CN108270097A - A kind of orthogonal High speed rear panel - Google Patents

A kind of orthogonal High speed rear panel Download PDF

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Publication number
CN108270097A
CN108270097A CN201711480207.3A CN201711480207A CN108270097A CN 108270097 A CN108270097 A CN 108270097A CN 201711480207 A CN201711480207 A CN 201711480207A CN 108270097 A CN108270097 A CN 108270097A
Authority
CN
China
Prior art keywords
orthogonal
high speed
rear panel
speed rear
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711480207.3A
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Chinese (zh)
Inventor
张昌辉
赵振伟
闵敏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHINESE CORPORATION DAWNING INFORMATION INDUSTRY CHENGDU CO., LTD.
Original Assignee
Dawning Information Industry Beijing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dawning Information Industry Beijing Co Ltd filed Critical Dawning Information Industry Beijing Co Ltd
Priority to CN201711480207.3A priority Critical patent/CN108270097A/en
Publication of CN108270097A publication Critical patent/CN108270097A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements

Abstract

The invention discloses a kind of orthogonal High speed rear panels, the orthogonal High speed rear panel has two surfaces being oppositely arranged and multiple orthogonal connectors, multiple orthogonal connectors are set on both surfaces, and the position of multiple orthogonal connectors on both surfaces mutually corresponds, overlaps;Two surfaces are used to connection board, and orthogonal High speed rear panel is orthogonal for the signal transfer between the board on two surfaces and the board on two surfaces.The present invention can realize the orthogonality of its both sides board and effective transmission of high speed signal by orthogonal High speed rear panel, the highly dense property of system is not only increased, and improves the transmission quality of high speed signal, reduces design cost, facilitate system later maintenance, and be with good expansibility.

