CN101795546B - Subrack and heat radiating method thereof - Google Patents

Abstract

The embodiment of the present invention provides a subrack and a heat dissipation method for the subrack. The subrack includes a subrack housing and a fan for driving air flow. A backboard is installed in the subbox housing. The electronic devices are respectively connected, and an air inlet channel is formed on the back board and one end of the electronic devices on both sides of the back board. The other end of the device is formed with an air outlet channel, and on the other side of the backboard, the subrack housing is provided with an air outlet, wherein the electronic equipment on one side of the backboard and the electronic equipment on the other side of the backboard are aligned along the height direction of the backboard Displaced and arranged along the direction of air flow through the electronic equipment, the electronic equipment on one side of the backplane protrudes from the electronic equipment on the other side of the backplane. By adopting the subrack structure of the embodiment of the present invention, the height or volume of the subrack can be effectively reduced on the basis of ensuring the heat dissipation effect, thereby improving the compactness of electronic products.

Description

The heat dissipation method of the box and the box

technical field

The invention relates to the communication field, in particular to a subrack and a heat dissipation method for the subrack.

Background technique

With the development of electronic products, the heat consumption of electronic components in electronic products continues to increase, and the problem of heat dissipation of electronic components is becoming more and more important. Electronic heat dissipation technology needs to ensure that the electronic components of electronic products work within the allowable temperature range, so as to ensure the reliability of electronic products.

Heat dissipation methods can be divided into natural heat dissipation and forced air cooling. Among them, the forced air cooling is to drive the air through the heating device through the fan, so as to take the heat out of the device. The forced air cooling is mostly used in the occasions with high heat generation and severe ambient temperature.

When using forced air cooling, in general, the greater the wind speed or air volume, the better the heat dissipation effect, but the fan-driven air flow needs to overcome the system resistance of electronic products, and the system resistance also increases with the increase of air volume or wind speed. Therefore, a good heat dissipation solution needs to consider minimizing the ventilation resistance of electronic products.

Another development trend or competitiveness of electronic products is high density. With the same business capabilities, the more compact and miniaturized electronic products are, the more competitive they are. Reducing the volume or height of the product often leads to an increase in the system resistance of the electronic product, which creates a contradiction with better heat dissipation.

As shown in Fig. 1, in an existing subrack 10, electronic devices 11, 12, such as PCB, are vertically inserted and installed on both sides of the backplane 16 of the subrack 10, and a fan 13 is arranged in the subbox 10 for The airflow is driven to dissipate heat to the electronic equipment 11, 12 (such as PCB). The sub-box 10 has an air inlet 14 and an air outlet 15, and the fan 13 drives cold air with relatively low temperature to enter from the air inlet 14 of the sub-box 10, and then passes through the electronic equipment 11, 12, and the heat generated by the electronic equipment 11 and 12 is relatively The lower cold air is cooled, and then the heat of the electronic components on the electronic equipment 11 , 12 is dissipated into the air, and the heated air is finally discharged from the air outlet 15 of the subrack 10 .

As shown in FIG. 1 , in order to meet the heat dissipation requirements of electronic equipment, a certain height of the air inlet and outlet must be ensured, so as to control the airflow resistance of the sub-box 10 so that sufficient air volume can pass through the sub-box 10 . This results in a relatively high height of the subrack 10 in the prior art, resulting in a reduction in the number of configurable subracks 10 in the cabinet, a low level of integration, and a reduction in the competitiveness of electronic products.

Contents of the invention

Embodiments of the present invention provide a subrack and a heat dissipation method for the subrack, which can reduce the height or volume of the subrack while ensuring the heat dissipation effect.

An embodiment of the present invention provides a plug-in box, the plug-in box includes:

Plug-in case;

a backboard, installed in the subrack housing, and connected to electronic equipment on both sides of the backboard;

a fan for driving air flow;

The air inlet channel is formed on the backboard and one end of the electronic equipment on both sides of the backboard, and on the side of the backboard, the box housing is provided with an air inlet;

The air outlet channel is formed on the backboard and the other end of the electronic equipment on both sides of the backboard, and on the other side of the backboard, the box housing is provided with an air outlet;

Wherein, the electronic equipment on one side of the backplane and the electronic equipment on the other side of the backplane are dislocated along the height direction of the backplane, and are arranged so that, along the direction in which the airflow flows through the electronic equipment, the electronic equipment on the one side of the backplane Electronics that protrude beyond the other side of the backplane.

