CN103687449B - Electronic equipment and data center - Google Patents
Electronic equipment and data center Download PDFInfo
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- CN103687449B CN103687449B CN201310674262.1A CN201310674262A CN103687449B CN 103687449 B CN103687449 B CN 103687449B CN 201310674262 A CN201310674262 A CN 201310674262A CN 103687449 B CN103687449 B CN 103687449B
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Abstract
The invention discloses electronic equipment and data center, the electronic equipment includes rack and the first backboard, at least two first veneers and the first heat abstractor that are placed in rack, wherein：Rack includes the back of two side walls being oppositely arranged and the described two side walls of connection；First backboard is substantially vertical with back, and substantially parallel with side wall；At least two first veneers are plugged on the first surface of the first backboard, and have space between adjacent two the first veneers；And first heat abstractor air inlet or air outlet towards the space between two adjacent the first veneers.So, because the first heat abstractor can be dried along the air channel parallel with the plate plane of the first backboard to the first veneer, duct resistance will not be substantially produced at backboard, electronic equipment according to embodiments of the present invention and data center can effectively improve heat-sinking capability of the electronic equipment under forced air cooling mode.
Description
Technical field
The present invention relates to electronic technology field, more particularly to a kind of electronic equipment to be radiated using forced air cooling mode
And data center.
Background technology
In ICT（Information Communication Technology, ICT）Under convergence, electricity
Bandwidth, the speed of sub- equipment are constantly lifted, and the heat density of electronic equipment is also constantly being lifted.This causes, using to bay structure
Electronic equipment preferably has straight-through air channel, to realize forced air cooling.Wherein, it is so-called that bay structure is referred to, the list in electronic equipment
Plate is plugged on backboard.
Generally, in order to realize forced air cooling, as shown in Figure 1 a, 1 b, in the housing 1040 of electronic equipment：With horizontal plane
Parallel multiple veneers 1010 stack along with respect to the horizontal plane vertical direction；Backboard 1020 with horizontal plane is positioned at described
The rear of multiple veneers 1010；Fan 1030 is placed in the front portion of veneer 1010 or is placed in the rear portion of backboard 1020, and as schemed
Shown in 1c, the air channel air vent 1050 that is provided with backboard 1020, so as to form the straight-through air channel directly dried to veneer.
However, as level of integrated system is constantly lifted, circuit is more and more on backboard 1020, and this certainly will limit backboard
1020 percent opening.Percent opening is limited will to cause the duct resistance at backboard 1020 to increase, so as to reduce whole electronic equipment
Heat dispersion.
The content of the invention
In view of this, the technical problem to be solved in the present invention is how to improve electronic equipment in forced air cooling mode as far as possible
Under heat-sinking capability.
In order to solve the above-mentioned technical problem, according to the first aspect of the invention, there is provided a kind of electronic equipment, including rack
（140、240、340）, the first backboard（120、220、320、421）, at least two first veneers（110、210、311、411）And
First heat abstractor（130、230、331、431）, wherein：First backboard（120、220、320、421）, described at least two
First veneer（110、210、311、411）With first heat abstractor（130、230、331、431）It may be contained within the rack
It is interior；The rack includes two side walls being oppositely arranged（141、142、241、242、341、342、441、442）And connection institute
State the back of two side walls（143、243、343、443）；First backboard（120、220、320、421）Substantially with the back
（143、243、343、443）Vertically, and substantially with the side wall（141、142、241、242、341、342、441、442）It is flat
OK；At least two first veneer（110、210、311、411）It is plugged on first backboard（120、220、320、421）'s
On first surface, and adjacent two first veneers（110、210、311、411）Between there is space；And described
One heat abstractor（130、230、331、431）Air inlet or air outlet towards two adjacent first veneers（110、
210、311、411）Between space.
For above-mentioned electronic equipment, in a kind of possible implementation, first heat abstractor（130、230、331、
431）Air inlet air intake direction or air outlet air-out direction substantially with the back（143、243、343、443）Vertically.
For above-mentioned electronic equipment, in a kind of possible implementation, first heat abstractor（130、230、331、
431）Air inlet air intake direction or air outlet air-out direction substantially with the side wall（141、142、241、242、341、
342、441、442）It is parallel.
For above-mentioned electronic equipment, in a kind of possible implementation, first heat abstractor（130、230、331、
431）Including multiple fans.
