WO2017193721A1 - Modular router - Google Patents

Modular router Download PDF

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Publication number
WO2017193721A1
WO2017193721A1 PCT/CN2017/078413 CN2017078413W WO2017193721A1 WO 2017193721 A1 WO2017193721 A1 WO 2017193721A1 CN 2017078413 W CN2017078413 W CN 2017078413W WO 2017193721 A1 WO2017193721 A1 WO 2017193721A1
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Prior art keywords
packet forwarding
heat dissipation
unit
switching
forwarding unit
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PCT/CN2017/078413
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French (fr)
Chinese (zh)
Inventor
张远望
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中兴通讯股份有限公司
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Publication of WO2017193721A1 publication Critical patent/WO2017193721A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04LTRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L45/00Routing or path finding of packets in data switching networks
    • H04L45/60Router architectures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans

Definitions

  • the present invention relates to the field of communication device applications, and in particular, to a modular router.
  • Optical interconnects are mainly used to solve the problem of shorter and shorter channel lengths caused by higher and higher backplane bus speeds.
  • Traditional electrical backplanes have become a key technology or bottleneck for high-capacity switches and router designs.
  • the main solutions of optical interconnection are optical waveguide backplane, optical fiber flexible board or direct optical fiber interconnection.
  • the current problem of optical waveguide is that the loss of waveguide material is still large, and the process of optical waveguide backplane and optical fiber flexible board is not yet Too mature, the use of optical fiber interconnection is relatively mature; at the same time, optical connectors used in optical interconnected boards are not yet able to meet the requirements of vertical mode; optical interface boards are serialized compared to traditional electrical backplanes, with small capacity.
  • the cost of the plug-in box has no advantage; the other is that the system's heat-dissipation bottleneck is prominent in the large system.
  • the power consumption of the cooling fan is a whole due to the system air duct, and the board is less wasteful when it is configured; the cost of the optical interconnect is also very expensive.
  • the present invention provides a modular router to solve the problem of limited capacity and scale of existing routing systems.
  • the present invention provides a modular router comprising: at least one packet forwarding unit, and a switching unit, the packet forwarding unit and the switching unit being connected by a cable.
  • the working mode of the switching unit is a single-level mode.
  • the packet forwarding unit includes an independent heat dissipation module and a power supply.
  • the heat dissipation module includes a heat dissipation fan and a heat pipe, and the heat pipe is configured to connect the heat dissipation chip in the package forwarding unit, and guide the heat of the heat dissipation chip to the air outlet position of the heat dissipation fan.
  • the packet forwarding unit is provided with two processing boards.
  • the packet forwarding unit is further included in the board optical module, and the board optical module is configured to connect the switching unit through the optical connector.
  • the switching unit includes a switching network board, a main control board, a power supply, and a cooling fan.
  • the number of switching stencils matches the number of packet forwarding units.
  • the switching network board is provided with multiple switching network chips and optical module interfaces, and the serial bus connected to the same optical module interface is connected to each switching network chip.
  • the packet forwarding unit and the switching unit are all provided with a standard optical module interface;
  • the cable includes a cable and an optical fiber, and the packet forwarding unit and the switching unit are connected according to a distance, and the cable or optical fiber connection is used based on the standard optical module interface.
  • the present invention provides a modular router, which is divided into a plurality of modular packet forwarding units and centralized switching units by using an integrated plug-in type router commonly used in the prior art, and is connected by a cable instead of a backplane.
  • the number and location of the packet forwarding units are no longer subject to the backplane in the plugged box, which solves the problem of limited capacity and scale of the existing routing system.
  • each packet forwarding unit independently considers the heat dissipation design, and the mutual influence of the system-level heat dissipation design also increases the reliability.
  • FIG. 1 is a schematic structural diagram of a modular router according to a first embodiment of the present invention
  • FIG. 2 is a schematic structural diagram of a modular router according to a second embodiment of the present invention.
  • FIG. 3 is a schematic structural diagram of a packet forwarding unit in a second embodiment of the present invention.
  • FIG. 4 is a schematic structural view of an exchange unit in a second embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a modular router according to a first embodiment of the present invention.
  • the modular router provided by the present invention includes: at least one packet forwarding unit 101 and an exchange unit 102.
  • the packet forwarding unit 101 and the switching unit 102 are connected by a cable.
  • the operating mode of the switching unit in the above embodiment is a single-level mode. In this way, the switching network only needs to work in a single-level mode, which saves half of the switching network chips compared to the cluster system.
  • the packet forwarding unit 101 in the above embodiment includes an independent heat dissipation module and a power supply. In this way, each packet forwarding unit independently considers the heat dissipation design, and the mutual influence of the system-level heat dissipation design also increases the reliability.
  • the heat dissipation module in the above embodiment includes a heat dissipation fan and a heat pipe, and the heat pipe is disposed to connect the heat dissipation chip in the package forwarding unit to guide the heat of the heat dissipation chip to the tuyere position of the heat dissipation fan. In this way, the heat dissipation effect of the packet forwarding unit is better.
  • the packet forwarding unit 101 in the above embodiment further includes a hardware management module, and the hardware management module is connected through a serial management bus.
  • the packet forwarding unit 101 in the above embodiment further includes a synchronous clock input interface that is connected by a coaxial or dual-axis cable.
  • the packet forwarding unit 101 in the above embodiment is provided with a two-layer processing board.
  • the packet forwarding unit 101 in the above embodiment further includes a board optical module, and the board optical module is disposed to connect the switching unit through the optical connector.