The embodiment of the present invention also provides a heat dissipation method for the sub-box. Under the action of the fan, the airflow outside the sub-box flows in from the side of the back plate and the air inlet opened on the sub-box shell, and flows through the air inlet formed on the back plate and the The air inlet passage at one end of the electronic equipment on both sides of the backboard, the air outlet passage at the other end of the electronic equipment on both sides of the backboard, through the other side of the backboard, the box housing The opened air outlet flows out, wherein, the electronic equipment on one side of the backboard and the electronic equipment on the other side of the backboard are arranged in a dislocation along the height direction of the backboard, along the direction in which the airflow flows through the electronic equipment, and the electronic equipment on one side of the backboard The electronics are higher than the electronics on the other side of the backplane.

It can be seen from the above technical solution that the electronic equipment on both sides of the back panel of the sub-box is misplaced, and the misalignment is set so that, along the direction of air flow through the electronic equipment, the electronic equipment on the side of the back panel adjacent to the air inlet protrudes beyond the adjacent The electronic equipment on the other side of the air outlet backplane, which makes the space distribution of the air inlet channel and the air outlet channel more reasonable, and can reduce the other end of the electronic equipment on one side of the backplane and the one end of the electronic equipment on the other side of the backplane In areas with low or no use value for heat dissipation, the height or volume of the subrack is reduced, and the size of the air inlet and outlet is not affected, that is, the resistance of the system is hardly increased, and the ventilation and heat dissipation capacity are guaranteed. On the basis of not affecting the heat dissipation effect, the compactness of the equipment is improved, and the contradiction between reducing the volume or height and ensuring the heat dissipation effect in the prior art is effectively solved.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those skilled in the art, other drawings can also be obtained according to these drawings without any creative effort.

Fig. 1 is a kind of box structure schematic diagram in the prior art;

Fig. 2 is a schematic diagram of the heat dissipation layout analysis of the box in Fig. 1 in the prior art;

Fig. 3 is a schematic structural view of a plug box according to an embodiment of the present invention;

Fig. 4 is a schematic diagram of the relative positions of the fan of the plug-in box and two electronic devices in the embodiment of the present invention;

Fig. 5 is a schematic diagram of the three-dimensional structure of Fig. 4 according to an embodiment of the present invention;

Fig. 6 is a schematic structural diagram of a plug-in box according to another embodiment of the present invention;

Fig. 7 is a schematic structural diagram of another subrack according to another embodiment of the present invention;

Fig. 8 is a schematic structural diagram of a plug-in box according to another embodiment of the present invention.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

In the description, certain terms are used herein for reference only and therefore are not meant to be limiting. For example, terms such as "upper," "lower," "above," "below," etc. refer to directions in the drawings to which reference is made. The terms "first," "second," and other such numerals referring to structures do not imply a sequence or order unless clearly indicated by the context.

As shown in FIG. 3 , the embodiment of the present invention provides a subrack 30 , which includes a subrack housing 31 , a backplane 32 , electronic equipment 33 , 34 , a fan 37 , an air inlet channel 35 , and an air inlet 351 , the air outlet channel 36 and the air outlet 361. Wherein, the backboard 32 is installed in the subrack housing 31, the electronic device 33 is connected to one side of the backboard 32, the electronic device 34 is connected to the other side of the backboard 32, and the backboard 32 and the backboard 32 both sides One end of the electronic equipment 33,34 forms the air inlet channel 35, and the air inlet 351 is arranged on the sub-box housing 31 on one side of the back plate 32, and on the back plate 32 and the electronic equipment 33,34 on both sides of the back plate 32 The other end forms the air outlet channel 36, and the air outlet 361 is arranged on the sub-box housing 31 on the other side of the backplane. The fan 37 is used to drive the air flow, so that the air flow outside the sub-box 30 will make the electronic equipment 33, 34 work. The heat generated during the process is taken out of the sub-box housing 31. As shown in FIG. 5 , in an embodiment of the present invention, the electronic equipment 33 on one side of the backplane 32 and the electronic equipment 34 on the other side of the backplane 32 are along the height direction of the backplane 32 (that is, flow through the electronic equipment 33, 34). The airflow direction) is misplaced, and is arranged so that, along the direction of airflow flowing through the electronic equipment, the electronic equipment 33 on one side of the backplane 32 protrudes from the electronic equipment 34 on the other side of the backplane.

