WO2017118385A1 - Three-layer sub-rack, single board and heat dissipation system - Google Patents

Three-layer sub-rack, single board and heat dissipation system Download PDF

Info

Publication number
WO2017118385A1
WO2017118385A1 PCT/CN2017/070169 CN2017070169W WO2017118385A1 WO 2017118385 A1 WO2017118385 A1 WO 2017118385A1 CN 2017070169 W CN2017070169 W CN 2017070169W WO 2017118385 A1 WO2017118385 A1 WO 2017118385A1
Authority
WO
WIPO (PCT)
Prior art keywords
subrack
board
heat dissipation
veneer
layer
Prior art date
Application number
PCT/CN2017/070169
Other languages
French (fr)
Chinese (zh)
Inventor
叶兵
关童童
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN201610013337.5 priority Critical
Priority to CN201610013337.5A priority patent/CN106954364A/en
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2017118385A1 publication Critical patent/WO2017118385A1/en

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127Natural convection

Abstract

Provided are a three-layer sub-rack, a single board, and a heat dissipation system. The three-layer sub-rack comprises an upper-layer sub-rack 30, a middle-layer sub-rack 31, and a lower-layer sub-rack 32, an upper-layer heat dissipation vent 33 provided between the upper-layer sub-rack 30 and the middle-layer sub-rack 31, and a lower-layer heat dissipation vent 34 provided between the middle-layer sub-rack 31 and the lower-layer sub-rack 32. The height of the upper-layer heat dissipation vent 33 is 0 to 1U and /or the height of the lower-layer heat dissipation vent 34 is 0 to 1U. The embodiments of the present invention solve the problem of a high link loss caused by long wiring on a backplate of a single board, shorten the wiring of the backplate of the single board, and reduce the link loss.

Description

Three-layer subrack, single board and cooling system Technical field

The embodiments of the present invention relate to the field of communications, and in particular, to a three-layer subrack, a single board, and a heat dissipation system.

Background technique

With the rapid development of optical communication technology, the cross-capacity requirements of the data exchange equipment based on this technology are getting higher and higher. The industry needs to adopt a belt type design on the sub-frame structure for this large-capacity structure. A variety of air duct designs.

Referring to FIG. 1 , a common single-sided three-layer heat dissipation air channel design is shown, in which a plurality of service boards are vertically inserted in the upper and lower layers, and a plurality of cross boards are inserted horizontally in the middle layer, the upper service boards are inserted, and the lower service boards are inverted. The upper and lower backplane high-speed connectors of the upper and lower layers are as close as possible to the cross-board, and the upper, middle and lower sub-frame air passages are relatively independent and do not affect each other. The upper air duct of the subrack is drawn into the cold air by the wind on the side of the cross plate 2U (1U=44.45 mm), and the hot air is discharged through the top of the cabinet; the lower air duct of the subrack is drawn into the cold air from the bottom end of the cabinet, and is discharged from the 2U air hole at the lower side of the cross plate. Hot air; the middle layer of the sub-rack is drawn into the cold air from the gap between the right side of the cross plate and the side edge of the cabinet, and the hot air is discharged from the left side of the cross plate.

Referring to FIG. 2, the sub-rack structure of the single-sided three-layer heat dissipation air duct is shown. The upper and lower layers of the sub-frame are completely separated from the middle layer by the partition plate, so that the three-layer air passage of the sub-frame is relatively independent and does not affect each other; There are 2U air-filling holes between the lower rail and the upper rail of the lower sub-frame and the partition of the sub-frame of the sub-frame to form the air passage of the upper and lower layers of the sub-frame.

Due to the design of the subrack structure, although the heat dissipation condition of the single board is good, because there is a 2U air supply hole between the upper layer, the lower layer and the middle layer of the subrack, the backplane of the service board and the cross board is connected at a high speed. Relatively more than 2U of space distance, for reducing backplane routing, reducing link loss is not good.

Summary of the invention

The embodiments of the present invention provide a three-layer subrack, a single board, and a heat dissipation system, so as to at least solve the problem of large link loss caused by the long trace of the backplane of the related technology board.

According to an aspect of an embodiment of the present invention, a three-layer subrack is provided, including an upper subrack 30, a middle subrack 31, a lower subrack 32, and the upper subrack 30 and the middle subrack 31. An upper heat dissipation air hole 33, and a lower heat dissipation air hole 34 disposed between the middle layer subrack 31 and the lower layer subrack 32, the upper heat dissipation air hole 33 having a height of 0 to 1 U, and/or The lower layer of the heat dissipation air holes 34 has a height of 0 to 1 U.

