of the gas G. However, it is possible to prevent the flow of the gas G from being obstructed even by arranging needle-like or rod-like fins instead of the plate-like fins 3a. Can do.

The fan 4 controls the flow of the gas G so that the flow of the gas G in the sealed space S is directed to the heat exchanger 3. For example, the fan 4 generates a clockwise flow in a plan view of FIG. Thereby, the heat of the gas G is conducted from the heat exchanger 3 to the liquid refrigerant L. The fan 4 is disposed between the first heat generating component 103 and the second heat generating component (for example, memory) 104, and blows the gas G on the first heat generating component 103 side (heat exchanger 3 side).

The second heat generating component 104 does not generate a larger amount of heat than the first heat generating component 103, but is not arranged so as to directly conduct heat with the liquid flow path 2, so that the lee of the heat exchanger 3 Is arranged so that the gas G deprived of heat by the heat exchanger 3 is in contact with the heat exchanger 3. Therefore, the size of the second heating component 104 is determined such that only the gas G in contact with the heat exchanger 3 is in contact with the gas G not in contact with the heat exchanger 3. Good.

In the present embodiment, the first heat generating component 103, the second heat generating component 104, the fan 4, and the first heat generating component 103 are arranged along the wind direction of the gas G from the left back in FIG. The first heating component 103, the second heating component 104, the first heating component 103, the second heating component 104, the fan 4, the first heating component 103, and the second heating component 104 are arranged in this order. As described above, the first heat generating component 103 and the second heat generating component 104 are alternately arranged without being continuous in the wind direction. The second heat generating component 104 is arranged on both sides of the liquid flow path 2 in parallel with the wind direction.

The second heat generating component 104 includes a plurality of plate-like members 104a that are vertically arranged and parallel to each other. The fan 4 causes the gas S to flow so that the gas G is brought into contact with the plurality of plate-like members 104 a of the second heat generating component 104 in parallel with the plurality of plate-like members 104 a. That is, the plurality of plate-like members 104a of the second heat generating component 104 are arranged in parallel to the wind direction.

The partition member 5 partitions the sealed space S to form a circulation path for the gas G in the clockwise direction in the plan view of FIG. A plurality of partition members 5 may be disposed, for example, according to the size of the casing 101, and the position and size of the partition member 5 may be disposed so as to suppress convection and pressure loss.

The wind deflection member 6 is provided at both left and right (longitudinal) ends in the plan view of FIG. 1 so as to assist the change in the wind direction of the gas G by rounding the four corners of the rectangular sealed space S in the plan view of FIG. Two are arranged in a curved plate shape. Thereby, the duct formed by the two wind deflecting members 6 and the partition member 5 reduces the pressure loss of the gas G.

The gas G in the sealed space S may have a low thermal resistance by increasing the pressure. When the pressure of the gas G is increased, at the time of manufacturing the cooling device 1 and the electronic device 100, the gas injection hole is provided in the housing 101 and the gas G is enclosed in the housing 101 by the compressor to increase the atmospheric pressure. At this time, a backflow prevention valve for preventing a backflow of the gas G may be provided in the injection hole.

In addition, since the gas G is compressed when it is compressed, it is preferable to enclose it in the housing 101 after cooling and removing moisture. When the gas G sealed in the sealed space S is dry air, condensation of the liquid flow path 2 can be prevented.

¡For the relative humidity of dry air, select an appropriate value from the wet air diagram. Further, instead of air, a gas having a low thermal resistance (for example, a high-efficiency refrigerant such as carbon dioxide, nitrogen, etc.) is sealed, and between the gas G and the heat exchanger 3, and between the gas G and the heat generating component 104, The cooling efficiency can be increased by reducing the thermal resistance between the two.

FIG. 4 is a graph showing the relationship between the wind speed of the gas G and the temperature of the memory case (second electronic component 104).

As shown in FIG. 4, the temperature of the memory case decreases as the wind speed of the gas G increases or the water temperature of the liquid refrigerant L decreases. In addition, the volume and water temperature of the heat exchanger 3 shall be constant.

