CN104898814A - Ventilation device for ventilation source cluster and server - Google Patents
Ventilation device for ventilation source cluster and server Download PDFInfo
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- CN104898814A CN104898814A CN201510370206.8A CN201510370206A CN104898814A CN 104898814 A CN104898814 A CN 104898814A CN 201510370206 A CN201510370206 A CN 201510370206A CN 104898814 A CN104898814 A CN 104898814A
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- guide duct
- source
- heat release
- ventilation
- air
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Abstract
The invention discloses a ventilation device for a ventilation source cluster and a server. The device comprises air guiding tubes and fans. The air guiding tubes comprise ventilation source arrangement areas and ventilation areas, the section of the ventilation source arrangement areas is larger than that of the ventilation areas, and the ventilation source arrangement area of each air guiding tube is adjacent to the ventilation area of the adjacent air guiding tube; the fans are arranged on the air feeding sides and/or air exhausting sides of the air guiding tubes and are used for providing air flow for the air guiding tubes. Multiple ventilation sources can be arranged in small space, and the cooling flows of the ventilation sources are not influenced mutually.
Description
Technical field
The application relates to technical field of integrated circuits, is specifically related to cooling integrated technical field, particularly relates to the heat abstractor for source of heat release cluster and server.
Background technology
In prior art, for high power dissipation density graphic process unit GPU (Graphics Processing Unit) group system, usually should arrange with the following methods in server system: GPU in the horizontal direction placed side by side or GPU places front and back in the horizontal direction.
But, horizontal direction GPU placed side by side will make the applicable GPU limited amount of system, and place before and after horizontal direction two groups of GPU, when dispelling the heat, cooling draught organizes GPU and rear group of GPU before successively flowing through, therefore the temperature flowing through the cooling draught of rear group of GPU is higher, makes the heat dispersion of rear group of GPU poor.
Summary of the invention
In view of above-mentioned defect of the prior art or deficiency, expect to provide a kind of and settle many group source of heat releases and the scheme that is independent of each other of the cooling draught of each group source of heat release.In order to realize above-mentioned one or more object, this application provides the heat abstractor for source of heat release cluster and server.
First aspect, this application provides a kind of heat abstractor for source of heat release cluster, comprising:
Guide duct, is provided with source of heat release setting area and plenum area, and the cross section of described source of heat release setting area is greater than the cross section of described plenum area, and the source of heat release setting area of each guide duct is adjacent with the plenum area of adjacent guide duct;
Fan, is located at inlet air side and/or the air side of described guide duct, for providing air-flow for described guide duct.
Second aspect, this application provides a kind of server, comprises more than one heat abstractor for source of heat release cluster, and described device comprises:
Guide duct, is provided with source of heat release setting area and plenum area, and the cross section of described source of heat release setting area is greater than the cross section of described plenum area, and the source of heat release setting area of each guide duct is adjacent with the plenum area of adjacent guide duct;
Fan, is located at inlet air side and/or the air side of described guide duct, for providing air-flow for described guide duct.
The heat abstractor for source of heat release cluster that the application provides and server, adjacent by the plenum area arranging source of heat release setting area in guide duct and adjacent guide duct, the cross section arranging again source of heat release setting area is greater than the cross section of plenum area, thus can arrange in less space and organize source of heat release more, again due to the blocking effect of guide duct, the cooling draught of the source of heat release in adjacent guide duct is not interfere with each other, thus achieve and to arrange in less space and organize source of heat release more, and respectively the cooling draught organized between source of heat release is independent of each other.
Accompanying drawing explanation
By reading the detailed description to non-limiting example done with reference to the following drawings, the other features, objects and advantages of the application will become more obvious:
Fig. 1 shows the exemplary block diagram of the heat abstractor for source of heat release cluster according to the application's embodiment;
Fig. 2 shows and removes the exemplary block diagram behind the part pipe face at guide duct top according to the heat abstractor for source of heat release cluster of another embodiment of the application;
Fig. 3 shows the exemplary block diagram of the heat abstractor for source of heat release cluster of another embodiment according to the application;
Fig. 4 shows the exemplary block diagram of the heat abstractor for source of heat release cluster of another embodiment according to the application.
Embodiment
Below in conjunction with drawings and Examples, the application is described in further detail.Be understandable that, specific embodiment described herein is only for explaining related invention, but not the restriction to this invention.It also should be noted that, for convenience of description, in accompanying drawing, illustrate only the part relevant to Invention.
