CN110831393B - Communication equipment - Google Patents
Communication equipment Download PDFInfo
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- CN110831393B CN110831393B CN201810916743.1A CN201810916743A CN110831393B CN 110831393 B CN110831393 B CN 110831393B CN 201810916743 A CN201810916743 A CN 201810916743A CN 110831393 B CN110831393 B CN 110831393B
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- exchange plate
- air inlet
- heat dissipation
- service board
- fan box
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
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- Microelectronics & Electronic Packaging (AREA)
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention introduces a communication device, comprising: the device comprises a device main body, an exchange plate and a heat dissipation fan box of the exchange plate; the exchange plate is arranged in the equipment main body, and the heat dissipation fan box of the exchange plate is arranged on the back panel of the equipment main body; the heat dissipation fan box of the exchange plate is used for dissipating heat of the exchange plate; the air inlet surface of the radiating fan box of the exchange plate is provided with an air inlet hole, the air outlet surface of the radiating fan box of the exchange plate is provided with an air outlet hole, and the air inlet surface and the air outlet surface are perpendicular to each other; and a fan is arranged in the heat dissipation fan box of the exchange plate, and the rotating shaft of the fan is vertical to the air inlet surface. The invention improves the heat dissipation capability of the communication equipment.
Description
Technical Field
The invention relates to the technical field of communication product structures, in particular to communication equipment.
Background
Nowadays, with the increasing power consumption of communication equipment, the requirement for the heat dissipation capability of the communication equipment is also higher and higher. The heat dissipation capacity of the communication equipment is related to the area of an air inlet and an air outlet of the equipment, the wind resistance of the equipment and the capacity and the number of fans installed in the equipment. Any point can be changed to improve the heat dissipation capacity of the communication equipment. However, since the above factors are mutually restricted and influenced in the actual design process due to the influence of the size of the space, it is difficult to change any one of the factors. Therefore, how to improve the heat dissipation capability of the communication device is a problem that needs to be solved urgently.
Disclosure of Invention
The invention mainly aims to provide communication equipment, which can provide a brand new structural layout mode and improve the heat dissipation capacity of the communication equipment.
To achieve the above object, the present invention provides a communication device, comprising: the device comprises a device main body, an exchange plate and a heat dissipation fan box of the exchange plate;
the exchange plate is arranged in the equipment main body, and the heat dissipation fan box of the exchange plate is arranged on the back panel of the equipment main body;
the heat dissipation fan box of the exchange plate is used for dissipating heat of the exchange plate;
the air inlet surface of the radiating fan box of the exchange plate is provided with an air inlet hole, the air outlet surface of the radiating fan box of the exchange plate is provided with an air outlet hole, and the air inlet surface and the air outlet surface are perpendicular to each other; and a fan is arranged in the heat dissipation fan box of the exchange plate, and the rotating shaft of the fan is vertical to the air inlet surface.
Optionally, the fan is located near one end of the air inlet surface, and the air outlet on the air outlet surface is located at one end far away from the air inlet surface.
Optionally, the communication device further includes: a front baffle of the exchange plate;
the front baffle of the exchange plate is arranged on the front panel of the equipment main body, the position of the front baffle of the exchange plate is opposite to that of the exchange plate, and an air inlet channel is formed between the front baffle of the exchange plate and the exchange plate;
and the front baffle of the exchange plate is provided with an air inlet hole.
Optionally, an air outlet channel is formed between the exchange plate and the back panel of the device main body.
Optionally, the heat dissipation fan box of the exchange board is mounted on the back panel of the device main body, and includes:
the air inlet surface of the heat dissipation fan box of the exchange plate is positioned in the air outlet channel, and the air outlet surface of the heat dissipation fan box of the exchange plate is positioned on the plane where the back panel of the equipment main body is positioned.
Optionally, the air inlet face of the radiator fan box of the exchange plate is located in the air outlet channel, and includes:
in the horizontal direction, the air inlet surface of the heat dissipation fan box of the exchange plate is flush with the top or the bottom of the exchange plate.
