CN212009564U

CN212009564U - Server cluster

Info

Publication number: CN212009564U
Application number: CN202020911976.5U
Authority: CN
Inventors: 林沧
Original assignee: Individual
Current assignee: Microgrid Cloud Shenzhen Technology Co ltd
Priority date: 2020-05-26
Filing date: 2020-05-26
Publication date: 2020-11-24
Anticipated expiration: 2030-05-26

Abstract

The utility model discloses a server cluster, include: the system comprises a chassis, a tray, at least one backboard, at least one network switching module, at least one server module and/or at least one hard disk drive and/or at least one PCIe module; the backboard is provided with at least one composite interface, at least one network interface, at least one PCIe interface, at least one hard disk interface, at least one power interface and at least one power supply interface; each power supply interface is used for being connected with a power supply; each composite interface is used for being connected with a server module or a management module; each second network interface and each second power interface are connected with one network interface or one exchange module; each hard disk interface is for interfacing with a hard disk drive. The utility model discloses put into an organic incasement with a complete distributed server cluster, reduced the space that the cluster took and user's total cost of ownership.

Description

Server cluster

Technical Field

The utility model discloses embodiment relates to server technical field, especially involves a server cluster.

Background

The server cluster refers to that a plurality of servers are centralized together to perform the same service, and the client looks like only one server. The cluster can utilize a plurality of servers to perform parallel computation to obtain high computation performance, or utilize a plurality of servers to perform distributed storage to obtain mass storage capacity, large bandwidth and high IOPS performance; the method can also realize the integration of existing computation, improve computing capacity, storage capacity and performance, reduce time delay, eliminate single-point faults and realize high reliability and high availability of clustered resources.

Existing server clusters are typically built using generic servers. The CPU adopted by the general server has strong function and high performance, so that the power consumption and the heat productivity of the CPU are high, and the normal operation of the CPU can be ensured only by radiating by a high-power radiating system. Meanwhile, in order to meet different applications of the universal server, a plurality of peripherals need to be connected, a plurality of peripheral interfaces must be arranged on the mainboard, and enough space is reserved for accommodating the peripherals, so that the mainboard and the heat dissipation system of the universal server are large, the flexibility is poor, and the universal server can be accommodated by an independent chassis. Therefore, a server cluster constructed by the general server has high power consumption, large occupied space, low reliability and usability, inconvenient maintenance and high total user ownership cost.

SUMMERY OF THE UTILITY MODEL

The utility model provides a server cluster, include: the device comprises a case, a tray and at least one back plate; the backboard is provided with at least one first composite interface, at least one second network interface, at least one hard disk interface, at least one PCIe interface, at least one second power interface and at least one power supply interface; the server cluster further comprises at least one management module, at least one network interface or switching module, at least one server module and/or at least one hard disk drive and/or at least one PCIe module, the management module, the network interface or switching module, the server module and/or the hard disk drive and/or the PCIe module being electrically connected through the backplane; each of the second network interface and the second power interface is used for connecting with the network interface or the switching module; each first composite interface is used for being connected with the server module or the management module; each hard disk interface is used for being connected with the hard disk drive; each second PCIe interface is used for connecting with the PCIe module; the management module comprises a first circuit board, and a substrate management controller and/or a CPU, an internal memory and an external memory are arranged on the first circuit board; the first circuit board is provided with a second composite interface and an input/output interface.

Further, the server module includes a second circuit board; the second circuit board is provided with a CPU, an internal memory, an external memory and at least one third composite interface; and the second circuit board is connected with the first composite interface on the back plate through a third composite interface.

Further, the hard disk interface is connected with at least one hard disk drive; the hard disk drive is a mechanical hard disk drive and/or a solid state hard disk drive and/or a hybrid hard disk drive.

Furthermore, each PCIe interface is connected with at least one PCIe module.

Furthermore, each PCIe interface is connected with at least one PCIe module; each hard disk interface is connected with at least one hard disk drive.

Further, still include: the power module and the heat dissipation module are arranged in the case, and the power module is electrically connected with the power supply interface.

Further, still include: one end of the telescopic wire arranging arm is arranged at the rear part of the case, the other end of the telescopic wire arranging arm is connected with the tray, and the tray can be drawn out from the front end of the case.