For example, when the operating temperature of the memory case is 85 ° C., the wind speed is about 3 [m / sec] or more when the water temperature of the liquid refrigerant L is 15 ° C., and the wind speed is about when the water temperature of the liquid refrigerant L is 20 ° C. What is necessary is just to set it as 4 [m / sec] or more.

FIG. 5 is a front view showing the fan 4 and the flow path restricting portion 7.
As shown in FIG. 5, the flow path restricting unit 7 is disposed between the top plate 105 of the housing 101 and the fan 4. The flow path restricting section 7 narrows the flow path of the circulation path at least at the fan 4 portion so that no space is generated in the upper portion of the fan 4. For example, the flow path restricting unit 7 may gradually narrow the flow path as it approaches the fan 4 from the front of the fan 4 and gradually expand the flow path as it moves away from the fan 4.

FIG. 6 is a front view showing the fan 4 and the spacer 8.
The spacers 8 are arranged at, for example, four corners of the bottom surface of the fan 4 so as to form a gap C between the fan 4 and the substrate 102. Thereby, a mounting area on the substrate 102 can be secured.

Further, instead of disposing the spacer 8, the fan 4 is suspended from the top plate 105 of the housing 101, or a portal-type support member that supports the fan 4 on the side surface is disposed, for example. A mounting area may be secured.

In the present embodiment described above, the heat of the gas G in the sealed space S is circulated or flowed by the fan 4 to conduct heat to the liquid refrigerant L flowing in the liquid flow path 2 via the heat exchanger 3. . Therefore, it is possible to suppress an increase in the environmental temperature outside the electronic device 100 due to the heat in the sealed space S. Further, since the fan 4 serving as a noise source is installed in the sealed space S, noise reduction can be realized. Furthermore, since the increase in the environmental temperature can be suppressed, it is possible to reduce the investment in the air conditioner equipment for lowering the environmental temperature and the like and to save the power consumption of the air conditioner.

In this embodiment, the cooling plate 2a (liquid flow path 2) is arranged so that the heat of the first heat generating component 103 is conducted to the liquid refrigerant L. Therefore, the liquid refrigerant L in the liquid flow path 2 can absorb not only the heat conducted from the gas G through the heat exchanger 3 but also the heat of the first heat generating component 103.

In this embodiment, the heat exchanger 3 is disposed so as to face the first heat generating component 103 with the cooling plate 2a (liquid flow path 2) interposed therebetween. Therefore, the liquid refrigerant L can absorb the heat from the heat exchanger 3 and the first heat generating component 103 at the same location.

Further, in the present embodiment, the fan 4 is disposed between the first heat generating component 103 and the second heat generating component 104 alternately disposed with the first heat generating component 103 in the wind direction of the gas G, for example, The gas G is sprayed on the first heat generating component 103 side (heat exchanger 3 side). Therefore, the heat transfer efficiency from the gas G to the heat exchanger 3 can be increased.

Further, in the present embodiment, the second heat generating component 104 includes a plurality of plate-like members 104a arranged in parallel with each other, and the fan 4 includes a plurality of plate-like members 104a and a plurality of plate-like members 104a. A flow is generated in the gas G so that the gas G is brought into contact in parallel. Therefore, it is possible to prevent the second heat generating component 104 from obstructing the flow of the gas G.

Moreover, in this embodiment, the partition member 5 forms the circulation path of the gas G in the sealed space S by partitioning the sealed space S. Therefore, the heat transfer efficiency from the gas G to the heat exchanger 3 can be increased.

In the present embodiment, the wind deflecting member 6 assists the change in the wind direction of the gas G in the circulation path. Therefore, the heat transfer efficiency from the gas G to the heat exchanger 3 can be increased.

Further, in the present embodiment, the flow path restricting section 7 restricts the flow path of the circulation path at least by the fan 4 portion. Therefore, convection around the fan 4 can be prevented and the heat transfer efficiency from the gas G to the heat exchanger 3 can be improved without using the fan 4 having the same size as the flow path.

