CN107396593B - Cabinet system - Google Patents
Cabinet system Download PDFInfo
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- CN107396593B CN107396593B CN201610327471.2A CN201610327471A CN107396593B CN 107396593 B CN107396593 B CN 107396593B CN 201610327471 A CN201610327471 A CN 201610327471A CN 107396593 B CN107396593 B CN 107396593B
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- interconnection
- connector
- function
- board
- back plate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
The present invention provides a cabinet system, comprising: the back plate device consists of 2N +1 sub back plates, a function plate and a fan; wherein, sub-backplate includes: a first interconnection backplane and a second interconnection backplane; a second interconnection back plate is arranged in every two first interconnection back plates; the function board is horizontally arranged between the first interconnection backboard and the second interconnection backboard and is respectively connected with the first interconnection backboard and the second interconnection backboard in a horizontal orthogonal mode; the fan is arranged between the first interconnection back plate and the second interconnection back plate to form an air channel and is arranged on a plane vertical to the plane of the first interconnection back plate and the plane of the second interconnection back plate; n is an integer greater than or equal to 1. According to the invention, the problem of low heat dissipation efficiency caused by the fact that the heat dissipation open holes of the cabinet system are limited by the electrical interconnection among the functional modules in the related art is solved.
Description
Technical Field
The invention relates to the field of communication, in particular to a cabinet system.
Background
In the equipment in communication and electron field, the framework based on server product is the development trend of the centralized processing rack of future large capacity, and the radiating mode of server framework adopts and induced drafts through afterbody fan to make wind advance from the front panel, wind takes out functional module's heat after from the afterbody outflow, promptly: the front and rear air ducts dissipate heat. In addition, the cabinet realizes centralized placement of each functional module, and the expansion of the processing capacity of the cabinet only needs to configure a corresponding number of functional modules, so that the requirement of system interconnection exists among the functional modules, the system interconnection of the functional modules is realized by Printed Circuit Board (PCB for short) backplanes in the industry at present, and the reliability and the high cost are low because the Printed Circuit Board (PCB for short) backplanes are rarely interconnected by cables.
Traditional backplates are used for machine frame or cabinet system interconnection in the current industry, namely: the plane of the back plate is perpendicular to the plane of the functional modules, and interconnection signals between the functional modules are all carried by the back plate, as shown in fig. 1 and 2, fig. 1 is a schematic diagram of an interconnection topology of a conventional back plate system in the related art, and fig. 2 is a schematic diagram of an assembly and an air duct of a conventional interconnection system in the related art. As can be seen from fig. 2, the heat dissipation of the conventional back plate interconnection system is suitable for left and right air ducts, and is not suitable for heat dissipation of front and rear air ducts similar to a server framework, if heat dissipation of the front and rear air ducts is to be achieved, the current practice in the industry is to open holes in the back plate, and a fan performs air suction and heat dissipation behind the back plate, as shown in fig. 3, fig. 3 is a schematic diagram of a heat dissipation scheme of the front and rear air ducts based on back plate interconnection in the related;
as can be seen from fig. 3, in the heat dissipation scheme of the front and rear air ducts based on interconnection of the back plates in the industry, the fan is behind the back plate, and a plurality of heat dissipation holes need to be formed in the back plate, so that the air coming from the ventilation holes of the functional module panel passes through the ventilation holes of the back plate to bring out the heat. The defect of the mode is very obvious, the opening rate of the back plate directly influences the heat dissipation capacity of the system, but the opening of the back plate is limited by the electrical interconnection among the functional modules and can not be opened freely without limit; meanwhile, the heat dissipation of the heating device on the functional module is limited by the opening of the backboard, so that the layout of the heating device of the functional module and the opening of the backboard have strong correlation coupling relationship.
In view of the above problems in the related art, no effective solution exists at present.
Disclosure of Invention
The embodiment of the invention provides a cabinet system, which at least solves the problem of low heat dissipation efficiency caused by the limitation of heat dissipation openings of the cabinet system to electrical interconnection among functional modules in the related art.
According to an aspect of an embodiment of the present invention, there is provided a rack system including: the back plate device consists of 2N +1 sub back plates, a function plate and a fan; wherein the sub-backplane comprises: a first interconnection backplane and a second interconnection backplane; one second interconnection back plate is arranged between every two first interconnection back plates; the function board is horizontally arranged between the first interconnection back board and the second interconnection back board and is respectively connected with the first interconnection back board and the second interconnection back board in a horizontal orthogonal mode; the fan is arranged between the first interconnection back plate and the second interconnection back plate to form an air channel and is arranged on a plane vertical to the plane of the first interconnection back plate and the second interconnection back plate; and N is an integer greater than or equal to 1.
