JP7442585B2 - Electronic devices and electronic device manufacturing methods - Google Patents

Description

TECHNICAL FIELD The disclosed embodiments relate to electronic devices and methods of manufacturing electronic devices.

Patent Document 1 describes a fixing structure between a radiator of a motor control device and an assembly component. In this motor control device, the interior of the casing is divided by a partition wall into a portion where a large number of cooling fins are provided, through which air is blown by a cooling fan, and a circuit portion where circuit components are provided on a circuit board.

JP2009-253183A

In the motor control equipment of the above-mentioned prior art, if heat-generating circuit components are installed on the circuit board, it may not be possible to sufficiently cool the circuit components, and higher cooling performance has been required.

The present invention has been made in view of such problems, and an object of the present invention is to provide an electronic device and a method of manufacturing the electronic device that can improve cooling performance.

In order to solve the above problems, according to one aspect of the present invention, a circuit board is provided with a housing, a heat sink including a plurality of first fins, and a plurality of circuit components including a first circuit component; A partition that partitions the inside of the casing into a first accommodation space that accommodates the plurality of first fins and the first circuit component, and a second accommodation space that accommodates the circuit components other than the first circuit component. An electronic device having a member and a fan that ventilates air into the first storage space is applied.

According to another aspect of the present invention, there is provided a housing, a heat sink having a plurality of first fins, a circuit board provided with a plurality of circuit components including a first circuit component, and an interior of the housing. into a first accommodation space that accommodates the plurality of first fins and the first circuit component, and a second accommodation space that accommodates the circuit components other than the first circuit component; 1. A method for manufacturing an electronic device, the method comprising: a fan for ventilating air into an accommodation space; However, a method for manufacturing an electronic device is applied, which includes attaching the casing to the heat sink so as to overlap the tip of the wall when viewed from a direction parallel to the casing.

According to another aspect of the present invention, there is provided a housing, a heat sink having a plurality of first fins, a circuit board provided with a plurality of circuit components including a first circuit component, and an interior of the housing. into a first accommodation space that accommodates the plurality of first fins and the first circuit component, and a second accommodation space that accommodates the circuit components other than the first circuit component; A method for manufacturing an electronic device, the method comprising: a fan that circulates air into a storage space; A method for manufacturing an electronic device is applied, the method comprising: engaging a tip of a first fin; and fixing the partition member to the heat sink together with the circuit board disposed between the partition member and the heat sink. be done.

According to the electronic device and the like of the present invention, cooling performance can be improved.

FIG. 2 is a side view showing an example of the appearance of the motor control device according to the embodiment, viewed from the right. FIG. 2 is a bottom view showing an example of the appearance of the motor control device according to the embodiment, viewed from below. FIG. 2 is a top view showing an example of the appearance of the motor control device according to the embodiment, viewed from above. FIG. 1 is an exploded perspective view showing an example of the internal configuration of a motor control device according to an embodiment. It is a perspective view showing an example of composition of a partition member. FIG. 3 is a side view showing an example of the configuration of a partition member, viewed from the right. FIG. 7 is a side view, seen from the right, showing an example of a state in which the second circuit board is fixed to the heat sink in the assembly process of the motor control device. FIG. 7 is a side view, seen from the right, showing an example of a state in which the partition member is fixed to the heat sink from above the second circuit board in the assembly process of the motor control device. 9 is a cross-sectional view corresponding to the IX-IX cross section in FIG. 8. FIG. FIG. 7 is a perspective view showing an example of a state in which the third circuit board is fixed to the heat sink in the assembly process of the motor control device. FIG. 3 is a perspective view showing an example of the structure inside the right cover. 9 is a cross-sectional view corresponding to the IX-IX cross section in FIG. 8 with the right cover attached to the heat sink during the assembly process of the motor control device 1. FIG.

An embodiment will be described with reference to the drawings. In this embodiment, a motor control device that controls a motor will be described as an example of an electronic device, but the electronic device is not limited to the motor control device. In the present embodiment, directions such as up, down, left, right, front and back may be used as appropriate for the convenience of explaining the configuration of the motor control device, but this does not limit the arrangement direction of the motor control device or the positional relationship of each component. Each direction in the embodiment corresponds to the direction shown in each figure.