Optionally, the heat dissipation fan boxes of the exchange plate are mounted at the upper edge position and the lower edge position of the projection of the exchange plate on the back panel of the device main body.
Optionally, the communication device further includes: a cabling rack;
the cabling rack is arranged on a front panel of the equipment main body;
the chute includes: the U-shaped support frame, the support panel and the ventilation panel; a U-shaped support frame is arranged on one surface of the support panel, a ventilation panel is arranged on the other surface of the support panel, and the ventilation panel is vertically arranged at the outer edge of the support panel;
an air inlet hole is formed in the ventilation panel.
Optionally, the communication device further includes: the service board and the front baffle of the service board;
the service board is arranged in the equipment main body;
the front baffle of the service board is arranged on the front panel of the equipment main body, the position of the front baffle of the service board is opposite to that of the service board, and an air inlet channel is formed between the front baffle of the service board and the service board.
Optionally, the communication device further includes: a heat dissipation fan box of the service board;
the heat dissipation fan box of the business board is arranged on the back panel of the equipment main body;
the heat dissipation fan box of the service board is used for dissipating heat of the service board;
the service board comprises a service board and a radiating fan box, wherein an air inlet face of the radiating fan box of the service board is provided with an air inlet hole, an air outlet face of the radiating fan box of the service board is provided with an air outlet hole, and the air inlet face and the air outlet face are parallel to each other; and a fan is arranged in the heat dissipation fan box of the service board, and the rotating shaft of the fan is perpendicular to the air inlet surface.
The communication equipment provided by the invention changes the structural layout of the traditional radiating fan box of the exchange plate, the air inlet surface and the air outlet surface of the radiating fan box of the exchange plate are vertically arranged, and the positions of the air outlet hole on the air outlet surface and the air inlet hole on the air inlet surface are pulled apart by a certain height, so that the air mixing area is increased; meanwhile, the number of the heat dissipation fan boxes of the exchange plate arranged on the back panel of the equipment main body can be increased, and the integral heat dissipation capability is improved. In addition, for the heat dissipation of the service board, the front baffle plate and the cabling rack of the service board can be provided with vent holes, so that the heat dissipation capability of the service board is improved.
Drawings
Fig. 1 is a schematic structural diagram of a communication device according to a first embodiment of the present invention;
fig. 2(a) is a front view of a heat radiation fan case of the exchange plate in the first embodiment of the present invention;
fig. 2(b) is a side view of a heat radiation fan case of the exchange plate in the first embodiment of the present invention;
fig. 2(c) is a schematic structural view of a heat dissipation fan case of the exchange plate in the first embodiment of the present invention;
fig. 3 is a schematic structural view of a heat dissipation fan box of an exchange plate in the prior art;
FIG. 4 is a schematic diagram of a back side of a communication device in the prior art
Fig. 5 is a schematic structural diagram of a communication device according to a second embodiment of the present invention;
fig. 6 is a layout diagram of a heat dissipation fan box of an exchange board on a communication device according to a second embodiment of the present invention;
fig. 7 is a schematic structural diagram of a communication device according to a third embodiment of the present invention;
FIG. 8 is a schematic structural view of a rack in a third embodiment of the present invention;
fig. 9 is a schematic structural view of a heat dissipation fan box of a service board in a third embodiment of the present invention;
fig. 10 is a schematic front view of a communication device according to a fourth embodiment of the present invention;
fig. 11 is a schematic back side view of a communication device according to a fourth embodiment of the present invention;
fig. 12 is a schematic view of the air flow direction in the fourth embodiment of the present invention.
Detailed Description
To further explain the technical means and effects of the present invention adopted to achieve the intended purpose, the present invention will be described in detail with reference to the accompanying drawings and preferred embodiments.