For above-mentioned electronic equipment, in a kind of possible implementation, first heat abstractor（130、230、331、
431）Compared to first veneer（110、210、311、411）Closer to or further from the back（143、243、343、
443）.For example, first heat abstractor（130、230、331、431）It may be disposed at first veneer（110、210、311、
411）With the back（143、243、343、443）Between.Or first heat abstractor（130、230、331、431）Can
It is arranged at the back（143、243、343、443）On.
For above-mentioned electronic equipment, in a kind of possible implementation, in addition to the second heat abstractor（332）At least
Two the second veneers（312）, wherein：At least two second veneer（312）It is plugged in first backboard（320）With institute
State on the relative second surface of first surface, and adjacent two second veneers（312）Between there is space；Described
Two heat abstractors（332）Air outlet or air inlet towards two adjacent second veneers（312）Between space.
For above-mentioned electronic equipment, in a kind of possible implementation, second heat abstractor（332）Air inlet
Air intake direction or air outlet air-out direction substantially with the back（343）Vertically.
For above-mentioned electronic equipment, in a kind of possible implementation, second heat abstractor（332）Air inlet
Air intake direction or air outlet air-out direction substantially with the side wall（341、342）It is parallel.
For above-mentioned electronic equipment, in a kind of possible implementation, second heat abstractor（332）Including multiple
Fan.
For above-mentioned electronic equipment, in a kind of possible implementation, second heat abstractor（332）Compared to described
Second veneer（312）Closer to or further from the back（343）.For example, second heat abstractor（332）It is arranged at institute
State the second veneer（312）With the back（343）Between.Or second heat abstractor（332）It is arranged at the back
（343）On.
For above-mentioned electronic equipment, in a kind of possible implementation, in addition to dividing plate（451）, the second backboard
（422）, at least two the 3rd veneers（412）With the 3rd heat abstractor（432）, wherein：Second backboard（422）Substantially with institute
State back（443）Vertically, and substantially with the side wall（441、442）It is parallel；The dividing plate（451）It is fixed on first back of the body
Plate（421）With second backboard（422）Between, and with the back（443）And the side wall（441、442）Substantially
Vertically；At least two the 3rd veneer（412）It is plugged on second backboard（422）First surface on, it is and adjacent
Two the 3rd veneers（412）Between there is space；And the 3rd heat abstractor（432）Air inlet or air outlet court
To two adjacent the 3rd veneers（412）Between space.
For above-mentioned electronic equipment, in a kind of possible implementation, the 3rd heat abstractor（432）Air inlet
Air intake direction or air outlet air-out direction substantially with the back（443）Vertically.
For above-mentioned electronic equipment, in a kind of possible implementation, the 3rd heat abstractor（432）Air inlet
Air intake direction or air outlet air-out direction substantially with the side wall（441、442）It is parallel.
For above-mentioned electronic equipment, in a kind of possible implementation, the 3rd heat abstractor（432）Including multiple
Fan.
For above-mentioned electronic equipment, in a kind of possible implementation, the 3rd heat abstractor（432）Compared to described
3rd veneer（412）Closer to or further from the back（443）.For example, the 3rd heat abstractor（432）It may be disposed at
3rd veneer（412）With the back（443）Between.Or the 3rd heat abstractor（432）It may be disposed at the back of the body
Portion（443）On.
For above-mentioned electronic equipment, in a kind of possible implementation, the dividing plate（451、452）It is and the back
（443）And the side wall（441、442）It is integrally formed.
For above-mentioned electronic equipment, in a kind of possible implementation, the fan is air ejector fan or exhausting wind
Fan.
In order to solve the above-mentioned technical problem, according to the second aspect of the invention, there is provided a kind of data center, it include be in
At least two electronic equipments as described above that determinant is put, and had between electronic equipment described in two adjacent rows
Road.
In electronic equipment according to embodiments of the present invention and data center, due to backboard and formed in veneer and heat abstractor
Between straight-through air channel it is parallel, duct resistance will not be substantially produced at backboard, is existed so as to effectively improve electronic equipment
Heat-sinking capability under forced air cooling mode.
According to below with reference to the accompanying drawings becoming to detailed description of illustrative embodiments, further feature of the invention and aspect
It is clear.
Brief description of the drawings
Comprising in the description and the accompanying drawing of a part for constitution instruction and specification together illustrate the present invention's
Exemplary embodiment, feature and aspect, and for explaining the principle of the present invention.
