CN2672342Y - Wind guide tube and radiator using siad wind guide tube - Google Patents
Wind guide tube and radiator using siad wind guide tube Download PDFInfo
- Publication number
- CN2672342Y CN2672342Y CN 03273834 CN03273834U CN2672342Y CN 2672342 Y CN2672342 Y CN 2672342Y CN 03273834 CN03273834 CN 03273834 CN 03273834 U CN03273834 U CN 03273834U CN 2672342 Y CN2672342 Y CN 2672342Y
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- China
- Prior art keywords
- air
- radiator
- guide duct
- radiators
- wind
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a radiator with a wind guide tube.The wind guide tube is suitable for the radiation of the multi-chip system.The utility model comprises a plurality of radiators, a plurality of fans and a wind guide tube.The radiators are respectively arranged on the surfaces of the chips, and each radiator is provided with a plurality of airflow channels.The fans are arranged in the extending directions of the airflow channels of the radiators correspondingly, and certain distance exists between the fans and the radiators.One end of the wind guide tube is provided with a wind inlet, and the other end of the wind guide tube is provided with a plurality of wind-out paths.The wind-out paths are formed by the separation of a plurality of separating components, and the fans are contained in the wind inlet.The radiators are respectively installed in the wind-out paths correspondingly.A plurality of radiators are contained in the wind-out paths of the wind guide tube.The separating components arranged between the wind-out paths can avoid the disturbed flow formed by the air current provided by the fans, the radiators do not need to be provided with the wind guide tubes respectively, the installation time efficiency is helped to be increased, and the cost is reduced.
Description
[technical field]
The utility model is about a kind of sink, refers to a kind of sink that is used for the heat radiation of multicore sheet especially.
[background technique]
Progress along with the intergrated circuit production technology, the degree of integration of chip is more and more higher, its internal arithmetic speed is also more and more faster, corresponding generation heat also increases severely thereupon, for guarantee that chip moves under normal working temperature, usually at chip surface one radiator is installed it is carried out auxiliary heat dissipation, but because of the cabinet inside space narrow and small, cross-ventilation is not smooth, radiating effect is not good, and cabinet inside air its temperature after carrying out heat exchange continuously with radiator will be raised to certain altitude, thereby influence radiating effect.
For improving the effect of chip cooling, install a fan additional to radiator usually and radiator is cooled off so that forced draft to be provided, the speed by improving circulation of air flow is improving radiator and air heat exchange speed, thus improvement is to the radiating effect of chip.But some system is because of spatial constraints, fan can not directly be installed on the radiator, and can only be installed near a certain position radiator, to this type systematic, because the forced draft that fan produces is subject to the influence of other part of cabinet inside, produce flow-disturbing or air-flow leakage, make radiator lower to the utilization ratio of the air-flow that fan provided, radiating effect is also not obvious.For improving radiating effect, between radiator and fan, install a guide duct usually additional, produced whole air-flows and blowed to radiator to compile fan.
Along with the development of information technology, quantity of information increases severely, and single-chip is handled the demand that more and more can not satisfy information processing, handles the information that increases day by day with large-scale servo-systems such as twin-core sheet and multicore sheets and has become main flow.For improving the stability of multicore sheet servo-system operation, effectively dispel the heat more and more important to its chip.Prior art is all installed a radiator and a fan to each chip, in order to chip is dispelled the heat.For avoiding phase mutual interference between the formed air-flow of each fan, form flow-disturbing, be unfavorable for the entire system heat radiation, existing mode is that multichip system is all installed a guide duct between each fan and radiator, but a guide duct all is installed for each chip, be unfavorable for improving timeliness is installed, and cost is higher.For timeliness increase being installed, reducing cost, and avoid each fan to provide forming flow-disturbing between the air-flow, the air-flow that the formed air-flow of each fan must be accumulated the unified flow direction of tool blows to radiator it is dispelled the heat.
[model utility content]
The purpose of this utility model provides a kind of guide duct that is applicable to the multicore sheet.