A first embodiment of the present invention provides a communication device, as shown in fig. 1, which specifically includes the following components: the apparatus main body 10, the exchange plate 20, and the heat dissipation fan box 30 of the exchange plate;
wherein, the apparatus body 10 includes: a front panel and a back panel;
the exchange board 20 is installed inside the apparatus main body 10;
a heat radiation fan case 30 of the exchange plate is attached to the back surface plate of the apparatus main body 10 to radiate heat from the exchange plate 20.
Specifically, as shown in fig. 2(a), 2(b), and 2(c), the heat dissipation fan case 30 of the exchange plate includes: an air inlet surface 301, an air outlet surface 302 and a fan 303;
wherein, an air inlet hole is arranged on the air inlet surface 301 of the heat radiation fan box 30 of the exchange plate, an air outlet hole is arranged on the air outlet surface 302 of the heat radiation fan box 30 of the exchange plate, and the air inlet surface 301 and the air outlet surface 302 are mutually vertical; a fan 303 is provided in the heat dissipation fan box 30 of the exchange plate, and a rotation axis of the fan 303 is perpendicular to the air intake surface 301.
Further, the fan 303 is located at one end close to the air inlet surface 301, and the air outlet on the air outlet surface 302 is located at one end far from the air inlet surface 301; preferably, the upper edge of the fan 303 is flush with the lower edge of the air outlet face 302.
The design of the heat dissipation fan box of the exchange plate in the prior art is shown in fig. 3, the air inlet surface and the air outlet surface in the heat dissipation fan box of the exchange plate in the prior art are parallel and opposite, and the rotation axis of the fan is perpendicular to the air inlet surface and the air outlet surface, so that the fan in the prior art is over against the exchange plate. However, due to the limitation of the depth dimension of the communication equipment, in the prior art, as shown in fig. 4, the heat dissipation fan boxes of the exchange board are generally arranged only on both sides of the back panel of the equipment main body. If the heat dissipation fan box of the exchange plate in the related art is disposed at the middle position of the back plate of the apparatus main body, the distance between the fan and the back plate and the distance between the fan and the exchange plate are too close due to the narrow gap between the exchange plate and the back plate of the apparatus main body, thereby affecting the operation capability of the fan and increasing the noise of the fan.
In the embodiment of the invention, the air inlet surface and the air outlet surface of the radiating fan box of the exchange plate are vertically arranged, and the positions of the air outlet hole on the air outlet surface and the air inlet hole on the air inlet surface are pulled apart by a certain height, so that an air mixing area is increased; meanwhile, the heat dissipation fan box of the exchange plate in the embodiment of the invention can be arranged at any position on the back plate of the device main body, and a plurality of heat dissipation fan boxes of the exchange plate can be arranged on the back plate, so that the whole heat dissipation capability can be improved.
A second embodiment of the present invention provides a communication device, as shown in fig. 5, where the communication device specifically includes the following components: the apparatus main body 10, the exchange plate 20, the heat radiation fan box 30 of the exchange plate, and the front baffle 40 of the exchange plate;
wherein, the apparatus body 10 includes: a front panel and a back panel;
the exchange board 20 is installed inside the apparatus main body 10;
a heat radiation fan box 30 for exchanging plates is installed on the back panel of the apparatus main body 10 for radiating heat to the exchange plate 20;
the front baffle 40 of the exchange plate is detachably arranged on the front panel of the equipment main body 10, and the front baffle 40 of the exchange plate is provided with an air inlet;
the position of the front baffle 40 of the exchange plate is opposite to the position of the exchange plate 20, and an air inlet channel is formed between the front baffle 40 of the exchange plate and the exchange plate 20;
an air outlet channel is formed between the exchange plate 20 and the back plate of the device main body 10.
Specifically, as shown in fig. 2(a), 2(b), and 2(c), the heat dissipation fan case 30 of the exchange plate includes: an air inlet surface 301, an air outlet surface 302 and a fan 303;
wherein, an air inlet hole is arranged on the air inlet surface 301 of the heat radiation fan box 30 of the exchange plate, an air outlet hole is arranged on the air outlet surface 302 of the heat radiation fan box 30 of the exchange plate, and the air inlet surface 301 and the air outlet surface 302 are mutually vertical; a fan 303 is provided in the heat dissipation fan box 30 of the exchange plate, and a rotation axis of the fan 303 is perpendicular to the air intake surface 301.