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the application in detail in conjunction with the embodiments.
Fig. 1 shows the exemplary block diagram of the heat abstractor for source of heat release cluster according to the application's embodiment.
As shown in Figure 1, the heat abstractor 100 for source of heat release cluster comprises: guide duct 110 and fan 120.Wherein, guide duct 110, be provided with source of heat release setting area 111 and plenum area 112, the cross section of source of heat release setting area 111 is greater than the cross section of plenum area 112, and the source of heat release setting area 111 of each guide duct is adjacent with the plenum area 112 of adjacent guide duct.Fan 120, is located at inlet air side and/or the air side of guide duct 110, for providing air-flow (as indicated by a dashed arrow in the figure) for guide duct.
In this application, heat abstractor 100 may be used in the electronic equipment needing to be provided with multiple source of heat release, such as computer housing, server and cloud computer etc.
Guide duct 110 is typically provided with dismountable wind deflector, so that source of heat release 113 is installed on source of heat release setting area 111.Wind deflector can be present in electronic equipment with forms such as the cabinet shell of circuit board, back up pad, electronic equipment, shutters.
Guide duct 110 can be formed by the U-shaped structures to form of a wind deflector with one, also can be spliced by multiple wind deflector.Exemplary, guide duct can be spliced by circuit board and shutter, and source of heat release is arranged on circuit board.Or guide duct is made up of the circuit board in the relative sidewall of the shutter in rack, cabinet shell two and horizontal insertion sidewall.
The material of guide duct 110 all parts can be heat-barrier material, and the radiating airflow reduced between two guide ducts interferes with each other further; Also can be non-insulated material, thus reduce the cost of wind deflector.
The fan of one or more acceleration air-flow velocity can also be provided with in guide duct 110, such as, the fan accelerating air-flow velocity be set at the guide duct that the length of some plenum areas is longer, to strengthen the heat radiation to source of heat release.
The setting direction of guide duct 110 can be following either direction: fore-and-aft direction, above-below direction and left and right directions.
Source of heat release setting area 111 in guide duct 110, is generally one, can arrange one group of source of heat release 113.Source of heat release 113 can be the radiating element that in work, power is higher, such as central processor CPU, microprocessor MPU, graphic process unit GPU, on-site programmable gate array FPGA, microprocessor ARM etc.
Plenum area 112 in guide duct 110, according to the position of source of heat release in guide duct, can be 1 to 2 usually, for providing the air-flow after cooling draught and/or discharge heat radiation for source of heat release setting area.
The air quantity of fan 120 needed for the quantity of guide duct and guide duct is arranged.A powerful fan can be set for multiple guide duct, also a fan can be set respectively for each guide duct.The setting position of fan, can be positioned at the entrance side of guide duct, also can be positioned at the outlet side of guide duct, or is positioned at entrance side and the outlet side of guide duct simultaneously.In an optional implementation of the present embodiment, in order to better form air-flow, between fan and source of heat release setting area, be provided with air-flow buffer district.
The heat abstractor for source of heat release cluster of the above embodiments of the present application, makes the source of heat release setting area of two guide ducts all shift to install in short transverse and horizontal direction, and fair water fin is by each group source of heat release isolation, and the cooling duct of two groups of source of heat releases is independent separately.
Fig. 2 shows and removes the exemplary block diagram behind the part pipe face at guide duct top according to the heat abstractor for source of heat release cluster of another embodiment of the application.
As shown in Figure 2, heat abstractor comprises two guide ducts 110 setting up and down, the front side of guide duct 110 is located in the plenum area 112 of the guide duct 110 on upper strata, the rear side of guide duct 110 is located in source of heat release setting area 111, the front side of guide duct is located in the source of heat release setting area 111 of lower floor's guide duct, the rear side of guide duct 110 is located in plenum area 112, and the air side of two guide ducts 110 is provided with fan 120.By the said structure of the embodiment of the present application, achieve each the group source of heat release isolation in heat abstractor, the cooling duct of the two groups of source of heat releases made is independent separately.
Heat abstractor in the present embodiment, on the basis of embodiment shown in Figure 1, embodies a kind of three-dimensional structure diagram of heat abstractor.About the description of guide duct 110 in Fig. 1, be equally applicable to the guide duct 110 in the present embodiment, do not repeat them here.