Description

A kind of orthogonal High speed rear panel
Technical field
The present invention relates to server technology field, it particularly relates to which a kind of high speed signal transfer for server fills It puts.
Background technology
As market is to the rapid growth of server demands total amount, the highly dense property and stability of server become Market Selection Most want index.In order to which server is allowed to make full use of mechanism space and reduces cost, highly dense property is more and more important and as super Calculate the direction of industry development.Blade server is improved to the utilization rate in space, multiple blades are combined well to be become Need key problems-solving.Orthogonal High speed rear panel can make system save space well, can make high speed transmission of signals Integrality is remarkably reinforced.
Current application it is more be nonopiate High speed rear panel, to realize the transfer of high speed signal.The shortcomings that this design, is such as Under:(1) complexity of PCB trace is increased, is unfavorable for signal integrity, increases Layout workloads.(2) increment connection Device type, the encapsulation of two side-connector of backboard is different so that design is more complicated, and cost increases, subsequent procurement and BOM (Bill of Material, bill of materials) safeguard it is more complicated.(3) puzzlement is brought to mechanism design, highly dense property reduces.
Invention content
The problem of for the relevant technologies, the present invention propose a kind of orthogonal High speed rear panel, can well solve clothes The transfer problem of business device high speed signal realizes the orthogonality of backboard both sides board.
The technical proposal of the invention is realized in this way:
According to an aspect of the invention, there is provided a kind of orthogonal High speed rear panel, orthogonal High speed rear panel, which has, to be oppositely arranged Two surfaces and multiple orthogonal connectors, the setting of multiple orthogonal connectors on both surfaces, and multiple orthogonal connectors Position on both surfaces mutually corresponds, overlaps;Two surfaces are used to connection board, and orthogonal High speed rear panel is used Signal transfer between the board on two surfaces and the board on two surfaces it is orthogonal.
According to an embodiment of the invention, the wiring of orthogonal connector is 6 × 12 structure high-speed connectors.
According to an embodiment of the invention, multiple guide pins are additionally provided on two surfaces, guide pin is each perpendicular to two surfaces.
According to an embodiment of the invention, the board on two surfaces is respectively to calculate mainboard and 100G network modules.
According to an embodiment of the invention, board includes blade type mainboard, backboard, network module.
The present invention can realize the orthogonality of its both sides board and effective biography of high speed signal by orthogonal High speed rear panel It is defeated, the highly dense property of system is not only increased, and improve the transmission quality of high speed signal, reduce design cost, facilitated and be System later maintenance.Designer can determine the type and quantity of orthogonal connector according to project demands, have good expand Malleability.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to institute in embodiment Attached drawing to be used is needed to be briefly described, it should be apparent that, the accompanying drawings in the following description is only some implementations of the present invention Example, for those of ordinary skill in the art, without creative efforts, can also obtain according to these attached drawings Obtain other attached drawings.
Fig. 1 a are the front views of orthogonal High speed rear panel according to embodiments of the present invention;
Fig. 1 b are the side views of orthogonal High speed rear panel according to embodiments of the present invention;
Fig. 1 c are the three-dimensional views of orthogonal High speed rear panel according to embodiments of the present invention;
Fig. 2 is the schematic diagram that orthogonal High speed rear panel according to embodiments of the present invention is connect with board;
Fig. 3 is the block diagram being connect according to the orthogonal High speed rear panel of the specific embodiment of the invention with board.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, those of ordinary skill in the art's all other embodiments obtained belong to what the present invention protected Range.
With reference to shown in Fig. 1 a to Fig. 1 c and Fig. 2, show that orthogonal (orthogonal) according to embodiments of the present invention is high Fast backboard 10, orthogonal High speed rear panel 10 include two surfaces being oppositely arranged and multiple orthogonal connectors 12, multiple positive commissures It connects device 12 to be arranged on two surfaces of orthogonal High speed rear panel 10, multiple orthogonal connectors 12 are in the both sides of orthogonal High speed rear panel 10 Position on surface mutually corresponds and overlaps;Two surfaces of orthogonal High speed rear panel 10 are used to connection board, just Hand over the signal transfer between board 20,30 of the High speed rear panel 10 on two surfaces and the board 20,30 on two surfaces It is orthogonal.Wherein, the phase between two orthogonal connectors 12 overlapped in the both side surface of orthogonal High speed rear panel 10 is 90 degree.Since the orthogonal connector 12 of the both sides of orthogonal High speed rear panel 10 overlaps, it can ensure both sides just in this way Connector 12 is handed over to encapsulate completely overlapped.Wherein, board 20 and board 30 can be the boards of any appropriate type.
The above-mentioned technical proposal of the present invention, the orthogonal of its both sides board 20,30 can be realized by orthogonal High speed rear panel 10 Property, not only increases the highly dense property of system, and improve the transmission quality of high speed signal, reduces design cost, facilitates and is System later maintenance.It, can according to project in addition, as long as designer designs orthogonal High speed rear panel using the orthogonality in the present invention Demand determines the type and quantity of orthogonal connector 12, is with good expansibility.
With reference to shown in Fig. 1 a to Fig. 1 c, the cloth of 6 × 12 structures crimping orthogonal connector 12, i.e. orthogonal connector 12 can be used Line is 6 × 12 structures.Designer can also select the orthogonal connector of other different structures according to demand.It is required when placing orthogonal 12 phase of orthogonal connector of the both sides of High speed rear panel 10 is 90 degree, can ensure orthogonal 10 liang of side-connector envelopes of High speed rear panel in this way Fill it is completely overlapped, high speed signal can completely by through-hole realize transmit, reduce signal transmission distance, improve signal integrity Quality avoids high speed signal cabling in the PCB (printed circuit board) of backboard so that layout (Layout) more convenient letter It is single.Meanwhile realize orthogonal on the both sides board structure of orthogonal High speed rear panel 10 so that system structure optimizes, and reduces Design cost.
In addition, having particular requirement to the pcb board thickness of orthogonal High speed rear panel 10,12 pin of orthogonal connector (pin) should be greater than 2 times of length, preferably 4mm optimums.
In order to enhance the stability of mechanism, the both sides of orthogonal High speed rear panel 10 are additionally provided with multiple guide pins 14, and guide pin 14 hangs down Directly in orthogonal backboard.So that the board of orthogonal 10 both sides of High speed rear panel and the connection of orthogonal High speed rear panel 10 are more accurate, structure On more securely.
Refering to what is shown in Fig. 2, the side board 20 of orthogonal High speed rear panel 10 is the blade mainboard of blade server.In this implementation In example, orthogonal High speed rear panel 10 can make blade server save space well, and the integrality for making high speed transmission of signals is apparent Enhancing;Solves the problems, such as the transfer of multinode blade server high speed signal.
With reference to figure 3, the specific embodiment that the orthogonal High speed rear panel 10 of the present invention is connect with board is shown.Orthogonal height Board on two surfaces of fast backboard 10 is respectively to calculate mainboard 40 and 100G network modules 50.Specifically, calculate mainboard 40 Quantity can be 8, each mainboard 40 that calculates includes 2 nodes, and each node exports all the way × 16PCIE.100G network moulds The quantity of block 50 is 2, and function is that PCIE is converted into network signal.In the present embodiment, high performance 100G networks mould Block 50 is connected with calculating mainboard 40 by orthogonal High speed rear panel 10, and orthogonal High speed rear panel 10, which realizes, calculates mainboard 40 and network mould It is orthogonal in the transfer of PCIE signal and structure between block 50.
It should be noted that designer can independently determine the board class of orthogonal High speed rear panel both sides according to their needs Type, the board of High speed rear panel both sides can be the plates of blade type mainboard, network module or other any appropriate types Card.
In conclusion the advantageous effect of technical scheme of the present invention is:
1. realize the good transmission of high speed signal between multinode multi-blade and network module.
Mainboard and the orthogonality in 100G network modules mechanism are calculated 2. realizing, is very beneficial for network module cable Plug, is conducive to operation maintenance, enhances system to space availability ratio, has good highly dense property.
3. high speed signal can directly be transmitted by the through-hole of orthogonal High speed rear panel, effectively subtract compared to nonopiate backboard The small transmission range of signal, reduces the complexity of layout (Layout), is very beneficial for signal integrity.
4. compared to nonopiate backboard, a kind of connector can be only used, reduces cost, the maintenance to purchase with BOM carries Convenience is supplied.
5. suitable guide pin is used on orthogonal High speed rear panel so that the board of orthogonal High speed rear panel both sides is carried on the back with orthogonal high speed The connection of plate is more accurately with consolidating.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention With within principle, any modification, equivalent replacement, improvement and so on should all be included in the protection scope of the present invention god.

