WO2017185840A1

WO2017185840A1 - Backplane device and communication apparatus

Info

Publication number: WO2017185840A1
Application number: PCT/CN2017/071746
Authority: WO
Inventors: 张远望
Original assignee: 中兴通讯股份有限公司
Priority date: 2016-04-27
Filing date: 2017-01-19
Publication date: 2017-11-02
Also published as: CN107317770A

Abstract

Provided are a backplane device and a communication apparatus. The backplane device comprises a line card and a switch board which are disposed at one side of the backplane device. The line card is perpendicular to the switch board. The switch board is orthogonal to multiple backplanes. The multiple backplanes are disposed at the other side of the backplane device and arranged parallel to the line card. High-speed signal connection is established between the line card and the switch board by means of the multiple backplanes. The invention solves problems in the prior art backplane architecture systems in which insertion loss of a high-speed channel and costs are high, the depth requirement cannot be met easily, heat dissipation performance is poor, and bandwidth capacity of the system is limited.

Description

Backplane device, communication device

Technical field

The present invention relates to the field of communication hardware architecture, and in particular to a backplane device and a communication device.

Background technique

The device forwarding bandwidth requirements of the aggregation and core nodes are increasing. The high-speed bus rate of the communication boards connected to the service boards is getting higher and higher (current mainstream devices are already greater than or equal to 25 Gbps), and the number of high-speed channels is also increasing. As the channel rate increases, the insertion loss per unit length becomes larger and larger, and the system high-speed channel length becomes a key factor that restricts the bandwidth capacity of the device. The power consumption of the board is also increased due to the increased processing bandwidth and enhanced functions. Heat dissipation has also become a bottleneck in the overall design of system hardware.

In order to solve the problem that the channel insertion loss introduced by the bus speed increase is increased, the length of the high-speed channel of the backplane is controlled as much as possible. Currently, a common method is that the line card and the switch board adopt an orthogonal architecture, and FIG. 1 is a line card and a switch board in the related art of the present invention. Schematic diagram of the orthogonal architecture, as shown in Figure 1, the problem of the two layers of the front and rear boards is that the depth of the equipment is deep; the orthogonal architecture is because the switch board needs to bridge all the line cards, so it will also lead to the movement inside the switch board. Line growth; limited by the size of the switch board, the number of line cards cannot be too much, and the capacity of the device is constrained. In order to reduce the length of the traces in the switch board, balance the total length of the system high-speed channel, and increase the number of line cards, the conventional backplane architecture using the line card and the switch network vertical is also selected. FIG. 2 is a line card and related art in the related art of the present invention. The schematic diagram of the traditional backplane structure of the switchboard is vertical. As shown in Fig. 2, in order to reduce the insertion loss, the high-frequency board with lower loss coefficient is used, and the cost of synchronization increases a lot. The use of the traditional backplane also affects the use of the front and rear air ducts due to the backplane blocking. Heat dissipation is constrained.

In response to the above problems in the related art, the industry is actively seeking effective solutions.

Summary of the invention

The embodiments of the present invention provide a backplane device and a communication device, which solve the problems of high speed channel insertion loss, high cost, difficulty in meeting depth requirements, poor heat dissipation, and system bandwidth capacity size constraints of the backplane frame system in the related art. .

According to an embodiment of the present invention, there is provided a backplane device comprising: a line card disposed on a side of the backplane device and perpendicular to the switchboard; the switchboard, and the plurality of backplanes Orthogonally disposed; the plurality of backplanes are disposed on the other side of the backplane device, disposed in parallel with the line card; wherein the plurality of backs are passed between the line card and the switchboard The board performs high speed signal connections.

Further, there is a gap between the plurality of backplanes, and/or the number of the backplanes corresponds to the number of columns of the line card slots.

Further, the backplane device further includes: a middle plate disposed between two sides of the backboard device, configured to fix a position of the line card, the plurality of backboards, and the switchboard, and / or, the transmission of low speed signals and / or power signals.