Optionally, one second interconnection backplane is arranged between every two first interconnection backplanes at equal intervals.
Optionally, the system further comprises a connector; wherein the connector comprises: the first connector is arranged on the first interconnection backboard and is on the same side as the second interconnection backboard; the second connectors are arranged on two sides of the second interconnection backboard; a third connector provided on the function board and orthogonally connected to the first connector; a fourth connector provided on the function board and orthogonally connected to the second connector; the third connector is in conduction with the fourth connector.
Optionally, the third connector and the fourth connector are disposed on the same side of the function board.
Optionally, the third connector and the fourth connector are respectively disposed on different sides of the function board.
Optionally, when there are a plurality of function boards, there are a plurality of first connectors and a plurality of second connectors, where any one of the plurality of first connectors is respectively in conductive connection with other first connectors, and any one of the plurality of second connectors is respectively in conductive connection with other second connectors.
Optionally, when there are a plurality of function boards, an air duct is formed between every two function boards by the fan when there are a plurality of function boards.
Optionally, the fan is used for sucking air behind the sub-back plate or blowing air at the front end of the panel of the function board.
Optionally, the length of the function board is one or more preset lengths, where the preset length is a spacing distance between the first interconnection backplane and the second interconnection backplane.
Optionally, the function board is disposed on any one side of the first interconnection backplane and the second interconnection backplane.
Optionally, the function boards are disposed on two sides of the first interconnection backplane and the second interconnection backplane.
According to the embodiment of the invention, the sub-back plate and each function plate are in orthogonal connection, so that the system is a front air channel and a rear air channel, the back plate and each function plate do not shield the air channels, the air cooling heat dissipation efficiency is higher, and the problem of low heat dissipation efficiency caused by the fact that the heat dissipation opening of the cabinet system is limited by the electrical interconnection among the function modules in the related art is solved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the invention and together with the description serve to explain the invention without limiting the invention. In the drawings:
FIG. 1 is a schematic diagram of a conventional backplane system interconnection topology in the related art;
FIG. 2 is a schematic view of a conventional interconnect system assembly and duct of the related art;
FIG. 3 is a schematic diagram of a heat dissipation scheme of a front air duct and a rear air duct based on back plate interconnection in the related art;
FIG. 4a is a schematic front view of a rack system according to an embodiment of the invention;
FIG. 4b is a schematic diagram of a rack system according to an embodiment of the invention;
FIGS. 5 a-5 b are schematic structural diagrams of a rack system including connectors according to an embodiment of the invention;
FIG. 6 is a first schematic structural diagram of a rack system including a backplane apparatus according to an embodiment of the present disclosure;
FIG. 7 is a first schematic diagram of a full-crossover topology of a backplane apparatus according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of a full-width, half-width backplane apparatus according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of an application having function boards on both sides of a backplane apparatus according to an embodiment of the present invention;
FIG. 10 is a first schematic structural diagram of a rack system including a backplane apparatus according to an embodiment of the present disclosure;
fig. 11 is a schematic diagram of a full-crossover topology of a backplane apparatus according to an embodiment of the present invention.
Detailed Description
The invention will be described in detail hereinafter with reference to the accompanying drawings in conjunction with embodiments. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
Example 1
Fig. 4a is a schematic front view of a rack system according to an embodiment of the present invention, and fig. 4b is a schematic diagram of a rack system according to an embodiment of the present invention, and as shown in fig. 4a and fig. 4b, the rack system 1 includes: the back plate device comprises a back plate device 1-1 consisting of 2N +1 sub back plates, a function plate 1-2 and a fan 1-3;
wherein, sub-backplate includes: a first interconnection backboard 1-1-1 and a second interconnection backboard 1-1-2; one second interconnection back plate 1-1-2 can be arranged in every two first interconnection back plates 1-1-1;
the function board 1-2 is horizontally arranged between the first interconnection backboard 1-1-1 and the second interconnection backboard 1-1-2 and is respectively and horizontally and orthogonally connected with the first interconnection backboard 1-1-1 and the second interconnection backboard 1-1-2;
the fans 1-3 are arranged between the first interconnection back plate and the second interconnection back plate to form an air channel and are arranged on a plane vertical to the plane of the first interconnection back plate and the plane of the second interconnection back plate;
n is an integer greater than or equal to 1.
