CN106659087B - Single plate cooling device and its assembly method, internet device - Google Patents

Single plate cooling device and its assembly method, internet device Download PDF

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Publication number
CN106659087B
CN106659087B CN201611270217.XA CN201611270217A CN106659087B CN 106659087 B CN106659087 B CN 106659087B CN 201611270217 A CN201611270217 A CN 201611270217A CN 106659087 B CN106659087 B CN 106659087B
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China
Prior art keywords
static pressure
pressure chamber
group
radiator
fan group
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CN201611270217.XA
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Chinese (zh)
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CN106659087A (en
Inventor
曲中江
池善久
曾文辉
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XFusion Digital Technologies Co Ltd
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Huawei Technologies Co Ltd
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Priority to CN201611270217.XA priority Critical patent/CN106659087B/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20145Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Abstract

This application discloses a kind of single plate cooling device and its assembly methods, internet device, belong to internet area.Described device includes: at least one radiator, at least one first fan group and at least one set of guiding subassembly, each guiding subassembly includes: two static pressure chambers and first diversion pipe, each static pressure is intracavitary to be equipped with cavity, and the first deflector hole being connected to cavity is provided on each static pressure chamber, the both ends of first diversion pipe are connect with the first deflector hole of described two static pressure chambers respectively;Each radiator is connect with a processor on veneer, described two static pressure chambers include: the first static pressure chamber and the second static pressure chamber, the cavity of the first static pressure chamber coats a radiator, and the cavity of the second static pressure chamber coats the air outlet of first fan group.The application effectively improves the radiating efficiency of processor.The application is used for as the veneer heat dissipation in internet device.

Description

Single plate cooling device and its assembly method, internet device
Technical field
This application involves internet area, in particular to a kind of single plate cooling device and its assembly method, internet device.
Background technique
With internet (literal translation: Information Technology;Referred to as: the IT) raising of device integration is related The power consumption of equipment is higher and higher, and the heat generated at runtime is also more and more, for example, internet device (such as: server) The middle more device of heat that generates includes: the power consuming devices such as processor and memory on veneer, if these power consuming devices produce Raw heat is excessive and can not radiate in time, and the operation conditions of internet device will be affected, therefore, in internet device Design process in, the design of single plate cooling device is a very important link.
Traditional single plate cooling device includes multiple fans, and the air-flow that multiple fans generate is used for as the processor on veneer It radiates with power consuming devices such as memories.Since the power consumption of processor is larger, the power consumption of memory is smaller, and processor needs more gas Stream, memory need less air-flow.Therefore, in traditional single plate cooling device, close to the position of memory usually on veneer Upper setting wind deflector, and aperture is set on wind deflector, using being memory heat radiation by a small amount of air-flow of aperture, utilize its residual air Stream is that processor radiates.Meanwhile being fixedly connected with processor with the processor heat sink with larger area, make the heat of processor Amount can be transferred to processor heat sink, and the heat dissipation of processor, phase are realized by the processor heat sink with larger area The heat dissipation area of processor is increased over the ground.
But due to using remaining air-flow of multiple fans for processor heat dissipation, remaining air-flow is more dispersed, generates gas The phenomenon that stream bypass, (that is to say that air-flow does not pass through processor), can not effectively take away the heat of processor, lead to processor Radiating efficiency it is lower.
Summary of the invention
Radiating efficiency in order to solve the problems, such as heat dissipating method in traditional technology is lower, and the embodiment of the invention provides one kind Single plate cooling device and its assembly method, internet device.The technical solution is as follows:
In a first aspect, this application provides a kind of single plate cooling device, described device includes:
At least one radiator, at least one first fan group and at least one set of guiding subassembly, guiding subassembly described in every group It include: two static pressure chambers and first diversion pipe, each static pressure is intracavitary to be equipped with cavity, and is provided on each static pressure chamber and chamber First deflector hole of body connection, the both ends of first diversion pipe are connect with the first deflector hole of described two static pressure chambers respectively;
Each radiator is connect with a processor on veneer, and described two static pressure chambers include: the first static pressure chamber With the second static pressure chamber, the cavity of the first static pressure chamber coats a radiator, the cavity cladding of the second static pressure chamber The air outlet of one the first fan group.
It should be noted that by being mounted with individual guiding subassembly between fan group and radiator, so that fan group Independent heat dissipation channel is formd between processor, the air-flow for then enabling fan group to generate intensively is oriented to heat dissipation Device, the phenomenon that avoiding bypass of gas flow, the air-flow that fan is generated as often as possible are used for the heat dissipation of radiator, improve The heat-sinking capability of single plate cooling device effectively improves the radiating efficiency of radiator.Simultaneously as in fan group and radiator Between the phenomenon that being mounted with individual guiding subassembly, bypass of gas flow can be avoided the occurrence of, therefore, can correspondingly increase radiator Fin density the heat-sinking capability of single plate cooling device is further improved with increasing heat radiation area, to solve the processing of big power consumption The heat dissipation problem of device (such as power consumption is greater than 100 watts of processor).Also, since memory and processor are blown using different fan groups The airflow radiating that wind generates is conducive to veneer heat dissipation so can adjust the speed respectively to memory and the corresponding fan of processor The energy conservation of device and noise reduction.