Further, the fan 303 is located at one end close to the air inlet surface 301, and the air outlet on the air outlet surface 302 is located at one end far from the air inlet surface 301; preferably, the upper edge of the fan 303 is flush with the lower edge of the outlet face 302.
The air inlet surface 301 of the heat dissipation fan box of the exchange plate is located in the air outlet channel, the air outlet surface 302 of the heat dissipation fan box of the exchange plate is located on the plane where the back panel of the device main body 10 is located, and the air outlet surface 302 is not located in the air outlet channel; preferably, the air inlet surface 301 of the heat dissipation fan box of the exchange plate is flush with the top or bottom of the exchange plate 20 in the horizontal direction.
Further, the heat radiation fan case 30 of the exchange plate is attached to both the upper side and the lower side of the projection of the exchange plate 20 on the rear panel of the apparatus main body 10. Preferably, as shown in fig. 6, two heat radiation fan boxes 30 of the parallel exchange plates are provided at the upper side of the exchange plate 20, and two heat radiation fan boxes 30 of the parallel exchange plates are also provided at the lower side of the exchange plate 20.
In the embodiment of the present invention, as shown in fig. 5, outside air enters the main body 10 through the air inlet holes on the front baffle 40 of the exchange plate, passes through the air inlet channel to the exchange plate 20, then passes through the air outlet channel, is blown in from the air inlet holes on the air inlet surface 301 of the heat dissipation fan box 30 of the exchange plate, passes through the fan 303, and is blown out from the air outlet holes on the air outlet surface 302.
A third embodiment of the present invention provides a communication device, as shown in fig. 7, where the communication device specifically includes the following components: the device comprises a device main body 10, a switching board 20, a heat radiation fan box 30 of the switching board, a front baffle 40 of the switching board, a wiring rack 50, a service board 60, a front baffle 70 of the service board and a heat radiation fan box 80 of the service board;
1) an apparatus body 10, comprising: a front panel and a back panel.
2) The exchange board 20 is installed inside the apparatus main body 10.
3) A heat radiation fan case 30 for exchanging plates is mounted on the rear surface plate of the apparatus main body 10 for radiating heat to the exchange plate 20.
Specifically, as shown in fig. 2(a), 2(b), and 2(c), the heat dissipation fan case 30 of the exchange plate includes: an air inlet surface 301, an air outlet surface 302 and a fan 303;
wherein, an air inlet hole is arranged on the air inlet surface 301 of the heat radiation fan box 30 of the exchange plate, an air outlet hole is arranged on the air outlet surface 302 of the heat radiation fan box 30 of the exchange plate, and the air inlet surface 301 and the air outlet surface 302 are mutually vertical; a fan 303 is provided in the heat dissipation fan box 30 of the exchange plate, and a rotation axis of the fan 303 is perpendicular to the air intake surface 301.
Further, the fan 303 is located at one end close to the air inlet surface 301, and the air outlet on the air outlet surface 302 is located at one end far from the air inlet surface 301; preferably, the upper edge of the fan 303 is flush with the lower edge of the outlet face 302.
Further, an air outlet channel is formed between the exchange plate 20 and the back plate of the device main body 10. The air inlet surface 301 is located in the air outlet channel, the air outlet surface 302 is located on a plane where a back panel of the device main body 10 is located, and the air outlet surface 302 is not located in the air outlet channel; preferably, the air inlet surface 301 of the heat dissipation fan box of the exchange plate is flush with the top or bottom of the exchange plate 20 in the horizontal direction. When the heat dissipation fan box 30 of the exchange plate is located on the upper side of the exchange plate 20, the air inlet surface 301 is flush with the top of the exchange plate 20, and the air outlet surface 302 deviates from the exchange plate 20; when the heat dissipation fan box 30 of the exchange plate is located at the lower side of the exchange plate 20, the air inlet surface 301 is flush with the bottom of the exchange plate 20, and the air outlet surface 302 faces away from the exchange plate 20.