Fig. 3 shows the exemplary block diagram of the heat abstractor for source of heat release cluster of another embodiment according to the application.
As shown in Figure 3, heat abstractor comprises three guide ducts 110, the source of heat release setting area 111 of each guide duct 110 all shifts to install in short transverse and horizontal direction, the plenum area 112 of each guide duct 110 also shifts to install in short transverse and horizontal direction, be positioned at middle guide duct and comprise a source of heat release setting area 111 and two plenum areas 112, fan 120 is provided with in the air side of guide duct, for providing air-flow (as indicated by a dashed arrow in the figure) for guide duct, fair water fin is by each group source of heat release isolation, make the cooling duct of three groups of source of heat releases independent separately.
Heat abstractor in the present embodiment, compared with the embodiment of the heat abstractor shown in Fig. 1, adds the quantity of guide duct 110, embodies the another kind of structure of heat abstractor.About the description of guide duct 110 in Fig. 1, be equally applicable to the guide duct 110 in the present embodiment, do not repeat them here.
Fig. 4 shows the exemplary block diagram of the heat abstractor for source of heat release cluster of another embodiment according to the application.
As shown in Figure 4, heat abstractor comprises three guide ducts 110, the source of heat release setting area 111 of each guide duct 110 all shifts to install in short transverse and horizontal direction, the plenum area 112 of each guide duct 110 also shifts to install in short transverse and horizontal direction, fan 120 is provided with in the air side of each guide duct, for providing air-flow (as indicated by a dashed arrow in the figure) for guide duct, the fan 114 accelerating air-flow velocity is provided with in the plenum area of each guide duct, fair water fin is by each group source of heat release isolation, make the cooling duct of three groups of source of heat releases independent separately.
Heat abstractor in the present embodiment, compared with the embodiment of the heat abstractor shown in Fig. 1, adds the quantity of guide duct 110, and the set-up mode of source of heat release setting area is different, embodies the another kind of structure of heat abstractor.For the description about guide duct 110 in single guide duct 110, Fig. 1, be equally applicable to the guide duct 110 in the present embodiment, do not repeat them here.
In the electronic equipment that space is usually limited, effective heat dispersion is made to stand compared with challenge with radiator structure of the prior art, by the heat abstractor for source of heat release cluster in the above embodiments of the present application, can arrange in limited space simultaneously organize source of heat release more, and for each source of heat release group, air channel is set respectively, thus improve the heat dispersion of source of heat release group.
More than describe and be only the preferred embodiment of the application and the explanation to institute's application technology principle.Those skilled in the art are to be understood that, invention scope involved in the application, be not limited to the technical scheme of the particular combination of above-mentioned technical characteristic, also should be encompassed in when not departing from described inventive concept, other technical scheme of being carried out combination in any by above-mentioned technical characteristic or its equivalent feature and being formed simultaneously.The technical characteristic that such as, disclosed in above-mentioned feature and the application (but being not limited to) has similar functions is replaced mutually and the technical scheme formed.
Claims (10)
1. for a heat abstractor for source of heat release cluster, it is characterized in that, comprising:
Guide duct, is provided with source of heat release setting area and plenum area, and the cross section of described source of heat release setting area is greater than the cross section of described plenum area, and the source of heat release setting area of each guide duct is adjacent with the plenum area of adjacent guide duct;
Fan, is located at inlet air side and/or the air side of described guide duct, for providing air-flow for described guide duct.
2. device according to claim 1, is characterized in that, described guide duct is made up of with the fair water fin be located in described sidewall two relative sidewalls in rack.
3. device according to claim 1, is characterized in that, is provided with the fan that at least one accelerates air-flow velocity in described guide duct.
4., according to the arbitrary described device of claim 1-3, it is characterized in that, between described fan and described source of heat release setting area, be provided with air-flow buffer district.
5. device according to claim 1, is characterized in that, described guide duct is multiple;
Multiple described guide duct is arranged along following either direction: fore-and-aft direction, above-below direction and left and right directions.
6. a server, comprise more than one and it is characterized in that for the heat abstractor of source of heat release cluster, described device comprises:
Guide duct, is provided with source of heat release setting area and plenum area, and the cross section of described source of heat release setting area is greater than the cross section of described plenum area, and the source of heat release setting area of each guide duct is adjacent with the plenum area of adjacent guide duct;
Fan, is located at inlet air side and/or the air side of described guide duct, for providing air-flow for described guide duct.