Optionally, processor, described device include: there are two settings on the veneer
Two radiators, at least two first fan groups and at least two groups guiding subassembly, guiding subassembly described in every group also wrap Include: second diversion pipe is additionally provided with the second deflector hole being connected to cavity on each static pressure chamber;
One end of each second diversion pipe is connect with the second deflector hole of the first static pressure chamber in one group of guiding subassembly, The other end is connect with the second deflector hole of the second static pressure chamber in another group of guiding subassembly.
It should be noted that there is event in any processor in two processors when two processors are arranged on veneer When barrier, another processor can work on, and that is to say the effect for realizing internet device redundancy.Also, two on veneer Each processor in a processor can provide the air-flow for heat dissipation by two groups of fans for it, can guarantee in veneer in this way On some fan group break down when, processor can continue to use another fan group offer air-flow radiate, with Guarantee that the temperature of processor will not overheat, then guarantees the normal work of processor.Alternatively, when the power consumption of processor is smaller, A fan group can be only used as processor heat dissipation, be conducive to energy conservation and the noise reduction of single plate cooling device.
Optionally, multiple groups memory, described device are provided on the veneer further include:
At least one second fan group, at least one set of memory of air outlet direction of each second fan group.
It should be noted that second fan group is used to be other function on the multiple groups memory and its veneer being arranged on veneer Device heat dissipation is consumed, air-flows more as far as possible can be blowed to memory, within meeting towards multiple groups memory by the air outlet of the second fan group The radiating requirements deposited.
Optionally, the first static pressure chamber is fixedly connected with the radiator, the second static pressure chamber and first wind The air outlet of fan group is fixedly connected.
Optionally, the first static pressure chamber and the radiator are connect, be bolted, snapped connection and gluing using withholding Any one connection type in connection is fixedly connected;
The second static pressure chamber uses to withhold with the air outlet of first fan group and connect, is bolted, snapping connection It is fixedly connected with any one connection type in gluing connection.
Optionally, first diversion pipe and second diversion pipe by can deformation material be made.
It should be noted that diversion pipe by can deformation material be made and can be convenient installation, and reduce and installing or using In the process because of damage caused by bending or collide etc. diversion pipe.
Optionally, it is described can deformation material be plastics or rubber.
It should be noted that can deformation material be plastics or rubber, be it is provided by the present application can two kinds of deformation material can Material selection.
Optionally, first fan group and second fan group are arranged in the same side of the veneer.
It, can be with it should be noted that the first fan group and second fan group are arranged in the same side of the veneer So that the air-flow that the first fan group and the second fan group generate moves towards identical, to avoid the gas occurred because air-flow moves towards different Stream conflict then reduces the loss of air-flow caused by due to air-flow conflict, to guarantee the air-flow that fan generates to a certain extent It can as often as possible be used for as radiator heat-dissipation.
Optionally, the processor is central processor CPU.
Optionally, the air outlet of the first fan group can face radiator, that is to say, at least two first fan groups Each of the central axes of the first fan group can be overlapped with the central axes of any one radiator in two radiators.
It should be noted that on the one hand such setting can reduce the length of the first diversion pipe, on the other hand can subtract Few entire single plate cooling device the space occupied.
Second aspect, this application provides a kind of assembly methods of single plate cooling device, which comprises
Obtain at least one radiator, at least one first fan group and at least one set of guiding subassembly, water conservancy diversion described in every group Component includes: two static pressure chambers and first diversion pipe, and each static pressure is intracavitary to be equipped with cavity, and is provided on each static pressure chamber The first deflector hole being connected to cavity, described two static pressure chambers include: the first static pressure chamber and the second static pressure chamber;
Carry out the assembly of at least one set of guiding subassembly, wherein the assembling process of every group of guiding subassembly includes:
The first static pressure chamber is coated on the radiator;
The second static pressure chamber is coated on the air outlet of first fan group;
By the processor connection on each radiator and veneer for being coated with the first static pressure chamber;
First fan group for being coated with the second static pressure chamber is arranged in veneer side;
The both ends of first diversion pipe are connect with the first deflector hole of described two static pressure chambers respectively.
