CN111010855B - Heat dissipation system and electronic equipment with same - Google Patents
Heat dissipation system and electronic equipment with same Download PDFInfo
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- CN111010855B CN111010855B CN201911415620.0A CN201911415620A CN111010855B CN 111010855 B CN111010855 B CN 111010855B CN 201911415620 A CN201911415620 A CN 201911415620A CN 111010855 B CN111010855 B CN 111010855B
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- heat dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the application discloses a heat dissipation system, which comprises a case frame body, a service single board, a middle backboard, a service module, a fan module and a power module. The service single board, the middle backboard, the service module, the fan module and the power module are fixed in the case frame body. The middle backboard is vertically arranged with the bottom surface of the case frame body, the plane of the service single board is arranged in parallel with the bottom surface of the case frame body, and the service single board is connected with the first plane of the middle backboard; the service module, the fan module and the power module are respectively connected with the second plane of the middle backboard. The middle back plate comprises a first vent hole and a second vent hole, the first vent hole corresponds to the fan module to form a first heat dissipation air channel, and an air inlet of the first heat dissipation air channel is a first position of the chassis frame body; the second vent hole corresponds to the power module to form a second heat dissipation air channel, the air inlet of the second heat dissipation air channel is the second position of the case frame body, and the heat dissipation function can be realized through the first heat dissipation air channel and the second heat dissipation air channel.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to a heat dissipation system and an electronic device having the same.
Background
With the standardization of Ethernet with higher speed, the current electronic test equipment, such as communication test equipment, has evolved Ethernet port speed from GE (Gigabit Ethernet) to 10GE, 25GE, 40GE, 100GE, 400GE, 600GE, 800GE, etc., which has brought higher bandwidth and density requirements for the electronic test equipment.
The bandwidth of the system (the port density is increased) but the system also has extremely high heat consumption, and the heat dissipation of the system is increased to 800W-1600W or even higher from the traditional single slot position of 200W. In particular in certain cases such as: data center equipment strictly requires a heat dissipation air duct with front air inlet and rear air outlet. This presents a significant challenge to overall system heat dissipation.
The heat dissipation schemes in the related art are left air inlet, right air outlet or right air inlet, and left air outlet combined with upper air inlet, lower air outlet or lower air inlet and lower air outlet, however, the heat dissipation scheme can bring the phenomenon of air channeling of the heat dissipation air duct, seriously affects the heat dissipation efficiency of the equipment, leads to the increase of the power consumption of the equipment, and has low reliability of the equipment.
Disclosure of Invention
In order to solve the technical problem, the application provides a heat dissipation system and an electronic device with the same, which avoid the phenomenon of air channeling among different heat dissipation air channels, improve the heat dissipation efficiency of the device, reduce the power consumption of the device, and improve the reliability of the device.
The embodiment of the application discloses the following technical scheme:
in a first aspect, an embodiment of the present application provides a heat dissipation system, where the heat dissipation system includes a chassis frame, a service board, a mid-set backplane, a service module, a fan module, and a power module:
the service single board, the middle backboard, the service module, the fan module and the power module are fixed in the case frame body;
the middle backboard is vertically arranged with the bottom surface of the case frame body, the plane of the service single board is arranged in parallel with the bottom surface of the case frame body, and the service single board is connected with the first plane of the middle backboard; the service module, the fan module and the power module are respectively connected with a second plane of the middle backboard;
the middle back plate comprises a first vent hole and a second vent hole, the first vent hole corresponds to the fan module to form a first heat dissipation air channel, and an air inlet of the first heat dissipation air channel is a first position of the chassis frame body; the second vent hole corresponds to the power module to form a second heat dissipation air duct, and an air inlet of the second heat dissipation air duct is a second position of the chassis frame body; a partition plate is arranged between the first position and the second position, and a partition plate is arranged between the first heat dissipation air duct and the second heat dissipation air duct.
Optionally, if the air inlet is at the first position, the first heat dissipation air duct supplies air to the first position, and the air is formed by the fan module radiating through the first vent hole of the middle back plate.
Optionally, if the air inlet is at the second position, the second heat dissipation air duct supplies air to the second position, and the air is dissipated by a fan of the power module through a second vent hole of the middle-mounted back plate.
Optionally, the chassis frame includes a front surface, a back surface opposite to the front surface, two opposite side surfaces, a top surface, and a bottom surface opposite to the top surface.
Optionally, if the second heat dissipation air channels are located on two sides of the chassis frame body, the second heat dissipation air channels are formed by the side surface of the chassis frame body and the partition plate between the first heat dissipation air channel and the second heat dissipation air channel, and the side surface of the chassis frame body further includes a third ventilation hole.