  • the board optical module can be used to connect the switching unit through the optical connector to solve the problem.
  • the switching unit 102 in the foregoing embodiment includes a switching network board, a main control board, a power supply, and a cooling fan.
  • the number of switching stencils in the above embodiments matches the number of packet forwarding units. In this way, different numbers of switching network boards can be configured to connect different numbers of packet forwarding units.
  • the switching network board in the foregoing embodiment is provided with a plurality of switching network chips and an optical module interface, and the serial bus interfaces connected to the same optical module are equally connected to the switching network chips.
  • the packet forwarding unit 101 and the switching unit 102 in the foregoing embodiments are all provided with a standard optical module interface;
  • the cable includes a cable and an optical fiber, and the packet forwarding unit 101 and the switching unit 102 are based on a distance, based on a standard optical module.
  • the interface uses a cable or fiber connection.
  • optical interconnects are mainly used to solve the problem of shorter and shorter channel lengths caused by higher and higher backplane bus speeds.
  • Traditional electrical backplanes have become a key technology or bottleneck for high-capacity switches and router designs.
  • the main solutions of optical interconnection include optical waveguide backplane, optical fiber flexible board or direct optical fiber interconnection.
  • the current problem of optical waveguide is that the loss of waveguide material is still large, and the process of optical waveguide backplane and optical fiber flexible board is still not mature.
  • the fiber optic interconnects are relatively mature. At the same time, the optical connectors used in optical interconnects are not well suited to the vertical mode. Optical serial boards are serialized compared to traditional electrical backplanes.
  • the cost of the small-capacity plug-in box has no advantage; the other is that the system's heat-dissipation bottleneck is prominent in the large system.
  • the power consumption of the cooling fan is a whole due to the system air duct, and the board is less wasteful when it is configured; the cost of the optical interconnect is also very expensive;
  • This embodiment designs a new modular architecture and the overall hardware of the communication equipment based on the architecture, which solves the high cost of the high-speed system, the optical waveguide technology and the optical connector are immature, the optical interconnection series has low cost performance, heat dissipation difficulty and system capacity. Problems such as limited size.
  • the modular architecture provided by the embodiment splits the integrated plug-in into a plurality of modular packet forwarding units and a centralized switching unit, and the connection is implemented by replacing the backplane with a cable.
  • the following parts are included:
  • 101 is a packet forwarding unit, which is composed of a packet processing board and an interface card.
  • the interface card can be designed to be modular and flexible for configuration.
  • 102 shows an integrated switching unit, which is composed of a switching network board 105 and a main control board.
  • the switching network board and the packet forwarding unit pass the standard optical module interface (such as QSFP28, CXP, etc.), use the optical fiber or close distance (usually less than 6 meters) when using the cable connection,
  • an Ethernet connection is used; in order to enhance the reliability of the system, a hardware management module can also be added, through the serial management bus. Connection (such as CAN, RS485, etc.); if the system requires the clock, you can also add a synchronous clock input interface, and connect through coaxial cable or dual-axis cable, as shown in Figure 2, 104.
  • the heat dissipation of the packet forwarding unit 101 is the key, but only the heat dissipation of one unit is considered, and the heat dissipation of the system is solved.
  • the heat pipe can be used to transfer heat to the air outlet to increase the heat dissipation efficiency. In order to select a suitable fan, the heat dissipation of the fan is increased.
  • the box structure of the forwarding unit can also be considered to use a height of 2U.
  • a modular router based on this modular architecture the system is connected to Figure 2 and connected using the CXP interface.
  • the packet forwarding unit 101 is designed as shown in FIG. 3, and optionally supports four or eight interface daughter cards, see 201; 202 is a cooling fan. Because the power of the key chip is large, the heat pipe can be used to guide the heat to the air outlet position to improve heat dissipation; 203 is a DC power supply unit; 204 is an Ethernet interface for communication. In the actual design, it can support 2 layers of processing boards, and the maximum scalable support 8T processing bandwidth; if the rear panel space is tight, BOA (Board Mount Optical Assembly) can be used to connect to the rear panel through optical connectors.
  • BOA Board Mount Optical Assembly
  • FIG. 4 shows the switching network board, 301 is the CXP optical module interface (2X12 way), and 302 is the switching network chip.
  • 301 is the CXP optical module interface (2X12 way)
  • 302 is the switching network chip.
  • this scheme supports up to 24 packet forwarding units.
  • This embodiment provides a modular hardware architecture and a communication device implemented based on the architecture, which can effectively solve the various problems described above. mainly includes:
  • Each packet forwarding unit is a separate router, and 2-3 units can be connected by a full mesh; different numbers of packet forwarding units can be connected to the integrated switching network unit, and different numbers of switching network boards can be configured to meet different configuration requirements;
  • fiber optic interconnection avoids the problem of the immature technology and process of the optical waveguide backplane, and also eliminates the cost of using the backplane and the limitation of the high-speed channel length;
  • Each packet forwarding unit independently considers the heat dissipation design, without the mutual influence of the system-level heat dissipation design, and also increases the reliability.
  • the heat dissipation problem of one unit is solved, and the heat dissipation problem of the system is also solved;
  • the system scale is not subject to the insertion box constraint, and the system with larger bandwidth can be configured.
  • the example of this patent can support 24 packet forwarding units, and the total processing bandwidth of the system can reach 192Tbps. If the switching network board increases the switching network chip, it can also support more. Large system. Compared with the cluster system, the design of the large system plug-in is also omitted. The switching network only needs to work in the single-level mode, eliminating half of the switching network chips.