It should be noted that due to being mounted with individual guiding subassembly between fan group and radiator, so that fan group Independent heat dissipation channel is formd between processor, the air-flow for then enabling fan group to generate intensively is oriented to heat dissipation Device, the phenomenon that avoiding bypass of gas flow, the air-flow that fan is generated as often as possible are used for the heat dissipation of radiator, improve The heat-sinking capability of single plate cooling device effectively improves the radiating efficiency of radiator.
Optionally, on the veneer setting there are two processor, described at least one radiator of acquisition, at least one first Fan group and at least one set of guiding subassembly, comprising:
Obtain two radiators, at least two first fan groups and at least two groups guiding subassembly, guiding subassembly described in every group Further include: second diversion pipe is additionally provided with the second deflector hole being connected to cavity on each static pressure chamber;
The assembly for carrying out at least one set of guiding subassembly, comprising:
Carry out the assembly of at least two groups guiding subassembly;
One end of each second diversion pipe and the second deflector hole of the first static pressure chamber in one group of guiding subassembly are connected It connects, the other end is connect with the second deflector hole of the second static pressure chamber in another group of guiding subassembly.
Optionally, it is provided with multiple groups memory on the veneer, in the assembly for carrying out at least one set of guiding subassembly After process, the method also includes:
At least one second fan group is set in the side of the veneer, the air port of each second fan group is towards institute State at least one set of memory on veneer.
The third aspect, this application provides a kind of internet devices, comprising:
Cabinet, veneer and single plate cooling device,
The veneer and the single plate cooling device are arranged in the cabinet, and the single plate cooling device is first aspect Any single plate cooling device.
Optionally, at least one first fan group is fixed in the cabinet.
It should be noted that due to pacifying in the fan group in the single plate cooling device in internet device and between radiator Individual guiding subassembly is filled, so that foring independent heat dissipation channel between fan group and processor, then fan group is produced Raw air-flow can intensively guide radiator, the phenomenon that avoiding bypass of gas flow, the air-flow that fan is generated is as far as possible It mostly is used for the heat dissipation of radiator, improves the heat-sinking capability of single plate cooling device, effectively improves the heat dissipation effect of radiator Rate.
Technical solution provided by the present application has the benefit that
Single plate cooling device provided by the present application and its assembly method, internet device, due in fan group and radiator Between be mounted with individual guiding subassembly so that foring independent heat dissipation channel between fan group and processor, then make The air-flow that fan group generates can intensively guide radiator, the phenomenon that avoiding bypass of gas flow, so that the air-flow that fan generates It can be as often as possible used for the heat dissipation of radiator, the heat-sinking capability of single plate cooling device is improved, effectively improve processor Radiating efficiency.
Detailed description of the invention
Fig. 1-1 is a kind of schematic diagram of single plate cooling device shown according to an exemplary embodiment;
Fig. 1-2 is a kind of stereoscopic schematic diagram of first static pressure chamber shown according to an exemplary embodiment;
Fig. 1-3 is that a kind of cavity of first static pressure chamber shown according to an exemplary embodiment coats the vertical of a radiator Body schematic diagram;
Fig. 2-1 is a kind of schematic top plan view of traditional single plate cooling device provided in an embodiment of the present invention;
Fig. 2-2 is a kind of schematic front view of traditional single plate cooling device provided in an embodiment of the present invention;
Fig. 3 is the schematic diagram of another single plate cooling device shown according to an exemplary embodiment
Fig. 4 is a kind of flow chart of the assembly method of single plate cooling device shown according to an exemplary embodiment;
Fig. 5 is a kind of flow chart of the assembling process of every group of guiding subassembly shown according to an exemplary embodiment;
Fig. 6 is the signal that a kind of first static pressure chamber shown according to an exemplary embodiment is coated on a radiator Figure;
Fig. 7 is the outlet air that a kind of second static pressure chamber shown according to an exemplary embodiment is coated on first fan group Schematic diagram on mouth;
Fig. 8 is one on a kind of radiator and veneer for being coated with the first static pressure chamber shown according to an exemplary embodiment The schematic diagram of a processor connection;
Fig. 9 is that a kind of the first fan group for being coated with the second static pressure chamber shown according to an exemplary embodiment is arranged in list The schematic diagram of the side of plate;
Figure 10 be a kind of first diversion pipe shown according to an exemplary embodiment both ends respectively with the first static pressure chamber and Schematic diagram after the first deflector hole connection of second static pressure chamber.
Specific embodiment
To keep the purposes, technical schemes and advantages of the application clearer, below in conjunction with attached drawing to the application embodiment party Formula is described in further detail.