<1. External configuration of motor control device>
An example of the external configuration of the motor control device 1 according to the present embodiment will be described with reference to FIGS. 1 to 3. 1 is a side view of the motor control device 1 viewed from the right, FIG. 2 is a bottom view of the motor control device 1 viewed from below, and FIG. 3 is a side view of the motor control device 1 viewed from above. FIG.

As shown in FIGS. 1 to 3, the motor control device 1 includes a right cover 3, a left cover 5, a heat sink 7, and a front panel 9. The right cover 3 is attached to the right side of the heat sink 7, and the left cover 5 is attached to the left side of the heat sink 7. The front panel 9 is attached to the front side of the right cover 3 and the left cover 5. The right cover 3, left cover 5, and front panel 9 are made of resin, for example, and the heat sink 7 is made of a material with high thermal conductivity (for example, aluminum alloy). The right cover 3, left cover 5, heat sink 7, and front panel 9 are combined to form a substantially rectangular parallelepiped-shaped housing 10.

<2. Internal configuration of motor control device>
An example of the internal configuration of the motor control device 1 according to the present embodiment will be described with reference to FIG. 4. FIG. 4 is an exploded perspective view of the motor control device 1.

As shown in FIG. 4, the heat sink 7 is formed into a substantially rectangular frame shape. The heat sink 7 is a member that cools the circuit components by dissipating heat, and is also a structural member that constitutes the casing of the motor control device 1 . The heat sink 7 has a front plate part 11 , a rear plate part 13 , an upper plate part 15 , and a lower plate part 17 .

The lower plate portion 17 is provided with a fan accommodating portion 21 in which the fan 19 is accommodated. The fan accommodating portion 21 is a recessed portion formed in the same shape as the fan 19 . The fan 19 is fixed to the fan accommodating portion 21 with a plurality of screws 23 via a fixture 25 . The fan 19 is, for example, an axial fan, and blows out or sucks air in the direction of the rotation axis AX to circulate the air in the vertical direction. In this embodiment, the fan 19 sucks air from below and discharges it upward, thereby ventilating the first accommodation space S1 (see FIG. 12 described later). Electric power is supplied to the fan 19 from the third circuit board 24 via the cable 26 .

The heat sink 7 has a plurality of first fins 27. Each first fin 27 is formed to protrude rightward from the bottom portion 35 (see FIG. 9, which will be described later). The plurality of first fins 27 are provided above the fan accommodating portion 21, and each first fin 27 extends in the vertical direction. The plurality of first fins 27 are arranged in parallel at intervals in the front-rear direction. The fan 19 sucks air from below and circulates the air between each first fin 27. The upper plate portion 15 has an exhaust port 29 formed of a plurality of slits, and the air that has passed between each of the first fins 27 is discharged to the outside via the exhaust port 29 and the like. The circuit component 33 provided on the first circuit board 31 is provided so as to contact the bottom portion 35 of the first fin 27 (see FIG. 9 described later). Note that a heat conductive member such as a thermal sheet may be provided between the circuit component 33 and the bottom portion 35. The circuit component 33 is, for example, a switching element, but may be any other circuit component that generates heat. The plurality of first fins 27 radiate heat generated in the circuit component 33 to cool it.

A ventilation space 37 (see FIG. 9 described later) is provided between the right cover 3 and the tip portions of the plurality of first fins 27 on the side opposite to the bottom portion 35 . The ventilation space 37 is capable of passing air in a direction (for example, the front-rear direction) that intersects the direction in which the first fins 27 extend. In the ventilation space 37, a circuit component 39 is fixed to the first fin 27 with a screw 41. The circuit component 39 is, for example, a regenerative resistor, but may be any other circuit component that generates heat. Note that the circuit component 39 may not be installed.

The heat sink 7 has a plurality of second fins 43 on the front side above the plurality of first fins 27 . Each second fin 43 is formed to protrude rightward from a bottom portion 44 (see FIGS. 7 and 8 described below). The plurality of second fins 43 are arranged on the downstream side of the circuit component 47 provided on the second circuit board 45 in the air ventilation direction formed by the partition member 63 described below. The circuit component 47 is, for example, a capacitor, but may be any other circuit component that generates heat. The circuit component 47 is an example of a first circuit component. The plurality of second fins 43 are arranged in parallel at intervals in the front-rear direction. Air discharged from the fan 19 and ventilated around the circuit component 47 is ventilated between each second fin 43. An exhaust port 49 formed of a plurality of slits is formed in the right cover 3, and the air that has passed between each second fin 43 is discharged to the outside via the exhaust port 49 and the like. The circuit component 51 is provided so as to be in contact with a mounting portion (not shown) formed on the bottom portion 44 of the second fin 43 by means of a screw 53 . Note that a heat conductive member such as a thermal sheet may be provided between the circuit component 51 and the mounting portion. The circuit component 51 is, for example, a rectifier diode, but may be any other circuit component that generates heat. The plurality of second fins 43 radiate heat generated in the circuit component 51 to cool it.