Fig. 1 a show the schematic diagram before the assembling of the electronic equipment of prior art；
Fig. 1 b show the schematic perspective view of the electronic equipment of prior art；
Fig. 1 c show the schematic diagram of the electronic equipment dorsulum of prior art；
Fig. 2 a show the schematic diagram before according to embodiments of the present invention 1 electronic equipment assembling；
Fig. 2 b show the schematic perspective view of according to embodiments of the present invention 1 electronic equipment；
Fig. 2 c show the top view of according to embodiments of the present invention 1 electronic equipment；
Fig. 2 d show the front view of according to embodiments of the present invention 1 electronic equipment；
Fig. 3 a show the schematic diagram before according to embodiments of the present invention 2 electronic equipment assembling；
Fig. 3 b show the schematic perspective view of according to embodiments of the present invention 2 electronic equipment；
Fig. 3 c show the top view of according to embodiments of the present invention 2 electronic equipment；
Fig. 3 d show the front view of according to embodiments of the present invention 2 electronic equipment；
Fig. 4 a show the schematic diagram before according to embodiments of the present invention 3 electronic equipment assembling；
Fig. 4 b show the schematic perspective view of according to embodiments of the present invention 3 electronic equipment；
Fig. 4 c show the top view of according to embodiments of the present invention 3 electronic equipment；
Fig. 4 d show the front view of according to embodiments of the present invention 3 electronic equipment；
Fig. 5 a show the schematic perspective view of according to embodiments of the present invention 4 electronic equipment；
Fig. 5 b show the front view of according to embodiments of the present invention 4 electronic equipment；
Fig. 5 c show the top view of according to embodiments of the present invention 4 electronic equipment.
Embodiment
Describe various exemplary embodiments, feature and the aspect of the present invention in detail below with reference to accompanying drawing.It is identical in accompanying drawing
Reference represent the same or analogous element of function.Although the various aspects of embodiment are shown in the drawings, remove
Non-specifically point out, it is not necessary to accompanying drawing drawn to scale.
Special word " exemplary " is meant " being used as example, embodiment or illustrative " herein.Here as " exemplary "
Illustrated any embodiment should not necessarily be construed as preferred or advantageous over other embodiments.
In addition, in order to better illustrate the present invention, numerous details is given in embodiment below.
It will be appreciated by those skilled in the art that without these details, the present invention can equally be implemented.In other example,
It is not described in detail for known method, means, element and circuit, in order to highlight the purport of the present invention.
As described in background technology and Summary, the grafting framework that is plugged into for veneer on backboard, by carrying on the back
At plate perforate come formed for veneer carry out forced air cooling straight-through air channel, because the duct resistance at backboard is big, turn into
The main bottleneck of high efficiency and heat radiation.In view of this, the present inventor originally proposes, is formed and carried on the back between veneer and heat abstractor
The parallel straight-through air channel of plate plane, not produce duct resistance substantially at backboard, so as to effectively improve electronic equipment
Heat-sinking capability under forced air cooling mode.
For example, according to a kind of electronic equipment of one embodiment of the invention, including rack and it is arranged in the rack
Backboard, at least two first veneers and the first heat abstractor, wherein：The rack include two side walls being oppositely arranged with
And the back of the described two side walls of connection；The backboard is vertical with the back, and parallel with the side wall；Described at least two
Individual first veneer is plugged on the first surface of the backboard, and has space between adjacent two first veneers；
And the air inlet or air outlet of first heat abstractor are towards the space between two adjacent first veneers.
Left side, right side and the pars intermedia of rack will be located in a manner of the backboard is with respect to the horizontal plane vertical respectively below
As an example, the specific implementation for describing the foregoing invention design of the present invention in detail is as follows.
Fig. 2 a show the schematic diagram before according to embodiments of the present invention 1 electronic equipment assembling.Fig. 2 b are shown according to the present invention
The schematic perspective view of the electronic equipment of embodiment 1.Fig. 2 c show the top view of according to embodiments of the present invention 1 electronic equipment.Figure
2d shows the front view of according to embodiments of the present invention 1 electronic equipment.
As shown in Fig. 2 a~Fig. 2 d, the electronic equipment 100 mainly includes rack 140, the first backboard 120, at least two the
One veneer 110 and the first heat abstractor 130.
Wherein, as illustrated in figures 2 c and 2d, rack 140 is included described in two side walls 141,142 being oppositely arranged and connection
The back 143 of two side walls 141,142.In a kind of possible implementation, rack 140 can be frame framework or frame cabinet one
Body formula framework.
As shown in Fig. 2 a~Fig. 2 d, the first backboard 120 is located at rack 140 in a manner of plate plane is with respect to the horizontal plane vertical
Right side.Also, as shown in the arrow in Fig. 2 a, the first backboard 120 can be arranged in rack 140 by movement backward.