Fig. 1-1 is a kind of schematic diagram (dotted line in figure of single plate cooling device 10 shown according to an exemplary embodiment Arrow is air-flow trend), as Figure 1-1, be provided with processor 201 on veneer 20, single plate cooling device 10 may include: to Few first fan group 101, at least one set of guiding subassembly 102 and at least one radiator 103, every group of guiding subassembly 102 can To include: two static pressure chambers and first diversion pipe 1023, each static pressure is intracavitary to be equipped with cavity, and is arranged on each static pressure chamber Have the first deflector hole (being not drawn into Fig. 1-1) being connected to cavity, the both ends of the first diversion pipe 1023 respectively with two static pressure chambers The first deflector hole connection.
Wherein, each radiator 103 is connect with a processor 201 on veneer 20, and two static pressure chambers include: first quiet Chamber 1021 and the second static pressure chamber 1022 are pressed, the cavity of the first static pressure chamber 1021 coats a radiator 103, the second static pressure chamber 1022 Cavity coat first fan group 101 air outlet, such connection type can make the first fan group 101 generate gas Stream can pass through intensively guide radiator 103 of guiding subassembly 102.Illustratively, the stereoscopic schematic diagram of the first static pressure chamber 1021 can With as shown in Figs. 1-2, it is equipped with cavity 1021a in the first static pressure chamber 1021, and is provided on the first static pressure chamber 1021 and cavity First deflector hole 1021b of 1021a connection;The solid that the cavity 1021a of first static pressure chamber 1021 coats a radiator 103 is shown Be intended to can with as shown in Figure 1-3, the one side of 103 the first static pressure of face chamber 1021 of radiator by the cavity of the first static pressure chamber 1021 1021a is all covered.
Optionally, the first static pressure chamber 1021 is fixedly connected with radiator 103, the second static pressure chamber 1022 and the first fan group 101 air outlet is fixedly connected.Illustratively, which can be to withhold connection, be bolted, buckle company Any one in connecting with gluing is connect, the embodiment of the present invention is not specifically limited it.
It should be noted that above-mentioned processor 201 can be central processing unit (English: Central Processing Unit;Referred to as: CPU), or, or graphics processor (English: Graphic Processing Unit;Referred to as: GPU) Etc..
Optionally, multiple groups memory 202 is also provided on veneer 20.Correspondingly, single plate cooling device 10 can also wrap It includes: at least one second fan group 104, at least one set of memory 202 of air outlet direction of each second fan group 104.This second Fan group 104 is used for multiple groups memory 202 and the heat dissipation of other power consuming devices to be arranged on veneer 20, and the second fan group 104 goes out Air-flows more as far as possible can be blowed to memory, to meet the radiating requirements of memory towards multiple groups memory 202 by air port.
Optionally, first fan group 101 and the second fan group 104 can be arranged in the same side of veneer 20, so that The air-flow that first fan group 101 and the second fan group 104 generate moves towards identical, occurs to avoid because air-flow move towards difference Air-flow conflict then reduces the loss of air-flow caused by due to air-flow conflict, to guarantee the gas that fan generates to a certain extent Stream can as often as possible be used for as radiator heat-dissipation.
Illustratively, Fig. 2-1 is a kind of schematic top plan view of traditional single plate cooling device 30 provided in an embodiment of the present invention (dotted arrow in figure is air-flow trend), Fig. 2-2 is a kind of traditional single plate cooling device 30 provided in an embodiment of the present invention Schematic front view, as shown in Fig. 2-1, which includes multiple fans 301, and multiple fans 301 are single jointly Processor 201 and memory 202 on plate 20 radiate, and the position on veneer 20 close to memory 202 is provided with wind deflector 302. It can be seen that, it is provided with aperture 3021 on wind deflector 302 from Fig. 2-2, is used to dissipate for memory 202 by the air-flow of aperture 3021 Heat, remaining air-flow are used to radiate for processor 201.Meanwhile from Fig. 2-2 it can further be seen that memory 202 and processor 201 with And all there is gap between processor 201 and veneer 20, it the use of the single plate cooling device 30 is being processor 201 and memory 202 When heat dissipation, air-flow may be lost from the gap, and the air-flow of the loss can not be used to radiate, and that is to say showing for bypass of gas flow occur As, also, when the fin density of radiator 303 increases, since the windage that fin generates air-flow will increase, the bypass of gas flow Phenomenon can be more serious, and the air-flow that be subsequently used in heat dissipation is reduced, and it is bad to eventually lead to heat dissipation, therefore, is using veneer heat dissipation dress When setting 30 heat dissipation, the fin density of radiator 303 is also had been more limited.