A metal fitting 54 is fixed to the right side of the front plate portion 11 of the heat sink 7 with screws 52 (see FIG. 9 described later). The metal fitting 54 is provided so as to come into contact with a circuit component 58 of the third circuit board 24 via a heat conductive member 56 such as a thermal sheet (see FIG. 12 described later). The heat conductive member 56 is made of an elastic member such as rubber, and can absorb component tolerances, positional errors, etc. and bring the heat conductive member 56 and circuit component 58 into close contact. The circuit component 58 is, for example, a resistor, but may be any other circuit component that generates heat. The heat of the circuit components 58 of the third circuit board 24 is transferred to the front plate portion 11 via the heat conductive member 56 and the metal fittings 54, and is radiated.

The first circuit board 31 is fixed to the left side of the heat sink 7 with a plurality of screws 55. As described above, a plurality of circuit components 33 are provided on the rear side of the right side surface of the first circuit board 31 so as to be in contact with the bottom portion 35 of the first fin 27 . Although not shown, the first circuit board 31 includes, for example, a converter that converts AC power supplied from an AC power supply into DC power, an inverter (circuit component 33 ), and circuit components related to a control circuit that controls power conversion by an inverter and controls a motor.

The left cover 5 is fixed to the left side of the heat sink 7 so as to accommodate the first circuit board 31 and the like.

The second circuit board 45 is fixed to a region on the right side of the heat sink 7 in front of the first fin 27 . The front portion of the second circuit board 45 is fixed to the heat sink 7 with a plurality of screws 61. The rear portion of the second circuit board 45 is sandwiched between the partition member 63 and the heat sink 7 , and is fixed to the heat sink 7 together with the partition member 63 by a plurality of screws 65 . As described above, a plurality of circuit components 47 are provided on the rear side of the right side surface of the second circuit board 45. The circuit component 47 and other circuit components include, for example, a converter that converts AC power supplied from an AC power source into DC power, an inverter that converts DC power into AC power and supplies it to a motor, and a power converter using an inverter. Contains circuit components related to control circuits and the like that control the motor.

As described above, the partition member 63 is fixed to the right side of the heat sink 7 with a plurality of screws 65 together with the second circuit board 45 disposed between the heat sink 7 and the second circuit board 45 . The partition member 63 partitions the inside of the casing 10 into a first accommodation space S1 (see FIG. 12 described later) and a second accommodation space S2 (see FIG. 12 described later). Details of the partition member 63 will be described later.

The third circuit board 24 is fixed to the right side of the heat sink 7 with a plurality of screws 69 (see FIG. 10 described later). The third circuit board 24 is arranged further to the right of the second circuit board 45 (see FIG. 10, which will be described later).

The right cover 3 is fixed to the right side of the heat sink 7 so as to accommodate the second circuit board 45, the partition member 63, the third circuit board 24, and the like. The front panel 9 is fixed to the front sides of the right cover 3 and left cover 5 by engaging portions 81.

<3. Structure of partition member>
An example of the configuration of the partition member 63 will be described with reference to FIGS. 5 and 6. FIG. 5 is a perspective view showing an example of the configuration of the partition member 63, and FIG. 6 is a side view of the partition member 63 viewed from the right side. Each direction shown in FIGS. 5 and 6 is a direction when the partition member 63 is assembled to the motor control device 1, and corresponds to FIGS. 1 to 4 described above.