Optionally, in a case where the height of the upper heat dissipation air hole 33 is 0, the upper subrack 30 is used for fixing the first single board, wherein the first board fixed on the upper subrack 30 The first board has a first air-filling hole having a height of 2 U, and the first air-filling hole is disposed on a side of the first board adjacent to the middle layer sub-frame 31, and the first single board A board connector 41 is also disposed on a side of the first board adjacent to the middle subrack 31.

Optionally, in a case where the height of the upper heat dissipation air hole 33 is 1U, the upper subrack 30 is used for fixing the first single board, wherein the first one fixed on the upper subrack 30 is The first board has a first air-filling hole having a height of 1 U, and the first air-filling hole is disposed on a side of the first board adjacent to the middle layer sub-frame 31, and the first single board A board connector 41 is also disposed on a side of the first board adjacent to the middle subrack 31.

Optionally, in a case where the height of the lower layer heat dissipation vent 34 is 0, the lower subrack 32 is used to fix the second veneer, wherein the second layer is fixed on the lower subrack 32. The single board has a second air-filling hole having a height of 2 U, and the second air-filling hole is disposed on a side of the second board adjacent to the middle layer sub-frame 31, and the second single board is second. A board connector 41 is also disposed on a side of the second board adjacent to the middle subrack 31.

Optionally, in a case where the height of the lower layer heat dissipation vent 34 is 1 U, the lower subrack 32 is used to fix the second veneer, wherein the second frame is fixed on the lower subrack 32. The veneer has a second air-filling hole having a height of 1 U, the second air-filling hole is disposed on a side of the second veneer adjacent to the middle sub-frame 31, and the second veneer A board connector 41 is also disposed on a side of the second board adjacent to the middle subrack 31.

Optionally, the three-layer subrack is a single-sided sub-frame or a double-sided sub-frame.

According to another aspect of the present invention, a board is provided for the above-mentioned three-layer subrack, which includes a device area 40 and a single board connector 41, and the board further includes: a supplemental air hole, wherein The air-filling hole is disposed on a lower side of the device region 40, and the height of the air-filling hole is 2U to 1U; the single-board connector 41 is connected to the device region 40, and is disposed on the air supply The hole and/or the right side of the device region 40.

Optionally, the height of the air filling hole is 2U.

Optionally, the air filling hole has a height of 1 U.

According to another aspect of the present invention, a heat dissipation system is further provided, comprising: the above three-layer subrack, and the first single board and/or the second single board, wherein the first The veneer and/or the second veneer are the veneers described above.

According to the embodiment of the present invention, a three-layer subrack is adopted, including an upper subrack 30, a middle subrack 31, a lower subrack 32, and an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31. And a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, the height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U, The problem of large link loss caused by the long trace of the backplane of the board shortens the backplane trace of the board and reduces link loss.

DRAWINGS

The drawings described herein are intended to provide a further understanding of the invention, and are intended to be a part of the invention. In the drawing:

1 is a schematic structural view of a heat dissipation air passage based on a single-sided subrack according to the related art;

2 is a schematic structural view of a single-sided subrack according to the related art;

3 is a schematic structural view of a three-layer subrack according to an embodiment of the present invention;

4 is a schematic structural diagram of a single board according to an embodiment of the present invention;

FIG. 5 is a first schematic diagram of a heat dissipation air passage structure based on a single-sided subrack according to an alternative embodiment of the present invention; FIG.

6 is a second schematic diagram of a heat dissipation air passage structure based on a single-sided subrack according to an alternative embodiment of the present invention;

7 is a schematic structural view 1 of a heat dissipation air passage based on a double-sided subrack according to an alternative embodiment of the present invention;

FIG. 8 is a second schematic diagram of a heat dissipation air passage structure based on a double-sided subrack according to an alternative embodiment of the present invention.

detailed description

The invention will be described in detail below with reference to the drawings in conjunction with the embodiments. It should be noted that the embodiments in the present application and the features in the embodiments may be combined with each other without conflict.

It is to be understood that the terms "first", "second" and the like in the specification and claims of the present invention are used to distinguish similar objects, and are not necessarily used to describe a particular order or order.