Further, the preset area of the middle plate is hollowed out, or a ventilation hole is provided on the middle plate.

Further, the backplane and the line card are coplanarly connected by a coplanar connector, and/or the backplane and the switchboard are orthogonally connected by an orthogonal connector.

Further, the line card is vertically disposed on an upper side and/or a lower side of the switchboard.

Further, the backplane includes at least one of the following: a high speed signal electric backplane, and an optical waveguide board.

According to another embodiment of the present invention, a communication device is provided, including: a backplane device, a fan, wherein the backplane device includes: a line card disposed on a side of the backplane device with a switchboard, Vertically disposed with the switchboard; the switchboard is disposed orthogonally to the plurality of backplanes; the plurality of backplanes are disposed on the other side of the backplane apparatus, disposed in parallel with the line card, a plurality of backplanes further including a backplane gap disposed to ventilate and dissipate the backplane device through the backplane gap; a fan disposed outside the backplane gap; wherein the line card and the High-speed signal connections are made between the switch boards through the plurality of backplanes.

Further, the preset area of the middle plate is hollowed out or provided with ventilation holes for ventilation, and/or the plurality of back plates and the exchange plate are connected by orthogonal connectors, the plurality of backs The board and the line card are connected by a coplanar connector.

According to the embodiment of the present invention, a line card is disposed, and the switch board is disposed on one side of the backboard device and perpendicular to the switch board; the switch board is disposed orthogonally to the plurality of back boards; the plurality of back boards, Provided on the other side of the backplane device, disposed in parallel with the line card; wherein the line card and the switchboard are connected by the plurality of backplanes for high-speed signal through orthogonal multiple backs The design of the board solves the problems of high-speed channel insertion loss, high cost, difficulty in meeting deep demand, poor heat dissipation, and system bandwidth capacity size constraints in the backplane frame system of the related art.

DRAWINGS

The drawings described herein are intended to provide a further understanding of the invention, and are intended to be a part of the invention. In the drawing:

1 is a schematic diagram of an orthogonal structure of a line card and a switch board in the related art of the present invention;

2 is a schematic diagram of a conventional backplane structure in which a line card and a switch board are vertical in the related art of the present invention;

3 is a schematic structural diagram of a backplane device according to an embodiment of the present invention;

4 is a block diagram of a communication device in accordance with an embodiment of the present invention.

detailed description

The invention will be described in detail below with reference to the drawings in conjunction with the embodiments. It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict.

It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above drawings are used. To distinguish similar objects, and not necessarily to describe a specific order or order.

In this embodiment, a backplane device is provided. FIG. 3 is a schematic structural diagram of a backplane device according to an embodiment of the present invention. As shown in FIG.

The line card 303 is disposed on a side of the backboard device with the switchboard, and is perpendicular to the switchboard;

The switch board 301 is disposed orthogonally to the plurality of back boards;

a plurality of back plates 302 disposed on the other side of the backplane device and disposed in parallel with the line card;

The high speed signal connection is performed between the line card and the switch board through multiple back boards.

The line card and the switch board are placed vertically, and the high-speed signal channel is the shortest. Since the switch board does not need to bridge all the line cards as shown in FIG. 1, the board has a short trace, and the system high-speed channel can better meet the total insertion loss requirement;

The orthogonal backplane is set to take high-speed signals, and the board area is small, so the impact of using high-speed boards on cost is much reduced;

Multiple orthogonal backplane designs can be the same, which can reduce design difficulty, shorten design cycle, and reduce design cost.