As shown in FIGS. 5 and 6, the partition member 63 is a container-shaped member, and has a bottom portion 83, a communication portion 85, and a wall portion 87. A hole 89 is formed in the bottom 83, into which the cylindrical circuit component 47 provided on the second circuit board 45 is inserted. In this embodiment, since the second circuit board 45 is provided with, for example, three circuit components 47, the hole 89 is formed in a shape that allows the three circuit components 47 to be inserted therethrough. The hole portion 89 is formed in a shape and size that allows a slight gap between the hole portion 89 and the outer circumferential surface of the circuit component 47 . Thereby, leakage of air from the first accommodation space S1 to the second accommodation space S2 can be reduced while allowing component tolerances, positional errors, and the like. Note that the number of circuit components 47 may be one or a plurality other than three, and in that case, the hole portion 89 is formed in a shape corresponding to the number of circuit components 47.

The communication section 85 has a first communication section 85A and a second communication section 85B. The first communicating portion 85A is provided at the edge of the bottom portion 83 on the first fin 27 side, in this example, on the rear side of the bottom portion 83. The second communicating portion 85B is provided at the edge of the bottom portion 83 on the second fin 43 side, in this example, at the upper edge of the bottom portion 83. The first communicating portion 85A and the second communicating portion 85B are provided so as to protrude rightward from the bottom portion 83. The protruding height of the first communication portion 85A is lower than the protruding height of the wall portion 87, for example, approximately half the height (see FIG. 9, which will be described later). The first communicating portion 85A forms a space 91 that communicates with the ventilation space 37 described above between the tip portion on the opposite side of the bottom portion 83 and the right cover 3. Air ventilated in the ventilation space 37 in a direction intersecting the extending direction of the first fins 27 flows into the partition member 63 via the space 91. The first communication section 85A is an example of a communication section.

The first communicating portion 85A has an engaging portion 92 at the tip opposite to the bottom portion 83. The engaging portion 92 is formed, for example, by bending and folding back the tip portion, so as to protrude rearward and form a flange-shaped member having a recessed portion on the left side. The engaging portion 92 engages so as to cover the tip of the first fin 27 that is located closest to the partition member 63 among the plurality of first fins 27, in this example, the first fin 27 that is located furthest to the front. (See FIG. 9 below).

The protrusion height of the second communicating portion 85B is approximately the same as that of the first communicating portion 85A. The second communication portion 85B forms a space 93 between the tip portion on the opposite side of the bottom portion 83 and the right cover 3, which communicates with the space in which the second fin 43 described above is installed. Air flowing into the partition member 63 through the space 91 and flowing around the circuit component 47 flows out through the space 93 to the second fin 43 side.

The partition member 63 has a wind guiding portion 95 at the upper end of the bottom portion 83 . The air guide portion 95 is formed as a slope that slopes from the bottom portion 83 toward the tip of the second communication portion 85B. The air guiding portion 95 guides the air that has flowed into the partition member 63 through the space 91 into the space 93 and causes it to flow out to the second fin 43 side.

The second communicating portion 85B has an engaging portion 97 at the tip opposite to the bottom portion 83. The engagement portion 97 is formed, for example, by bending and folding back the tip portion, so as to protrude upward and form a collar-shaped member having a recessed portion on the left side. The engaging portion 97 engages with the heat sink 7 so as to cover the tip of a fin 99 (see FIG. 7 described later) that extends in the front-rear direction below the second fin 43 .

The wall portion 87 protrudes rightward from the edge of the bottom portion 83 other than the communication portion 85, in this example, the front edge and lower edge of the bottom portion 83, and is erected so as to reach the vicinity of the right cover 3. ing. The protruding height of the wall portion 87 is slightly smaller than the distance between the bottom portion 83 of the partition member 63 and the right cover 3. A slight gap is formed between the tip of the wall portion 87 and the inner surface of the right cover 3 (see FIG. 12 described later). Thereby, leakage of air from the first accommodation space S1 to the second accommodation space S2 can be reduced while allowing component tolerances, positional errors, and the like. The wall portion 87 has a front wall portion 87A and a lower wall portion 87B. The front wall portion 87A is a flat wall portion that is tangentially close to the outer peripheral surfaces of the three circuit components 47 protruding from the hole portions 89. The lower wall portion 87B is a curved wall portion that is close to approximately the lower half of the outer peripheral surface of the circuit component 47 located at the lowest position among the three circuit components 47. The lower wall portion 87B is located below the first communication portion 85A. The partition member 63 is configured such that a part of the circuit component 47 located at the lowermost side protrudes below the first communication portion 85A, thereby securing an installation space for the air guiding portion 95.