  • the modular architecture is mainly shown in Figure 2.
  • the standard optical module interface is adopted, and the flexible configuration of the system is realized through modularization to meet the system's continuously increasing exchange bus speed.
  • the requirements of the system, and the cost of control is within an acceptable range.
  • the system can use the traditional router multi-level multi-plane switching (CLOS) architecture and chipset implementation, or use the super-cloud router's spine-leaf architecture to control and manage each unit through lossless Ethernet. Realize control, separation of forwarding planes, etc.
  • CLOS router multi-level multi-plane switching
  • the implementation of the packet processing unit 101 mainly focuses on the optical interconnection interface, and selects an appropriate interface form according to the switching capacity of the module to meet bandwidth and panel space requirements.
  • the heat dissipation of the packet forwarding unit is another important point, and the heat dissipation needs to be optimized according to the power consumption and internal layout of the chip. Meet the requirements; management, control plane communication interface and hardware management interface, clock interface, etc. can be arranged according to the needs.
  • the design of the switch board is the choice of the optical interface. You need to refer to the choice of the packet forwarding unit. If there are multiple switching network chips, you should also pay attention to the bus division of different switching network chips to each optical module to facilitate supporting more packages. Forwarding unit.
  • the standard optical module interface basically has the corresponding cable assembly.
  • the QSFP28 is more suitable at the 25G rate, and the CXP cable is thicker, but the QSFP28 is It will bring more problems in occupying panel space, and it needs to be comprehensively selected according to the plan and requirements.
  • the present invention provides a modular router, which is divided into a plurality of modular packet forwarding units and centralized switching units by using an integrated plug-in type router commonly used in the prior art, and is connected by a cable instead of a backplane. In this way, the number and location of the packet forwarding units are no longer subject to the backplane in the plugged box, which solves the problem of limited capacity and scale of the existing routing system.
  • each packet forwarding unit independently considers the heat dissipation design, and the mutual influence of the system-level heat dissipation design also increases the reliability.
  • the modular router provided by the embodiment of the present invention has the following beneficial effects: the problem of the capacity and scale of the existing routing system is solved.
  • each packet forwarding unit independently considers the heat dissipation design, and has no system.
  • the interaction of the thermal design of the stage increases the reliability.

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Abstract

Disclosed is a modular router, comprising at least one packet forwarding unit and a switching unit. The packet forwarding unit is connected to the switching unit by means of a cable. By means of implementation of the present invention, a common integrated router in the form of a subrack in the prior art is split into a plurality of modular packet forwarding units and a centralized switching unit, and connection is implemented by means of a cable instead of a back plate. In this way, the number and locations of the packet forwarding units are no longer limited by the back plate in the subrack, so that the problems of limited capacity and scale of the existing routing system are solved. Optionally, heat dissipation design is considered independently for each packet forwarding unit, so that the effect of system-level heat dissipation design is avoided, and the reliability is improved.

Description

一种模块化路由器a modular router 技术领域Technical field
本发明涉及通信设备运用领域,尤其涉及一种模块化路由器。The present invention relates to the field of communication device applications, and in particular, to a modular router.
背景技术Background technique
随着光互联技术的发展,当前通信设备内部高速总线的速率越来越高,汇聚及核心节点的通信设备转发带宽需求越来越大,且都为一体化插箱或集群系统;板卡功耗越来越高,散热也已经成为路由系统设计的瓶颈。With the development of optical interconnect technology, the speed of the high-speed bus in the current communication equipment is getting higher and higher, and the bandwidth of the communication equipment of the aggregation and core nodes is increasing, and both are integrated plug-in or cluster systems; The consumption is getting higher and higher, and heat dissipation has become the bottleneck of routing system design.
光互联主要是为了解决越来越高的背板总线速率导致的通道长度越来越短的问题,传统电背板已经成为大容量交换机、路由器设计的关键技术或瓶颈。当前,光互联主要的解决方案有光波导背板、光纤软板或直接光纤互联,但是,光波导目前的问题是波导材料损耗仍然较大,光波导背板及光纤软板的工艺也还不太成熟,使用光纤互联相对比较成熟;同时,光互联的单板使用的光连接器目前也还不能很好满足垂直方式等使用需求;光接口单板系列化相比传统电背板,小容量插箱的成本没有优势;另外就是系统的散热瓶颈在大系统里比较突出,散热风扇的功耗因系统风道是个整体,配置单板少时浪费明显;光互联的成本也非常昂贵。Optical interconnects are mainly used to solve the problem of shorter and shorter channel lengths caused by higher and higher backplane bus speeds. Traditional electrical backplanes have become a key technology or bottleneck for high-capacity switches and router designs. At present, the main solutions of optical interconnection are optical waveguide backplane, optical fiber flexible board or direct optical fiber interconnection. However, the current problem of optical waveguide is that the loss of waveguide material is still large, and the process of optical waveguide backplane and optical fiber flexible board is not yet Too mature, the use of optical fiber interconnection is relatively mature; at the same time, optical connectors used in optical interconnected boards are not yet able to meet the requirements of vertical mode; optical interface boards are serialized compared to traditional electrical backplanes, with small capacity. The cost of the plug-in box has no advantage; the other is that the system's heat-dissipation bottleneck is prominent in the large system. The power consumption of the cooling fan is a whole due to the system air duct, and the board is less wasteful when it is configured; the cost of the optical interconnect is also very expensive.