Please refer to FIG. 3 again, the backboard 32 can be vertically installed in the subrack housing 31 . The air inlet channel 35 is formed at one end of the backboard 32 and the electronic devices 33 and 34 on both sides of the backboard 32, which may be: the air inlet channel 35 is formed under the backboard 32 and the electronic devices 33 and 34 on both sides of the backboard 32 Channel 35; the air outlet channel 36 is formed at the other end of the backplane 32 and the electronic equipment 33, 34 on both sides of the backplane 32, which can be: above the backplane 32 and the electronic equipment 33, 34 on both sides of the backplane 32 The air outlet channel 36 is formed.

Wherein, the air inlet channel 35 is opposite to the air inlet 351 ; the air outlet channel 36 is opposite to the air outlet 361 .

Wherein, the air inlet 351 is arranged on the subrack housing 31 on one side of the backplane 32, specifically, the air inlet 351 is arranged on the side wall 311 of the subbox casing 31 on one side of the backplane 32; similarly: The air outlet 361 is arranged on the subrack housing 31 on the other side of the backboard, specifically: the air outlet 361 is arranged on the side wall 312 of the subbox casing 31 on the other side of the backboard.

It can be understood that, for the subrack 30 in FIG. 3 , the air outlet channel 36 can be formed under the back plate 32 and the electronic devices 33 and 34 on both sides of the back plate 32 , and the air outlet channel 36 can be formed on the back plate 32 and the two sides of the back plate 32 . The air inlet channel 35 is formed above the electronic equipment 33 , 34 . That is, the air inlet passage 35 is located above the backboard 32 and the electronic devices 33 , 34 on both sides of the backboard 32 ; the air outlet passage 36 is located below the backboard 32 and the electronic devices 33 , 34 on both sides of the backboard 32 . In this way, the air inlet 351 in FIG. 3 can be an air outlet, and the air outlet 361 in FIG. 3 can be an air inlet.

Form the air inlet passage 35 below the backplane 32 and the electronic equipment 33, 34 on both sides of the backplane 32, and form the air outlet passage above the backplane 32 and the electronic equipment 33, 34 on both sides of the backplane 32 36, the air inlet is 351, and the air outlet is 361 as an example to illustrate. Wherein, the direction of the airflow flowing through the electronic devices 33 and 34 is shown by the hollow arrows on the electronic devices 33 and 34 in FIG. 3 , which is the direction from bottom to top.

When the subrack 30 of the embodiment of the present invention is in operation, as shown in FIG. The air outlet channel 36 above the equipment 33,34 is finally exhausted out of the sub-box 30 by the air outlet 361, so that the heat generated by the electronic equipment 33,34 is discharged outside the sub-box 30 to realize the heat dissipation of the electronic equipment 33,34.

Please refer to the schematic diagram of the heat dissipation layout analysis of the existing subrack 10 shown in FIG. In the entire process of the air outlet space 18 above, the flow rate changes gradually, and the shaded area actually does not help much to reduce the resistance of the airflow, resulting in a waste of space. As shown in FIG. 3, in the subrack 30 of the embodiment of the present invention, the dislocation structure of the electronic equipment 33, 34 is used to ensure that the air inlet space below the electronic equipment 33 and the air outlet space above the electronic equipment 34 remain unchanged. In the case of the above, the air intake space below the electronic equipment 34 in the air intake channel 35 and the space above the electronic equipment 33 in the air outlet channel 36 can be effectively reduced, so that the air intake channel 35 and the air outlet channel 36 are spatially allocated It is more reasonable. In this way, not only the height or volume of the sub-box 30 is reduced, but also the sizes of the air inlet 351 and the air outlet 361 are not affected, that is, the resistance of the system hardly increases, and the ventilation and heat dissipation capacity are also guaranteed at the same time. , thereby improving the compactness of the device without affecting the heat dissipation effect, and effectively solving the contradiction between reducing the volume or height and ensuring the heat dissipation effect in the prior art.