Screw fixing portions 101 into which the aforementioned screws 65 are inserted are provided at two locations in the vertical direction on the rear side of the bottom portion 83 and on the front side of the lower portion of the lower wall portion 87B. In this example, three screws 65 are inserted through the screw fixing part 101, through holes 103 (see FIG. 7 described later) formed in the second circuit board 45, and fastened to the screw holes of the heat sink 7, respectively.

With the above configuration, the partition member 63 partitions the inside of the housing 10 into the first accommodation space S1 and the second accommodation space S2. As shown in FIG. 12, which will be described later, the first accommodation space S1 accommodates a plurality of first fins 27 and circuit components 47. The second accommodation space S2 accommodates circuit components other than the circuit component 47 of the second circuit board 45, the first circuit board 31, the third circuit board 24, and the like. The partition member 63 is integrally formed, for example, by molding in which molten resin is injected into a mold. Since resin molding increases the degree of freedom in shape, the partition member 63 can be provided with various functions in addition to the space partitioning function.

<4. How to install partition members>
An example of a method for attaching the partition member 63 will be described with reference to FIGS. 7 to 10. FIG. 7 is a diagram showing an example of a state in which the second circuit board 45 is fixed to the heat sink 7 in the assembly process of the motor control device 1, and FIG. FIG. 9 is a cross-sectional view corresponding to the IX-IX cross section in FIG. 8, and FIG. 10 is a diagram showing an example of the third circuit board 24 fixed to the heat sink 7.

As shown in FIG. 7, the second circuit board 45 is fixed to the area in front of the first fin 27 on the right side of the heat sink 7 with a plurality of (for example, four) screws 61. Next, as shown in FIGS. 8 and 9, the partition member 63 is attached to the heat sink 7 so as to sandwich the second circuit board 45 therebetween. At this time, the engaging portion 92 of the first communicating portion 85A of the partition member 63 is engaged so as to cover the tip of the first fin 27 that is disposed closest to the partition member 63 among the plurality of first fins 27. Ru. Further, the engaging portion 97 of the second communication portion 85B of the partition member 63 is engaged to cover the tip portion of the fin 99. Thereby, the partition member 63 is positioned with respect to the heat sink 7 and the second circuit board 45, so assembly becomes easy and workability can be improved. Thereafter, a plurality of (for example, three) screws 65 are inserted through the screw fixing portion 101 of the partition member 63 and the through hole 103 of the second circuit board 45, and fastened to the screw hole of the heat sink 7. As a result, the partition member 63 is fixed to the heat sink 7 together with the second circuit board 45 disposed between the partition member 63 and the heat sink 7 . The method for attaching the partition member 63 described above is an example of a method for manufacturing the motor control device 1.

Thereafter, as shown in FIG. 10, the third circuit board 24 is fixed to the heat sink 7 further to the right of the second circuit board 45 with a plurality of screws 69. The third circuit board 24 is arranged in a region in front of the wall portion 87 of the partition member 63. A cable 26 that supplies power to the fan 19 is connected to the third circuit board 24 . The circuit component 39 is fixed to the first fin 27 with a screw 41. The circuit component 39 may not be installed. When installing the circuit component 39, part of the air discharged upward from the fan 19 can be brought into contact with the lower end surface of the circuit component 39 to change the flow forward, so that the air can be directed toward the partition member 63 side. This has the effect of making it easier to introduce air into the area.

<5. Inside structure and installation method of right cover>
An example of the inner structure and attachment method of the right cover 3 will be described with reference to FIGS. 11 and 12. 11 is a perspective view showing an example of the inner structure of the right cover 3, and FIG. 12 is a cross section taken along line IX-IX in FIG. 8 with the right cover 3 attached to the heat sink 7 during the assembly process of the motor control device 1. FIG. 3 is a corresponding cross-sectional view. Each direction shown in FIG. 11 is a direction when the right cover 3 is assembled to the motor control device 1, and corresponds to FIGS. 1 to 4 described above.