In this embodiment, a three-layer subrack is provided. FIG. 3 is a schematic structural diagram of a three-layer subrack according to an embodiment of the present invention. As shown in FIG. 3, the three-layer subrack includes: an upper subrack 30 and a middle layer. a subrack 31, a lower subrack 32, an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31, and a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, among them,

The height of the upper heat dissipation air holes 33 is 0 to 1 U, and/or the height of the lower heat dissipation air holes 34 is 0 to 1 U.

Through the above three-layer subrack, after the height of the upper heat dissipation air hole 33 is reduced from 2U to 1U or 0, the length of the backplane trace of the single board on the upper subrack 30 can be shortened; in the lower layer heat dissipation air hole 3424 After the height is reduced from 2U to 1U or 0, the length of the backplane of the single board on the lower subrack 32 can be shortened. It can be seen that the above-mentioned three-layer subrack solves the problem of large link loss caused by the long trace of the backplane of the board, shortens the backplane trace of the board, and reduces link loss.

In a specific implementation, the total height of the subrack is still a subrack of the same height of the related art, for example, a 42U subrack. The upper heat dissipation air hole 33 or the lower heat dissipation air hole 34 is lowered in height, and accordingly, the upper subrack 30 or the lower subrack 32 is increased in height. The increased height of the upper subrack 30 or the lower subrack 32 can be used to set the air supply holes of the single board, thereby ensuring that the overall heat dissipation effect of the subrack remains substantially unchanged.

For example, in a case where the height of the upper heat dissipation air hole 33 is 0, the upper subrack 30 is used to fix the first veneer, wherein the first veneer fixed on the upper subrack 30 has the first compensation of 2 U in height. The air hole, the first air hole is disposed on a side of the first board adjacent to the middle subrack 31, and the first board connector 41 of the first board is also disposed on the first board near the middle subrack 31. One side.

For example, in a case where the height of the upper heat dissipation air vent 33 is 1 U, the upper subrack 30 is used to fix the first veneer, wherein the first veneer fixed on the upper subrack 30 has the first compensation of 1 U in height. a wind hole, the first air hole is disposed on a side of the first board adjacent to the middle subrack 31, and the first board connector 41 of the first board is also disposed on the first board near the middle layer One side of the frame 31.

For example, in a case where the height of the lower layer heat dissipation vent 34 is 0, the lower subrack 32 is used to fix the second veneer, wherein the second veneer fixed on the lower subrack 32 has a second complement having a height of 2 U. The air hole, the second air hole is disposed on a side of the second board adjacent to the middle subrack 31, and the second board connector 41 of the second board is also disposed on the second board near the middle subrack 31. One side.

For example, in a case where the height of the lower heat dissipation air vent 34 is 1 U, the lower subrack 32 is used to fix the second veneer, wherein the second veneer fixed on the lower subrack 32 has a second complement having a height of 1 U. The air hole, the second air hole is disposed on a side of the second board adjacent to the middle subrack 31, and the second board connector 41 of the second board is also disposed on the second board near the middle subrack 31. One side.

Optionally, the three-layer subrack described above may be a single-sided subrack or a double-sided subrack.

A single board applied to the above three-layer subrack is also provided in this embodiment. 4 is a schematic structural diagram of a single board according to an embodiment of the present invention. As shown in FIG. 4, the board includes: a device area 40 and a single board connector 41. The board further includes: a wind filling hole 42 The hole 42 is disposed on the lower side of the device region 40, and the height of the air-filling hole 42 is 2U to 1U; the single-plate connector 41 is connected to the device region 40 and disposed on the right side of the air-filling hole 42 and/or the device region 40.

The board provided in this embodiment solves the problem of large link loss caused by the long cable length of the backplane of the board, shortens the backplane routing of the board, and reduces the link loss. The heat dissipation performance of the subrack.

Optionally, the height of the air filling hole 42 is 2U.

Optionally, the height of the air filling hole 42 is 1U.

A heat dissipation system is further provided in the embodiment, comprising: the above three-layer subrack, and the first veneer inserted into the upper subrack 30 and/or the second veneer inserted into the lower subrack 32, wherein A single board and/or a second board is a single board applied to the above three-layer subrack.

In order to make the description of the embodiments of the present invention more clear, the following description and description are made in conjunction with the exemplary embodiments.

An alternative embodiment of the present invention provides a heat dissipation air channel, which can be applied to data exchange devices of optical communication technologies such as OTN and PTN.