Optionally, the first position and the second position are located on the front surface of the chassis frame.
Optionally, the back of the chassis frame further includes a third position serving as an air inlet, the third position corresponds to the service module, and the heat dissipation system further includes a third heat dissipation air duct.
Optionally, if the air inlet is at the third position, and both sides of the service module include fourth ventilation holes, the third heat dissipation duct is used for supplying air at the third position, and the third heat dissipation duct is formed by the fan modules radiating air out of both sides through the fourth ventilation holes.
Optionally, the heat dissipation system further includes a case brow:
the upper frame of the case is used for displaying relevant test information.
In a second aspect, an embodiment of the present application provides an electronic device having the heat dissipation system of any one of the first aspects.
According to the technical scheme, the heat dissipation system provided by the embodiment of the application comprises a case frame body, a service single board, a middle backboard, a service module, a fan module and a power module. The service single board, the middle backboard, the service module, the fan module and the power module are fixed in the case frame body. The middle backboard is vertically arranged with the bottom surface of the case frame body, the plane of the service single board is arranged in parallel with the bottom surface of the case frame body, and the service single board is connected with the first plane of the middle backboard; the service module, the fan module and the power module are respectively connected with the second plane of the middle backboard. The middle back plate comprises a first vent hole and a second vent hole, the first vent hole corresponds to the fan module to form a first heat dissipation air channel, and an air inlet of the first heat dissipation air channel is a first position of the chassis frame body; the second vent hole corresponds to the power module to form a second heat dissipation air channel, the air inlet of the second heat dissipation air channel is the second position of the case frame body, and the heat dissipation function can be realized through the first heat dissipation air channel and the second heat dissipation air channel. Because the partition plate is arranged between the first position and the second position, and the partition plate is arranged between the first heat dissipation air channel and the second heat dissipation air channel, different heat dissipation air channels are separated through the partition plate, so that independent work between different heat dissipation air channels is ensured, the phenomenon of air channeling between different heat dissipation air channels is avoided, the heat dissipation efficiency of the equipment is improved, the power consumption of the equipment is reduced, and the reliability of the equipment is improved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.
Fig. 1 is a structural diagram of a heat dissipation system according to an embodiment of the present disclosure;
fig. 2 is a physical structure diagram of a heat dissipation system according to an embodiment of the present disclosure;
fig. 3 is a view of a heat dissipation system provided in an embodiment of the present application in different directions;
fig. 4 is a structural diagram of a middle backboard according to an embodiment of the present application;
FIG. 5 is an exemplary illustration of a first position and a second position provided by an embodiment of the present application;
fig. 6 is an exemplary diagram of a second heat dissipation air duct provided in the embodiment of the present application;
fig. 7 is an exemplary diagram of a third heat dissipation air duct provided in the embodiment of the present application;
fig. 8 is a structural diagram of a heat dissipation system according to an embodiment of the present application.
Detailed Description
In order to make the technical solutions of the present application better understood, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The heat dissipation schemes in the related art are left air inlet, right air outlet or right air inlet, left air outlet combined with upper air inlet, lower air outlet or lower air inlet, lower air outlet, and mutually perpendicular heat dissipation air ducts are adopted, however, the non-uniform heat dissipation air duct can bring the phenomenon of air channeling of the heat dissipation air duct, the heat dissipation efficiency of the equipment is seriously affected, the power consumption of the equipment is increased, and the reliability of the equipment is low. Meanwhile, the maximum power consumption which can be met by a single slot position is about 300W. The current high power consumption requirement can not be met far away.
In order to solve the foregoing technical problem, an embodiment of the present application provides a heat dissipation system including a chassis frame, a service board, a middle backplane, a service module, a fan module, and a power module. The service single board, the middle backboard, the service module, the fan module and the power module are fixed in the case frame body. The middle backboard is vertically arranged with the bottom surface of the case frame body, the plane of the service single board is arranged in parallel with the bottom surface of the case frame body, and the service single board is connected with the first plane of the middle backboard; the service module, the fan module and the power module are respectively connected with the second plane of the middle backboard. The middle back plate comprises a first vent hole and a second vent hole, the first vent hole corresponds to the fan module to form a first heat dissipation air channel, and an air inlet of the first heat dissipation air channel is a first position of the chassis frame body; the second vent hole corresponds to the power module to form a second heat dissipation air channel, the air inlet of the second heat dissipation air channel is the second position of the case frame body, and the heat dissipation function can be realized through the first heat dissipation air channel and the second heat dissipation air channel. Because the partition plate is arranged between the first position and the second position, and the partition plate is arranged between the first heat dissipation air channel and the second heat dissipation air channel, different heat dissipation air channels are separated through the partition plate, so that independent work between different heat dissipation air channels is ensured, the phenomenon of air channeling between different heat dissipation air channels is avoided, the heat dissipation efficiency of the equipment is improved, the power consumption of the equipment is reduced, and the reliability of the equipment is improved.