Compared with the switching board of the related art, the high-speed backplane can greatly compress the depth dimension, and the depth of the device can better meet the depth requirement even if the rear fan is added;

Because the high-speed backplane is orthogonal to the switchboard, it can design a straight air duct with a rear exhaust, and the heat dissipation efficiency is high. The high-speed signal connector area of the middle board can be hollowed out or ventilated in the middle panel, and the line card has a high-speed back. The fan in the board area cooperates with the fan on the other side of the line card to dissipate heat, and the heat dissipation efficiency and heat dissipation capacity are greatly increased, which greatly improves the heat dissipation design bottleneck;

Through the above steps, the line card is disposed, and the switch board is disposed on one side of the backboard device, perpendicular to the switch board; the switch board is disposed orthogonally with the plurality of back boards; and the plurality of back boards are disposed on the back board device Side, parallel with the line card; wherein, the line card and the switch board are connected by a plurality of backplanes for high-speed signal connection, and the design structure of the orthogonal multi-backplane is used to solve the high-speed channel insertion loss of the backplane frame system in the related art. High, high cost, difficult to meet deep demand, poor heat dissipation and system bandwidth capacity size constraints.

Optionally, the line card may be vertically disposed on the upper side or the lower side of the switch board, or may be vertically disposed on the upper and lower sides at the same time. Because the line card can be designed in two rows, the capacity of the system is larger than the orthogonal system of Figure 1 under the same conditions, which can better meet the single-capacity capacity requirement. At the same time, this architecture form facilitates the light-emitting interface on the front of the switchboard, and is also more convenient to implement the cluster system.

The backplane 302 can be a set of high-speed signal electrical backplanes, or can be a group of optical waveguides and other optical signals, and there is a gap between the plurality of backplanes, which can be used as a ventilation and heat dissipation channel. As shown in FIG. 3, the number of the backplanes 302 corresponds to the number of rows of the line cards 303; the optional coplanar connector 306 of the connection line cards, the backplane and the line cards are coplanarly connected by the coplanar connectors The connector connecting the switchboard is an orthogonal connector 305, and the backplane and the switchboard are orthogonally connected by orthogonal connectors.

In an alternative embodiment according to this embodiment, the middle plate of the backboard device may be provided with a venting hole, or the high-speed connector region is hollowed out, as shown in FIG. 3, including: a middle plate 304, and the middle plate is disposed on the back plate device Between the two sides, it can be used for positioning of line cards, switch boards and back boards, and for low speed signals and power supply.

A communication device, including the above-mentioned backplane device, is provided in the embodiment, and the communication device is used to implement the foregoing embodiments and preferred embodiments, and details are not described herein.

FIG. 4 is a schematic structural diagram of a communication device according to an embodiment of the present invention. As shown in FIG. 4, the device includes: a backplane device and a fan.

Including the backplane device shown in FIG. 3, based on the device of the orthogonal multi-backplane architecture shown in FIG. 3, FIG. 4 shows a design example of a specific communication device, including: a switch board 401, a main control board 408, and upper and lower sides. Design two rows of line card slots for setting the line card 403 to increase the system bandwidth capacity, the orthogonal back plate 402, and the fan 407 can be designed on the outside of the back plate to construct the airflow of the forward wind and the rear wind and increase the total Ventilation capacity 409; the high-speed connector area on the middle plate 404 can be hollowed out because there is no high-speed signal, and the direct orthogonal connector is used, and the front and rear ventilations are used to dissipate heat to the switching network. Since the orthogonal back plate 402 is placed vertically, the line card can also be cooled. It forms a good air duct, and each side of the line card is designed with a fan, and the air passage efficiency is high, and the heat dissipation capability is strong; the high-speed signal back board can compress the depth of the device because of the small width, which can better satisfy the use. The requirements for a standard cabinet (eg, 800 mm deep); also include: an orthogonal connector 405, a coplanar connector 406.

An orthogonal multi-backplane hardware architecture (backplane device) provided by this embodiment and a communication device implemented based on the architecture.