Single plate cooling device shown in Fig. 1-1 is compared to single plate cooling device shown in Fig. 2-1 and Fig. 2-2, by wind Individual guiding subassembly is installed, so that it is logical to form independent heat dissipation between fan group and processor between fan group and radiator Road, the air-flow for then enabling fan group to generate is by intensively guide radiator, the phenomenon that can avoiding the occurrence of bypass of gas flow, The air-flow that fan is generated as often as possible is used for the heat dissipation of radiator, can be improved the heat radiation energy of single plate cooling device Power that is to say, can effectively improve the radiating efficiency of radiator.Simultaneously as being mounted between fan group and radiator Individual guiding subassembly, the phenomenon that can avoiding the occurrence of bypass of gas flow, therefore, the fin that can correspondingly increase radiator is close Degree, with increasing heat radiation area, further improves the heat-sinking capability of single plate cooling device, to solve big power consumption processor (such as function Consumption is greater than 100 watts of processor) heat dissipation problem.Also, it is dried and is generated using different fan groups due to memory and processor Airflow radiating be conducive to single plate cooling device so can adjust the speed respectively to memory and the corresponding fan of processor Energy conservation and noise reduction.
Further, as shown in Figure 3 (dotted arrow in figure is air-flow trend), there are two also can be set on veneer 20 Processor 201.When two processors are arranged on veneer, when any processor in two processors breaks down, another Processor can work on, and that is to say the effect for realizing internet device redundancy.It is arranged at two corresponding on veneer 20 Device 201 is managed, single plate cooling device 10 may include: at least two first fan groups 101, at least two groups guiding subassembly 102 and two A radiator 103.Wherein, every group of guiding subassembly 102 further include: second diversion pipe 1024 is also set up on each static pressure chamber There is the second deflector hole being connected to cavity.
Second deflector hole of one end of each second diversion pipe 1024 and the first static pressure chamber 1021 in one group of guiding subassembly Connection, the other end are connect with the second deflector hole of the second static pressure chamber 1022 in another group of guiding subassembly.
According to the single plate cooling device of Fig. 3 it is known that each processor on veneer can be mentioned by two groups of fans for it For the air-flow for heat dissipation, it can guarantee that processor can continue to make when some fan group on veneer breaks down in this way It is radiated with the air-flow that another fan group provides, to guarantee that the temperature of processor will not overheat, then guarantees processor energy It is enough to work normally.Alternatively, can only use a fan group when the power consumption of the processor on veneer is smaller and be provided for processor For the air-flow of heat dissipation, such energy conservation being provided with conducive to single plate cooling device and noise reduction.
Optionally, the air outlet of the first fan group 101 can face radiator 103, that is to say, at least two first wind It the central axes of first fan group of each of fan group 101 101 can be with any one radiator 103 in two radiators 103 Central axes are overlapped.On the one hand such setting can reduce the length of the first diversion pipe, on the other hand can reduce entire veneer 10 the space occupied of radiator.
It should be noted that above-mentioned first diversion pipe and the second diversion pipe can by can deformation material be made.Diversion pipe By can deformation material be made and can be convenient installation, and reduce in installation or use process because bending or colliding etc. to diversion pipe Caused by damage.Illustratively, this can deformation material can be plastics or rubber.Alternatively, above-mentioned first diversion pipe and the second water conservancy diversion Pipe can also be made of non-deformable material, such as: metal, the embodiment of the present invention are not specifically limited it.
It should also be noted that, single plate cooling device shown in Fig. 3 is only schematical example, not to limit, Multiple processors are also provided in practical application, on veneer, such as: 3,4 or more, the setting of number can be with It is set according to the actual situation, the embodiment of the present invention is not specifically limited it.Wherein, when the processor number on veneer is When odd number, the mounting means of every group of guiding subassembly, radiator and the first fan group can refer to the mounting means in Fig. 1-1, Alternatively, can also a part with reference to the mounting means in Fig. 1-1, another part is with reference to the mounting means in Fig. 3, for example, every two The mounting means of the adjacent guiding subassembly of group refers to the mounting means of Fig. 3, the mounting means reference of remaining single group guiding subassembly Mounting means in 1-1, radiator and the first fan group are accordingly arranged according to the arrangement of guiding subassembly;When the processing on veneer When device number is even number, the mounting means for providing every group of guiding subassembly for heat dissipation for processor can be with reference to the peace in Fig. 3 Dress mode, such as the mounting means of every two groups of adjacent guiding subassemblies refer to the mounting means of Fig. 3, radiator and the first fan Group accordingly arranges according to the arrangement of guiding subassembly, alternatively, can also a part with reference to the mounting means in Fig. 1-1, another part With reference to the mounting means in Fig. 3.
In conclusion single plate cooling device provided in an embodiment of the present invention, due to being installed between fan group and radiator Individual guiding subassembly so that foring independent heat dissipation channel between fan group and processor then produces fan group Raw air-flow can intensively guide radiator, the phenomenon that avoiding bypass of gas flow, the air-flow that fan is generated is as far as possible It mostly is used for the heat dissipation of radiator, improves the heat-sinking capability of single plate cooling device, effectively improves the heat dissipation effect of processor Rate.