针对上述问题,提出一种模块化路由器架构,以解决现有路由系统容量及规模受限的问题,是本领域技术人员亟待解决的技术问题。Aiming at the above problems, a modular router architecture is proposed to solve the problem that the capacity and scale of the existing routing system are limited, which is a technical problem to be solved by those skilled in the art.
发明内容Summary of the invention
本发明提供了一种模块化路由器,以解决现有路由系统容量及规模受限的问题。The present invention provides a modular router to solve the problem of limited capacity and scale of existing routing systems.
本发明提供了一种模块化路由器,其包括:至少一个包转发单元、以及交换单元,包转发单元与交换单元通过线缆连接。The present invention provides a modular router comprising: at least one packet forwarding unit, and a switching unit, the packet forwarding unit and the switching unit being connected by a cable.
可选的,交换单元的工作模式为单级模式。 Optionally, the working mode of the switching unit is a single-level mode.
可选的,包转发单元包括独立的散热模块及供电电源。Optionally, the packet forwarding unit includes an independent heat dissipation module and a power supply.
可选的,散热模块包括散热风扇以及热管,热管设置为连接包转发单元内散热芯片,将散热芯片的热量引导至散热风扇的风口位置。Optionally, the heat dissipation module includes a heat dissipation fan and a heat pipe, and the heat pipe is configured to connect the heat dissipation chip in the package forwarding unit, and guide the heat of the heat dissipation chip to the air outlet position of the heat dissipation fan.
可选的,包转发单元设置有两层处理板。Optionally, the packet forwarding unit is provided with two processing boards.
可选的,包转发单元还包括在板光模块,在板光模块设置为通过光连接器连接交换单元。Optionally, the packet forwarding unit is further included in the board optical module, and the board optical module is configured to connect the switching unit through the optical connector.
可选的,交换单元包括交换网板、主控板、电源及散热风扇。Optionally, the switching unit includes a switching network board, a main control board, a power supply, and a cooling fan.
可选的,交换网板的数量与包转发单元的数量匹配。Optionally, the number of switching stencils matches the number of packet forwarding units.
可选的,交换网板设置有多个交换网芯片以及光模块接口,同一个光模块接口连接的串行总线均分连接到各交换网芯片。Optionally, the switching network board is provided with multiple switching network chips and optical module interfaces, and the serial bus connected to the same optical module interface is connected to each switching network chip.
可选的,包转发单元以及交换单元均设置有标准光模块接口;线缆包括电缆及光纤,包转发单元与交换单元根据距离远近,基于标准光模块接口使用电缆或光纤连接。Optionally, the packet forwarding unit and the switching unit are all provided with a standard optical module interface; the cable includes a cable and an optical fiber, and the packet forwarding unit and the switching unit are connected according to a distance, and the cable or optical fiber connection is used based on the standard optical module interface.
本发明的有益效果:The beneficial effects of the invention:
本发明提供了一种模块化路由器,通过将现有技术中常用的一体化插箱形式的路由器拆分为多个模块化的包转发单元和集中的交换单元,通过线缆替代背板实现连接,这样,包转发单元的数量及设置位置不再受制于插箱内的背板,解决了现有路由系统容量及规模受限的问题。可选的,每个包转发单元独立考虑散热设计,无系统级散热设计的相互影响,也增加了可靠性。The present invention provides a modular router, which is divided into a plurality of modular packet forwarding units and centralized switching units by using an integrated plug-in type router commonly used in the prior art, and is connected by a cable instead of a backplane. In this way, the number and location of the packet forwarding units are no longer subject to the backplane in the plugged box, which solves the problem of limited capacity and scale of the existing routing system. Optionally, each packet forwarding unit independently considers the heat dissipation design, and the mutual influence of the system-level heat dissipation design also increases the reliability.
附图说明DRAWINGS
图1为本发明第一实施例提供的模块化路由器的结构示意图;1 is a schematic structural diagram of a modular router according to a first embodiment of the present invention;
图2为本发明第二实施例提供的模块化路由器的结构示意图;2 is a schematic structural diagram of a modular router according to a second embodiment of the present invention;
图3是本发明第二实施例中的包转发单元的结构示意图;3 is a schematic structural diagram of a packet forwarding unit in a second embodiment of the present invention;
图4是本发明第二实施例中的交换单元的结构示意图。 4 is a schematic structural view of an exchange unit in a second embodiment of the present invention.
具体实施方式detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例只是本发明中一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention are clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present invention. It is obvious that the described embodiments are only a part of the embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts are within the scope of the present invention.
现通过具体实施方式结合附图的方式对本发明做出进一步的诠释说明。The invention will now be further illustrated by way of specific embodiments in conjunction with the accompanying drawings.
第一实施例:First embodiment:
图1为本发明第一实施例提供的模块化路由器的结构示意图,由图1可知,在本实施例中,本发明提供的模块化路由器包括:至少一个包转发单元101、以及交换单元102,包转发单元101与交换单元102通过线缆连接。FIG. 1 is a schematic structural diagram of a modular router according to a first embodiment of the present invention. As shown in FIG. 1 , in the embodiment, the modular router provided by the present invention includes: at least one packet forwarding unit 101 and an exchange unit 102. The packet forwarding unit 101 and the switching unit 102 are connected by a cable.
在一些实施例中,上述实施例中的交换单元的工作模式为单级模式。这样,交换网只需要工作在单级模式,相比集群系统,省去了一半的交换网芯片。In some embodiments, the operating mode of the switching unit in the above embodiment is a single-level mode. In this way, the switching network only needs to work in a single-level mode, which saves half of the switching network chips compared to the cluster system.