A data communication device based on an optical communication technology such as an OTN or a PTN generally includes a plurality of service boards (a single board) and a plurality of cross boards. The service board establishes a data link with the cross board through a high-speed interconnect line on the backplane. The belt-shaped sub-frame structure is used to form a special heat dissipation air channel, which can ensure the high-speed trace length of the back board as much as possible under the premise of good heat dissipation of the board, reduce link loss, and make the device have relatively good signal characteristics and Cross capacity.

In order to solve the above problem, an alternative embodiment of the present invention provides a heat dissipation air channel scheme to reduce the spatial distance between the service board and the cross board on a related basis, which is advantageous for shortening the high-speed line length of the back board and reducing the link. loss.

Refer to Figure 5. Compared with the one-sided sub-rack heat dissipation air channel design shown in FIG. 1 , other dimensions and structures are not changed on the sub-rack structure, and the upper and lower slot heights of the sub-frame and the service board panel portion are improved. Figure The guide rails of the service board slots shown in the figure extend 1U to the cross-board area, so that the service board size is relatively increased by 1U. At the same time, a 1U air-filling hole is left in the upper part of the service board panel, so that the high-speed connector of the lower board of the service board is relatively closer to the cross-board, and the space between the upper and lower layers of the sub-rack is reduced by 1U, which shortens the backplane. High-speed trace length is beneficial for reducing losses. Compared with the original sub-frame structure, although the height of the air inlet hole area of the upper and lower layers is reduced to 1U, at the same time, the 1U air supply hole is added to the single-board panel, and the heat dissipation effect is not substantially reduced compared with the original.

Refer to Figure 6. Compared with the one-sided sub-rack heat dissipation air channel design shown in FIG. 1 , other dimensions and structures are not changed on the sub-rack structure, and the upper and lower slot heights of the sub-frame and the service board panel portion are improved. Extend the rail of the service board slot shown in the figure to the cross-board area by 2U, so that the service board size is increased by 2U. At the same time, a 2U air supply hole is left in the upper part of the service board panel, so that the service board and the cross board are directly connected in the slot, but the air duct is physically completely isolated, and the lower back board high speed connector is very close to the cross board, and the subrack upper and lower layers The distance between the space and the middle layer is reduced to 0, which shortens the length of the high-speed trace of the backplane, which is very beneficial for reducing the loss. Compared with the original subrack structure, although the air inlet hole area of the upper and lower layers is removed, at the same time, the 2U air supply hole is added to the single board panel, and the heat dissipation effect is not substantially reduced compared with the original.

Refer to Figure 7. Compared with the one-sided sub-frame heat dissipation air channel design shown in FIG. 1 , the expansion is a double-sided sub-rack structure, and other basic dimensions and structures are not changed, and the upper and lower slot heights and service boards of the double-sided sub-frame are The panel section is improved. Extend the rail of the service board slot shown in the figure to the cross-board area by 1U, so that the service board size is increased by 1U. At the same time, a 1U air-filling hole is left in the upper part of the service board panel, so that the high-speed connector of the lower board of the service board is relatively closer to the cross-board, and the space between the upper and lower layers of the sub-rack is reduced by 1U, which shortens the backplane. High-speed trace length is beneficial for reducing losses. Compared with the original sub-frame structure, although the height of the air inlet hole area of the upper and lower layers is reduced to 1U, at the same time, the 1U air supply hole is added to the single-board panel, and the heat dissipation effect is not substantially reduced compared with the original. After expansion, the two sides of the double-sided sub-frame are independent of each other.

Refer to Figure 8. Compared with the single-sided sub-rack heat dissipation air channel design shown in FIG. 1 , the expansion is a double-sided sub-frame structure, and other basic dimensions and structures are not changed, and the height and service of the upper and lower slots of the double-sided sub-frame are also The panel panel section was improved. Extend the rail of the service board slot shown in the figure to the cross-board area by 2U, so that the service board size is increased by 2U. At the same time, a 2U air supply hole is left in the upper part of the service board panel, so that the service board and the cross board are directly connected in the slot position, and the high speed connector of the lower back board is very close to the cross board, and the space distance between the upper and lower layers of the subrack is relatively small. The original reduction to 0 shortens the length of the high-speed trace of the backplane, which is very beneficial for reducing the loss. Compared with the original subrack structure, although the air inlet hole area of the upper and lower layers is removed, at the same time, the 2U air supply hole is added to the single board panel, and the heat dissipation effect is not substantially reduced compared with the original. After expansion, the two sides of the double-sided sub-frame are independent of each other.