Fig. 4 is a kind of flow chart of the assembly method of single plate cooling device shown according to an exemplary embodiment, such as Fig. 4 Shown, the assembly method of the single plate cooling device may include:
Step 401 obtains at least one radiator, at least one first fan group and at least one set of guiding subassembly.
Wherein, every group of guiding subassembly includes: two static pressure chambers and first diversion pipe, and each static pressure is intracavitary to be equipped with chamber Body, and the first deflector hole being connected to cavity is provided on each static pressure chamber, two static pressure chambers include: the first static pressure chamber and second Static pressure chamber.
It should be noted that when setting is there are two processor on veneer, obtain at least one radiator, at least one the One fan group and at least one set of guiding subassembly, comprising: obtain two radiators, at least two first fan groups and at least two groups and lead Flow component.Wherein, every group of guiding subassembly further include: be additionally provided on second diversion pipe and each static pressure chamber and cavity Second deflector hole of connection.
Step 402, the assembly for carrying out at least one set of guiding subassembly.
Optionally, the assembly of at least one set of guiding subassembly can be there are many mode of can be achieved, and the embodiment of the present invention is with following It is illustrated for a kind of achievable mode, as shown in figure 5, the assembling process of every group of guiding subassembly may include:
First static pressure chamber is coated on a radiator by step 4021.
Optionally, the first static pressure chamber is coated on a radiator, it can be understood as, radiator face the first static pressure chamber It is all covered by the cavity of the first static pressure chamber on one side, so that can all be blowed to from the gas that the cavity of the first static pressure chamber flows out Radiator, the phenomenon that bypass of gas flow can be avoided the occurrence of.Illustratively, the first static pressure chamber is coated on the schematic diagram on a radiator It can be as shown in fig. 6, the one side of 103 the first static pressure of face chamber 1021 of radiator be all covered by the cavity of the first static pressure chamber 1021 Lid.
Second static pressure chamber is coated on the air outlet of first fan group by step 4022.
Optionally, the second static pressure chamber is coated on the air outlet of first fan group, it can be understood as, the first fan group Air outlet face the second static pressure chamber one side by the second static pressure chamber cavity all cover so that from the first fan group go out The gas of air port outflow can be by guiding subassembly guide radiator, the phenomenon that can avoiding the occurrence of bypass of gas flow.Illustratively, Two static pressure chambers are coated on the schematic diagram on the air outlet of first fan group can be as shown in fig. 7, the first fan group 101 goes out The one side of the second static pressure of air port face chamber 1022 is all covered by the cavity of the second static pressure chamber 1022.
Step 4023 connects a processor on each radiator and veneer for being coated with the first static pressure chamber.
Illustratively, referring to FIG. 8, being coated with the radiator 103 of the first static pressure chamber 1021 and a processing on veneer 20 Device 201 connects, wherein the first static pressure chamber 1021 is coated on a radiator 103.
The first fan group for being coated with the second static pressure chamber is arranged in veneer side step 4024.
Illustratively, referring to FIG. 9, the first fan group 101 for being coated with the second static pressure chamber 1022 is arranged in the one of veneer 20 Side, wherein the second static pressure chamber 1022 is coated on the air outlet of the first fan group 101.
The both ends of first diversion pipe are connect with the first deflector hole of two static pressure chambers by step 4025 respectively.
Since the first static pressure chamber is coated on a radiator, the second static pressure chamber is coated on the outlet air of first fan group On mouth, the both ends of the first diversion pipe are connect with the first deflector hole of two static pressure chambers respectively, it can be in fan group and heat dissipation Individual guiding subassembly is formed between device, so that independent heat dissipation channel is formd between fan group and processor, so that fan The air-flow that group generates can intensively guide radiator, the phenomenon that avoiding bypass of gas flow, the air-flow that fan is generated As often as possible it is used for the heat dissipation of radiator.
Illustratively, Figure 10 (dotted arrow in figure is air-flow trend), the both ends difference of the first diversion pipe 1023 are please referred to It is connect with the first deflector hole of the first static pressure chamber 1021 and the second static pressure chamber 1022.
It should be noted that when there are two the assembly for when processor, carrying out at least one set of guiding subassembly for setting on veneer Journey may include: to carry out the assembly of at least two groups guiding subassembly;It will be in one end of each second diversion pipe and one group of guiding subassembly The first static pressure chamber the connection of the second deflector hole, the second deflector hole of the other end and the second static pressure chamber in another group of guiding subassembly Connection.The assembling process can accordingly refer to step 4021~step 4025, and details are not described herein again.
At least one second fan group is arranged in the side of veneer in step 403, and the air port direction of each second fan group is single At least one set of memory on plate.