4) The front baffle 40 of the exchange plate is detachably arranged on the front panel of the equipment main body 10, and the front baffle 40 of the exchange plate is provided with an air inlet;
the position of the front baffle 40 of the exchange plate is opposite to the position of the exchange plate 20, and an air inlet channel is formed between the front baffle 40 of the exchange plate and the exchange plate 20.
5) The rack 50 is detachably mounted on the front panel of the apparatus body 10.
Specifically, as shown in fig. 8, the rack 50 includes: a U-shaped support 501, a support panel 502 and a ventilation panel 503; a U-shaped support frame 501 is arranged on one surface of the support panel 502, a ventilation panel 503 is arranged on the other surface of the support panel 502, and the ventilation panel 503 is vertically arranged at the outer edge of the support panel 502; an air inlet hole is formed in the ventilation panel 503.
6) The service plate 60 is installed inside the apparatus body 10.
7) The front baffle 70 of the service board is installed on the front panel of the device body 10, the position of the front baffle 70 of the service board is opposite to the position of the service board 60, and an air inlet channel is formed between the front baffle 70 of the service board and the service board 60.
8) A heat radiation fan box 80 of the service board is mounted on the rear panel of the apparatus body 10 for radiating heat to the service board 60.
Specifically, as shown in fig. 9, the heat dissipation fan box 80 of the service board includes: an air inlet surface 801, an air outlet surface 802 and a fan 803;
an air inlet hole is formed in the air inlet surface 801, an air outlet hole is formed in the air outlet surface 802, and the air inlet surface 801 and the air outlet surface 802 are parallel to each other; a fan 803 is arranged in the heat dissipation fan box 80 of the service board, and a rotating shaft of the fan 803 is perpendicular to the air inlet surface 801 and the air outlet surface 802; the fan 803 is opposite to the service plate 60.
In the embodiment of the present invention, outside air enters the main body 10 through the air inlet holes on the front baffle 40 of the exchange plate, passes through the air inlet channel between the front baffle 40 of the exchange plate and the exchange plate 20 to reach the exchange plate 20, then passes through the air outlet channel between the exchange plate 20 and the back plate of the main body 10, is blown in from the air inlet holes on the air inlet face 301 of the heat dissipation fan box 30 of the exchange plate, passes through the fan 303, and is blown out from the air outlet holes on the air outlet face 302.
In the present embodiment, the rack 50 is utilized to dissipate heat from the service board 60. Outside air can enter the device body 10 through the air inlet holes on the ventilation panel 503 of the cabling rack 50 and/or the air inlet holes on the front baffle 70 of the service board, pass through the air inlet channel between the front baffle 70 of the service board and the service board 60 to reach the service board 60, and then pass through the heat dissipation fan box 80 of the service board to be blown out.
A fourth embodiment of the present invention provides a communication device, as shown in fig. 10, which is a schematic front structure diagram of the communication device, wherein the communication device includes: an upper layer cabling rack S1, an upper layer service board S2, an upper layer service board air inlet cover S3, a switch board S4, a lower layer service board air inlet cover S5, a lower layer service board S6 and a lower layer cabling rack S7; as shown in fig. 11, which is a schematic view of a back structure of the communication device, wherein the communication device further includes: the heat dissipation fan box S8 of the upper business board, the heat dissipation fan box S9 of the exchange board, and the heat dissipation fan box S10 of the lower business board.
The upper-layer cabling rack S1 is arranged above the upper-layer service board S2, and the upper-layer service board air inlet cover S3 is arranged below the upper-layer service board S2; the switch board S4 is located between the upper service board S2 and the lower service board S6; the lower-layer service board air inlet cover S5 is arranged above the lower-layer service board S6, and the lower-layer cabling rack S7 is arranged below the lower-layer service board S6; the heat dissipation fan box S8 of the upper service board is right opposite to the upper service board S2 to dissipate heat of the upper service board S2; the heat dissipation fan box S10 of the lower service board is right opposite to the lower service board S6 to dissipate heat of the lower service board S6; the two heat radiation fan boxes S9 are provided in parallel on the upper side of the exchange plate S4, and the two heat radiation fan boxes S9 are also provided in parallel on the lower side of the exchange plate S4.