7. server according to claim 6, is characterized in that, described guide duct is made up of with the fair water fin be located in described sidewall two relative sidewalls in the rack of server.
8. server according to claim 6, is characterized in that, is provided with the fan that at least one accelerates air-flow velocity in described guide duct.
9., according to the arbitrary described server of claim 6-8, it is characterized in that, between described fan and described source of heat release setting area, be provided with air-flow buffer district.
10. server according to claim 1, is characterized in that, described guide duct is multiple;
Multiple described guide duct is arranged along following either direction: fore-and-aft direction, above-below direction and left and right directions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510370206.8A CN104898814A (en) | 2015-06-29 | 2015-06-29 | Ventilation device for ventilation source cluster and server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510370206.8A CN104898814A (en) | 2015-06-29 | 2015-06-29 | Ventilation device for ventilation source cluster and server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104898814A true CN104898814A (en) | 2015-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510370206.8A Pending CN104898814A (en) | 2015-06-29 | 2015-06-29 | Ventilation device for ventilation source cluster and server |
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| CN (1) | CN104898814A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106339054A (en) * | 2016-08-29 | 2017-01-18 | 浪潮电子信息产业股份有限公司 | Heat dissipation system and heat dissipation method |
| CN109189189A (en) * | 2018-10-10 | 2019-01-11 | 郑州云海信息技术有限公司 | A kind of cooling system for server |
| CN109270994A (en) * | 2018-09-27 | 2019-01-25 | 浪潮电子信息产业股份有限公司 | Mainboard device and server |
| CN109407797A (en) * | 2018-10-16 | 2019-03-01 | 郑州云海信息技术有限公司 | A kind of server heat-radiation framework |
| CN109656339A (en) * | 2018-11-30 | 2019-04-19 | 曙光信息产业股份有限公司 | Server air guiding cover |
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| US6442024B1 (en) * | 2000-12-11 | 2002-08-27 | Shoei-Yuan Shih | Fan flow guide |
| CN201440775U (en) * | 2009-07-16 | 2010-04-21 | 加弘科技咨询(上海)有限公司 | Heat emission air guiding structure for electronic equipment |
| CN203012619U (en) * | 2013-01-07 | 2013-06-19 | 浪潮电子信息产业股份有限公司 | 1U wind scooper with isolation duct |
| CN103793030A (en) * | 2012-10-30 | 2014-05-14 | 英业达科技有限公司 | Electronic device |
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| US6442024B1 (en) * | 2000-12-11 | 2002-08-27 | Shoei-Yuan Shih | Fan flow guide |
| CN201440775U (en) * | 2009-07-16 | 2010-04-21 | 加弘科技咨询(上海)有限公司 | Heat emission air guiding structure for electronic equipment |
| CN103793030A (en) * | 2012-10-30 | 2014-05-14 | 英业达科技有限公司 | Electronic device |
| CN203012619U (en) * | 2013-01-07 | 2013-06-19 | 浪潮电子信息产业股份有限公司 | 1U wind scooper with isolation duct |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106339054A (en) * | 2016-08-29 | 2017-01-18 | 浪潮电子信息产业股份有限公司 | Heat dissipation system and heat dissipation method |
| WO2018040363A1 (en) * | 2016-08-29 | 2018-03-08 | 浪潮电子信息产业股份有限公司 | Heat dissipation system and heat dissipation method |
| US10416733B2 (en) | 2016-08-29 | 2019-09-17 | Inspur Electronic Information Industry Co., Ltd | Heat dissipation system and heat dissipation method |
| CN109270994A (en) * | 2018-09-27 | 2019-01-25 | 浪潮电子信息产业股份有限公司 | Mainboard device and server |
| CN109189189A (en) * | 2018-10-10 | 2019-01-11 | 郑州云海信息技术有限公司 | A kind of cooling system for server |
| CN109407797A (en) * | 2018-10-16 | 2019-03-01 | 郑州云海信息技术有限公司 | A kind of server heat-radiation framework |
| CN109656339A (en) * | 2018-11-30 | 2019-04-19 | 曙光信息产业股份有限公司 | Server air guiding cover |
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Application publication date: 20150909 |
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