As shown in FIG. 12, the right cover 3 has a top plate portion 3A disposed on the side opposite to the bottom portion 83 of the wall portion 87 of the partition member 63. As shown in FIG. The top plate portion 3A constitutes the right side surface of the housing 10. As shown in FIG. 11, the top plate portion 3A has protrusions 107, 109, and 111 on the inner surface. The protrusion 107 extends along the shape of the tip of the wall 87 of the partition member 63. As shown in FIG. 12, when the right cover 3 is attached to the heat sink 7, the protruding portion 107 is located at the tip of the wall portion 87 when viewed from a direction parallel to the top plate portion 3A (front-back direction or up-down direction). It is provided to wrap only a fixed amount. A slight gap is formed between the tip of the wall portion 87 and the inner surface of the top plate portion 3A, and between the wall portion 87 and the protruding portion 107. As a result, a labyrinth structure is formed and the second accommodation space is accommodated from the first accommodation space S1 while allowing the tolerances and positional errors of parts by making the tip of the wall part 87 and the protrusion part 107 of the top plate part 3A non-contact. Air leakage into the space S2 can be reduced.

The protrusion 109 extends linearly in the front-rear direction, and its length is approximately the same as the front-rear dimension of the fan accommodating portion 21 . The protruding portion 109 abuts and positions the fan 19 when the fan 19 is accommodated in the fan accommodating portion 21 . The protruding portion 111 extends linearly in the vertical direction, and its length is approximately the same as the vertical dimension of the second fin 43, and its protruding height is equal to the protruding height of the second fin 43. Almost equivalent. The protrusion 111 is inserted between the plurality of second fins 43 and prevents air from leaking from the first accommodation space S1 to the second accommodation space S2 in the installation area of the second fins 43.

The right cover 3 has a protrusion 107 extending along the shape of the wall 87 of the partition member 63 on the inner surface of the top plate 3A, which is similar to the wall 87 when viewed from a direction parallel to the top plate 3A. It is attached to the heat sink 7 so as to overlap the tip of the heat sink 7. The method for attaching the right cover 3 described above is an example of a method for manufacturing the motor control device 1.

<6. Effects of embodiment>
As explained above, in the motor control device 1 of this embodiment, the inside of the housing 10 is partitioned by the partition member 63 into the first accommodation space S1 and the second accommodation space S2. The first accommodation space S1 accommodates the plurality of first fins 27 of the heat sink 7 and the circuit components 47 of the second circuit board 45. The second accommodation space S2 accommodates circuit components other than the circuit component 47 of the second circuit board 45, the first circuit board 31, the third circuit board 24, and the like. Air is ventilated into the first accommodation space S1 by a fan 19. Thereby, in addition to the circuit component 33 that is the object to be cooled by the first fin 27, the circuit component 47 provided on the second circuit board 45 can also be sufficiently cooled. Therefore, even if a heat-generating circuit component other than the one to be cooled by the heat sink 7 is installed on the circuit board, it can be cooled, so that the cooling performance of the motor control device 1 can be improved.

In the present embodiment, the first accommodation space S1 is provided between the tips of the plurality of first fins 27 and the right cover 3, and is capable of passing air in a direction intersecting the extending direction of the first fins 27. A ventilation space 37 may be provided. In this case, the air ventilated by the fan 19 is ventilated in the extending direction of the first fins 27 to cool the first fins 27, and also crosses the extending direction of the first fins 27 via the ventilation space 37. Ventilated in the direction. This allows the air to flow into the circuit component 47 side. Therefore, the cooling effect of the circuit components 47 can be enhanced.

In this embodiment, the partition member 63 is provided at the bottom 83 in which a hole 89 into which the circuit component 47 is inserted is formed, and at the edge of the bottom 83 on the first fin 27 side, and forms a space into which air flows. It may have the first communication portion 85A and a wall portion 87 that stands up from the edge of the bottom portion 83 other than the communication portion 85 to the vicinity of the right cover 3. In this case, the air ventilated by the fan 19 flows into the circuit component 47 side protruding from the bottom 83 of the partition member 63 via the first communication portion 85A of the partition member 63. Since there is no partition between the installation space of the first fin 27 and the installation space of the circuit component 47 in the first accommodation space S1, a large amount of air can flow from the first fin 27 side to the circuit component 47 side. Therefore, the cooling effect of the circuit components 47 can be enhanced. When the circuit component 47 is a capacitor, for example, the capacitor can be made smaller due to the improved cooling effect.