The utility model discloses the beneficial effect who brings: the server modules are not provided with external equipment but are connected with various external equipment such as a hard disk drive, a PCIe module and the like through a composite interface and a back plate, the power consumption is low, the size is small, a high-power heat dissipation system is not needed, the server modules with different performances and functions can be selected and combined with different peripheral modules according to different applications, and a complete distributed storage cluster, a distributed computing cluster or a storage-computing integrated super-fusion distributed cluster can be constructed in one case. No matter the server module or the peripheral module can be expanded, and hot plugging can be realized, so that low power consumption, high density, high reliability, high availability and good maintainability are realized, and the total cost of ownership of a user can be greatly reduced.

Drawings

Fig. 1 is a schematic structural view of the power module and the heat dissipation module disposed in the chassis of the present invention;

fig. 2 is a schematic structural view of the case of the present invention without a power module and a heat dissipation module;

FIG. 3 is a schematic diagram of an embodiment of a distributed storage server cluster employing a 19 "1U rack server chassis with a tray having retractable cable management arms, a plurality of server modules, and a plurality of 3.5" and/or 2.5 "hard disk drives;

FIG. 4 is a schematic structural diagram of an embodiment of a storage-computing integrated super-fusion distributed server cluster employing a 19-inch 1U rack server chassis, provided with a tray with a retractable cable management arm, a plurality of server modules, a plurality of 3.5-inch hard disk drives and/or 2.5-inch hard disk drives, and a plurality of PCIe modules;

FIG. 5 is a schematic diagram of an embodiment of a distributed storage server cluster employing a 19 "2U rack server chassis with a tray having a retractable cable management arm, a plurality of server modules, and a plurality of 3.5" hard drive expansion modules;

FIG. 6 is a side view of a tray, on which a plurality of 3.5-inch hard disk expansion modules with backplanes are arranged, and a plurality of hard disk interfaces are arranged on the backplanes of each 3.5-inch hard disk expansion module, which can be connected with a plurality of 3.5-inch hard disk drives.

FIG. 7 is a schematic structural diagram of an embodiment of a distributed computing server cluster employing a 19 "2U rack server chassis with a tray having a retractable cable management arm, a plurality of server modules, and a plurality of PCIe modules;

FIG. 8 is a schematic diagram of an embodiment of a computing-integrated super-converged distributed server cluster employing a 19 "2U rack server chassis with a tray having retractable cable management arms, a plurality of server modules or server expansion modules, 3.5" and/or 2.5 "hard drive expansion modules, and a plurality of PCIe modules or PCIe expansion modules;

fig. 9 is a side view of the tray, and a schematic structural diagram of at least one server expansion module and/or PCIe expansion module, at least one 3.5 inch hard disk expansion module and/or 2.5 inch hard disk expansion module is disposed on two sides of the tray.

FIG. 10 is a front view of a tray with at least one 2.5 inch hard disk expansion module and/or 3.5 inch hard disk expansion module disposed on the front of the tray.

Fig. 11 is a schematic structural diagram of an embodiment of a storage-computing integrated super-fusion distributed server cluster that adopts a 19-inch 4U rack server chassis, and is provided with a tray with a retractable cable management arm, a plurality of server modules or server expansion modules, a plurality of PCIe modules or PCIe expansion modules, and a plurality of 3.5-inch and/or 2.5-inch hard disk drives and/or 2.5-inch hard disk expansion modules.

Fig. 12 is a schematic structural diagram of an embodiment of a storage-computation integrated super-fusion server cluster employing a tower chassis, provided with a tray, multiple server expansion modules, PCIe expansion modules, and hard disk expansion modules.

Numbering of modules, interfaces and components as shown in the drawings

Cabinet 100

Tray 1

Back plate 2

Tray 3 with telescopic wire-arranging arm

Management module 11

Server module 12

Server expansion module 13

High density server expansion module 13-A

Medium density server expansion module 13-B

Low density server expansion module 13-C

Server expansion module backboard 15

First compound interface 16

3.5 inch hard disk drive 21

3.5 inch hard disk expansion module 22

3.5-inch hard disk expansion module back plate 23

2.5 inch hard disk drive 25

2.5 inch hard disk expansion module 26

2.5-inch hard disk expansion module backboard 27

Hard disk interface 28

Network interface or switching module 30

Second network interface 31

Second power interface 32

PCIe module 50

PCIe expansion module 51

PCIe expansion module backplane 52

PCIe interface 53

PCIe switching module 55

Power supply interface 56

Tray 60 without telescoping cable management arm

Telescopic wire arranging arm 61

Heat radiation module 62

Power supply module 63

External network interface 65

Third network interface 66

The objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated items.