Wherein, left-hand side during by user plane to the front of rack 140 is referred to as left side, right side during by user plane to the front of rack 140
Hand side is referred to as right side.
As shown in Fig. 2 a~Fig. 2 d, the first veneer 110 is plugged on first in a manner of plate plane is with respect to the horizontal plane parallel
On the first surface of backboard 120, such as left-hand face.In a kind of possible implementation, each first veneer 110 can be such as figure
It is stacked in parallel to each other shown in 2a, Fig. 2 b and Fig. 2 d, every two pieces the first adjacent veneers 110 there can be certain interval, to help
In radiating.Wherein, before the first veneer 110 side apart from each other with the back 143 of rack 140 being referred to as into the first veneer 110
Side, the back 143 of the first veneer 110 and rack 140 is referred to as to the rear side of the first veneer 110 at a distance of nearer side.
Also, as shown in the arrow in Fig. 2 a, each first veneer 110 can be connected to by movement backward and to the right
On one backboard 120, i.e. the first veneer 110 can complete the plug to the first backboard 120 by two dimension linear motion in the horizontal plane.
It should be noted that plug of first veneer 110 to the first backboard 120 can be, but not limited to two-dimentional linear motion, and two dimension
It is two mutually orthogonal directions that can be, but not limited to.
As shown in Fig. 2 a~Fig. 2 c, the first heat abstractor 130 is located at the rear side of the first veneer 110.In a kind of possible reality
In existing mode, the first heat abstractor 130 may be disposed on the back 143 of rack 140, for example, being embedded what is be provided with back 143
It is logical aerial.Also, the air inlet or air outlet of the first heat abstractor 130 are towards the sky between two adjacent the first veneers 110
Gap.In other words, the air-out direction of the air intake direction of the air inlet of the first heat abstractor 130 or air outlet substantially hangs down with back 143
Directly, it is and substantially parallel with side wall 141,142, so as to which as shown in Fig. 2 b arrow, the first heat abstractor 130 can be carried on the back along with first
Dried to the first veneer 110 in the air channel that the plate plane of plate 120 is parallel.
In alternatively possible implementation, heat abstractor 130 can be located at the front side of the first veneer 110.In addition, the
One heat abstractor 130 can be fan such as air ejector fan, extractor fan or other can produce the device for forcing blast.
In fact, form is not further is limited for the riding position to heat abstractor 130 and blowing by the present invention, as long as heat abstractor
130 can dry along the air channel parallel with the plate plane of the first backboard 120 to the first veneer 110.
In a kind of possible specific implementation, multiple heat abstractors 130 can be by the specific of matrix as shown in Figure 2 a
Mode is arranged, to form fan wall, so as to further improve the radiating of electronic equipment 100 using the mutual assistance effect of fan wall
Reliability.
So, it is straight due to that can be formed between first the 110 to the first heat abstractor of veneer 130 under forced air cooling mode
Ventilating duct, and the plate plane of the first backboard 120 is parallel with air channel, therefore the first backboard 120 substantially will not be to the direct ventilation
Road produces resistance, so as to effectively improve the heat-sinking capability of electronic equipment 100.Experimental data shows, compared with prior art,
The heat-sinking capability of electronic equipment 100 according to the abovementioned embodiments of the present invention improves more than 30%.
Fig. 3 a show the schematic diagram before according to embodiments of the present invention 2 electronic equipment assembling.Fig. 3 b are shown according to the present invention
The schematic perspective view of the electronic equipment of embodiment 2.Fig. 3 c show the top view of according to embodiments of the present invention 2 electronic equipment.Figure
3d shows the front view of according to embodiments of the present invention 2 electronic equipment.Wherein, in Fig. 3 a~Fig. 3 d with label in Fig. 2 a~Fig. 2 d
Similar component has identical function, and will not be repeated here.
As shown in Fig. 3 a~Fig. 3 d, the main distinction of the electronic equipment 100 shown in electronic equipment 200 and Fig. 2 a~Fig. 2 d exists
In：First backboard 220 is located at the left side of rack 240, and the first veneer 210 is located at the right side of the first backboard 220.
Similar with the electronic equipment 100 shown in Fig. 2 a~Fig. 2 d, the plate plane due to the first backboard 220 is with being formed at first
Straight-through air channel between the heat abstractor 230 of veneer 210 and first is parallel so that the heat-sinking capability of electronic equipment 200 and existing skill
Art is compared and is also greatly improved.