In the present embodiment, the top plate portion 3A of the right cover 3 extends along the shape of the wall portion 87 of the partition member 63 on the inner side surface, and the wall portion 87 when viewed from a direction parallel to the top plate portion 3A. It may have a protrusion 107 that protrudes so as to overlap the tip of the tip. In this case, a labyrinth structure can be formed by wrapping the tip of the wall portion 87 and the protruding portion 107. Thereby, leakage of air from the first accommodation space S1 to the second accommodation space S2 can be reduced, so that the cooling efficiency of the first accommodation space S1 can be increased. Further, circuit components other than the circuit component 47 provided on the second circuit board 45, the first circuit board 31, the third circuit board 24, etc. can be protected from moisture, oil, dust, etc. contained in the air. . Further, a small gap can be provided without making the wall portion 87 of the partition member 63 and the protruding portion 107 of the top plate portion 3A contact each other. This makes it possible to tolerate component tolerances, positional errors, etc., and facilitates design and manufacturing.

In this embodiment, the first communication portion 85A of the partition member 63 has an engaging portion 92 that engages with the tip of the first fin 27 that is disposed closest to the partition member 63 among the plurality of first fins 27. You may. In this case, when the partition member 63 is attached, the engaging portion 92 is engaged with the tip of the first fin 27, so that the partition member 63 can be easily positioned. This facilitates assembly and improves workability.

In this embodiment, the partition member 63 may be fixed to the heat sink 7 with screws 65 together with the second circuit board 45 disposed between the partition member 63 and the heat sink 7 . In this case, since the partition member 63 and the second circuit board 45 can be fixed together by tightening, assembly becomes easy and the number of parts such as screws can be reduced.

In this embodiment, the heat sink 7 may include, in addition to the plurality of first fins 27, a plurality of second fins 43 arranged downstream of the circuit component 47 in the air ventilation direction. In this case, in addition to the circuit component 33 to be cooled by the first fin 27 and the circuit component 47 of the second circuit board 45, it is possible to cool the circuit component 51 to be cooled by the second fin 43, and the motor The cooling performance of the control device 1 can be further improved.

In this embodiment, the partition member 63 may have an air guide portion 95 for guiding air to the second fins 43. In this case, air flowing from the first fin 27 side to the circuit component 47 side can be guided to the second fin 43 by the air guide section 95. Thereby, it becomes possible to efficiently cool the circuit component 51 that is the cooling target of the second fin 43, and the cooling performance of the motor control device 1 can be further improved.

<7. Modified example>
The disclosed embodiments are not limited to the above, and various modifications can be made without departing from the spirit and technical idea thereof.

In the above embodiment, the fan 19 sucks air from the bottom and discharges it to the top, so that air is ventilated upward into the first storage space S1. By discharging the air downward, the air may be ventilated downward into the first accommodation space S1.

In the above embodiment, the fan 19 is installed below the first fins 27, but the fan 19 may be installed above the first fins 27. Also in this case, the direction of air ventilation in the first accommodation space S1 may be either upward or downward.

For example, an outlet may be provided at the bottom of the partition member 63 to allow water, oil, dust, etc. to be discharged. Since the partition member 63 is arranged with its longitudinal direction along the vertical direction, moisture, oil, dust, etc. contained in the air ventilated inside are likely to accumulate inside the lower lower wall portion 87B. Therefore, for example, by providing a discharge port that can be opened and closed at the lowest position of the lower wall portion 87B, the discharge port can be opened during maintenance to discharge water, oil, dust, etc. accumulated at the bottom of the partition member 63. can do.

Moreover, although the case where the electronic device is a motor control device has been described above as an example, the content explained above may be applied to a control device that controls a machine other than a motor. Furthermore, the present invention can be applied to any type of electronic device, even if it is not a control device, as long as it is equipped with a cooling fan, a heat sink, a circuit board, etc.

In the above description, when there is a description such as "perpendicular", "parallel", "plane", etc., the description does not have a strict meaning. The terms "perpendicular," "parallel," and "plane" mean "substantially perpendicular," "substantially parallel," and "substantially plane," allowing tolerances and errors in design and manufacturing.

In the above description, when external dimensions, sizes, shapes, positions, etc. are described as "same", "same", "equal", "different", etc., the descriptions do not have strict meanings. The terms "same," "same," "equal," and "different" mean that tolerances and errors in design and manufacturing are allowed, and "substantially the same," "substantially the same," "substantially equal," and "substantially It means "different from".