In a preferred embodiment of the present invention, the dislocation dimension h of the electronic equipment 33 on one side of the backplane 32 and the electronic equipment 34 on the other side of the backplane 32 is preferably greater than or equal to 5mm (that is, the misalignment dimension h is more than 5mm), and less than 1/2 of the height of the electronic equipment 33, 34, so as to reduce the height of the sub-box 30 more effectively while ensuring the heat dissipation effect. According to the occasion where the sub-box 30 is used and the size of the sub-box 30, the misalignment size h will be different. The specific misalignment size h can be determined according to the actual needs of the sub-box 30, as long as the heat dissipation effect and the sub-box size can be reduced. The height or volume of 30 is sufficient, and is not specifically limited here.

In a specific example of the embodiment of the present invention, as shown in FIG. 5, the electronic equipment 33 on one side of the backplane 32 and the electronic equipment 34 on the other side of the backplane 32 can both be single boards, for example, they can have electronic For the PCB board of components, please refer to Fig. 3 and Fig. 4 together. The single board (electronic device 33) on one side of the backplane 32 is vertically inserted into the backplane 32 along the subrack housing 31, and the other side of the backplane 32 The single board (electronic device 34 ) is vertically inserted into the backplane 32 along the subrack housing 31 . In this example, the air inlet duct 35 can be formed between the back plate 32 and the bottom of the single plate located on both sides of the back plate 32 and the bottom wall 313 of the sub-box housing 31, and the The front wall 311 of the body 31 defines the air inlet 351 . And an air outlet channel 36 is formed between the back plate 32 and the top of the single board located on both sides of the back plate 32 and the top wall 314 of the sub-box housing 31 , and the air outlet 361 can be opened on the rear wall 312 of the sub-box housing 31 .

In the embodiment of the present invention, although the electronic devices 33 and 34 can be PCBs with electronic components, they are certainly not limited to PCBs. Those skilled in the art can understand that, according to needs, they can be arranged in sub-boxes Any kind of electronic equipment that needs to dissipate heat.

As shown in FIGS. 3-5 , in an optional embodiment of the present invention, the fan 37 may be arranged at the position of the air outlet 361 . Like this, as shown in Figure 3, under the effect of this fan 37, air enters from the air inlet 351, and after passing through the air inlet channel 35 below the electronic equipment 33,34, flows through the electronic equipment 33,34, and the electronic equipment 33 , 34 to take away the heat generated, and finally be discharged outside the sub-box 30 through the air outlet channel 36, the fan 37, and the air outlet 361.

In a modified example of this optional embodiment, the fan 37 can also be arranged at the position of the air inlet 351 (not shown in the figure), so that the air outside the air inlet 351 is blown into the air inlet passage 35, and then After the electronic equipment 33, 34, it passes through the air outlet channel 36, and finally is discharged out of the sub-box 30 through the air outlet 361, so that the heat generated by the electronic equipment 33, 34 is discharged out of the sub-box 30 for cooling. Of course, according to heat dissipation requirements, a fan 37 (not shown in the figure) may also be provided at both the air inlet 351 and the air outlet 352 .

In this optional embodiment, according to heat dissipation requirements, the fan 37 may be one or a group of fans (as shown in FIG. 5 ). The fan 37 can be a vertical axial flow fan.

As shown in FIG. 6 , in another optional embodiment of the present invention, fans 371 and 372 can be respectively arranged above the corresponding electronic equipment 33 and above the electronic equipment 34 of the air outlet channel 36, so that Driven by 371 and fan 372, the air enters from the air inlet 351, and after passing through the air inlet channel 35 below the electronic equipment 33 and the electronic equipment 34, it flows through the electronic equipment 33, 34, and the heat generated by the electronic equipment 33, 34 Take it away, and finally be discharged outside the sub-box 30 through the fans 371, 372, the air outlet passage 36, and the air outlet 361.

In this optional embodiment, the fans 371 and 372 can be shown in FIG. 6 , both of which are axial flow fans placed horizontally.