在一些实施例中,上述实施例中的包转发单元101包括独立的散热模块及供电电源。这样,每个包转发单元独立考虑散热设计,无系统级散热设计的相互影响,也增加了可靠性。In some embodiments, the packet forwarding unit 101 in the above embodiment includes an independent heat dissipation module and a power supply. In this way, each packet forwarding unit independently considers the heat dissipation design, and the mutual influence of the system-level heat dissipation design also increases the reliability.
在一些实施例中,上述实施例中的散热模块包括散热风扇以及热管,热管设置为连接包转发单元内散热芯片,将散热芯片的热量引导至散热风扇的风口位置。这样,包转发单元的散热效果更好。In some embodiments, the heat dissipation module in the above embodiment includes a heat dissipation fan and a heat pipe, and the heat pipe is disposed to connect the heat dissipation chip in the package forwarding unit to guide the heat of the heat dissipation chip to the tuyere position of the heat dissipation fan. In this way, the heat dissipation effect of the packet forwarding unit is better.
在一些实施例中,上述实施例中的包转发单元101还包括硬件管理模块,硬件管理模块通过串行管理总线连接。In some embodiments, the packet forwarding unit 101 in the above embodiment further includes a hardware management module, and the hardware management module is connected through a serial management bus.
在一些实施例中,上述实施例中的包转发单元101还包括同步时钟输入接口,同步时钟输入接口通过同轴或双轴电缆连接。 In some embodiments, the packet forwarding unit 101 in the above embodiment further includes a synchronous clock input interface that is connected by a coaxial or dual-axis cable.
在一些实施例中,上述实施例中的包转发单元101设置有两层处理板。In some embodiments, the packet forwarding unit 101 in the above embodiment is provided with a two-layer processing board.
在一些实施例中,上述实施例中的包转发单元101还包括在板光模块,在板光模块设置为通过光连接器连接交换单元。在实际应用中,根据运用场景,例如需要处理的数据容量过大导致后面板空间不足,就可以使用在板光模块于通过光连接器连接交换单元,以解决这个问题。In some embodiments, the packet forwarding unit 101 in the above embodiment further includes a board optical module, and the board optical module is disposed to connect the switching unit through the optical connector. In practical applications, depending on the application scenario, for example, if the data capacity to be processed is too large and the rear panel space is insufficient, the board optical module can be used to connect the switching unit through the optical connector to solve the problem.
在一些实施例中,上述实施例中的交换单元102包括交换网板、主控板、电源及散热风扇。In some embodiments, the switching unit 102 in the foregoing embodiment includes a switching network board, a main control board, a power supply, and a cooling fan.
在一些实施例中,上述实施例中的交换网板的数量与包转发单元的数量匹配。这样,配置不同数量的交换网板,可以连接不同数量的包转发单元。In some embodiments, the number of switching stencils in the above embodiments matches the number of packet forwarding units. In this way, different numbers of switching network boards can be configured to connect different numbers of packet forwarding units.
在一些实施例中,上述实施例中的交换网板设置有多个交换网芯片以及光模块接口,同一个光模块接口连接的串行总线均分连接到各交换网芯片。In some embodiments, the switching network board in the foregoing embodiment is provided with a plurality of switching network chips and an optical module interface, and the serial bus interfaces connected to the same optical module are equally connected to the switching network chips.
在一些实施例中,上述实施例中的包转发单元101以及交换单元102均设置有标准光模块接口;线缆包括电缆及光纤,包转发单元101与交换单元102根据距离远近,基于标准光模块接口使用电缆或光纤连接。In some embodiments, the packet forwarding unit 101 and the switching unit 102 in the foregoing embodiments are all provided with a standard optical module interface; the cable includes a cable and an optical fiber, and the packet forwarding unit 101 and the switching unit 102 are based on a distance, based on a standard optical module. The interface uses a cable or fiber connection.
第二实施例:Second embodiment:
现结合具体应用场景对本发明做进一步的诠释说明。The present invention will be further explained in conjunction with specific application scenarios.