It should be noted that, in fig. 4a and 4b, N is 1 as an example, that is, in fig. 4a and 4b, the number of backplane is 3, that is, the number of first interconnection backplane 1-1-1 is 2, the number of second interconnection backplane 1-1-2 is 1, and of course, other values of N may be also possible, for example, N is 2, 3 …, as long as it is satisfied that the second interconnection backplane is disposed between two first interconnection backplanes at an interval; in addition, a function board 1-2 is arranged between the interval of the two fans 1-3 in the figure 4a and the figure 4b, and the function board is orthogonally connected with the sub-back board.
In an optional implementation manner of this embodiment, every two second interconnection backplanes 1-1-2 are arranged at equal intervals between the first interconnection backplanes 1-1-1.
In addition, the functional boards 1-2 involved in the present embodiment may also be one or more, as shown in fig. 4a and 4b, when there are multiple functional boards, an air duct is formed between every two functional boards 1-2 by the fans 1-3, wherein the fans 1-3 draw air behind the sub-back board or blow air at the front end of the panel of the functional board.
The length of the function board 1-2 is one or more preset lengths, wherein the preset length is a spacing distance between the first interconnection back board and the second interconnection back board.
In an optional implementation manner of this embodiment, the function board 1-2 is disposed on either side of the first interconnection backplane 1-1-1 and the second interconnection backplane 1-1-2, or disposed on both sides of the first interconnection backplane 1-1-1 and the second interconnection backplane 1-1-2. As shown in fig. 4b, the functional boards 1-2 are disposed on both sides of the first interconnection backplane 1-1-1 and the second interconnection backplane 1-1-2, but it should be noted that, in another embodiment of this embodiment, the function board can be arranged on one side of the interconnection backboard, the other side can be provided with an interconnection backboard for interconnection between the first interconnection backboard 1-1-1 and the second interconnection backboard 1-1-2, when there are a lot of signals to be interconnected between the three vertical backplates, the functional board 1-2 horizontal interconnection backplane can be added on the other side to realize the interconnection between the three backplates, that is, the mode shown in fig. 4b, it can be seen that this mode is not necessary, because the interconnection among the three vertical backbones is realized by the functional board arranged on one side only under the condition that the interconnection signal scale is controllable.
It can be seen that, through the above-mentioned mode of this embodiment, through the quadrature connection between sub-backplate and each function board for the system is the wind channel around for the backplate does not shelter from the wind channel with each function board, makes air-cooled radiating efficiency higher, thereby has solved among the correlation technique problem that rack system heat dissipation trompil is limited to the electrical interconnection between the functional module and leads to the radiating efficiency low.
Example 2
For the cabinet system 1 related in the present embodiment further includes a connector, as shown in fig. 5a and 5b, fig. 5a to 5b are schematic structural diagrams of the cabinet system including the connector according to the embodiment of the present invention;
wherein, the connector includes: the first connector 1-4-1 is arranged on the same side of the first interconnection backboard and the second interconnection backboard; the second connectors 1-4-2 are arranged on two sides of the second interconnection backboard; a third connector 1-4-3 provided on the function board and orthogonally connected to the first connector 1-4-1; a fourth connector 1-4-4 provided on the function board and orthogonally connected to the second connector 1-4-2; the third connector 1-4-3 is in conductive communication with the fourth connector 1-4-4.
It should be noted that the third connector 1-4-3 and the fourth connector 1-4-4 referred to in this embodiment may be disposed on the same side of the function board. In addition, the third connector 1-4-3 and the fourth connector 1-4-4 are respectively disposed on opposite sides of the function board.
As for the connection relationship between the connectors in this embodiment, when there are a plurality of function boards 1-2 in this embodiment, there are a plurality of first connectors 1-4-1 and a plurality of second connectors 1-4-2, wherein any one of the plurality of first connectors 1-4-1 is respectively in conduction connection with other first connectors, and any one of the plurality of second connectors 1-4-2 is respectively in conduction connection with other second connectors.
Example 3
The present embodiment is an implementation manner of the foregoing embodiment 1 and embodiment 2 in a specific application scenario, and the implementation manner exemplifies the present invention by taking a cabinet as an example, and provides a fully symmetric Mesh orthogonal interconnection cabinet system based on heat dissipation of front and rear interconnected air ducts, as shown in fig. 6, where fig. 6 is a first structural schematic diagram of a cabinet system including a backplane device according to an embodiment of the present invention;
the cabinet system includes: a backplane apparatus, wherein the backplane apparatus comprises three sub-backplates: an upper and lower interconnection backplane 1 (corresponding to the first interconnection backplane in the above-described embodiment), an upper and lower interconnection backplane 2 (corresponding to the first interconnection backplane in the above-described embodiment), and a horizontal interconnection backplane (corresponding to the second interconnection backplane in the above-described embodiment), where the three sub-backplanes are parallel to each other. The cabinet system also comprises a functional module, a fan and the like.