Fig. 4 a show the schematic diagram before according to embodiments of the present invention 3 electronic equipment assembling.Fig. 4 b are shown according to the present invention
The schematic perspective view of the electronic equipment of embodiment 3.Fig. 4 c show the top view of according to embodiments of the present invention 3 electronic equipment.Figure
4d shows the front view of according to embodiments of the present invention 3 electronic equipment.In Fig. 4 a~Fig. 4 d with Fig. 2 a~Fig. 2 d, Fig. 3 a~Fig. 3 d
The similar component of middle label has identical function, and will not be repeated here.
As shown in Fig. 4 a~Fig. 4 d, the master of the electronic equipment shown in electronic equipment 300 and Fig. 2 a~Fig. 2 d, Fig. 3 a~Fig. 3 d
Distinguish and be：The first backboard 320 in electronic equipment 300 is located at the middle part of rack 340, and electronic equipment 300 also includes
Second heat abstractor 332 and at least two second veneers 312.
On the one hand, the first veneer 311 is plugged in the first surface of the first backboard 320, in such as left-hand face, i.e., first is single
Plate 311 is located at the left side of the first backboard 320.There is space between two adjacent the first veneers 311.In a kind of possible realization
In mode, as shown in Fig. 4 a~Fig. 4 c, the first heat abstractor 331 is located at the rear side of the first veneer 311.Also, the first radiating dress
Put 331 air outlet or air inlet towards the space between two adjacent the first veneers 311.In other words, the first heat abstractor
The air intake direction of 331 air inlet or the air-out direction of air outlet are substantially vertical with back 343, and substantially with sidewall 34 1,
342 is parallel, so as to which as shown in Fig. 4 b arrow, the first heat abstractor 331 can be along the wind parallel with the plate plane of the first backboard 320
Dried to the first veneer 311 in road.
On the other hand, the second veneer 312 is plugged in the second surface of the first backboard 320, in such as right lateral surface, i.e., and second
Veneer 312 is located at the right side of the first backboard 320.Wherein, the second surface of the first backboard 320 is first with the first backboard 320
The relative another plate plane in surface.There is space between two adjacent the second veneers 312.In a kind of possible implementation
In, as shown in Fig. 4 a~Fig. 4 c, the second heat abstractor 332 is located at the rear side of the second veneer 312.Also, the second heat abstractor 332
Air outlet or air inlet towards the space between two adjacent the second veneers 312.In other words, second heat abstractor 332
The air intake direction of air inlet or the air-out direction of air outlet are substantially vertical with back 343, and substantially flat with sidewall 34 1,342
OK, so as to as shown in Fig. 4 b arrow, the second heat abstractor 332 can along the air channel parallel with the plate plane of the first backboard 320 to
Second veneer 312 is dried.
So, as shown in Figure 4 b, in electronic equipment 300 realizing that the air channel of forced air cooling includes：Positioned at the first backboard
First air channel in 320 left sides, and positioned at second air channel on the right side of the first backboard 320.Wherein, the first air channel and the second air channel are equal
It is parallel with the plate plane of the first backboard 320.
It should be noted that the first air channel can be with identical with the wind direction in the second air channel, can also be different.First heat abstractor
331 and second heat abstractor 332 can respectively positioned at the phase homonymy or not homonymy of the first veneer 311 and the second veneer 312, as long as
Both dry along the first air channel and the second air channel to the first veneer 311 and the second veneer 312 respectively.In a kind of possible reality
In existing mode, the first heat abstractor 331 and the second heat abstractor 332 can be integral.In a kind of possible specific implementation side
In formula, the first heat abstractor 331 and/or the second heat abstractor 332 can be fan walls.
It is similar with the electronic equipment 100 shown in Fig. 2 a~Fig. 2 d, the electronic equipment 200 shown in Fig. 3 a~Fig. 3 d, due to the back of the body
The plate plane of plate 320 and be formed between the first veneer 311 and the first heat abstractor 331, the second veneer 312 and the second radiating fill
The straight-through air channel put between 332 is parallel so that the heat-sinking capability of electronic equipment 300 also increases substantially compared with prior art
.
Fig. 5 a show the schematic perspective view of according to embodiments of the present invention 4 electronic equipment.Fig. 5 b are shown according to of the invention real
Apply the front view of the electronic equipment of example 4.Fig. 5 c show the top view of according to embodiments of the present invention 4 electronic equipment.Fig. 5 a~figure
The component similar to label in Fig. 2 a~Fig. 2 d, Fig. 3 a~Fig. 3 d, Fig. 4 a~Fig. 4 d has identical function in 5c.