Optionally, multiple groups memory is also provided on veneer, therefore, in the assembly for carrying out at least one set of guiding subassembly After journey, it is also necessary at least one second fan group be set in the side of veneer, and make the air port direction of each second fan group At least one set of memory on veneer, for radiating for other power consuming devices at least one set of memory and veneer.The one of veneer The schematic diagram that at least one the second fan group is arranged in side can be with reference to the schematic diagram of the single plate cooling device in Fig. 1-1, herein not It repeats again.
It is apparent to those skilled in the art that for convenience and simplicity of description, the method for foregoing description Specific steps, can be with reference to the corresponding process in aforementioned single plate cooling device embodiment, details are not described herein.
It should be noted that the sequencing of the assembly method step of single plate cooling device provided in an embodiment of the present invention can To carry out appropriate adjustment, step according to circumstances can also accordingly be increased and decreased, for example, step 402 and step 403 can be carried out Adjustment, anyone skilled in the art in the technical scope disclosed by the present invention, can readily occur in the side of variation Method should be covered by the protection scope of the present invention, therefore repeat no more.
In conclusion the assembly method of single plate cooling device provided in an embodiment of the present invention, due in fan group and heat dissipation It is mounted with individual guiding subassembly between device, so that foring independent heat dissipation channel between fan group and processor, then makes The air-flow that generates of fan group can intensively guide radiator, the phenomenon that avoiding bypass of gas flow, so that the gas that fan generates Stream can as often as possible be used for the heat dissipation of radiator, improve the heat-sinking capability of single plate cooling device, effectively improve processing The radiating efficiency of device.
The embodiment of the invention also provides a kind of internet device, which may include: cabinet, veneer and list Plate heat dissipating device.Wherein, veneer and single plate cooling device are arranged in cabinet, which can be Fig. 1-1 or Fig. 3 Shown in single plate cooling device 10.
Optionally, the first fan group of at least one of single plate cooling device can be fixed at the case of internet device In vivo.
Illustratively, which may include server.
In conclusion internet device provided in an embodiment of the present invention, fills since the veneer in internet device radiates Individual guiding subassembly is installed, so that foring between fan group and processor independent between the fan group set and radiator Heat dissipation channel, the air-flow intensively guide radiator for then enabling fan group to generate, make the phenomenon that avoiding bypass of gas flow The heat dissipation that the air-flow that fan generates can as often as possible be used for radiator is obtained, the heat-sinking capability of single plate cooling device is improved, has Improve to effect the radiating efficiency of processor.
Those of ordinary skill in the art will appreciate that realizing that all or part of the steps of above-described embodiment can pass through hardware It completes, relevant hardware can also be instructed to complete by program, the program can store in a kind of computer-readable In storage medium, storage medium mentioned above can be read-only memory, disk or CD etc..
The foregoing is merely the preferred embodiments of the application, not to limit the application, it is all in spirit herein and Within principle, any modification, equivalent replacement, improvement and so on be should be included within the scope of protection of this application.

Claims (12)

1. a kind of single plate cooling device, which is characterized in that described device includes:
Two radiators, at least two first fan groups and at least two groups guiding subassembly, guiding subassembly described in every group include: two Static pressure chamber, first diversion pipe and second diversion pipe, each static pressure is intracavitary to be equipped with cavity, and is arranged on each static pressure chamber There are the first deflector hole and the second deflector hole being connected to cavity;
In the guiding subassembly described in every group, the both ends of first diversion pipe the first deflector hole with described two static pressure chambers respectively Connection;
One end of each second diversion pipe is connect with the second deflector hole of the first static pressure chamber in one group of guiding subassembly, another End is connect with the second deflector hole of the second static pressure chamber in another group of guiding subassembly;
Each radiator is connect with a processor on veneer, and described two static pressure chambers include: the first static pressure chamber and Two static pressure chambers, the cavity of the first static pressure chamber coat a radiator, and the cavity of the second static pressure chamber coats one The air outlet of first fan group.
2. the apparatus according to claim 1, which is characterized in that be provided with multiple groups memory on the veneer, described device is also Include:
At least one second fan group, at least one set of memory of air outlet direction of each second fan group.
3. the apparatus according to claim 1, which is characterized in that the first static pressure chamber is fixedly connected with the radiator, The second static pressure chamber is fixedly connected with the air outlet of first fan group.
4. device according to claim 3, which is characterized in that the first static pressure chamber and the radiator use the company of withholding Connect, be bolted, snap connection with gluing connection in any one connection type be fixedly connected;
The air outlet of the second static pressure chamber and first fan group is connect, be bolted, snapped connection and glue using withholding Any one connection type in being connected is fixedly connected.
5. single plate cooling device according to claim 1, which is characterized in that first diversion pipe and second water conservancy diversion Pipe by can deformation material be made.
6. single plate cooling device according to claim 5, which is characterized in that it is described can deformation material be plastics or rubber.
7. single plate cooling device according to claim 2, which is characterized in that first fan group and second fan Group is arranged in the same side of the veneer.