The connectors 1 are connected to the same sides of the upper and lower interconnection backplanes 1 and the horizontal interconnection backplanes, the connectors 2 are connected to the same sides of the upper and lower interconnection backplanes 2 and the horizontal interconnection backplanes, and the connectors 1 and the connectors 2 on the horizontal interconnection backplanes are located on two sides of the horizontal interconnection backplanes. Meanwhile, the upper side of the functional module is connected with a connector 3 capable of being orthogonally connected with the connector 1, and the lower side of the functional module is connected with a connector 4 capable of being orthogonally connected with the connector 2. Thus, each function board is orthogonally connected to the sub-backplane. The fan is located the interval department of sub-backplate, and the air-out around, backplate and function board all are located the wind channel to do not shelter from the wind channel, make air-cooled efficiency reach the highest.
It should be noted that the backplane device is of a full-symmetric Mesh structure, and can implement shortest path connection between the function boards, and can implement full cross connection of all the function boards at the same time. As shown in fig. 7, fig. 7 is a first schematic diagram of a full-crossover topology of a backplane apparatus according to an embodiment of the present invention; taking the slot 1 as an example, by the connectors 1 of the upper and lower interconnected backplanes 1, the functional board inserted into the slot 1 can be connected to the functional board of each slot in the vertical position, and the link distance is shortest. Through the connecting machine 1 and the connector 2 of the horizontal interconnection backboard, the functional board inserted into the slot position 1 can be connected with the functional board of each slot position in the horizontal position, and the link distance is shortest. In summary, the function board in any slot can realize the fully symmetric Mesh connection with the function boards in other slots, and the connection link is shortest. Thereby reducing link loss and improving signal quality, which is particularly important for high speed signals. Meanwhile, the PCB wiring is simple, the wiring layer number can be reduced, the single board area is reduced, and the cost is greatly saved.
FIG. 8 is a schematic diagram of a full-width, half-width backplane apparatus according to an embodiment of the present invention; as shown in fig. 8, the backplane device can be inserted with not only a half-width function board but also a full-width function board. When the full-width function board is inserted, the full-width function board can be connected with the left slot function board through the connectors 1 of the upper and lower interconnection back boards 1, can be connected with the right slot function board through the connectors 2 of the upper and lower interconnection back boards 2, and can also be connected with the full-symmetric Mesh of other slot function boards, and the connection link is shortest. Namely, the back plate device can support a half-width function plate, can also support a full-width function plate, or can be used by mixed insertion of the half-width function plate and the full-width function plate, and is very flexible in application.
Fig. 9 is a schematic view of an application of a backplane device having function boards on both sides according to an embodiment of the present invention, and fig. 9 shows an application of the backplane device having function boards on both sides.
The backplane device in this embodiment may also use a longitudinal backplane plane for routing, fig. 10 is a schematic structural diagram of a rack system including the backplane device according to an embodiment of the present invention, fig. 11 is a schematic structural diagram of a full-cross topology of the backplane device according to an embodiment of the present invention, as shown in fig. 10 and fig. 11, which is similar to the solutions described in fig. 6 and fig. 7.
Therefore, in the embodiment, the function boards can realize the shortest link connection and the full-symmetry Mesh connection through the backboard device, so that the PCB wiring between the connectors of the backboard is shortest, the number and the area of layers of the backboard can be better controlled, the backboard is convenient to produce and process, and the cost is greatly saved. Meanwhile, the structure of the back plate device does not shield the air duct for front and back air outlet, so that the heat dissipation efficiency of the system is greatly improved, and the use and the upgrade of the system are facilitated.