Fig. 1 is a first embodiment of the present invention, which provides a server cluster. The server cluster comprises a chassis 100, a tray 1 and a back panel 2. The backplane 2 is provided with at least one first composite interface 16, at least one second network interface 31, at least one PCIe interface 53, at least one hard disk interface 28, at least one second power interface 32, and at least one power supply interface 56.

The server cluster further comprises at least one management module 11, at least one network interface or switch module 30, at least one server module 12 and/or at least one PCIe switch module 55, at least one hard disk drive and/or at least one PCIe module 50. The management module 11, the network interface or switch module 30, the server module 12 and/or the hard disk drive and/or the PCIe module 50 are electrically connected through the backplane 2. Wherein the hard disk drive includes: a 3.5 inch hard drive 21 and/or a 2.5 inch hard drive 25.

Wherein, each first composite interface 16 is used for connecting with the server module 12 or the management module 11; each second network interface 31 and each second power interface 32 are respectively used for connecting with the network interface or the switching module 30; each hard disk interface 28 is for connecting with a 3.5 inch hard disk drive 21 and/or a 2.5 inch hard disk drive 25; each PCIe interface 53 is configured to connect with the PCIe module 50 and/or the PCIe switch module 55.

Wherein, the management module 11 comprises a first circuit board; the first circuit board is provided with a substrate management controller and/or a CPU, an internal memory, an external memory and a second composite interface, wherein the second composite interface comprises at least one first network interface, at least one first PCIe interface and/or at least one first hard disk interface and at least one first power interface, and the external memory comprises but is not limited to: EEPROM and/or Flash chip and/or SSD. The first circuit board is correspondingly connected with the first composite interface 16 on the back panel 2 through the second composite interface. In the present embodiment, a CPU is provided. The first circuit board is also provided with an input/output interface; wherein the input/output interfaces include, but are not limited to: a display interface, a keyboard interface, a mouse interface and/or a serial port and/or a network interface and/or a USB interface.

The server module 12 includes a second circuit board; the second circuit board is provided with a CPU, an internal memory, an external memory and at least one third composite interface; the second circuit board is connected with the first composite interface on the back plate through a third composite interface, wherein the external memory includes but is not limited to: EEPROM and/or Flash chip and/or SSD.

The CPU, the memory, the EEPROM, the Flash chip, and the SSD in the management module 11 and the server module 12 are named as a standard, and may be the CPU, the memory, the EEPROM, the Flash chip, and the SSD of the same specification. Wherein SSD is Solid State Drives, Solid State disk Drives.

Wherein, a drawable tray 1 is arranged in the case 100, and a backboard 2 is arranged on the tray 1; the first composite interface 16 comprises at least one first network interface, at least one PCIe interface and/or at least one hard disk interface, and at least one first power interface;

the power module 63 and the heat dissipation module 62 are disposed in the chassis 100.

Fig. 2 is a schematic structural diagram of a second embodiment of the present invention, which is an embodiment in which a power module and a heat dissipation module are not disposed in a chassis.

The difference from the first embodiment is that the heat dissipation module and the power supply module are not disposed in the chassis 100, and heat dissipation and power supply are performed by the heat dissipation module and the power supply module outside the chassis 100. At this time, when the server cluster is used, the external power supply and the heat dissipation device are connected, for example, when the chassis of the server cluster is installed in the cabinet, the power supply and the heat dissipation device of the cabinet can supply power and dissipate heat for the server cluster.

Fig. 3 is a schematic structural diagram of a third embodiment, and the third embodiment is that the utility model discloses a 19 inches 1U rack-type server chassis sets up the tray with scalable wire management arm, a plurality of server modules, a plurality of 3.5 inches and/or 2.5 inches hard disk drive's distributed storage server cluster's embodiment.

The enclosure 100 is a 19 "1U rack server enclosure, 3.5" hard disk drive 21. The back board 2 arranged on the tray 3 with the telescopic wire arranging arm 61 is provided with a plurality of hard disk interfaces 28 which can be connected with a plurality of 3.5-inch hard disk drives 21. A plurality of first composite interfaces 16 are also provided on the backplane 2 to which a plurality of server modules 12 can be connected. One end of the telescopic wire arranging arm 61 is arranged in the case 100, and the other end is connected with the tray 3; when the server cluster is placed in the cabinet, the tray 3 can be pulled out under the condition of no power failure, so that the devices on the back plate 2 can be conveniently installed and maintained.