The results of the upper tier rack S1 and the lower tier rack S7 are shown in FIG. 8, and include: a U-shaped support 501, a support panel 502 and a ventilation panel 503; a U-shaped support frame 501 is arranged on one surface of the support panel 502, a ventilation panel 503 is arranged on the other surface of the support panel 502, and the ventilation panel 503 is vertically arranged at the outer edge of the support panel 502; an air inlet hole is formed in the ventilation panel 503.
The embodiment of the invention utilizes the wiring rack in the prior art, and improves the heat dissipation capability of the communication equipment by arranging the air inlet holes on the wiring rack.
The upper layer service board air inlet cover S3 and the lower layer service board air inlet cover S5 are structures used for dissipating heat of the service board in the prior art, and air inlet holes are formed in the service board air inlet cover.
In the embodiment of the present invention, air inlet holes are further disposed on the front baffle of the upper service board S2 and the front baffle of the lower service board S6, so as to improve the heat dissipation capability of the communication device.
Therefore, compared with the prior art that the communication equipment is cooled only through the service board air inlet cover, the communication equipment can be cooled by one or more of the service board air inlet cover, the cabling rack and the front baffle of the service board. In the embodiment of the invention, the air inlet hole of the communication equipment can be arranged on a fixed structural part of the equipment and can also be arranged on a pluggable movable structural part of the equipment. It should be noted that, in practical applications, one or more of the vent holes arranged on the front baffle of the service panel, the air inlet cover of the service panel, the cabling rack and the service panel may be retained or cancelled according to practical requirements, and the air inlet volume is optimized by designing the aperture ratio and the size of the wind resistance of the air inlet hole.
The structure of the heat dissipation fan box S8 of the upper service board and the heat dissipation fan box S10 of the lower service board is shown in fig. 9, and includes: an air inlet surface 801, an air outlet surface 802 and a fan 803;
an air inlet hole is formed in the air inlet surface 801, an air outlet hole is formed in the air outlet surface 802, and the air inlet surface 801 and the air outlet surface 802 are parallel to each other; a fan 803 is arranged in the heat dissipation fan box of the service board, and the rotating shaft of the fan 803 is perpendicular to the air inlet surface 801 and the air outlet surface 802; the fan 803 is opposite to the service plate.
In the embodiment of the invention, the air inlet holes are arranged on the front baffle of the exchange board S4 to improve the heat dissipation capability of the communication equipment. The air inlet volume reaches the optimal design by designing the aperture ratio and the air resistance of the air inlet holes. An air inlet channel is formed between the front baffle of the exchange plate S4 and the exchange plate S4.
As shown in fig. 2(a), 2(b), and 2(c), the heat dissipation fan box S9 of the exchange plate includes: an air inlet surface 301, an air outlet surface 302 and a fan 303;
wherein, an air inlet hole is arranged on the air inlet surface 301, an air outlet hole is arranged on the air outlet surface 302, and the air inlet surface 301 and the air outlet surface 302 are mutually vertical; a fan 303 is provided in the heat radiation fan box S9 of the exchange plate, and the rotation axis of the fan 303 is perpendicular to the air intake surface 301.
Specifically, the fan 303 is located at one end close to the air inlet surface 301, and the air outlet hole on the air outlet surface 302 is located at one end far from the air inlet surface 301; preferably, the upper edge of the fan 303 is flush with the lower edge of the outlet face 302.
Further, an air outlet channel is formed between the exchange board S4 and the back panel of the communication device. The air inlet surface 301 is located in the air outlet channel, the air outlet surface 302 is located on a plane where a back panel of the communication equipment is located, and the air outlet surface 302 is not located in the air outlet channel.