The line card can be selected according to the requirements of a row of slots or one row under the switchboard. The slot width needs to be kept as wide as possible to meet the panel opening requirements to meet the air inlet requirements;

The switch board height selection needs to be considered as a cluster system. The panel needs to meet the light-emitting module, and at the same time, a certain spare area opening is required to meet the air intake requirement, but at the same time, the high-speed signal length of the backplane is required to satisfy the system channel constraint, and the switch board slot is required. The interval should not be too large;

The connector can be equipped with an intermediate connector or an orthogonal connector without a middle plate. It mainly depends on the structural positioning requirements. The advantage of the form with the middle plate is that the positioning is simple. The disadvantage is that the signal needs to be increased by one level connection. The requirements for structural design are higher;

The length selection of the high-speed orthogonal small backplane is determined by the spacing of the upper and lower row of card slots and the position of the high-speed signal socket. It is also necessary to consider retaining a certain width to meet the requirements of high-speed signal routing, and at the same time taking into account the depth of the insertion box;

The air duct design is preferred to the hollow plate high-speed signal connector area hollowing out; for large power consumption and interface-intensive line cards, the opening of the front panel may be a bottleneck of the intake air, and the free space of the upper and lower sides of the line card may be extended. The internal air guide structure is added to increase the heat dissipation effect of the line card.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Industrial applicability

According to the foregoing technical solution provided by the embodiment of the present invention, a line card is disposed, and the switch board is disposed on one side of the backboard device and perpendicular to the switchboard; the switchboard is disposed orthogonally to the plurality of backplanes; a plurality of backplanes disposed on the other side of the backplane device, disposed in parallel with the line card; wherein the line card and the switchboard pass through the plurality of backplanes High-speed signal connection, through the design of the orthogonal multi-backplane, solves the problems of high-speed channel insertion loss, high cost, difficulty in meeting depth requirements, poor heat dissipation, and system bandwidth capacity size constraints in the backplane architecture system of the related art.

Claims

A backboard device comprising:

a line card disposed on a side of the backboard device and perpendicular to the switchboard;

The switch board is disposed orthogonally to the plurality of back boards;

The plurality of back plates are disposed on the other side of the backboard device and disposed in parallel with the line card;

The high speed signal connection is performed between the line card and the switch board through the plurality of back boards.
The backplane device according to claim 1, wherein a gap exists between the plurality of backboards, and/or the number of the backplanes corresponds to the number of rows of the line card slots.
The backplane device of claim 1, wherein the backplane device further comprises:

a midplane disposed between the two sides of the backplane device, configured to fix the position of the line card, the plurality of backplanes and the switchboard, and/or to perform low speed signals and/or power signals Transmission.
The backboard device according to claim 3, wherein the predetermined area of the middle plate is hollowed out, or a vent hole is provided on the middle plate.
The backplane device of claim 1, wherein the backplane and the line card are coplanarly connected by a coplanar connector, and/or the backplane and the switchboard are passed between The orthogonal connectors are orthogonally connected.
The backplane apparatus according to claim 1, wherein the line card is vertically disposed on an upper side and/or a lower side of the exchange board.
The backplane device according to any one of claims 1 to 6, wherein the backplane comprises at least one of the following: a high speed signal electrical backplane, an optical waveguide panel.
A communication device includes: a backboard device and a fan, wherein the backplane device includes:

a line card disposed on a side of the backboard device and perpendicular to the switchboard;

The switch board is disposed orthogonally to the plurality of back boards;

The plurality of backplanes are disposed on the other side of the backplane device, and are disposed in parallel with the line card, and the plurality of backplanes further include a backplane gap disposed through the backplane gap pair The backboard device performs ventilation and heat dissipation;

a fan disposed outside the gap of the backboard;

The high speed signal connection is performed between the line card and the switch board through the plurality of back boards.
The communication device of claim 8, wherein the backplane device further comprises:

a midplane disposed between the two sides of the backplane device, configured to fix the position of the line card, the plurality of backplanes and the switchboard, and/or to perform low speed signals and/or power signals Transmission.
The communication device according to claim 9, wherein the predetermined area of the middle plate is hollowed out or provided with ventilation holes provided for ventilation, and/or the plurality of back plates and the exchange plate are orthogonally arranged A connector is connected, and the plurality of backplanes and the line card are connected by a coplanar connector.