A second network interface 31 and a second power interface 32 are further disposed on the backplane 2 for connecting to a network interface or a switching module 30. The network interface or switching module 30 is connected to a third network interface 66 through the backplane 2, and the third network interface 66 and the power supply interface 56 are connected to the external network interface 65 and the power supply module 63 through cables in the telescopic cable management arm 61.

The tray 3 with the telescopic wire management arm 61 can be pulled out from the front part of the chassis 100 without power interruption, and the server modules 12, the 3.5-inch hard disk drives 21 and the network interface or exchange module 30 arranged on the tray 3 and the backboard 2 are convenient to install and replace.

The hard disk interface 28 is connected with at least one hard disk drive; the hard disk drive is a mechanical hard disk drive and/or a solid state hard disk drive and/or a hybrid hard disk drive; in other embodiments, the hard disk interface may also interface with a hard disk drive expansion module.

Fig. 4 is a schematic structural diagram of a fourth embodiment, and the fourth embodiment is that the utility model discloses a 19 inches 1U rack-mounted server machine case sets up the tray of taking scalable reason line arm, the embodiment of the super integration distributed server cluster of deposit and calculation integration of a plurality of server modules, polylith 3.5 cun hard disk drive and/or 2.5 cun hard disk drive, a plurality of PCIe modules.

The chassis 100 is a 19-inch 1U rack server chassis, and a plurality of hard disk interfaces 28 are disposed on the backplane 2 and can be connected to a plurality of 3.5-inch hard disk drives 21 and 2.5-inch hard disk drives 25. A plurality of first composite interfaces 16 are also provided on the backplane 2 to which a plurality of server modules 12 can be connected. The backplane 2 is further provided with a plurality of second PCIe interfaces 53, which can be connected to a plurality of PCIe modules 50. The server module 12 may communicate with the PCIe module 50 through a PCIe interface in the first composite interface 16 and a PCIe interface 53 provided on the backplane 2.

Each PCIe interface 53 is connected to at least one PCIe module 50; each hard disk interface 28 is connected with at least one hard disk drive; in other embodiments, PCIe interface 53 may also be coupled to a PCIe expansion module and hard disk interface 28 may also be coupled to a hard disk drive expansion module.

The tray 3 with the telescopic wire management arm 61 can be pulled out from the front part of the chassis 100 without power interruption, and the server module 12, the 3.5-inch hard disk drive 21, the 2.5-inch hard disk drive 25, the PCIe module 50 and the network interface or switching module 30 arranged on the tray 3 and the backboard 2 are convenient to install and replace.

Fig. 5 is a schematic structural diagram of a fifth embodiment, where the fifth embodiment is an embodiment of a distributed storage server cluster that employs a 19-inch 2U rack server chassis, and is provided with a tray with a retractable cable management arm, multiple server modules, and multiple 3.5-inch hard disk drive extension modules.

The case 100 is a 19-inch 2U rack server case, a plurality of 3.5-inch hard disk expansion modules 22 are arranged on a tray 3 with a telescopic cable management arm 61, a 3.5-inch hard disk expansion module back plate 23 is arranged on each 3.5-inch hard disk expansion module 22, a plurality of hard disk interfaces 28 are arranged on the 3.5-inch hard disk expansion module back plate 23, and a plurality of 3.5-inch hard disk drives 21 can be connected. A plurality of first composite interfaces 16 are provided on the backplane 2 to which a plurality of server modules 13 can be connected.

FIG. 6 is a side view of a tray, on which a plurality of 3.5 inch hard disk expansion modules are arranged, and a plurality of hard disk interfaces are arranged on a back plate of each 3.5 inch hard disk expansion module, which can be connected with a plurality of 3.5 inch hard disk drives.

Two sides of the tray 3 are provided with a plurality of 3.5-inch hard disk expansion modules 22, and a plurality of hard disk interfaces 28 are arranged on a 3.5-inch hard disk expansion module back plate 23 of each 3.5-inch hard disk expansion module 22 and can be connected with a plurality of 3.5-inch hard disk drives 21.

Fig. 7 is a schematic structural diagram of a sixth embodiment, where the sixth embodiment is an embodiment of a distributed computing server cluster that employs a 19-inch 2U rack-mounted server chassis and is provided with a tray with a retractable cable management arm, multiple server modules, and multiple PCIe modules.

A first composite interface 16 is arranged on the back panel 2 and connected with the server module 12; the backplane 2 is further provided with a PCIe interface 53 connected to the PCIe module 50.