As shown in Fig. 5 a~Fig. 5 c, shown in electronic equipment 400 and Fig. 2 a~Fig. 2 d, Fig. 3 a~Fig. 3 d, Fig. 4 a~Fig. 4 d
The main distinction of electronic equipment is：Electronic equipment 400 also includes dividing plate 451,452, more so as to which whole cabinet is divided into
The individual framework as shown in Fig. 2 a~Fig. 2 d, Fig. 3 a~Fig. 3 d, Fig. 4 a~Fig. 4 d.
Have speech, as shown in Fig. 5 a~Fig. 5 c, dividing plate 451 is fixed between the first backboard 421 and the second backboard 422, and
It is and substantially vertical with the side wall 441,442 of the back 443 of rack and rack.So, on the top of dividing plate 451, can be formed
Following framework：First backboard 421 is substantially vertical with the back 443 of rack, and substantially flat with the side wall 441,442 of rack
OK；At least two first veneers 411 are plugged in the right lateral surface of the first backboard 421, and adjacent two the first veneers 411
Between there is space；And as shown in Figure 5 a, the air inlet or air outlet of the first heat abstractor 431 are towards adjacent two
Space between one veneer 411.In other words, the air intake direction of air inlet or the air-out side of air outlet of the first heat abstractor 431
To substantially vertical with back 443 and substantially parallel with side wall 441,442, so as to which as shown in Fig. 5 a arrow, the first radiating fills
Putting 431 can dry along the air channel parallel with the plate plane of the first backboard 421 to the first veneer 411.
On the other hand, between dividing plate 451 and dividing plate 452, following framework can be formed：Second backboard 422 substantially with machine
The back 443 of cabinet is vertical, and substantially parallel with the side wall 441,442 of rack；At least two second veneers 412 are plugged on second
In the right lateral surface of backboard 422, and there is space between adjacent two the second veneers 412；And as shown in Figure 5 a, the
The air inlet or air outlet of two heat abstractors 432 are towards the space between two adjacent the second veneers 412.In other words, second
The air intake direction of the air inlet of heat abstractor 432 or the air-out direction of air outlet are substantially vertical with back 443, and substantially with side
Wall 441,442 is parallel, so as to which as shown in Fig. 5 a arrow, the second heat abstractor 432 can be put down along the plate plane with the second backboard 422
Dried to the second veneer 412 in capable air channel.
Another further aspect, in the bottom of dividing plate 452, following framework can be formed：Back of 3rd backboard 423 substantially with rack
443 is vertical and substantially parallel with the side wall 441,442 of rack；At least two the 3rd veneers 413 are plugged on the 3rd backboard 423
Right lateral surface on, and there is space between adjacent two the 3rd veneers 413；And as shown in Figure 5 a, the 3rd radiating dress
Put 433 air inlet or air outlet towards the space between two adjacent the 3rd veneers 413.In other words, the 3rd heat abstractor
The air intake direction of 433 air inlet or the air-out direction of air outlet are substantially vertical with back 443, and substantially with side wall 441,
442 is parallel, so as to which as shown in Fig. 5 a arrow, the 3rd heat abstractor 433 can be along the wind parallel with the plate plane of the 3rd backboard 423
Dried to the 3rd veneer 413 in road.
It should be noted that although to be located in the space that is partitioned into using dividing plate using backboard shown in Fig. 3 a~Fig. 3 d
The framework that left side, veneer are located at right side explains that as above those skilled in the art should be able to understand as example, in the feelings using dividing plate
Under condition, the space that rack inner route clapboard is partitioned into can arbitrarily select any one frame explained according to the above embodiment of the present invention
Structure, if used framework can be formed between veneer and heat abstractor the straight-through air channel parallel with backboard plane, so as to
Do not produce duct resistance substantially at backboard.
In addition, although explaining that as above those skilled in the art should be able to understand using two dividing plates as example, the present invention is unlimited
In this.In fact, completely can according to application scenarios and actual backboard, veneer wiring requirements, flexibly choose whether using dividing plate with
And using several dividing plates come the space in classifying rationally rack.
In a kind of possible implementation, dividing plate 451,452 be with the side wall 441 of the back of rack 443 and rack,
442 is integrally formed.
It should be noted that the first heat abstractor 431, the second heat abstractor 432, the 3rd heat abstractor 433 can be distinguished
Positioned at the first veneer 411, the second veneer 412, the phase homonymy of the 3rd veneer 413 or not homonymy, if each along respectively with backboard
421st, the parallel air channel of 422,423 plate plane is dried to the first veneer 411, the second veneer 412, the 3rd veneer 413.