通信设备内部高速总线速率越来越高,有向光互联发展趋势;汇聚及核心节点的通信设备转发带宽需求越来越大,且都为一体化插箱或集群系统;板卡功耗越来越高,散热也已经成为系统设计的瓶颈。光互联主要是为了解决越来越高的背板总线速率导致的通道长度越来越短的问题,传统电背板已经成为大容量交换机、路由器设计的关键技术或瓶颈。光互联主要的解决方案有光波导背板、光纤软板或直接光纤互联,光波导目前的问题是波导材料损耗仍然较大,光波导背板及光纤软板的工艺也还不太成熟,使用光纤互联相对比较成熟;同时,光互联的单板使用的光连接器目前也还不能很好满足垂直方式等使用需求;光接口单板系列化相比传统电背板, 小容量插箱的成本没有优势;另外就是系统的散热瓶颈在大系统里比较突出,散热风扇的功耗因系统风道是个整体,配置单板少时浪费明显;光互联的成本也非常昂贵;The high-speed bus speed of communication equipment is getting higher and higher, and there is a trend toward optical interconnection; the convergence bandwidth of communication equipment of aggregation and core nodes is increasing, and all are integrated plug-in or cluster systems; The higher the heat has become the bottleneck of system design. Optical interconnects are mainly used to solve the problem of shorter and shorter channel lengths caused by higher and higher backplane bus speeds. Traditional electrical backplanes have become a key technology or bottleneck for high-capacity switches and router designs. The main solutions of optical interconnection include optical waveguide backplane, optical fiber flexible board or direct optical fiber interconnection. The current problem of optical waveguide is that the loss of waveguide material is still large, and the process of optical waveguide backplane and optical fiber flexible board is still not mature. The fiber optic interconnects are relatively mature. At the same time, the optical connectors used in optical interconnects are not well suited to the vertical mode. Optical serial boards are serialized compared to traditional electrical backplanes. The cost of the small-capacity plug-in box has no advantage; the other is that the system's heat-dissipation bottleneck is prominent in the large system. The power consumption of the cooling fan is a whole due to the system air duct, and the board is less wasteful when it is configured; the cost of the optical interconnect is also very expensive;
本实施例设计了一种新型模块化架构及基于此架构实现的通信设备硬件总体,解决高速系统成本高,光波导工艺、光连接器不成熟,光互联系列化性价比低,散热困难及系统容量规模受限等问题。This embodiment designs a new modular architecture and the overall hardware of the communication equipment based on the architecture, which solves the high cost of the high-speed system, the optical waveguide technology and the optical connector are immature, the optical interconnection series has low cost performance, heat dissipation difficulty and system capacity. Problems such as limited size.
在实际应用中,本实施例提供的模块化架构将一体化插箱拆分为多个模块化的包转发单元和集中的交换单元,通过线缆替代背板实现连接。如图2所示,包括如下部分:In a practical application, the modular architecture provided by the embodiment splits the integrated plug-in into a plurality of modular packet forwarding units and a centralized switching unit, and the connection is implemented by replacing the backplane with a cable. As shown in Figure 2, the following parts are included:
图中101所示为包转发单元,由包处理板和接口卡组成,接口卡可以设计成模块化,便于灵活配置;图中102所示为集成交换单元,由交换网板105、主控板106、电源107、风扇108等部分组成;交换网板和包转发单元之间通过标准的光模块接口(如QSFP28、CXP等),使用光纤或近距离(通常小于6米)时使用电缆连接,如图中103所示;为了实现集成交换网单元中主控板对包处理单元的控制、管理,使用以太网连接;为了增强系统的可靠性,还可以增加硬件管理模块,通过串行管理总线连接(如CAN、RS485等);如果系统对时钟有要求,还可以增加同步时钟输入接口,并通过同轴电缆或双轴电缆连接,如图2中104所示。In the figure, 101 is a packet forwarding unit, which is composed of a packet processing board and an interface card. The interface card can be designed to be modular and flexible for configuration. 102 shows an integrated switching unit, which is composed of a switching network board 105 and a main control board. 106, the power supply 107, the fan 108 and the like; the switching network board and the packet forwarding unit pass the standard optical module interface (such as QSFP28, CXP, etc.), use the optical fiber or close distance (usually less than 6 meters) when using the cable connection, As shown in the figure 103, in order to realize the control and management of the packet processing unit of the main control board in the integrated switching network unit, an Ethernet connection is used; in order to enhance the reliability of the system, a hardware management module can also be added, through the serial management bus. Connection (such as CAN, RS485, etc.); if the system requires the clock, you can also add a synchronous clock input interface, and connect through coaxial cable or dual-axis cable, as shown in Figure 2, 104.
包转发单元101的散热是关键,但只需考虑解决一个单元的散热,系统的散热也就解决了,内部可以考虑使用热管将热量转移到风口增加散热效率,为了选择合适风扇,增加风扇的散热效果,转发单元的盒式结构也可以考虑使用2U的高度。The heat dissipation of the packet forwarding unit 101 is the key, but only the heat dissipation of one unit is considered, and the heat dissipation of the system is solved. The heat pipe can be used to transfer heat to the air outlet to increase the heat dissipation efficiency. In order to select a suitable fan, the heat dissipation of the fan is increased. For the effect, the box structure of the forwarding unit can also be considered to use a height of 2U.
基于此模块化架构设计的一款模块化路由器,系统连接同图2,使用CXP接口连接。A modular router based on this modular architecture, the system is connected to Figure 2 and connected using the CXP interface.
包转发单元101设计参见图3所示,可选择支持4个或8个接口子卡,见201;202为散热风扇,因关键芯片功率较大,可以使用热管将热量导到风口位置改善散热;203为直流电源单元;204为通信用的以太网接口。 在实际设计中,可以支持2层处理板,最大可扩展支持8T处理带宽;如果后面板空间紧张也可以使用BOA(Board Mount Optical Assembly,在板光模块),通过光连接器连接到后面板。The packet forwarding unit 101 is designed as shown in FIG. 3, and optionally supports four or eight interface daughter cards, see 201; 202 is a cooling fan. Because the power of the key chip is large, the heat pipe can be used to guide the heat to the air outlet position to improve heat dissipation; 203 is a DC power supply unit; 204 is an Ethernet interface for communication. In the actual design, it can support 2 layers of processing boards, and the maximum scalable support 8T processing bandwidth; if the rear panel space is tight, BOA (Board Mount Optical Assembly) can be used to connect to the rear panel through optical connectors.
图4所示为交换网板示意,301为CXP光模块接口(2X12路),302为交换网芯片,为了连接更多的包转发单元,需要两个芯片分别出一半的serdes总线到同一个光模块,此方案最多支持连接24个包转发单元。Figure 4 shows the switching network board, 301 is the CXP optical module interface (2X12 way), and 302 is the switching network chip. In order to connect more packet forwarding units, two chips are required to output half of the serdes bus to the same light. Module, this scheme supports up to 24 packet forwarding units.