Each PCIe interface 53 is connected to at least one PCIe module 50, and in other embodiments, the PCIe interface 53 may also be connected to a PCIe expansion module.

The tray 3 with the telescopic wire management arm 61 can be pulled out from the front part of the chassis 100 without power interruption, and the server module 12, the PCIe module 50 and the network interface or exchange module 30 arranged on the tray 3 and the backplane 2 are convenient to install and replace.

Fig. 8 is a schematic structural diagram of a seventh embodiment, where the seventh embodiment is an embodiment of a storage-computing integrated super-fusion distributed server cluster that employs a 19-inch 2U rack-type server chassis, and is provided with a tray with a retractable cable management arm, a plurality of server modules or server expansion modules, a 3.5-inch and/or 2.5-inch hard disk drive expansion module, and a plurality of PCIe modules or PCIe expansion modules.

A plurality of 3.5-inch hard disk expansion modules 22 are arranged on the tray 3 with the telescopic wire arranging arm 61, each 3.5-inch hard disk expansion module 22 is provided with a 3.5-inch hard disk expansion module back plate 23, a plurality of hard disk interfaces 28 are arranged on the 3.5-inch hard disk expansion module back plate 23 and can be connected with a plurality of 3.5-inch hard disk drives 21; a plurality of 2.5-inch hard disk expansion modules 26, wherein each 2.5-inch hard disk expansion module 26 is provided with a 2.5-inch hard disk expansion module back plate 27, and a plurality of hard disk interfaces 28 are arranged on the 2.5-inch hard disk expansion module back plate 27 and can be connected with a plurality of 2.5-inch hard disk drives 25; each server expansion module 13 is provided with a server expansion module back plate 15, and the server expansion module back plate 15 is provided with at least one first composite interface 16 which can be connected with at least one server module 12.

A plurality of first composite interfaces 16 are arranged on the back panel 2 and can be connected with a plurality of server modules 12 or server expansion modules 13; the plurality of second PCIe interfaces 53 may connect a plurality of PCIe modules 50 or PCIe expansion modules 51.

The tray 3 with the telescopic wire management arm 61 can be pulled out from the front end of the chassis 100 without power interruption, so that the server module 12, the 3.5-inch hard disk drive 21, the 2.5-inch hard disk drive 25, the PCIe module 50 and the network interface or exchange module 30 arranged on the tray 3 and the backboard 2 are convenient to install and replace.

Fig. 9 is a side view of the tray, and at least one server expansion module 13 and/or PCIe expansion module 51, at least one 3.5 "hard disk expansion module 22, and/or 2.5" hard disk expansion module 26 are disposed on two sides of the tray.

Server expansion modules 13 and/or PCIe expansion modules 51 and/or 3.5 hard disk expansion modules 22 are arranged on two sides of the tray 3, and a plurality of first composite interfaces 16 are arranged on a server expansion module back plate 15 of the server expansion modules 13 and can be connected with a plurality of server modules 12; a plurality of PCIe interfaces 53 are arranged on a PCIe expansion module back plate 52 of the PCIe expansion module and can be connected with a plurality of PCIe modules 50; a plurality of hard disk interfaces 28 are arranged on a 3.5-inch hard disk expansion module back plate 23 of the 3.5-inch hard disk expansion module 22 and can be connected with a plurality of 3.5-inch hard disk drives 21.

FIG. 10 is a front view of a tray with at least one 2.5 "hard disk expansion module positioned in the front of the tray.

The front part of the tray 3 is provided with at least one 2.5-inch hard disk expansion module 26, and a plurality of hard disk interfaces 28 are arranged on a 2.5-inch hard disk expansion module back plate 27 of the 2.5-inch hard disk expansion module 26 and can be connected with a plurality of 2.5-inch hard disk drives 25.

Fig. 11 is a schematic structural diagram of an eighth embodiment, where the eighth embodiment is an embodiment of a storage-computing integrated super-fusion distributed server cluster that adopts a 19-inch 4U rack-type server chassis, and is provided with a tray with a retractable cable management arm, multiple server modules or server expansion modules, multiple PCIe modules or PCIe expansion modules, multiple 3.5-inch and/or 2.5-inch hard disk drives, and/or 2.5-inch hard disk expansion modules.