The foregoing solution used in the optional embodiment of the present invention adopts the method of optimizing the subrack structure to implement the improvement of the related air duct structure, and reduces the relative spatial distance between the service board and the cross board compared with the related art. The length of the high-speed trace of the backplane is shortened, which is beneficial to reduce transmission loss.

It will be apparent to those skilled in the art that the various modules or steps of the present invention described above can be implemented by a general-purpose computing device that can be centralized on a single computing device or distributed across a network of multiple computing devices. Alternatively, they may be implemented by program code executable by the computing device such that they may be stored in the storage device by the computing device and, in some cases, may be different from the order herein. Perform the steps shown or described, or separate them into individual integrated circuit modules, or make multiple modules or steps into a single The integrated circuit module is implemented. Thus, the invention is not limited to any specific combination of hardware and software.

The above description is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and various modifications and changes can be made to the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and scope of the present invention are intended to be included within the scope of the present invention.

Industrial applicability

In the embodiment of the present invention, a three-layer subrack is adopted, including an upper subrack 30, a middle subrack 31, a lower subrack 32, and an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31. And a lower heat dissipation air hole 34 disposed between the middle subrack 31 and the lower subrack 32, the height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U, The problem of large link loss caused by the long trace of the backplane of the board is solved. The backplane trace of the board is shortened and the link loss is reduced.

Claims (10)

  1. A three-layer subrack includes an upper subrack 30, a middle subrack 31, a lower subrack 32, an upper heat dissipation air hole 33 disposed between the upper subrack 30 and the middle subrack 31, and a lower layer air vent 34 between the middle subrack 31 and the lower subrack 32,
    The height of the upper heat dissipation air hole 33 is 0 to 1 U, and/or the height of the lower heat dissipation air hole 34 is 0 to 1 U.
  2. The three-layer subrack according to claim 1, wherein the upper subrack 30 is used for fixing the first veneer in a case where the height of the upper heat dissipation air hole 33 is 0, wherein the The first veneer on the upper subrack 30 has a first air supply hole having a height of 2 U, and the first air supply hole is disposed on a side of the first veneer adjacent to the middle subrack 31. The first single board connector 41 of the first board is also disposed on a side of the first board adjacent to the middle layer subrack 31.
  3. The three-layer subrack according to claim 1, wherein the upper subrack 30 is used for fixing the first veneer in a case where the height of the upper heat dissipation air hole 33 is 1 U, wherein the The first veneer on the upper subrack 30 has a first air supply hole having a height of 1 U, and the first air supply hole is disposed on a side of the first veneer adjacent to the middle subrack 31. The first single board connector 41 of the first board is also disposed on a side of the first board adjacent to the middle layer subrack 31.
  4. The three-layer subrack according to claim 1, wherein the lower subrack 32 is used for fixing the second veneer in a case where the height of the lower heat dissipation vent 34 is 0, wherein the The second veneer on the lower subrack 32 has a second air supply hole having a height of 2 U, and the second air supply hole is disposed on a side of the second veneer adjacent to the middle subrack 31. The second board connector 41 of the second board is also disposed on a side of the second board adjacent to the middle subrack 31.
  5. The three-layer subrack according to claim 1, wherein the lower subrack 32 is used for fixing the second veneer in the case where the height of the lower heat dissipation vent 34 is 1 U, wherein the The second veneer on the lower subrack 32 has a second air supply hole having a height of 1 U, and the second air supply hole is disposed on a side of the second veneer adjacent to the middle subrack 31. The second board connector 41 of the second board is also disposed on a side of the second board adjacent to the middle subrack 31.
  6. The three-layer subrack according to any one of claims 1 to 5, wherein the three-layer subrack is a single-sided sub-frame or a double-sided sub-frame.
  7. A board for a three-layer sub-rack according to any one of claims 1 to 6, comprising a device area 40 and a single-board connector 41, the board further comprising: a wind-filling hole, wherein
    The air filling hole is disposed on a lower side of the device region 40, and the height of the air filling hole is 2U to 1U;
    The single board connector 41 is connected to the device region 40 and disposed on the right side of the air supply hole and/or the device region 40.
  8. The veneer according to claim 7, wherein the air filling hole has a height of 2 U.
  9. The veneer according to claim 7, wherein the air filling hole has a height of 1 U.
  10. A heat dissipation system comprising: the three-layer subrack according to any one of claims 1 to 6, and the first veneer and/or the second veneer, wherein the first veneer And/or the second veneer is a veneer according to any one of claims 7 to 9.
PCT/CN2017/070169 2016-01-06 2017-01-04 Three-layer sub-rack, single board and heat dissipation system WO2017118385A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201610013337.5 2016-01-06
CN201610013337.5A CN106954364A (en) 2016-01-06 2016-01-06 Three straton framves, veneer and cooling system