Another purpose of the present utility model provides a kind of sink of the tool guide duct that can be simultaneously the multicore sheet be dispelled the heat.
The utility model guide duct, be applicable to the heat radiation of multicore sheet, this guide duct is made of a two side and a roof that connects the two side ora terminalis, this guide duct comprises an intake grill and a plurality of air-out passage, and this air-out passage is separated to form by a plurality of slider that a roof end relative with intake grill extends downwards.
The sink of the utility model tool guide duct is applicable to the multichip system heat radiation, and it comprises a plurality of radiators, and these a plurality of radiators are installed in chip surface respectively, and each radiator has a plurality of air-flow paths; A plurality of fans, these a plurality of fan correspondences are installed on the bearing of trend of air-flow path of radiator, and with this radiator spacing certain distance; An and guide duct, this guide duct is made of a two side and a roof that connects the two side ora terminalis, the one end has an intake grill, the other end has a plurality of air-out passages, this air-out passage is to be separated to form by a plurality of sliders, this fan is located in this intake grill, and these a plurality of radiators correspondence respectively are installed in this air-out passage.
Compared with prior art, the utility model is by installing guide duct additional between radiator and fan, the formed air-flow of each fan is accumulated the unified air-flow that flows to of tool to blow to radiator and dispels the heat, can improve the utilization ratio of radiator to air-flow that fan produces, in addition, a plurality of air-out passages of this guide duct are ccontaining a plurality of radiators directly, each air-out interchannel is provided with slider, can avoid each fan to provide and form flow-disturbing between the air-flow, and need not a plurality of radiators are installed guide duct separately, help increasing timeliness is installed, reduce cost.
[description of drawings]
Fig. 1 is that the sink of the utility model tool guide duct is installed in the sectional view in the cabinet.
Fig. 2 is the three-dimensional inverted view of guide duct of the present utility model.
Fig. 3 is that the sink of the utility model tool guide duct is installed in the stereogram in the cabinet.
[embodiment]
See also Fig. 1, the sink of the utility model tool guide duct is to be applicable to the multichip system heat radiation.The surface of each chip (figure does not show) all is equipped with a radiator 30, each radiator 30 has a plurality of air-flow paths 31, on the bearing of trend of each radiator 30 air-flow path 31, be provided with a mounting plate 60 apart from radiator 30 a distance, a fan 40 is all installed in position relative with each radiator 30 on mounting plate 60, to provide forced draft to radiator 30.
See also Fig. 2 and Fig. 3, multicore sheet guide duct 20 of the present utility model is that plastic materials is one-body molded, its two ends have an intake grill (not indicating) and some air-out passages 28 respectively, and this guide duct 20 has the roof 24 that two vertical sidewalls 22 and connect two side 22 1 ora terminalis.Each sidewall 22 has portion 221 and first kink 222 of the outside oblique expansion extension of a vertical ora terminalis of this straight portion 221 always certainly.The position of this corresponding straight portion 221 of roof 24 central authorities offers a breach 26, the relative both sides of the edge of this breach 26 are extended the sidepiece 262 that parallels with straight portion 221 respectively in the same way, these both sides 262 and straight portion 221 common formation two air-out passages 28, with ccontaining radiator 30, another edge of this breach 26 extends a retaining wall 264 perpendicular to sidepiece 262, these both sides 262 and retaining wall 264 common formation one grooves; The other end of these roof 24 relative breach 26 is provided with second kink 242 that an outside oblique expansion is extended, thereby this 2 first kink 222 and second kink 242 form the intake grill of this guide duct 20.
During installation, at each chip surface one radiator 30 is installed respectively, a fan 40 is installed in the position of corresponding each radiator 30 on mounting plate 60, and the air flow direction of fan 40 generations and air-flow path 31 bearing of trends of radiator 30 are consistent.Guide duct 20 is covered at radiator 30 tops, make a radiator 30 is set in each air-flow path 28, and intake grill is installed in mounting plate 60 and connects airtight with it, make this fan 40 can be located in the intake grill of guide duct 20, at this moment, the bottom margin of this guide duct 20 contacts with host board (figure does not indicate), thereby forms a passage.