8. single plate cooling device according to claim 1, which is characterized in that
The processor is central processor CPU.
9. a kind of assembly method of single plate cooling device, which is characterized in that the described method includes:
Obtaining two radiators, at least two first fan groups and at least two groups guiding subassembly, guiding subassembly described in every group includes: Two static pressure chambers, first diversion pipe and second diversion pipe, each static pressure is intracavitary to be equipped with cavity, and on each static pressure chamber It is provided with the first deflector hole and the second deflector hole being connected to cavity, described two static pressure chambers include: the first static pressure chamber and second Static pressure chamber;
The assembly of guiding subassembly described in carrying out every group;
One end of each second diversion pipe is connect with the second deflector hole of the first static pressure chamber in one group of guiding subassembly, separately One end is connect with the second deflector hole of the second static pressure chamber in another group of guiding subassembly;
Wherein, the assembling process of guiding subassembly described in every group includes:
The first static pressure chamber is coated on the radiator;
The second static pressure chamber is coated on the air outlet of first fan group;
By the processor connection on each radiator and veneer for being coated with the first static pressure chamber;
First fan group for being coated with the second static pressure chamber is arranged in veneer side;
The both ends of first diversion pipe are connect with the first deflector hole of described two static pressure chambers respectively.
10. according to the method described in claim 9, it is characterized in that, multiple groups memory is provided on the veneer, in the progress After the assembly of guiding subassembly described in every group, the method also includes:
At least one second fan group is set in the side of the veneer, the air port of each second fan group is towards the list At least one set of memory on plate.
11. a kind of internet device characterized by comprising
Cabinet, veneer and single plate cooling device,
The veneer and the single plate cooling device are arranged in the cabinet, and the single plate cooling device is claim 1 to 8 Any single plate cooling device.
12. equipment according to claim 11, which is characterized in that at least one first fan group is fixed at the case In vivo.
CN201611270217.XA 2016-12-30 2016-12-30 Single plate cooling device and its assembly method, internet device Active CN106659087B (en)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2453646Y (en) * 2000-11-15 2001-10-10 唐徵 Guiding tube type air cooling radiator
US6400567B1 (en) * 2000-10-19 2002-06-04 Fujitsu Network Communications, Inc. Equipment enclosure having separate compartments cooled by separate cooling airflows
CN2672342Y (en) * 2003-08-22 2005-01-19 鸿富锦精密工业(深圳)有限公司 Wind guide tube and radiator using siad wind guide tube
JP2005302698A (en) * 2004-03-17 2005-10-27 Nissan Motor Co Ltd Battery pack and vehicle mounted with same
US7447023B2 (en) * 2006-12-08 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
CN202091129U (en) * 2011-05-14 2011-12-28 天通浙江精电科技有限公司 Internal air-cooling apparatus of a wind generating set
CN202103536U (en) * 2011-05-31 2012-01-04 天通浙江精电科技有限公司 Double-core body air cooling apparatus used for wind generator heat radiation
CN103037665A (en) * 2011-09-29 2013-04-10 华为技术有限公司 Electronic device cooling system with auxiliary cooling device
CN203691844U (en) * 2013-12-27 2014-07-02 联想(北京)有限公司 Electronic device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3131856B2 (en) * 1992-11-19 2001-02-05 日本電気エンジニアリング株式会社 Transmitter cooling system
CN102102893A (en) * 2009-12-17 2011-06-22 厦门海库电子有限公司 Semiconductor-refrigerated small-scale air-conditioner

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6400567B1 (en) * 2000-10-19 2002-06-04 Fujitsu Network Communications, Inc. Equipment enclosure having separate compartments cooled by separate cooling airflows
CN2453646Y (en) * 2000-11-15 2001-10-10 唐徵 Guiding tube type air cooling radiator
CN2672342Y (en) * 2003-08-22 2005-01-19 鸿富锦精密工业(深圳)有限公司 Wind guide tube and radiator using siad wind guide tube
JP2005302698A (en) * 2004-03-17 2005-10-27 Nissan Motor Co Ltd Battery pack and vehicle mounted with same
US7447023B2 (en) * 2006-12-08 2008-11-04 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device for computer add-on cards
CN202091129U (en) * 2011-05-14 2011-12-28 天通浙江精电科技有限公司 Internal air-cooling apparatus of a wind generating set
CN202103536U (en) * 2011-05-31 2012-01-04 天通浙江精电科技有限公司 Double-core body air cooling apparatus used for wind generator heat radiation
CN103037665A (en) * 2011-09-29 2013-04-10 华为技术有限公司 Electronic device cooling system with auxiliary cooling device
CN203691844U (en) * 2013-12-27 2014-07-02 联想(北京)有限公司 Electronic device

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