本实施例提供一种模块化硬件架构及基于此架构实现的通信设备,可以有效解决前面述及的各个问题。主要包括:This embodiment provides a modular hardware architecture and a communication device implemented based on the architecture, which can effectively solve the various problems described above. mainly includes:
1.此模块化架构可以实现灵活的配置,很方便实现系列化,解决了光接口单板用于小插箱的性价比低问题。每一台包转发单元都是一台独立的路由器,2-3台可以采用full mesh连接;不同数量的包转发单元可以连接集成交换网单元,配置不同数量的交换网板满足不同配置需求;1. This modular architecture can implement flexible configuration, which is convenient for serialization and solves the problem of low cost performance of optical interface boards for small insertion boxes. Each packet forwarding unit is a separate router, and 2-3 units can be connected by a full mesh; different numbers of packet forwarding units can be connected to the integrated switching network unit, and different numbers of switching network boards can be configured to meet different configuration requirements;
2.使用光纤互联回避了光波导背板技术及工艺不成熟的问题,也省去了使用背板的费用及高速通道长度约束;2. The use of fiber optic interconnection avoids the problem of the immature technology and process of the optical waveguide backplane, and also eliminates the cost of using the backplane and the limitation of the high-speed channel length;
3.使用标准的光模块接口替代了使用光连接器,回避了系列不全、正交光连接器技术不成熟及需要定制的困难;3. The use of a standard optical module interface instead of the use of optical connectors, avoiding the incomplete series, the orthogonal optical connector technology is immature and the need to customize;
4.每个包转发单元独立考虑散热设计,无系统级散热设计的相互影响,也增加了可靠性,一个单元的散热问题解决了,系统的散热问题也就解决了;4. Each packet forwarding unit independently considers the heat dissipation design, without the mutual influence of the system-level heat dissipation design, and also increases the reliability. The heat dissipation problem of one unit is solved, and the heat dissipation problem of the system is also solved;
5.对于配置规模较小,可以考虑使用标准的CXP、QSFP28电缆连接代替光连接,可以节省连接成本;5. For the smaller configuration, you can consider using standard CXP and QSFP28 cable connections instead of optical connections, which can save connection costs.
6.系统规模不受插箱约束,可以配置较大带宽的系统,本专利的实例可以支持24个包转发单元,系统总处理带宽可以达到192Tbps,如果交换网板增加交换网芯片还可以支持更大系统。相比集群系统同样省去大系统插箱的设计,交换网只需要工作在单级模式,省去了一半的交换网芯片。6. The system scale is not subject to the insertion box constraint, and the system with larger bandwidth can be configured. The example of this patent can support 24 packet forwarding units, and the total processing bandwidth of the system can reach 192Tbps. If the switching network board increases the switching network chip, it can also support more. Large system. Compared with the cluster system, the design of the large system plug-in is also omitted. The switching network only needs to work in the single-level mode, eliminating half of the switching network chips.
模块化架构主要是参见图2示意,采用标准光模块接口,通过模块化思想,实现系统的灵活配置,满足系统不断提高的交换总线速率下实现大 系统的需求,并且控制成本在可接受范围。The modular architecture is mainly shown in Figure 2. The standard optical module interface is adopted, and the flexible configuration of the system is realized through modularization to meet the system's continuously increasing exchange bus speed. The requirements of the system, and the cost of control is within an acceptable range.
系统可以使用传统的路由器多级多平面交换(CLOS)架构及套片实现,也可以使用超级云路由器的叶脊架构(spine-leaf),通过无损以太网实现各单元间的控制、管理,并实现控制、转发面分离等。The system can use the traditional router multi-level multi-plane switching (CLOS) architecture and chipset implementation, or use the super-cloud router's spine-leaf architecture to control and manage each unit through lossless Ethernet. Realize control, separation of forwarding planes, etc.
包处理单元101的实现主要关注光互联接口,根据模块的交换容量选择合适的接口形式等满足带宽及面板空间需求;包转发单元的散热是另一个重点,需要根据芯片功耗及内部布局优化散热满足要求;管理、控制面的通信接口及硬件管理接口、时钟接口等根据需要合理安排即可。The implementation of the packet processing unit 101 mainly focuses on the optical interconnection interface, and selects an appropriate interface form according to the switching capacity of the module to meet bandwidth and panel space requirements. The heat dissipation of the packet forwarding unit is another important point, and the heat dissipation needs to be optimized according to the power consumption and internal layout of the chip. Meet the requirements; management, control plane communication interface and hardware management interface, clock interface, etc. can be arranged according to the needs.
交换板的设计关键在光接口的选择,需要参考包转发单元的选择,如果有多片交换网芯片还要注意将不同交换网芯片的总线等分汇总到各个光模块中便于支持更多的包转发单元。The design of the switch board is the choice of the optical interface. You need to refer to the choice of the packet forwarding unit. If there are multiple switching network chips, you should also pay attention to the bus division of different switching network chips to each optical module to facilitate supporting more packages. Forwarding unit.