Next, a heat dissipation system provided in an embodiment of the present application will be described with reference to the drawings.
Referring to fig. 1, the heat dissipation system includes a chassis frame 101, a service single board 102, a mid-backplane 103, a service module 104, a fan module 105, and a power module 106:
the chassis frame 101 provided by the embodiment of the present application may include a front surface, a back surface opposite to the front surface, two opposite side surfaces, a top surface, and a bottom surface opposite to the top surface.
The service single board 102, the mid-plane backplane 103, the service module 104, the fan module 105, and the power module 106 are fixed in the chassis frame 101. The service single board 102, the mid-plane backplane 103, the service module 104, the fan module 105, and the power module 106 may be fixed in the chassis frame 101 in various ways, for example, by screws.
The middle-mounted back plate 103 is vertically arranged with the bottom surface of the case frame body 101, the plane of the service single plate 102 is arranged in parallel with the bottom surface of the case frame body 101, and the service single plate 102 is connected with the first plane of the middle-mounted back plate 103; the service module 104, the fan module 105 and the power module 106 are respectively connected with the second plane of the mid-backplane 103. The service single board 102, the service module 104, the fan module 105 and the power module 106 may be connected to the mid-backplane 103 in various ways, for example, by means of plugging, screws, etc.
In this embodiment, the service board 102 is used to implement various service functions; the middle back plate 103 is used for separating the service single plate 102 from the service module 104, the fan module 105 and the power module 106, and is fixedly connected, and is used for forming a heat dissipation air duct; the service module 104 is configured to control the service board 102 to implement various service functions; the fan module 105 is used for realizing heat dissipation of each component; the power module 106 is used to supply power to the various components.
The number and the type of the service boards 102 may be adjusted according to actual requirements, and in this embodiment, the service boards 102 include three boards as an example. The service module 104, the fan module 105 and the power module 106 may respectively include two, and the two service modules 104, the two fan modules 105 and the two power modules 106 are respectively symmetrically disposed.
For example, the physical structure diagram of the heat dissipation system may be as shown in fig. 2, where one end of the service board 102 in fig. 2 is used as a front surface, the front surface of the heat dissipation system is as shown in (1) in fig. 3, the side surface of the heat dissipation system may be as shown in (2) in fig. 3, the back surface of the heat dissipation system may be as shown in (3) in fig. 3, and the top view of the heat dissipation system may be as shown in (4) in fig. 3.
The middle-placed back plate 103 comprises a first vent hole and a second vent hole, the first vent hole corresponds to the fan module to form a first heat dissipation air channel, and an air inlet of the first heat dissipation air channel is a first position of the chassis frame 101; the second vent hole corresponds to the power module to form a second heat dissipation air duct, and an air inlet of the second heat dissipation air duct is a second position of the chassis frame 101; a partition plate is arranged between the first position and the second position, and a partition plate is arranged between the first heat dissipation air channel and the second heat dissipation air channel.
In the case that the fan modules 105 and the power modules 106 are symmetrically distributed, as shown in fig. 1 to 3, the structure of the mid-backplane 103 may be as shown in fig. 4, where the first vent holes are symmetrically distributed in two rows, each row of the first vent holes corresponds to one fan module 105, the second vent holes are symmetrically distributed in two rows, each row of the second vent holes corresponds to one power module 106, and the structure shown in fig. 4 is merely an example and is not limited to the structure.
It should be noted that, the internal structure of the heat dissipation system is shown in fig. 1-3, and the structure of the middle back plate 103 is shown in fig. 4, at this time, the second heat dissipation air ducts are located at two sides of the chassis frame body, and are formed by the side surfaces of the chassis frame body and the partition plates between the first heat dissipation air ducts and the second heat dissipation air ducts, as shown in fig. 1.
In the embodiment of the present application, the first position and the second position may be located on the front surface of the chassis frame 101. In general, in order to form the first heat dissipation air duct and the second heat dissipation air duct shown in fig. 1, the second position may be specifically located at the front lower portion of the chassis frame 101, as shown in fig. 5, and the first position may be located at another position on the front surface of the chassis frame 101.