The heat that chip produces is passed to radiator 30 by heat conducting mode, the fan 40 that is arranged on intake grill forces to be blown into guide duct 20 with the cool air of outside (opposite side of mounting plate 60), this forced draft is because of being subjected to the restriction of guide duct 20, and only a plurality of air-flow paths 31 from radiator 30 flow out guide duct 20.28 in air-out passage at wind scooper 20 is established groove, and sidepiece 262 and retaining wall 264 are located between two radiators 30, can effectively avoid air-flow from flowing out guide duct 20 between this two radiator 30, simultaneously, prevents that the air-flow that fan 40 produces from producing flow-disturbing.
Between two radiators 30, establish the preferred version that sidepiece 262 and retaining wall 264 only are present embodiments, establish between two radiators 30 the Any shape tool keep out the wind the effect dividing plate all can, as entity sheet material.In addition, employing is dispelled the heat to the twin-core chip system and also only is a specific embodiments of the present utility model, sink of the present utility model is not limited only to be suitable for the twin-core sheet is dispelled the heat, the heat radiation of any multichip system all can be adopted this guide duct, and only the quantity of air-out passage is determined according to the quantity of System on Chip/SoC.
Claims (10)
1. guide duct, be applicable to the heat radiation of multicore sheet, it is characterized in that: this guide duct is made of a two side and a roof that connects the two side ora terminalis, this guide duct comprises an intake grill and a plurality of air-out passage, and this air-out passage is separated to form by a plurality of slider that a roof end relative with intake grill extends downwards.
2. as 1 described guide duct of claim the, it is characterized in that this slider is an entity sheet material.
3. as 1 described guide duct of claim the, it is characterized in that this slider is a groove.
4. as 3 described guide ducts of claim the, it is characterized in that an end of this roof offers a breach, extend both sides in the limit, two opposite sides of this breach, another side of this breach extends a retaining wall, and these both sides and retaining wall constitute this groove jointly.
5. as 1 described guide duct of claim the, portion reaches first kink that is extended by the outside oblique expansion of this straight portion one ora terminalis to it is characterized in that having always by each sidewall.
6. the sink of a tool guide duct, be applicable to the multichip system heat radiation, it comprises a plurality of radiators and a plurality of fan, these a plurality of radiators are installed in chip surface respectively, each radiator has a plurality of air-flow paths, these a plurality of fan correspondences are installed on the bearing of trend of air-flow path of radiator, and with this radiator spacing certain distance, it is characterized in that: this sink also comprises a guide duct, this guide duct is made of a two side and a roof that connects the two side ora terminalis, the one end has an intake grill, the other end has a plurality of air-out passages, this air-out passage is to be separated to form by a plurality of sliders, and this fan is located in this intake grill, and these a plurality of radiators correspondence respectively are installed in this air-out passage.
7. as the sink of 6 described tool guide ducts of claim the, it is characterized in that the airflow direction of this fan is consistent with the air-flow path bearing of trend of this radiator.
8. as the sink of 6 described tool guide ducts of claim the, it is characterized in that this slider can be entity sheet material.
9. as the sink of 6 described tool guide ducts of claim the, it is characterized in that this slider can be groove.