Claims (5)

1. a kind of orthogonal High speed rear panel, which is characterized in that the orthogonal High speed rear panel have two surfaces being oppositely arranged and Multiple orthogonal connectors, the multiple orthogonal connector are arranged on described two surfaces, and multiple orthogonal connectors are described Position on two surfaces mutually corresponds, overlaps;
Described two surfaces are used to connection board, and the orthogonal High speed rear panel is between the board on described two surfaces Signal transfer and the board on described two surfaces it is orthogonal.
2. orthogonal High speed rear panel according to claim 1, which is characterized in that the wiring of the orthogonal connector is 6 × 12 Structure high-speed connector.
3. orthogonal High speed rear panel according to claim 1, which is characterized in that multiple lead is additionally provided on described two surfaces Needle, the guide pin are each perpendicular to described two surfaces.
4. orthogonal High speed rear panel according to claim 1, which is characterized in that the board difference on described two surfaces To calculate mainboard and 100G network modules.
5. orthogonal High speed rear panel according to any one of claims 1-4, which is characterized in that the board takes including blade The blade mainboard of business device.
CN201711480207.3A 2017-12-29 2017-12-29 A kind of orthogonal High speed rear panel Pending CN108270097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711480207.3A CN108270097A (en) 2017-12-29 2017-12-29 A kind of orthogonal High speed rear panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711480207.3A CN108270097A (en) 2017-12-29 2017-12-29 A kind of orthogonal High speed rear panel