If the air inlet is at the first position, that is, the air is introduced from the first position, the first heat dissipation air duct is introduced from the first position, and the air is further dissipated by the fan module 105 through the first ventilation hole of the middle-positioned back plate 103. Through the first heat dissipation air duct, the service board 102 and the fan module 105 can be cooled.
If the air inlet is at the second position, that is, the air is introduced from the second position, the second heat dissipation air duct is introduced from the second position, and the air is discharged from the fan of the power module 106 through the second vent hole of the middle-positioned back plate 103. Through the second heat dissipation air duct, the power module 106 can be cooled.
Under the condition that the second heat dissipation air channels are located on two sides of the case frame body and formed by the side face of the case frame body and the partition plate between the first heat dissipation air channel and the second heat dissipation air channel, the side face of the case frame body 101 further comprises third air through holes, so that the air inlet amount is increased, and the heat dissipation efficiency is improved. At this time, the second heat dissipation air duct is formed as shown in fig. 6.
It can be understood that, in order to implement heat dissipation of the service module 104, the back surface of the chassis frame 101 may further include a third position serving as an air inlet, where the third position corresponds to the service module 104, and at this time, the heat dissipation system may further include a third heat dissipation air duct.
If the air inlet is at the third position, that is, the air is introduced from the third position, and the two sides of the service module 104 include fourth ventilation holes, the third heat dissipation air duct is introduced from the third position, and the third heat dissipation air duct is formed by diffusing the air from the fan module 105 through the fourth ventilation holes. Referring to fig. 7, when air is introduced from the third position, the air is drawn out from the fourth vent holes on both sides of the service module 104 due to the force of the fan module 105, and the direction of the air is changed such that the air is emitted through the fan module 105.
In a possible implementation manner, the heat dissipation system further includes a case upper frame 107, and the case upper frame 107 is used for displaying the test-related information, for example, a display screen is disposed at the case upper frame 107 so as to display the test-related information.
According to the technical scheme, the heat dissipation system provided by the embodiment of the application comprises a case frame body, a service single board, a middle backboard, a service module, a fan module and a power module. The service single board, the middle backboard, the service module, the fan module and the power module are fixed in the case frame body. The middle backboard is vertically arranged with the bottom surface of the case frame body, the plane of the service single board is arranged in parallel with the bottom surface of the case frame body, and the service single board is connected with the first plane of the middle backboard; the service module, the fan module and the power module are respectively connected with the second plane of the middle backboard. The middle back plate comprises a first vent hole and a second vent hole, the first vent hole corresponds to the fan module to form a first heat dissipation air channel, and an air inlet of the first heat dissipation air channel is a first position of the chassis frame body; the second vent hole corresponds to the power module to form a second heat dissipation air channel, the air inlet of the second heat dissipation air channel is the second position of the case frame body, and the heat dissipation function can be realized through the first heat dissipation air channel and the second heat dissipation air channel. Because the partition plate is arranged between the first position and the second position, and the partition plate is arranged between the first heat dissipation air channel and the second heat dissipation air channel, different heat dissipation air channels are separated through the partition plate, so that independent work between different heat dissipation air channels is ensured, the phenomenon of air channeling between different heat dissipation air channels is avoided, the heat dissipation efficiency of the equipment is improved, the power consumption of the equipment is reduced, and the reliability of the equipment is improved.
The embodiment of the application further provides electronic equipment, which is provided with the heat dissipation system in any one of the preceding embodiments, so that the heat dissipation efficiency of the electronic equipment is improved, the power consumption of the electronic equipment is reduced, and the reliability of the electronic equipment is improved.
Those of ordinary skill in the art will understand that: all or part of the steps for realizing the method embodiments can be completed by hardware related to program instructions, the program can be stored in a computer readable storage medium, and the program executes the steps comprising the method embodiments when executed; and the aforementioned storage medium may be at least one of the following media: various media that can store program codes, such as read-only memory (ROM), RAM, magnetic disk, or optical disk.