As shown in FIG. 7 , in a modified example of this optional embodiment, the fans 371 and 372 may also be centrifugal fans placed horizontally. Because the centrifugal fan has the characteristics that the air inlet is parallel to the rotation axis and the air outlet is perpendicular to the rotation axis, as shown in Figure 7, for the fan 371 above the electronic equipment 33, the airflow flowing through the electronic equipment 33 will flow along the fan 371 after passing through the fan 371. The horizontal direction of 371 is discharged through the air outlet channel 36 and the air outlet 361, so there is no need to leave a space for airflow above the fan 371. Compared with the horizontally placed axial flow fan shown in Figure 6, the horizontally placed The centrifugal fan can further reduce the height or volume of the subrack 30 .

In this optional embodiment, of course, one of the fan 371 and the fan 372 may be an axial fan, while the other fan is a centrifugal fan (not shown), which is the same as that shown in Fig. 6 and Fig. 7 The example is similar, and the effect of reducing the volume or height of the subrack 30 while ensuring the heat dissipation capability can also be achieved, which will not be described in detail here.

As shown in FIG. 8 , in yet another optional embodiment of the present invention, fans 371 and 372 may be provided at positions corresponding to the electronic equipment 33 and the electronic equipment 34 in the air inlet channel 35 respectively, so that the fans 371 Driven by the fan 372, the air enters from the air inlet 351, and after the air inlet passage 35, the fan 371, and the fan 372 below the electronic equipment 33,34, it flows through the electronic equipment 33,34, and the electronic equipment 33,34 The hot heat produced is taken away, and finally is discharged outside the box 30 through the air outlet channel 36 and the air outlet 361 .

In this optional embodiment, the fans 371 and 372 can be shown in FIG. 8 , both of which are horizontally placed axial flow fans. Of course, the fans 371, 372 can also be both horizontally placed centrifugal fans or one of them can be a horizontally placed centrifugal fan, while the other fan can be a horizontally placed axial flow fan (not shown). It can achieve the effect of reducing the volume or height of the subrack 30 while ensuring the heat dissipation capability, which will not be described in detail here.

The above-mentioned embodiments are only several specific implementation modes of the present invention, and those skilled in the art can make various modifications or combinations on this basis, and will not be described in detail here. For example, the fan 371 and the fan 372 in the above-mentioned embodiments of the present invention can be respectively arranged below the electronic device 33 and above the electronic device 34; or the fan 371 and the fan 372 are respectively arranged above the electronic device 33 and below the electronic device 34 Or as required, fans can also be arranged above and below the electronic equipment 33 and the electronic equipment 34; these fans can be axial fans or centrifugal fans; A fan and the like are arranged at the air inlet 351 and/or the air outlet 361.

The embodiment of the present invention also provides a method for dissipating heat from a subrack, wherein, under the action of a fan, the airflow outside the subrack flows in from the side of the back plate through the air inlet opened on the subrack housing, and flows through the air inlet formed on the back. The air inlet passage at one end of the electronic equipment on both sides of the board and the backboard, the air outlet passage at the other end of the electronic equipment on both sides of the backboard and the backboard, through the other side of the backboard, The air outlet opened by the sub-box shell flows out, wherein, the electronic equipment on one side of the backplane and the electronic equipment on the other side of the backplane are misplaced along the height direction of the backplane, and the airflow flows through the electronic equipment along the direction of the backplane. The electronics on one side of the board protrude beyond the electronics on the other side of the backplane.

Wherein, the air intake channel at one end of the electronic equipment on both sides of the back plate and the back plate may be: the air intake channel below the back plate and the electronic equipment on both sides of the back plate; and the air outlet channel at the other end of the electronic equipment on both sides of the backboard may be: an air outlet channel above the backboard and the electronic equipment on both sides of the backboard.

It can be understood that: the air inlet passage at one end of the backboard and the electronic equipment on both sides of the backboard can also be: the air inlet passage above the backboard and the electronic equipment on both sides of the backboard; The air outlet channel at the other end of the backboard and the electronic equipment on both sides of the backboard may be: an air outlet channel under the backboard and the electronic equipment on both sides of the backboard.

Wherein, the misalignment size between the electronic equipment on one side of the backplane and the electronic equipment on the other side of the backplane is greater than or equal to 5 mm and less than half of the height of the electronic equipment.

Wherein, the structure of the subrack in the heat dissipation method of the subrack is consistent with the structure of the subrack described in the above embodiments, and will not be repeated here.