In addition to the methods described above, the methods according to the embodiments and modifications described above may be used in combination as appropriate. In addition, various changes may be made to the above-described embodiment and each modified example without departing from the spirit thereof, although no specific examples are given.

The problems and effects to be solved by the embodiments, modifications, etc. described above are not limited to the contents described above. Depending on the embodiments and modifications, it is possible to solve problems not described above or achieve effects not described above. Sometimes only the part is played.

1 Motor control device (electronic equipment)
3 Right cover 3A Top panel 5 Left cover 7 Heat sink 9 Front panel 10 Housing 19 Fan 27 First fin 37 Ventilation space 43 Second fin 45 Second circuit board (circuit board)
47 Circuit components (first circuit components)
63 Partition member 65 Screw 83 Bottom 85A First communication part (communication part)
87 Wall portion 89 Hole portion 92 Engagement portion 95 Wind guide portion 107 Projection portion S1 First accommodation space S2 Second accommodation space

Claims (10)

A casing and
a heat sink including a plurality of first fins;
a circuit board provided with a plurality of circuit components including a first circuit component;
The casing has a bottom portion formed with a hole through which the first circuit component is inserted, and the interior of the casing includes a first accommodation space for accommodating the plurality of first fins and the first circuit component; a second storage space that accommodates the circuit components other than the first circuit component; and a partition member that partitions the circuit components into two;
a fan that ventilates air into the first accommodation space;
electronic equipment. A casing and
a heat sink including a plurality of first fins;
a circuit board provided with a plurality of circuit components including a first circuit component;
A partition that partitions the inside of the casing into a first accommodation space that accommodates the plurality of first fins and the first circuit component, and a second accommodation space that accommodates the circuit components other than the first circuit component. parts and
a fan that ventilates air into the first accommodation space;
has
The partition member is
a bottom portion formed with a hole portion through which the first circuit component is inserted;
a communication portion provided at an edge of the bottom on the first fin side and forming a space into which the air flows;
a wall portion erected from the edge portion of the bottom portion other than the communication portion to the vicinity of the casing;
Electronics . The first accommodation space is
A ventilation space is provided between the tips of the plurality of first fins and the housing and allows the air to be ventilated in a direction intersecting the extending direction of the first fins.
The electronic device according to claim 2 . The casing is
a top plate portion disposed on the opposite side of the bottom portion of the wall portion of the partition member;
The top plate portion is
a protrusion extending along the shape of the wall on the inner surface and protruding so as to overlap the tip of the wall when viewed from a direction parallel to the top plate;
The electronic device according to claim 2 or 3. The communication part is
an engaging portion that engages with a tip of the first fin that is disposed closest to the partition member among the plurality of first fins;
The electronic device according to claim 2 or 3 . The partition member is
fixed to the heat sink together with the circuit board disposed between the heat sink and the heat sink;
The electronic device according to claim 2 or 3 . The heat sink is
a plurality of second fins arranged downstream of the first circuit component in the air ventilation direction;
The electronic device according to claim 2 or 3 . The partition member is
having a wind guide section for guiding the air to the second fin;
The electronic device according to claim 7. A casing and
a heat sink including a plurality of first fins;
a circuit board provided with a plurality of circuit components including a first circuit component;
A partition that partitions the inside of the casing into a first accommodation space that accommodates the plurality of first fins and the first circuit component, and a second accommodation space that accommodates the circuit components other than the first circuit component. parts and
A method for manufacturing an electronic device, the method comprising: a fan that ventilates air into the first storage space;
A protrusion extending along the shape of the wall of the partition member on the inner surface of the housing overlaps a tip of the wall when viewed from a direction parallel to the housing. , attaching the housing to the heat sink;
A method for manufacturing an electronic device, comprising: A casing and
a heat sink including a plurality of first fins;
a circuit board provided with a plurality of circuit components including a first circuit component;
A partition that partitions the inside of the casing into a first accommodation space that accommodates the plurality of first fins and the first circuit component, and a second accommodation space that accommodates the circuit components other than the first circuit component. parts and
A method for manufacturing an electronic device, the method comprising: a fan that ventilates air into the first storage space;
engaging the engaging portion of the partition member with the tip of the first fin that is disposed closest to the partition member among the plurality of first fins;
fixing the partition member to the heat sink together with the circuit board disposed between the partition member and the heat sink;
A method for manufacturing an electronic device, comprising:

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