Publications (1)

Publication Number Publication Date
WO2017118385A1 true WO2017118385A1 (en) 2017-07-13

Family

ID=59273278

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/070169 WO2017118385A1 (en) 2016-01-06 2017-01-04 Three-layer sub-rack, single board and heat dissipation system

Country Status (2)

Country Link
CN (1) CN106954364A (en)
WO (1) WO2017118385A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004228310A (en) * 2003-01-22 2004-08-12 Nec Mobiling Ltd Cabinet for heat dissipation
US7633754B1 (en) * 2008-08-27 2009-12-15 Ciena Corporation Air cooling system for an electronics rack
WO2010148362A1 (en) * 2009-06-18 2010-12-23 Intelicloud Technology, Inc. Improved computer server chassis
CN103677101A (en) * 2012-09-21 2014-03-26 英业达科技有限公司 Server
US8737067B1 (en) * 2011-04-01 2014-05-27 Juniper Networks, Inc. Connectivity scheme and cooling scheme for a large rack system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102724848B (en) * 2012-05-31 2014-12-03 华为技术有限公司 Network cabinet
CN104812184B (en) * 2014-01-23 2018-05-04 华为技术有限公司 A kind of Air System
CN204906923U (en) * 2015-09-18 2015-12-23 湖南科技大学 Rack of intellectual detection system equipment is synthesized to train monitoring device host computer

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004228310A (en) * 2003-01-22 2004-08-12 Nec Mobiling Ltd Cabinet for heat dissipation
US7633754B1 (en) * 2008-08-27 2009-12-15 Ciena Corporation Air cooling system for an electronics rack
WO2010148362A1 (en) * 2009-06-18 2010-12-23 Intelicloud Technology, Inc. Improved computer server chassis
US8737067B1 (en) * 2011-04-01 2014-05-27 Juniper Networks, Inc. Connectivity scheme and cooling scheme for a large rack system
CN103677101A (en) * 2012-09-21 2014-03-26 英业达科技有限公司 Server

Also Published As

Publication number Publication date
CN106954364A (en) 2017-07-14

Similar Documents

Publication Publication Date Title
EP2119250B1 (en) Telecommunication rack unit tray
US6611428B1 (en) Cabinet for cooling electronic modules
US10085358B2 (en) Technologies for sled architecture
US7173821B2 (en) Computer rack with power distribution system
US20090045889A1 (en) High-speed router with backplane using muli-diameter drilled thru-holes and vias
US6452789B1 (en) Packaging architecture for 32 processor server
US8116332B2 (en) Switch arbitration
US8842688B2 (en) Reducing cabling complexity in large-scale networks
US8164906B2 (en) Modular electronic enclosure
US9008485B2 (en) Attachment mechanisms employed to attach a rear housing section to a fiber optic housing, and related assemblies and methods
EP2672796A2 (en) Network communication device
EP2146563B1 (en) Airflow/cooling solution for chassis
JP4687621B2 (en) Communication module with switch function and communication device
US8908372B1 (en) Cooling a chassis by moving air through a midplane between two sets of channels oriented laterally relative to one another
US9019708B2 (en) Apparatus and systems having storage devices in a side accessible drive sled
US20070238326A1 (en) Module to couple to a plurality of backplanes in a chassis
US8866023B2 (en) Method and system for reducing trace length and capacitance in a large memory footprint
US20120019117A1 (en) Universal rack cable management system
US6935868B1 (en) Adjustable-width, dual-connector card module
US6997720B2 (en) Interconnecting module for the base of electronic equipment casing
US20130135811A1 (en) Architecture For A Robust Computing System
US8526182B2 (en) Cooling circulation system of server
WO2011137828A1 (en) Back plate, communication device and communication system
US20080112133A1 (en) Switch chassis
US20110222241A1 (en) High density switching platform with interbay connections arrangement

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17735823

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase in:

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17735823

Country of ref document: EP

Kind code of ref document: A1