It should be noted that, in the present specification, all the embodiments are described in a progressive manner, and the same and similar parts among the embodiments may be referred to each other, and each embodiment focuses on the differences from the other embodiments. In particular, for the apparatus and system embodiments, since they are substantially similar to the method embodiments, they are described in a relatively simple manner, and reference may be made to some of the descriptions of the method embodiments for related points. The above-described embodiments of the apparatus and system are merely illustrative, and the units described as separate parts may or may not be physically separate, and the parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
The above description is only one specific embodiment of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (4)
1. A heat dissipation system is characterized by comprising a case frame body, a service single board, a middle backboard, a service module, a fan module and a power module:
the service single board, the middle backboard, the service module, the fan module and the power module are fixed in the case frame body;
the case frame body comprises a front surface, a back surface opposite to the front surface, two opposite side surfaces, a top surface and a bottom surface opposite to the top surface;
the middle backboard is vertically arranged with the bottom surface of the case frame body, the plane of the service single board is arranged in parallel with the bottom surface of the case frame body, and the service single board is connected with the first plane of the middle backboard; the service module, the fan module and the power module are respectively connected with a second plane of the middle backboard;
the middle back plate comprises a first vent hole and a second vent hole, the first vent hole corresponds to the fan module to form a first heat dissipation air channel, an air inlet of the first heat dissipation air channel is a first position of the chassis frame body, the first heat dissipation air channel supplies air to the first position, and the air is dissipated out of the fan module through the first vent hole of the middle back plate; the second vent hole corresponds to the power module to form a second heat dissipation air channel, an air inlet of the second heat dissipation air channel is a second position of the chassis frame body, the second heat dissipation air channel supplies air to the second position, and the second heat dissipation air channel is formed by the second vent hole of the middle back plate and the fan of the power module; a partition plate is arranged between the first position and the second position, the first position and the second position are positioned on the front surface of the case frame body, a partition plate is arranged between the first heat dissipation air channel and the second heat dissipation air channel, the second position is positioned on the front lower part of the case frame body, the first position is positioned at other positions on the front surface of the case frame body, the other positions are different from the front lower part, the second heat dissipation air channels are positioned on two sides of the case frame body and are formed by the side surfaces of the case frame body and the partition plate between the first heat dissipation air channel and the second heat dissipation air channel;
the back of the case frame body further comprises a third position serving as an air inlet, the third position corresponds to the service module, the heat dissipation system further comprises a third heat dissipation air channel, the two sides of the service module comprise fourth air holes, the third heat dissipation air channel is used for air inlet of the third position, and the third air channel is formed by the fan module dissipating air out of the two sides of the fourth air hole.
2. The heat dissipation system of claim 1, wherein the side of the chassis frame further comprises a third vent hole.
3. The heat dissipating system of claim 1, further comprising a chassis brow:
the upper frame of the case is used for displaying relevant test information.
4. An electronic device characterized in that the electronic device has the heat dissipation system according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911415620.0A CN111010855B (en) | 2019-12-31 | 2019-12-31 | Heat dissipation system and electronic equipment with same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911415620.0A CN111010855B (en) | 2019-12-31 | 2019-12-31 | Heat dissipation system and electronic equipment with same |
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| CN111010855A CN111010855A (en) | 2020-04-14 |
| CN111010855B true CN111010855B (en) | 2022-02-25 |
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| CN201911415620.0A Active CN111010855B (en) | 2019-12-31 | 2019-12-31 | Heat dissipation system and electronic equipment with same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112135495B (en) * | 2020-09-30 | 2022-08-09 | 中国核动力研究设计院 | Modular modularization 1U heat abstractor |
| CN114340270B (en) * | 2022-01-12 | 2023-08-01 | 国网河北省电力有限公司电力科学研究院 | Cabinet for information security and heat dissipation method based on assembly |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102279633A (en) * | 2011-08-26 | 2011-12-14 | 华为技术有限公司 | Server |
| CN102645957A (en) * | 2012-03-09 | 2012-08-22 | 华为技术有限公司 | Back plate system |
| CN103687449A (en) * | 2013-12-11 | 2014-03-26 | 华为技术有限公司 | Electronic equipment and data center |
| CN204537038U (en) * | 2015-04-29 | 2015-08-05 | 杭州昆海信息技术有限公司 | Blade server and network equipment cabinet |
| CN209731914U (en) * | 2019-02-21 | 2019-12-03 | 烽火通信科技股份有限公司 | A kind of blade server radiator structure and blade server |
-
2019
- 2019-12-31 CN CN201911415620.0A patent/CN111010855B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102279633A (en) * | 2011-08-26 | 2011-12-14 | 华为技术有限公司 | Server |
| CN102645957A (en) * | 2012-03-09 | 2012-08-22 | 华为技术有限公司 | Back plate system |
| CN103687449A (en) * | 2013-12-11 | 2014-03-26 | 华为技术有限公司 | Electronic equipment and data center |
| CN204537038U (en) * | 2015-04-29 | 2015-08-05 | 杭州昆海信息技术有限公司 | Blade server and network equipment cabinet |
| CN209731914U (en) * | 2019-02-21 | 2019-12-03 | 烽火通信科技股份有限公司 | A kind of blade server radiator structure and blade server |
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| CN111010855A (en) | 2020-04-14 |
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