That is, the scheme of this embodiment is applicable to communication and electronic field equipment based on the use of the interconnected front and back air duct cooling system of backplate, compares with backplate interconnection technology among the relevant technology, has following effect:
① the backplane interconnect device comprises three sub-backplanes connected with each function board via orthogonal connectors;
② the backboard interconnection device is a full-symmetric Mesh structure, which can realize full cross connection of each function board and realize the shortest link connection between each function board;
③ the backboard interconnecting device makes the system be a front and back air channel, and the backboard and each function board do not shield the air channel, so that the air cooling heat dissipation efficiency is higher.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (9)
1. An enclosure system, the enclosure system comprising: the back plate device consists of 2N +1 sub back plates, a function plate and a fan;
wherein the sub-backplane comprises: a first interconnection backplane and a second interconnection backplane; one second interconnection back plate is arranged between every two first interconnection back plates;
the function board is horizontally arranged between the first interconnection back board and the second interconnection back board and is respectively connected with the first interconnection back board and the second interconnection back board in a horizontal orthogonal mode;
the fan is arranged between the first interconnection back plate and the second interconnection back plate to form an air channel and is arranged on a plane vertical to the plane of the first interconnection back plate and the second interconnection back plate;
n is an integer greater than or equal to 1;
wherein the system further comprises a connector;
wherein the connector comprises: the first connector is arranged on the first interconnection backboard and is on the same side as the second interconnection backboard; the second connectors are arranged on two sides of the second interconnection backboard; a third connector provided on the function board and orthogonally connected to the first connector; a fourth connector provided on the function board and orthogonally connected to the second connector; the third connector is conducted with the fourth connector;
when the function board is provided with a plurality of function boards, the first connector and the second connector are provided with a plurality of function boards, wherein any one of the first connectors is respectively connected with the other first connectors in a conduction mode, and any one of the second connectors is respectively connected with the other second connectors in a conduction mode;
the back plate device is of a full-symmetrical Mesh structure; the plurality of function boards are all cross-connected by the shortest path through the backplane device.
2. The system of claim 1, wherein every two of the first interconnect backplanes have one of the second interconnect backplanes equally spaced therebetween.
3. The system of claim 1, wherein the third connector and the fourth connector are disposed on a same side of the function board.
4. The system of claim 1, wherein the third connector and the fourth connector are disposed on opposite sides of the function board, respectively.
5. The system according to claim 1, wherein when there are a plurality of the function boards, one air passage is formed between each two function boards by the fan.
6. The system of claim 5, wherein the fan draws air behind the sub-backplane or blows air in front of the face plate of the performance board.
7. The system of claim 1, wherein the length of the function board is one or more predetermined lengths, wherein the predetermined length is a separation distance between the first and second interconnected backplanes.
8. The system of claim 1, wherein the function board is disposed on either side of the first and second interconnected backplanes.
9. The system of claim 1, wherein the function boards are disposed on both sides of the first and second interconnected backplanes.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610327471.2A CN107396593B (en) | 2016-05-17 | 2016-05-17 | Cabinet system |
| PCT/CN2017/084729 WO2017198174A1 (en) | 2016-05-17 | 2017-05-17 | Cabinet system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610327471.2A CN107396593B (en) | 2016-05-17 | 2016-05-17 | Cabinet system |
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| Publication Number | Publication Date |
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| CN107396593A CN107396593A (en) | 2017-11-24 |
| CN107396593B true CN107396593B (en) | 2020-06-23 |
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| CN201610327471.2A Active CN107396593B (en) | 2016-05-17 | 2016-05-17 | Cabinet system |
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| CN (1) | CN107396593B (en) |
| WO (1) | WO2017198174A1 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108235637B (en) * | 2017-12-15 | 2020-08-21 | 深圳市恒扬数据股份有限公司 | Vertical orthogonal system for communication equipment and communication equipment |
| CN109788697B (en) * | 2018-12-04 | 2021-04-09 | 华为技术有限公司 | Electronic equipment and storage equipment with parallel back plate |
| CN112543571B (en) * | 2019-09-20 | 2023-04-28 | 中兴通讯股份有限公司 | Backboard component and insertion box |
| CN113821383A (en) * | 2020-06-19 | 2021-12-21 | 华为技术有限公司 | Storage system |
| CN112291640B (en) * | 2020-10-30 | 2022-02-22 | 迈普通信技术股份有限公司 | Orthogonal rack equipment and communication equipment |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6867967B2 (en) * | 2002-12-16 | 2005-03-15 | International Business Machines Corporation | Method of constructing a multicomputer system |
| US8064200B1 (en) * | 2008-04-16 | 2011-11-22 | Cyan Optics, Inc. | Cooling a chassis by moving air through a midplane between two sets of channels oriented laterally relative to one another |
| CN102681618A (en) * | 2012-04-20 | 2012-09-19 | 华为技术有限公司 | Backboard system |
| CN203423891U (en) * | 2013-07-29 | 2014-02-05 | 杭州华三通信技术有限公司 | Electronic device |
| CN103687449B (en) * | 2013-12-11 | 2017-12-29 | 华为技术有限公司 | Electronic equipment and data center |
| CN204539679U (en) * | 2015-04-29 | 2015-08-05 | 杭州华三通信技术有限公司 | Communication equipment |
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2016
- 2016-05-17 CN CN201610327471.2A patent/CN107396593B/en active Active
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| CN107396593A (en) | 2017-11-24 |
| WO2017198174A1 (en) | 2017-11-23 |
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