In this embodiment, the fan 4 is disposed with a gap C between the fan 4 and the substrate 102. Therefore, a mounting area for the substrate 102 can be secured.

In this embodiment, the spacer 8 forms the gap C between the fan 4 and the substrate 102, so that the mounting area of the substrate 102 can be secured with a simple configuration.

In the present embodiment, the plurality of plate-like fins 3 a of the heat exchanger 3 are arranged in parallel with the flow of the gas G. Therefore, the heat exchanger 3 can be prevented from obstructing the flow of the gas G.

In the present embodiment, when a gas having a lower thermal resistance than air, such as a high-pressure gas or a high-efficiency refrigerant (for example, carbon dioxide or nitrogen) is enclosed in the sealed space S, heat exchange is performed from the gas G. The heat transfer efficiency to the vessel 3 can be increased.

Further, in the present embodiment, when dry air is sealed in the sealed space S, it is possible to prevent the occurrence of condensation in the liquid flow path 2 or the like.

DESCRIPTION OF SYMBOLS 1 Cooling device 2 Liquid flow path 2a Cooling plate 2b Piping 3 Heat exchanger 3a Fin 4 Fan 5 Partition member 6 Wind deflecting member 7 Flow path restricting part 8 Spacer 100 Electronic device 101 Case 102 Substrate 103 First heating component 104 First 2 heating parts 104a plate-like member 105 top plate

Claims

A flow path that is arranged to pass through the inside and outside of the sealed space and through which the refrigerant flows;
A heat exchanger disposed in the sealed space so as to be able to conduct heat with the refrigerant;
And a fan for controlling the flow of the gas so that the flow of the gas in the sealed space is directed to the heat exchanger.
The cooling device according to claim 1, wherein the flow path is arranged so that heat of the first heat generating component is conducted to the refrigerant.
The flow path has a cooling plate in surface contact with the first heat-generating component,
The cooling device according to claim 2, wherein the heat exchanger is in surface contact with the cooling plate so as to face the first heat generating component with the cooling plate interposed therebetween.
The said fan is arrange | positioned between the said 1st heat generating component and the 2nd heat generating component arrange | positioned alternately with the said 1st heat generating component in the wind direction of the said gas. The cooling device described.
The cooling device according to claim 4, wherein the fan blows the gas toward the first heat generating component between the first heat generating component and the second heat generating component.
The second heat generating component includes a plurality of plate-like members arranged in parallel to each other,
The fan causes a flow of the gas so that the gas is brought into contact with the plurality of plate-like members of the second heat-generating component in parallel with the plurality of plate-like members.
The cooling device according to claim 4.
The cooling device according to claim 1, further comprising a partition member that forms the gas circulation path in the sealed space by partitioning the sealed space.
The cooling device according to claim 7, further comprising a wind deflecting member for assisting a change in a wind direction of the gas in the circulation path.
The cooling device according to claim 7, further comprising a flow passage restricting portion that restricts the flow passage of the circulation passage at least by the fan portion.
In the sealed space, a substrate on which the first heat generating component is mounted is disposed,
The fan is disposed with a gap between the fan and the substrate.
The cooling device according to claim 2.
A spacer disposed between the fan and the substrate;
The spacer forms a gap between the fan and the substrate;
The cooling device according to claim 10.
The heat exchanger has a plurality of plate-like fins arranged in parallel to each other,
The plurality of plate-like fins are arranged in parallel with the gas flow,
The cooling device according to claim 1.
The cooling device according to claim 1, wherein a gas having a lower thermal resistance than air is enclosed in the sealed space.
The cooling device according to claim 1, wherein dry air is enclosed in the sealed space.
A housing having a sealed space inside,
A heat generating component disposed in the sealed space;
A flow path that is arranged to pass through the inside and outside of the sealed space, and through which the refrigerant flows;
A heat exchanger disposed in the sealed space so as to be able to conduct heat with the refrigerant;
An electronic device comprising: a fan that controls the flow of gas so that the flow of gas in the sealed space is directed toward the heat exchanger.