Publications (1)

Publication Number Publication Date
CN108270097A true CN108270097A (en) 2018-07-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711480207.3A Pending CN108270097A (en) 2017-12-29 2017-12-29 A kind of orthogonal High speed rear panel

Country Status (1)

Country Link
CN (1) CN108270097A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111341359A (en) * 2020-02-23 2020-06-26 苏州浪潮智能科技有限公司 Board splitting device for high-density hard disk backboard of server
CN113113822A (en) * 2021-04-25 2021-07-13 无锡江南计算技术研究所 Orthogonal and non-orthogonal backboard hybrid interconnection method and connector
WO2021249422A1 (en) * 2020-06-11 2021-12-16 中兴通讯股份有限公司 Server
WO2022199334A1 (en) * 2021-03-26 2022-09-29 山东英信计算机技术有限公司 Multi-processor server node cross-board signal interconnection device
WO2024050136A1 (en) * 2022-09-02 2024-03-07 Samtec, Inc. Switch

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101931828A (en) * 2009-06-12 2010-12-29 华为技术有限公司 Back plate and communication equipment
CN102695393A (en) * 2012-05-04 2012-09-26 华为技术有限公司 Perpendicular orthogonal interconnection system and communication device
CN202522984U (en) * 2012-04-20 2012-11-07 浪潮电子信息产业股份有限公司 Backplane structure device for novel blade server system
CN205812593U (en) * 2016-06-20 2016-12-14 广州凯媒通讯技术有限公司 A kind of communication equipment based on orthohormbic structure
CN107317770A (en) * 2016-04-27 2017-11-03 中兴通讯股份有限公司 Back board device, communication equipment

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101931828A (en) * 2009-06-12 2010-12-29 华为技术有限公司 Back plate and communication equipment
CN202522984U (en) * 2012-04-20 2012-11-07 浪潮电子信息产业股份有限公司 Backplane structure device for novel blade server system
CN102695393A (en) * 2012-05-04 2012-09-26 华为技术有限公司 Perpendicular orthogonal interconnection system and communication device
CN107317770A (en) * 2016-04-27 2017-11-03 中兴通讯股份有限公司 Back board device, communication equipment
CN205812593U (en) * 2016-06-20 2016-12-14 广州凯媒通讯技术有限公司 A kind of communication equipment based on orthohormbic structure

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111341359A (en) * 2020-02-23 2020-06-26 苏州浪潮智能科技有限公司 Board splitting device for high-density hard disk backboard of server
WO2021249422A1 (en) * 2020-06-11 2021-12-16 中兴通讯股份有限公司 Server
WO2022199334A1 (en) * 2021-03-26 2022-09-29 山东英信计算机技术有限公司 Multi-processor server node cross-board signal interconnection device
CN113113822A (en) * 2021-04-25 2021-07-13 无锡江南计算技术研究所 Orthogonal and non-orthogonal backboard hybrid interconnection method and connector
WO2024050136A1 (en) * 2022-09-02 2024-03-07 Samtec, Inc. Switch

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SE01 Entry into force of request for substantive examination
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TA01 Transfer of patent application right
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Effective date of registration: 20181228

Address after: 610213 846, southern section of Tianfu Avenue, Huayang street, Tianfu New District, Chengdu, Sichuan

Applicant after: CHINESE CORPORATION DAWNING INFORMATION INDUSTRY CHENGDU CO., LTD.

Applicant after: Dawning Information Industry (Beijing) Co., Ltd.

Address before: 100193 No. 36 Building, No. 8 Hospital, Wangxi Road, Haidian District, Beijing

Applicant before: Dawning Information Industry (Beijing) Co., Ltd.

RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180710