When the subrack of the embodiment of the present invention is working, as shown in Figure 3, the fan drives the airflow outside the subbox to enter the air inlet passage from the air inlet. After the air flows through the electronic equipment on both sides of the backboard, it passes The air outlet channel above the electronic equipment on the side is finally discharged out of the sub-box through the air outlet, so that the heat generated when the electronic equipment is in operation is discharged out of the sub-box to realize the heat dissipation of the electronic equipment. Since the electronic equipment on both sides of the backboard in the subrack is dislocated up and down, the compactness of the equipment is improved while ensuring heat dissipation, and the contradiction between reducing the volume or height and ensuring the heat dissipation effect in the prior art is effectively resolved.

The above descriptions are only a few embodiments of the present invention, and those skilled in the art can make various changes or modifications to the present invention according to the disclosure of the application documents without departing from the spirit and scope of the present invention.

Claims (11)

1. A plug box, comprising: Plug-in case; a backboard, installed in the subrack housing, and connected to electronic equipment on both sides of the backboard; a fan for driving air flow; The air inlet channel is formed on the backboard and one end of the electronic equipment on both sides of the backboard, and on the side of the backboard, the box housing is provided with an air inlet; The air outlet channel is formed on the backboard and the other end of the electronic equipment on both sides of the backboard, and on the other side of the backboard, the box housing is provided with an air outlet; It is characterized in that the electronic equipment on one side of the backboard and the electronic equipment on the other side of the backboard are dislocated along the height direction of the backboard, and are arranged so that, along the direction in which the airflow flows through the electronic equipment, the electronic equipment on one side of the backboard The electronic equipment protrudes from the electronic equipment on the other side of the backplane. 2. The subrack according to claim 1, wherein the misalignment between the electronic equipment on one side of the backplane and the electronic equipment on the other side of the backplane is greater than or equal to 5 mm and less than 5 mm of the height of the electronic equipment. Half. 3. The subrack according to claim 1 or 2, wherein the electronic equipment on one side of the backboard and the electronic equipment on the other side of the backboard are both single boards. 4. The subrack according to claim 1, wherein the fan is provided at the position of the air inlet or the position of the air outlet. 5. The plug-in box according to claim 1, characterized in that, the air inlet channel formed at one end of the electronic equipment on both sides of the backboard and the backboard is: formed on the backboard and the The air intake channel under the electronic equipment on both sides of the backplane; The air outlet channel formed on the back board and the other end of the electronic equipment on both sides of the back board is: the air outlet channel formed above the back board and the electronic equipment on both sides of the back board. 6. The plug-in box according to claim 5, characterized in that, at the upper position of the electronic device corresponding to one side of the back plate of the air outlet channel and the upper position of the electronic device corresponding to the other side of the back plate, there are respectively provided said fan. 7. The plug-in box according to claim 5, wherein the fan is arranged at the position below the electronic equipment on one side of the air inlet channel corresponding to the backplane and the electronic equipment on the other side of the backplane respectively. . 8 . The subrack according to claim 5 , wherein the fans are respectively arranged below the electronic equipment on one side of the backplane and above the electronic equipment on the other side of the backplane. 9 . The subrack according to claim 5 , wherein the fans are respectively arranged above the electronic equipment on one side of the backplane and below the electronic equipment on the other side of the backplane. 10. A heat dissipation method for sub-boxes, characterized in that, under the action of a fan, the airflow outside the sub-box flows in from the side of the backboard and the air inlet provided by the sub-box shell, and flows through the air inlet formed on the backplane and the The air inlet channel at one end of the electronic equipment on both sides of the back plate, the air outlet channel at the other end of the electronic equipment formed on both sides of the back plate, through the other side of the back plate, the sub-box housing is opened The air outlet of the backplane flows out, wherein, the electronic equipment on one side of the backplane and the electronic equipment on the other side of the backplane are dislocated along the height direction of the backplane. The electronics protrude beyond the electronics on the other side of the backplane. 11. The heat dissipation method for subracks according to claim 10, wherein the misalignment size between the electronic equipment on one side of the backplane and the electronic equipment on the other side of the backplane is greater than or equal to 5mm, and smaller than the electronic equipment on the other side of the backplane. One-half the height of the device.

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