It is any in the first heat abstractor 431, the second heat abstractor 432 and the 3rd heat abstractor 433 in a kind of possible implementation
Two or more can be integral.In a kind of possible specific implementation, the first heat abstractor 431, second radiating dress
Put 432 and the 3rd any one or more in heat abstractor 433 can be fan wall.
According to another aspect of the present invention, a kind of number for including at least two any one above-mentioned electronic equipment is additionally provided
According to center.In a kind of possible implementation, the electronic equipment in data center is put in determinant, and two adjacent rows
There is the passageway of preset width, to ensure enough heat-dissipating spaces between electronic equipment.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (22)
1. a kind of electronic equipment, including rack (140,240,340), the first backboard (120,220,320,421) and at least two
Individual first veneer (110,210,311,411), first backboard (120,220,320,421) and at least two first list
Plate (110,210,311,411) is arranged in the rack, it is characterised in that
The electronic equipment also includes the first heat abstractor (130,230,331,431),
The rack includes two side walls (141,142,241,242,341,342,441,442) being oppositely arranged and connection institute
The back (143,243,343,443) of two side walls is stated, the back (143,243,343,443) is provided with logical sky；
First backboard (120,220,320,421) is substantially vertical with the back (143,243,343,443), and substantially
It is parallel with the side wall (141,142,241,242,341,342,441,442)；
At least two first veneer (110,210,311,411) is plugged on first backboard (120,220,320,421)
First surface on, and there is space between adjacent two first veneers (110,210,311,411)；And
The air inlet or air outlet of first heat abstractor (130,230,331,431) are described first single towards adjacent two
Space between plate (110,210,311,411),
Wherein, the air intake direction of air inlet or the air-out side of air outlet of first heat abstractor (130,230,331,431)
To substantially vertical with the back (143,243,343,443)；
The air intake direction of the air inlet of first heat abstractor (130,230,331,431) or the air-out direction of air outlet are substantially
It is parallel with the side wall (141,142,241,242,341,342,441,442)；
Formed between first veneer (110,210,311,411) and first heat abstractor (130,230,331,431)
The straight-through air channel parallel with the plate plane of first backboard (120,220,320,421).
2. electronic equipment according to claim 1, it is characterised in that first heat abstractor (130,230,331,
431) multiple fans are included.
3. electronic equipment according to claim 1 or 2, it is characterised in that first heat abstractor (130,230,331,
431) compared to first veneer (110,210,311,411) closer to or further from the back (143,243,343,
443)。
4. electronic equipment according to claim 3, it is characterised in that first heat abstractor (130,230,331,
431) it is arranged between first veneer (110,210,311,411) and the back (143,243,343,443).
5. electronic equipment according to claim 3, it is characterised in that first heat abstractor (130,230,331,
431) it is arranged on the logical sky that the back (143,243,343,443) is provided with.
6. electronic equipment according to claim 1, it is characterised in that
The electronic equipment also includes the second heat abstractor (332) and at least two second veneers (312),
At least two second veneer (312) is plugged in relative with the first surface of first backboard (320)
On two surfaces, and there is space between adjacent two second veneers (312)；
The air outlet or air inlet of second heat abstractor (332) are towards between two adjacent second veneers (312)
Space.
7. electronic equipment according to claim 6, it is characterised in that the air inlet of second heat abstractor (332)
The air-out direction of air intake direction or air outlet is substantially vertical with the back (343).
8. electronic equipment according to claim 6, it is characterised in that the air inlet of second heat abstractor (332)
The air-out direction of air intake direction or air outlet is substantially parallel with the side wall (341,342).
9. electronic equipment according to claim 6, it is characterised in that second heat abstractor (332) includes multiple wind
Fan.
10. the electronic equipment according to any one of claim 6 to 9, it is characterised in that second heat abstractor
(332) compared to second veneer (312) closer to or further from the back (343).
11. electronic equipment according to claim 10, it is characterised in that second heat abstractor (332) is arranged at institute
State between the second veneer (312) and the back (343).
12. electronic equipment according to claim 10, it is characterised in that second heat abstractor (332) is arranged at institute
State on back (343).
13. electronic equipment according to claim 1, it is characterised in that also including dividing plate (451), the second backboard (422),
At least two the 3rd veneers (412) and the 3rd heat abstractor (432), wherein：
Second backboard (422) is substantially vertical with the back (443), and substantially parallel with the side wall (441,442)；
The dividing plate (451) is fixed between first backboard (421) and second backboard (422), and with the back of the body
Portion (443) and the side wall (441,442) are substantially vertical；
At least two the 3rd veneer (412) is plugged on the first surface of second backboard (422), and adjacent two
There is space between individual 3rd veneer (412)；And
The air inlet or air outlet of 3rd heat abstractor (432) are towards between two adjacent the 3rd veneers (412)
Space.