Referring to fig. 11, a back plate 2 is disposed on a tray 3 with a retractable cable management arm 61, a plurality of hard disk interfaces 28 are disposed on the back plate 2, and a 3.5-inch hard disk drive 21 and/or a 2.5-inch hard disk drive 25 and/or a 2.5-inch hard disk expansion module 26 can be vertically inserted on the hard disk interfaces 28; a plurality of first composite interfaces 16 are arranged and connected with a plurality of server modules 12 and/or a plurality of server expansion modules 13; a plurality of second PCIe interfaces 53 are provided to connect the plurality of PCIe modules 50 and/or the plurality of PCIe expansion modules 51.

Fig. 12 is a schematic structural diagram of a ninth embodiment, where the ninth embodiment is an embodiment of a storage-integration hyper-converged server cluster that employs a tower chassis, and is provided with a tray, multiple server expansion modules, PCIe expansion modules, and hard disk expansion modules.

Referring to fig. 12, at least one tray 60, at least one backplane 2, at least one management module 11, at least one server module 12 and/or at least one server expansion module 13 and/or a high density server expansion module 13-a and/or at least one medium density server expansion module 13-B and/or at least one low density server expansion module 13-C, at least one PCIe module 50 and/or at least one PCIe switch module 55 and/or at least one PCIe expansion module 51, at least one 3.5 inch hard disk expansion module 18 and/or at least one 2.5 inch hard disk expansion module 26, at least one network interface or switch module 30, at least one heat dissipation module 36, and at least one power module 37 are disposed in the tower chassis 100.

Wherein, the 2.5 inch hard disk expansion module 26 is provided with a 2.5 inch hard disk expansion module back plate 27, and a plurality of hard disk interfaces 28 are arranged on the 2.5 inch hard disk expansion module back plate 27 and can be connected with a plurality of 2.5 inch hard disk drives 25; 3.5 cun hard disk expansion module 22 sets up 3.5 cun hard disk expansion module backplate 23, and 3.5 cun hard disk expansion module backplate 23 sets up a plurality of hard disk interfaces 28, can connect polylith 3.5 cun hard disk drive 21, and still can set up one or more server module 12 on the 3.5 cun hard disk expansion module backplate 23.

The server expansion module 13, the 2.5-inch hard disk expansion module 26, and the 3.5-inch hard disk expansion module 22 are connected to the backplane 2 and connected to the network interface or switching module 30 through the backplane 2.

It should be noted that the present invention provides a preferred embodiment in the specification and the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, which should not be construed as an additional limitation on the present invention, but rather should be construed as broadly as the present invention will suggest themselves to those skilled in the art having the benefit of this disclosure. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the true spirit and scope of the invention as defined by the appended claims.

Claims

1. A cluster of servers, comprising: the device comprises a case, a tray and at least one back plate; the back board is provided with at least one first composite interface, at least one second network interface, at least one hard disk interface, at least one PCIe interface, at least one second power interface and at least one power supply interface;

the server cluster further comprises at least one management module, at least one network interface or switching module, at least one server module and/or at least one hard disk drive and/or at least one PCIe module, the management module, the network interface or switching module, the server module and/or the hard disk drive and/or the PCIe module being electrically connected through the backplane;

each of the second network interface and the second power interface is used for connecting with the network interface or the switching module; each first composite interface is used for being connected with the server module or the management module; each hard disk interface is used for being connected with the hard disk drive; each PCIe interface is used for connecting with the PCIe module;

the management module comprises a first circuit board, and a substrate management controller and/or a CPU, an internal memory and an external memory are arranged on the first circuit board; the first circuit board is also provided with a second composite interface and an input/output interface.

2. The server cluster of claim 1, wherein the server module comprises a second circuit board; the second circuit board is provided with a CPU, an internal memory, an external memory and a third composite interface; and the second circuit board is connected with the first composite interface on the back plate through the third composite interface.

3. The server cluster according to claim 2, wherein the hard disk interface is connected to at least one of the hard disk drives; the hard disk drive is a mechanical hard disk drive and/or a solid state hard disk drive and/or a hybrid hard disk drive.

4. The server cluster of claim 2, wherein each PCIe interface is connected to at least one PCIe module.

5. The server cluster of claim 2, wherein each PCIe interface is connected to at least one PCIe module; each hard disk interface is connected with at least one hard disk drive.

6. The server cluster according to any one of claims 1 to 5, further comprising: the power module and the heat dissipation module are arranged inside the case, and the power module is electrically connected with the power supply interface.

7. The server cluster according to any one of claims 1 to 5, further comprising: one end of the telescopic wire arranging arm is arranged at the rear part of the case, the other end of the telescopic wire arranging arm is connected with the tray, and the tray can be drawn out from the front end of the case.