In the embodiment of the invention, the air outlet channel of the exchange plate S4 has a turning direction in the middle due to the heat dissipation fan box S9 of the exchange plate, so that the air mixing area is enlarged. In this arrangement, the number of the heat dissipation fan boxes S9 of the exchange board may be one or more, thereby effectively improving the heat dissipation redundancy capability of the apparatus.
As shown in fig. 12, in the embodiment of the present invention, outside air is blown in through the air inlet holes provided in the upper-layer rack S1, the front baffle of the upper-layer service board S2, and the air inlet cover S3 of the upper-layer service board, and is blown out from the heat dissipation fan box S8 of the upper-layer service board through the area of the upper-layer service board S2; outside air is blown in through air inlet holes arranged on the air inlet cover S5 of the lower service board, the front baffle of the lower service board S6 and the lower wiring rack S7, passes through the area S6 of the lower service board and is blown out from the radiating fan box S10 of the lower service board; outside air is blown through the air inlet holes provided in the front baffle of the exchange panel S4, passes through the area of the exchange panel S4, and is blown out of the heat dissipation fan box S9 of the exchange panel.
The communication equipment introduced in the embodiment of the invention changes the structural layout of the traditional radiating fan box of the exchange plate, the air inlet surface and the air outlet surface of the radiating fan box of the exchange plate are vertically arranged, and the positions of the air outlet hole on the air outlet surface and the air inlet hole on the air inlet surface are pulled apart by a certain height, so that the air mixing area is increased; meanwhile, the number of the heat dissipation fan boxes of the exchange plate arranged on the back panel of the equipment main body can be increased, and the integral heat dissipation capability is improved. In addition, for the heat dissipation of the service board, the front baffle plate and the cabling rack of the service board can be provided with vent holes, so that the heat dissipation capability of the service board is improved.
While the invention has been described in connection with specific embodiments thereof, it is to be understood that it is intended by the appended drawings and description that the invention may be embodied in other specific forms without departing from the spirit or scope of the invention.
Claims (10)
1. A communication device, comprising: the device comprises a device main body, an exchange plate and a heat dissipation fan box of the exchange plate;
the exchange plate is arranged in the equipment main body, and the heat dissipation fan box of the exchange plate is arranged on the back panel of the equipment main body;
the heat dissipation fan box of the exchange plate is used for dissipating heat of the exchange plate;
the air inlet surface of the radiating fan box of the exchange plate is provided with an air inlet hole, the air outlet surface of the radiating fan box of the exchange plate is provided with an air outlet hole, and the air inlet surface and the air outlet surface are perpendicular to each other; and a fan is arranged in the heat dissipation fan box of the exchange plate, and the rotating shaft of the fan is vertical to the air inlet surface.
2. The communication device as claimed in claim 1, wherein the fan is located at an end close to the air inlet surface, and the air outlet of the air outlet surface is located at an end far from the air inlet surface.
3. The communication device of claim 1, further comprising: a front baffle of the exchange plate;
the front baffle of the exchange plate is arranged on the front panel of the equipment main body, the position of the front baffle of the exchange plate is opposite to that of the exchange plate, and an air inlet channel is formed between the front baffle of the exchange plate and the exchange plate;
and the front baffle of the exchange plate is provided with an air inlet hole.
4. The communication apparatus according to claim 1, wherein an air outlet passage is formed between the exchange plate and a back plate of the apparatus main body.
5. The communication apparatus according to claim 4, wherein the heat dissipation fan case of the exchange board is mounted on a back surface plate of the apparatus main body, comprising:
the air inlet surface of the heat dissipation fan box of the exchange plate is positioned in the air outlet channel, and the air outlet surface of the heat dissipation fan box of the exchange plate is positioned on the plane where the back panel of the equipment main body is positioned.
6. The communication device of claim 5, wherein the air inlet surface of the heat dissipation fan box of the exchange plate is located in the air outlet channel, and comprises:
in the horizontal direction, the air inlet surface of the heat dissipation fan box of the exchange plate is flush with the top or the bottom of the exchange plate.