14. electronic equipment according to claim 13, it is characterised in that the air inlet of the 3rd heat abstractor (432)
Air intake direction or air outlet air-out direction it is substantially vertical with the back (443).
15. electronic equipment according to claim 13, it is characterised in that the air inlet of the 3rd heat abstractor (432)
Air intake direction or air outlet air-out direction it is substantially parallel with the side wall (441,442).
16. electronic equipment according to claim 13, it is characterised in that the 3rd heat abstractor (432) includes multiple
Fan.
17. the electronic equipment according to any one of claim 13 to 16, it is characterised in that the 3rd heat abstractor
(432) compared to the 3rd veneer (412) closer to or further from the back (443).
18. electronic equipment according to claim 17, it is characterised in that the 3rd heat abstractor (432) is arranged at institute
State between the 3rd veneer (412) and the back (443).
19. electronic equipment according to claim 17, it is characterised in that the 3rd heat abstractor (432) is arranged at institute
State on back (443).
20. the electronic equipment according to any one of claim 13 to 16, it is characterised in that the dividing plate (451,452)
It is integrally formed with the back (443) and the side wall (441,442).
21. according to the electronic equipment any one of claim 2,9 and 16, it is characterised in that the fan is air draft wind
Fan or extractor fan.
22. a kind of data center, it is characterised in that including being put in determinant at least two as any in claims 1 to 8
Electronic equipment described in, and there is passageway between electronic equipment described in two adjacent rows.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310674262.1A CN103687449B (en) | 2013-12-11 | 2013-12-11 | Electronic equipment and data center |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310674262.1A CN103687449B (en) | 2013-12-11 | 2013-12-11 | Electronic equipment and data center |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103687449A CN103687449A (en) | 2014-03-26 |
| CN103687449B true CN103687449B (en) | 2017-12-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310674262.1A Active CN103687449B (en) | 2013-12-11 | 2013-12-11 | Electronic equipment and data center |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103687449B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105589818B (en) * | 2015-07-17 | 2018-12-11 | 新华三技术有限公司 | Electronic equipment and access control method for electronic equipment |
| CN107396593B (en) * | 2016-05-17 | 2020-06-23 | 中兴通讯股份有限公司 | Cabinet system |
| CN109788697B (en) * | 2018-12-04 | 2021-04-09 | 华为技术有限公司 | Electronic equipment and storage equipment with parallel back plate |
| CN111010855B (en) * | 2019-12-31 | 2022-02-25 | 北京信而泰科技股份有限公司 | Heat dissipation system and electronic equipment with same |
| CN114003108A (en) * | 2020-07-28 | 2022-02-01 | 华为技术有限公司 | Server, cabinet type server and blade type server |
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| JP2001358487A (en) * | 2000-06-12 | 2001-12-26 | Mori Seiki Co Ltd | Cooler for control panel |
| CN201426156Y (en) * | 2009-06-11 | 2010-03-17 | 大唐移动通信设备有限公司 | Two-face back inserting plate with back plates |
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| US6538881B1 (en) * | 2000-06-12 | 2003-03-25 | Alcatel Canada Inc. | Cooling of electronic equipment |
| JP2008235387A (en) * | 2007-03-19 | 2008-10-02 | Shindengen Electric Mfg Co Ltd | Electrical and electronic equipment device with heat dissipation structure |
| CN201181974Y (en) * | 2008-04-18 | 2009-01-14 | 大连捷成实业发展有限公司 | Macrotype multi-format mixed-insertion switch matrix |
| CN101795546B (en) * | 2009-02-04 | 2012-07-04 | 华为技术有限公司 | Subrack and heat radiating method thereof |
| CN102609058B (en) * | 2012-02-24 | 2014-12-10 | 成都珑之微科技有限公司 | Cabinet type modular high-density blade server system |
| CN102681618A (en) * | 2012-04-20 | 2012-09-19 | 华为技术有限公司 | Backboard system |
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| JP2001358487A (en) * | 2000-06-12 | 2001-12-26 | Mori Seiki Co Ltd | Cooler for control panel |
| CN102342193A (en) * | 2009-01-09 | 2012-02-01 | 力博特公司 | Liquid cooling system for server applications |
| CN201426156Y (en) * | 2009-06-11 | 2010-03-17 | 大唐移动通信设备有限公司 | Two-face back inserting plate with back plates |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103687449A (en) | 2014-03-26 |
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