10. as the sink of 9 described tool guide ducts of claim the, an end that it is characterized in that this roof offers a breach, both sides are extended on limit, two opposite sides in this breach, and another side of this breach extends a retaining wall, and these both sides and retaining wall constitute this groove jointly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03273834 CN2672342Y (en) | 2003-08-22 | 2003-08-22 | Wind guide tube and radiator using siad wind guide tube |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03273834 CN2672342Y (en) | 2003-08-22 | 2003-08-22 | Wind guide tube and radiator using siad wind guide tube |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2672342Y true CN2672342Y (en) | 2005-01-19 |
Family
ID=34473658
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03273834 Expired - Fee Related CN2672342Y (en) | 2003-08-22 | 2003-08-22 | Wind guide tube and radiator using siad wind guide tube |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2672342Y (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102053683A (en) * | 2010-12-27 | 2011-05-11 | 东莞市鑫塑源塑胶科技有限公司 | Air-guide pipe and radiating device using same |
| CN102900686A (en) * | 2012-09-11 | 2013-01-30 | 曾德邻 | Two-dimensional array pipeline fan |
| CN105208826A (en) * | 2014-06-26 | 2015-12-30 | 中兴通讯股份有限公司 | Heat dissipation device, communication device and heat dissipation method |
| CN105431022A (en) * | 2015-12-30 | 2016-03-23 | 杭州华为数字技术有限公司 | Heat dissipation system and electronic device with same |
| CN106659087A (en) * | 2016-12-30 | 2017-05-10 | 华为技术有限公司 | Single-board heat dissipation device and assembly method and internet device thereof |
| CN108843622A (en) * | 2018-05-25 | 2018-11-20 | 浙江东音泵业股份有限公司 | A kind of efficient pump cooling system |
| CN109407797A (en) * | 2018-10-16 | 2019-03-01 | 郑州云海信息技术有限公司 | A kind of server heat-radiation framework |
| CN110994902A (en) * | 2019-12-02 | 2020-04-10 | 深圳市优必选科技股份有限公司 | Cooling device |
| CN111447799A (en) * | 2020-04-29 | 2020-07-24 | 水氪(北京)科技发展有限公司 | Heat dissipation system for food purifier |
-
2003
- 2003-08-22 CN CN 03273834 patent/CN2672342Y/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102053683A (en) * | 2010-12-27 | 2011-05-11 | 东莞市鑫塑源塑胶科技有限公司 | Air-guide pipe and radiating device using same |
| CN102053683B (en) * | 2010-12-27 | 2012-05-30 | 东莞市鑫塑源塑胶科技有限公司 | Air-guide pipe and radiating device using same |
| CN102900686A (en) * | 2012-09-11 | 2013-01-30 | 曾德邻 | Two-dimensional array pipeline fan |
| CN105208826A (en) * | 2014-06-26 | 2015-12-30 | 中兴通讯股份有限公司 | Heat dissipation device, communication device and heat dissipation method |
| CN105431022B (en) * | 2015-12-30 | 2018-03-16 | 杭州华为数字技术有限公司 | Cooling system and the electronic equipment with the cooling system |
| CN105431022A (en) * | 2015-12-30 | 2016-03-23 | 杭州华为数字技术有限公司 | Heat dissipation system and electronic device with same |
| CN106659087A (en) * | 2016-12-30 | 2017-05-10 | 华为技术有限公司 | Single-board heat dissipation device and assembly method and internet device thereof |
| CN106659087B (en) * | 2016-12-30 | 2019-04-26 | 华为技术有限公司 | Single plate cooling device and its assembly method, internet device |
| CN108843622A (en) * | 2018-05-25 | 2018-11-20 | 浙江东音泵业股份有限公司 | A kind of efficient pump cooling system |
| CN108843622B (en) * | 2018-05-25 | 2019-12-03 | 浙江东音科技有限公司 | A kind of efficient pump cooling system |
| CN109407797A (en) * | 2018-10-16 | 2019-03-01 | 郑州云海信息技术有限公司 | A kind of server heat-radiation framework |
| CN110994902A (en) * | 2019-12-02 | 2020-04-10 | 深圳市优必选科技股份有限公司 | Cooling device |
| CN110994902B (en) * | 2019-12-02 | 2021-06-29 | 深圳市优必选科技股份有限公司 | Cooling device |
| CN111447799A (en) * | 2020-04-29 | 2020-07-24 | 水氪(北京)科技发展有限公司 | Heat dissipation system for food purifier |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050119 Termination date: 20100822 |