7. The communication apparatus according to any one of claims 1 to 6, wherein a heat radiation fan case of the exchange plate is attached to both upper and lower positions of a projection of the exchange plate on a rear surface plate of the apparatus main body.
8. The communication device of claim 1, further comprising: a cabling rack;
the cabling rack is arranged on a front panel of the equipment main body;
the chute includes: the U-shaped support frame, the support panel and the ventilation panel; a U-shaped support frame is arranged on one surface of the support panel, a ventilation panel is arranged on the other surface of the support panel, and the ventilation panel is vertically arranged at the outer edge of the support panel;
an air inlet hole is formed in the ventilation panel.
9. The communication device of claim 1, further comprising: the service board and the front baffle of the service board;
the service board is arranged in the equipment main body;
the front baffle of the service board is arranged on the front panel of the equipment main body, the position of the front baffle of the service board is opposite to that of the service board, and an air inlet channel is formed between the front baffle of the service board and the service board.
10. The communication device of claim 9, further comprising: a heat dissipation fan box of the service board;
the heat dissipation fan box of the business board is arranged on the back panel of the equipment main body;
the heat dissipation fan box of the service board is used for dissipating heat of the service board;
the service board comprises a service board and a radiating fan box, wherein an air inlet face of the radiating fan box of the service board is provided with an air inlet hole, an air outlet face of the radiating fan box of the service board is provided with an air outlet hole, and the air inlet face and the air outlet face are parallel to each other; and a fan is arranged in the heat dissipation fan box of the service board, and the rotating shaft of the fan is perpendicular to the air inlet surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810916743.1A CN110831393B (en) | 2018-08-13 | 2018-08-13 | Communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810916743.1A CN110831393B (en) | 2018-08-13 | 2018-08-13 | Communication equipment |
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| CN110831393A CN110831393A (en) | 2020-02-21 |
| CN110831393B true CN110831393B (en) | 2022-08-05 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2729785Y (en) * | 2004-09-30 | 2005-09-28 | 深圳市豪腾电脑科技有限公司 | Heat sink for computer |
| CN201008247Y (en) * | 2007-03-01 | 2008-01-16 | 大连捷成实业发展有限公司 | Large scale switch matrix cabinet |
| CN103079386A (en) * | 2012-12-31 | 2013-05-01 | 迈普通信技术股份有限公司 | Heat dissipation structure of rack-mounted communication equipment |
| CN103841792A (en) * | 2012-11-22 | 2014-06-04 | 华为技术有限公司 | Cooling system |
| CN107317770A (en) * | 2016-04-27 | 2017-11-03 | 中兴通讯股份有限公司 | Back board device, communication equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090195981A1 (en) * | 2008-01-31 | 2009-08-06 | Tek-Chain Technology Co., Ltd. | Heat dissipating air flow channel structure of electronic device |
| EP2941107B1 (en) * | 2012-12-31 | 2019-09-18 | Huawei Technologies Co., Ltd. | Heat dissipation system for communication device |
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- 2018-08-13 CN CN201810916743.1A patent/CN110831393B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2729785Y (en) * | 2004-09-30 | 2005-09-28 | 深圳市豪腾电脑科技有限公司 | Heat sink for computer |
| CN201008247Y (en) * | 2007-03-01 | 2008-01-16 | 大连捷成实业发展有限公司 | Large scale switch matrix cabinet |
| CN103841792A (en) * | 2012-11-22 | 2014-06-04 | 华为技术有限公司 | Cooling system |
| CN103079386A (en) * | 2012-12-31 | 2013-05-01 | 迈普通信技术股份有限公司 | Heat dissipation structure of rack-mounted communication equipment |
| CN107317770A (en) * | 2016-04-27 | 2017-11-03 | 中兴通讯股份有限公司 | Back board device, communication equipment |
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| CN110831393A (en) | 2020-02-21 |
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