连接距离较近时选择双轴电缆组件替代光缆连接可以节省连接成本,标准的光模块接口基本都有对应电缆组件,25G速率时使用QSFP28形式较合适,使用CXP的线缆较粗,但QSFP28又会带来占用面板空间较多问题,需要根据方案和需求综合选择。When the connection distance is close, the choice of the dual-axis cable assembly instead of the fiber-optic cable connection can save the connection cost. The standard optical module interface basically has the corresponding cable assembly. The QSFP28 is more suitable at the 25G rate, and the CXP cable is thicker, but the QSFP28 is It will bring more problems in occupying panel space, and it needs to be comprehensively selected according to the plan and requirements.
综上可知,通过本发明的实施,至少存在以下有益效果:In summary, through the implementation of the present invention, at least the following beneficial effects exist:
本发明提供了一种模块化路由器,通过将现有技术中常用的一体化插箱形式的路由器拆分为多个模块化的包转发单元和集中的交换单元,通过线缆替代背板实现连接,这样,包转发单元的数量及设置位置不再受制于插箱内的背板,解决了现有路由系统容量及规模受限的问题。The present invention provides a modular router, which is divided into a plurality of modular packet forwarding units and centralized switching units by using an integrated plug-in type router commonly used in the prior art, and is connected by a cable instead of a backplane. In this way, the number and location of the packet forwarding units are no longer subject to the backplane in the plugged box, which solves the problem of limited capacity and scale of the existing routing system.
可选的,每个包转发单元独立考虑散热设计,无系统级散热设计的相互影响,也增加了可靠性。Optionally, each packet forwarding unit independently considers the heat dissipation design, and the mutual influence of the system-level heat dissipation design also increases the reliability.
以上仅是本发明的具体实施方式而已,并非对本发明做任何形式上的限制,凡是依据本发明的技术实质对以上实施方式所做的任意简单修改、等同变化、结合或修饰,均仍属于本发明技术方案的保护范围。The above is only a specific embodiment of the present invention, and is not intended to limit the present invention in any way. Any simple modification, equivalent change, combination or modification of the above embodiments in accordance with the technical spirit of the present invention is still in the present invention. The scope of protection of the technical solution of the invention.
工业实用性 Industrial applicability
如上所述,本发明实施例提供的一种模块化路由器具有以下有益效果:解决了现有路由系统容量及规模受限的问题,可选的,每个包转发单元独立考虑散热设计,无系统级散热设计的相互影响,增加了可靠性。 As described above, the modular router provided by the embodiment of the present invention has the following beneficial effects: the problem of the capacity and scale of the existing routing system is solved. Optionally, each packet forwarding unit independently considers the heat dissipation design, and has no system. The interaction of the thermal design of the stage increases the reliability.

Claims (10)

  1. 一种模块化路由器,包括:至少一个包转发单元、以及交换单元,所述包转发单元与所述交换单元通过线缆连接。A modular router includes: at least one packet forwarding unit, and a switching unit, the packet forwarding unit and the switching unit being connected by a cable.
  2. 如权利要求1所述的模块化路由器,其中,所述交换单元的工作模式为单级模式。The modular router of claim 1 wherein said switching unit operates in a single-level mode.
  3. 如权利要求1所述的模块化路由器,其中,各包转发单元包括独立的散热模块及供电电源。The modular router of claim 1 wherein each packet forwarding unit comprises an independent heat dissipation module and a power supply.
  4. 如权利要求3所述的模块化路由器,其中,所述散热模块包括散热风扇以及热管,所述热管设置为连接所述包转发单元内散热芯片,将所述散热芯片的热量引导至所述散热风扇的风口位置。The modular router according to claim 3, wherein the heat dissipation module comprises a heat dissipation fan and a heat pipe, the heat pipe is configured to connect a heat dissipation chip in the package forwarding unit, and guide heat of the heat dissipation chip to the heat dissipation The position of the tuyere of the fan.
  5. 如权利要求3所述的模块化路由器,其中,所述包转发单元设置有两层处理板。The modular router of claim 3 wherein said packet forwarding unit is provided with a two layer processing board.
  6. 如权利要求3所述的模块化路由器,其中,所述包转发单元还包括在板光模块,所述在板光模块设置为通过光连接器连接所述交换单元。The modular router of claim 3 wherein said packet forwarding unit is further comprised in a panel light module, said onboard optical module being arranged to connect said switching unit via an optical connector.
  7. 如权利要求1所述的模块化路由器,其中,所述交换单元包括交换网板、主控板、电源及散热风扇。The modular router of claim 1 wherein said switching unit comprises a switching network board, a main control board, a power supply, and a cooling fan.
  8. 如权利要求7所述的模块化路由器,其中,所述交换网板的数量与所述包转发单元的数量匹配。The modular router of claim 7 wherein the number of said switching stencils matches the number of said packet forwarding units.
  9. 如权利要求7所述的模块化路由器,其中,所述交换网板设置有多个交换网芯片以及光模块接口,同一个光模块接口连接的串行总线均分连接到各交换网芯片。The modular router according to claim 7, wherein the switching network board is provided with a plurality of switching network chips and an optical module interface, and the serial buses connected to the same optical module are equally connected to the switching network chips.
  10. 如权利要求1至9任一项所述的模块化路由器,其中,所述包转发单元以及所述交换单元均设置有标准光模块接口;所述线缆包 括电缆及光纤,所述包转发单元与所述交换单元根据距离远近,基于所述标准光模块接口使用电缆或光纤连接。 The modular router according to any one of claims 1 to 9, wherein the packet forwarding unit and the switching unit are each provided with a standard optical module interface; Including the cable and the optical fiber, the packet forwarding unit and the switching unit are connected by using a cable or an optical fiber based on the standard optical module interface according to the distance.
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